JPWO2013171893A1 - Board work system - Google Patents

Abstract

A counter substrate that includes a plurality of work machines 16 arranged and that performs work on the circuit board while the circuit board is transported from the upstream side to the downstream side of the plurality of work machines. In the work system, the on-board work system includes a supply device 80 that is fixed to each of two or more adjacent work machines by a fixing mechanism and supplies an electronic component to at least one work machine of the two or more work machines. Configure. With this configuration, it is possible to disperse the load applied to the connection portion of the supply device to the work machine, and to securely fix the supply device to the work device, thereby preventing the supply device from rattling or tilting. It becomes possible to do.

Description

  The present invention relates to a substrate work system including a plurality of work machines arranged.

  In an on-board working system having a plurality of working machines arranged, a circuit board is transported over what is arranged on the downstream side from those arranged on the upstream side of the plurality of working machines, while the circuit board is transported to the circuit board. Thus, the work for each circuit board is executed by sequentially executing the work by each of the plurality of work machines. The working machine of the system configured as described above tends to be slimmed down, thereby making the entire system compact.

  On the other hand, supply devices for supplying electronic components to work machines have been widened as diversification of electronic components to be supplied and die assemblies for supplying dies as electronic components have increased in size. It is hoped that Incidentally, the die assembly is formed by dicing a wafer in which a dicing sheet is adhered, and is sometimes simply referred to as a wafer. A die is sometimes called a chip.

  As described above, various devices have been devised in order to attach the widened supply device to the slimmed working machine. For example, in the system described in Patent Document 1 below, the working machine protrudes in the width direction. In this state, the supply device is configured to be attached to the work machine. In the system described in Patent Document 2 below, two work machines are arranged in a separated state, and a supply device is arranged between the two separated work machines.

JP 2005-166878 A JP 2000-174495 A

  According to the system described in the above-mentioned patent document, it is possible to attach a supply device wider than the work machine to the work machine to some extent appropriately. However, in a system in which the supply device is attached to the work machine in a state where the supply device protrudes in the width direction of the work machine, the load applied to the connection portion of the supply device to the work machine is uneven, and the supply device can be appropriately fixed to the work machine. There is no fear. Further, in a system in which the supply device is disposed between two spaced apart work machines, a space is required for arranging the supply device between the two work machines. There is a risk that Thus, the system in which the wide supply device is attached to the work machine leaves much room for improvement. This invention is made | formed in view of such a situation, and makes it a subject to make the practicality of the system high by giving various improvement.

  In order to solve the above-described problem, a substrate work system according to claim 1 of the present application includes a plurality of work machines arranged, and a circuit board is arranged downstream from the work machine disposed upstream of the work machines. In the on-board work system for performing work on the circuit board by sequentially performing work by each of the plurality of work machines on the circuit board while being conveyed over the one arranged on the side, Each of the working machines includes a transport device that transports the circuit board, a work head that performs work on the circuit board, and a moving device that moves the work head to an arbitrary position. The two or more work machines adjacent to each other among the plurality of work machines are fixed by a fixing mechanism, and an electronic component is supplied to at least one of the two or more work machines. Characterized in that it comprises a supply device.

  According to a second aspect of the present invention, there is provided the anti-substrate work system according to the first aspect, wherein the supply device is provided corresponding to the two or more work machines, and the two or more work machines are provided. It has the 2 or more supply apparatus side terminal connected to the work machine side terminal provided in each of these.

  According to a third aspect of the present invention, there is provided the on-board working system according to the first or second aspect, wherein the supply device supplies electronic components to the two or more working machines. And

  According to a fourth aspect of the present invention, there is provided the anti-substrate working system according to the third aspect, wherein the supply device has a die supply machine for supplying a die from a die assembly formed by dicing a wafer. The die feeder is provided corresponding to the die assembly holding device that holds the die assembly and the two or more working machines, and the die is removed from the die assembly held by the die assembly holding device. It has two or more pickup heads for picking up and supplying the picked-up dies to the one corresponding to itself of the two or more work machines.

  Further, the substrate work system according to claim 5 is the substrate work system according to claim 1 or 2, wherein the supply device includes at least one work machine of the two or more work machines, The work head of at least one working machine that does not supply electronic components is for performing a work different from the work for mounting the electronic parts on the circuit board.

  According to a sixth aspect of the present invention, there is provided the on-board working system according to any one of the first to fifth aspects, wherein the two or more work machines are arranged adjacent to each other. The dimensions of the two or more work machines in the arrangement direction are the same, and the dimension of the supply device in the arrangement direction is an integral multiple of the dimensions of the two or more work machines. To do.

  In the substrate work system according to claim 1, one supply device is fixed to each of two or more adjacent work machines by a fixing mechanism. As a result, it is possible to disperse the load applied to the connection portion of the supply device to the work machine, and to securely fix the supply device to the work machine, and to prevent the supply device from rattling or tilting. Become.

  In the substrate-to-board working system according to the second aspect, each of the two or more working machines and the supply device are electrically connected. As a result, it is possible to transmit information regarding the supply device, specifically, whether or not the supply device is attached to the work device, information regarding the electronic components to be supplied, and the like for each work machine.

  According to a third aspect of the present invention, the supply system is configured such that the supply device supplies electronic components to two or more work machines fixed by a fixing mechanism. That is, electronic components can be supplied from a single supply device to a plurality of work machines. This makes it possible to efficiently supply electronic components.

  According to a fourth aspect of the present invention, the supply device includes a die supply machine for supplying a die from the die assembly. Thereby, it becomes possible to arrange | position a die supply machine to a wide supply apparatus, and it becomes possible to accommodate a comparatively big die assembly. The die feeder has a plurality of pickup heads for picking up dies from the die assembly. That is, a plurality of paths for supplying dies from one die assembly are formed corresponding to two or more work machines in which the supply device is fixed by the fixing mechanism. This makes it possible to supply the die efficiently.

  Further, in the anti-substrate work system according to claim 5, the supply device does not supply electronic components to at least one work machine of the two or more work machines fixed by the fixing mechanism, and the at least one work machine. Then, it is comprised so that the operation | work different from a mounting operation may be performed. Accordingly, it is possible to effectively use a work machine to which no electronic component is supplied, and it is possible to efficiently operate the substrate work system.

  Further, in the substrate work system according to the sixth aspect, the width of each work machine is the same, and the width of the supply device is an integral multiple of the width of each work machine. Thereby, even if it is any of the some working machines which comprise a system, it becomes possible to attach a supply apparatus, and it becomes possible to raise the versatility of a supply apparatus.

It is a perspective view which shows the electronic component mounting system which is an Example of this invention. It is a perspective view which shows the electronic component mounting apparatus which comprises the electronic circuit component mounting system shown in FIG. It is a top view which shows an electronic component mounting apparatus in the viewpoint from upper direction. It is a perspective view which shows a die supply machine. It is sectional drawing which shows the state in which the supply apparatus was attached to the electronic component mounting machine. It is a top view which shows the electronic component mounting apparatus which comprises the electronic component mounting system of the modification 1 from the viewpoint from upper direction. It is a top view which shows the electronic component mounting apparatus which comprises the electronic component mounting system of the modification 2 from the viewpoint from upper direction. It is a top view which shows the electronic component mounting apparatus which comprises the electronic component mounting system of the modification 3 from the viewpoint from upper direction.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments and modifications of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Example>
FIG. 1 shows an electronic circuit component mounting system 10. A system 10 shown in FIG. 1 performs an operation of mounting an electronic circuit component (hereinafter sometimes abbreviated as “electronic component”) on a circuit board, and includes four electronic components arranged adjacent to each other. The mounting device 12 is configured. The electronic component mounting apparatus 12 includes one system base 14 and two electronic component mounting machines 16 arranged adjacent to each other on the system base 14. That is, eight electronic component mounting machines 16 are arranged in order. In the following description, the direction in which the electronic component mounting machines 16 are arranged is referred to as an X-axis direction, and a horizontal direction perpendicular to the direction is referred to as a Y-axis direction.

  Since the four electronic component mounting apparatuses 12 constituting the system 10 have the same configuration, one of the four electronic component mounting apparatuses 12 is shown in FIG. This will be described as a representative. Incidentally, FIG. 2 is a perspective view in which a part of the exterior component of the electronic component mounting apparatus 12 is removed. Each of the electronic component mounting machines 16 included in the electronic component mounting apparatus 12 mainly includes a mounting unit main body 24 configured to include a frame unit 20 and a beam unit 22 overlaid on the frame unit 20, and a circuit board. A transport device 26 that transports in the X-axis direction and fixes it at a set position, a mounting head 28 that mounts electronic components on a circuit board fixed by the transport device 26, and a mounting head disposed on the beam unit 22 A moving device 30 that moves 28 in the X-axis direction and the Y-axis direction, and a supply device 32 that is disposed in front of the frame portion 20 and supplies circuit components to the mounting head 28 are provided.

  The transport device 26 includes two conveyor devices 40 and 42, and the two conveyor devices 40 and 42 are parallel to each other and extend in the X-axis direction so that the central portion in the Y-axis direction of the frame portion 20. It is arranged. Each of the two conveyor devices 40 and 42 has a structure in which a circuit board supported by each conveyor device 40 and 42 is conveyed in the X-axis direction by an electromagnetic motor (not shown). Furthermore, each of the conveyor devices 40 and 42 has a substrate holding device (not shown), and is configured to hold the circuit board in a fixed position.

  The mounting head 28 mounts electronic components on the circuit board held by the transport device 26, and has a suction nozzle 50 that sucks the electronic components on the lower surface. The suction nozzle 50 communicates with a positive / negative pressure supply device (not shown) via negative-pressure air and positive-pressure air passages. The suction nozzle 50 sucks and holds electronic components at a negative pressure and is supplied with a slight positive pressure. It is structured to release the held electronic component. Furthermore, the mounting head 28 has a nozzle lifting device (not shown) that lifts and lowers the suction nozzle 50 and a nozzle rotation device (not shown) that rotates the suction nozzle 50 about its axis, and holds the electronic components. It is possible to change the vertical position and the holding posture of the electronic component. The suction nozzle 50 is attachable to and detachable from the mounting head 28, and can be changed according to the size and shape of the electronic component.

  The moving device 30 moves the mounting head 28 to an arbitrary position on the frame unit 20, an X-axis direction slide mechanism (not shown) for moving the mounting head 28 in the X-axis direction, and the mounting head. And a Y-axis direction slide mechanism (not shown) for moving 28 in the Y-axis direction. The Y-axis direction sliding mechanism has a Y-axis slider (see FIG. 3) 60 provided in the beam section 22 so as to be movable in the Y-axis direction, and an electromagnetic motor (not shown) as a drive source. The Y-axis slider 60 can be moved to an arbitrary position in the Y-axis direction by an electromagnetic motor. The X-axis direction slide mechanism has an X-axis slider 66 provided on the Y-axis slider so as to be movable in the X-axis direction, and an electromagnetic motor (not shown) as a drive source. The X-axis slider 66 can be moved to an arbitrary position in the X-axis direction. The mounting head 28 is attached to the X-axis slider 66, so that the mounting head 28 can be moved to an arbitrary position on the frame unit 20 by the moving device 30. The mounting head 28 can be attached to and detached from the X-axis slider 66 with a single touch, and can be changed to a different type of work head, such as a dispenser head or an inspection head.

  The supply device 32 is disposed at the front end of the frame portion 20 as a base, and is a feeder-type supply device. The supply device 32 includes a plurality of tape feeders 74 that house taped parts on which electronic parts are taped and wound around a reel 72, and taped parts housed in each of the plurality of tape feeders 74. And a plurality of delivery devices (not shown) that sequentially feed the electronic parts from the taped parts to the supply position to the mounting head 28. Note that the tape feeder 74 can be attached to and detached from a device pallet 76 attached to the front end of the frame portion 20, and can be used for replacement of electronic components.

  The device pallet 76 to / from which the tape feeder 74 is attached / detached can be attached / detached to / from the frame unit 20 by the operation of a clamp mechanism (see FIG. 5) 78. A supply device 80 of a different type from the supply device 32 can be attached to the frame unit 20. However, the supply device 80 supplies dies from a die assembly formed by dicing a wafer in which a dicing sheet is attached, and the width of the supply device 80 (in order to accommodate a relatively large die assembly) The dimension in the X-axis direction) is larger than the width of the electronic component mounting machine 16 (dimension in the X-axis direction). For this reason, the supply apparatus 80 is attached to the frame part 20 of the two electronic component mounting machines 16.

  Specifically, as shown in FIG. 3, the width of the supply device 80 is twice the width of the electronic component mounting machine 16, and the frame unit 20 of the two adjacent electronic component mounting machines 16 is arranged. It is attached to the front side. Incidentally, FIG. 3 is a view showing the electronic component mounting apparatus 12 in a state in which the device pallet 76 is removed from the electronic component mounting machine 16 and the supply device 80 is attached instead of the supply device 32 from a viewpoint from above. .

  The supply device 80 holds the die assembly, and supplies a die supply unit 82 for supplying the die from the held die assembly, a mounting plate 84 on which the die supply unit 82 is mounted, and a mounting plate 84. It comprises a support frame (not shown) that supports it. The die supply machine 82 is disposed substantially at the center of the mounting plate 84 and holds a die assembly fixedly, and a die assembly holding device 86 and a die assembly held by the die assembly holding device 86. Supply of two pickup heads 88 for picking up the head, a head moving device 90 for moving the two pickup heads 88 to an arbitrary position on the mounting plate 84, and dies picked up by the two pickup heads 88 And two shuttle mechanisms 92 to carry the position.

  As shown in FIG. 4, the die assembly holding device 86 includes a pair of guide rails 100 (only one of which is shown in the figure) arranged to extend in the Y-axis direction, and the pair of guides. A holding frame 102 that is held by a rail 100 so as to be movable in the Y-axis direction, and a frame moving mechanism 104 that moves the holding frame 102 in the Y-axis direction. The held die assembly 106 is moved in the Y-axis direction by the frame moving mechanism 104.

  Each of the two pickup heads 88 is for picking up the die 108 from the die assembly holding device 86 held by the die assembly holding device 86, and a suction nozzle (not shown) for sucking the die 108. ) Are held at the lower end portion. The suction nozzle held by each holding rod 110 communicates with a negative pressure supply device (not shown) via an air passage, and has a structure for holding the die 108 by suction under negative pressure.

  The head moving device 90 is an XY robot type moving device, and can move each pickup head 88 to an arbitrary position on the mounting plate 84. Specifically, the head moving device 90 includes a Y-axis direction slide mechanism 112 for moving the pickup head 88 in the Y-axis direction, and an X-axis direction slide mechanism 114 for moving the pickup head 88 in the X-axis direction. I have. The Y-axis direction slide mechanism 112 has a Y-axis direction slider 116 provided on the mounting plate 84 so as to be movable in the Y-axis direction, and an electromagnetic motor (not shown). The axial slider 116 can be moved to an arbitrary position in the Y-axis direction. Further, the X-axis direction slide mechanism 114 has two X-axis direction sliders 118 provided on the side surface of the Y-axis direction slider 116 so as to be movable in the X-axis direction, and electromagnetic waves corresponding to the two X-axis direction sliders 118. Each of the two X-axis direction sliders 118 can be moved to an arbitrary position in the X-axis direction by an electromagnetic motor corresponding to each of the motors (not shown). Then, two pickup heads 88 are attached to the two X-axis direction sliders 118, so that each of the two pickup heads 88 is moved to an arbitrary position on the mounting plate 84 by the head moving device 90. It can be moved.

  The X-axis direction slider 118 to which the pickup head 88 is attached is provided with a die camera 120 in a state of facing downward, and the X-axis direction slider 118 is moved by the head moving device 90, so that the die set The die assembly 106 held by the body holding device 86 can be imaged at an arbitrary position. Thereby, it is possible to acquire position information and the like of each of the plurality of dies 108 of the die assembly 106.

  Further, as shown in FIG. 3, the two shuttle mechanisms 92 are provided corresponding to the two electronic component mounting machines 16, and are fixed on the mounting plate 84 so as to sandwich the die assembly holding device 86 therebetween. Has been. Each shuttle mechanism 92 is configured by a generally longitudinal shuttle body 122 and a die transfer table 124 provided on the upper surface of the shuttle body 122, and the die transfer table 124 slides in the longitudinal direction of the shuttle body 122. It is possible. The die transfer table 124 receives the die 108 from the pickup head 88 and transfers the received die 108 to the supply position, and has a shuttle nozzle (not shown) for receiving the die 108. The shuttle main body 122 is fixed to the upper surface of the mounting plate 84 at the base end portion thereof so as to extend in the Y-axis direction, and the distal end portion extends from the mounting plate 84. . As a result, the portion on the distal end side of each shuttle mechanism 92 extends onto the frame portion 20 of each electronic component mounting machine 16 with the supply device 80 attached to the electronic component mounting device 12.

  The supply device 80 is fixedly attached to the electronic component mounting device 12 by two clamp mechanisms 78 provided in the frame portion 20 of the two electronic component mounting machines 16. Specifically, as shown in FIG. 5, a hooking portion 126 that protrudes downward is formed on the lower surface of the mounting plate 84 of the supply device 80. When the supply device 80 is attached to the electronic component mounting device 12, the front end of the frame portion 20 of the two electronic component mounting machines 16 is used by the front end portion of the mounting plate 84 on which the hook portion 126 is formed. Part is covered. A swing arm 128 constituting a clamp mechanism 78 is attached to the upper surface of the front end portion of each frame portion 20 covered with the mounting plate 84. The swing arm 128 is swingable in the Y-axis direction, and is driven by an actuator (not shown) constituting the clamp mechanism 78 so that the swing arm 128 is tilted forward (in the drawing). The swing arm 128 is swingable between a position indicated by a solid line) and a standing position (position where the swing arm 128 is indicated by a dotted line in the drawing).

  With such a structure, when the swing arm 128 is tilted toward the front side, the supply device 80 can be mounted on the electronic component mounting device 12 or removed from the electronic component mounting device 12. When the swing arm 128 is in an upright state, the supply device 80 is locked to the frame portion 20 by the clamp mechanism 78, and the supply device 80 is removed from the electronic component mounting device 12. Is no longer possible. Note that casters (not shown) are attached to the legs of the support frame of the supply device 80, and the supply device 80 can be easily attached to and detached from the frame portion 20 by rolling of the casters. Yes.

  In addition, two connectors 130 are provided on the lower surface of the front end portion of the mounting plate 84 that is locked by the clamp mechanism 78 in correspondence with the two electronic component mounting machines 16. Each frame portion 20 of the machine 16 is provided with a connector connecting portion 132 to which a connector 130 corresponding to itself is connected. Thus, when the supply device 80 is mounted on the electronic component mounting device 12, each of the two electronic component mounting machines 16 and the supply device 80 are electrically connected.

  As described above, in the supply device 80 fixed to the frame unit 20 of the two electronic component mounting machines 16 by the two clamp mechanisms 78, the two pickup heads 88 cause the die assembly 106 to the die 108. In addition, the die 108 can be supplied to the two electronic component mounting machines 16 by transporting the picked-up die 108 to the supply position by the two shuttle mechanisms 92. Specifically, first, the die camera 120 attached to each of the two X-axis direction sliders 118 should pick up a plurality of dies 108 of the die assembly 106 held by the die assembly holding device 86. It is moved by the head moving device 90 above the die 108. Then, the die 108 is imaged by each die camera 120, and the position information of the die 108 is acquired by the imaging.

  Subsequently, based on the acquired position information of the die 108, each pickup head 88 is moved above the die 108 to be picked up by the head moving device 90. Then, the holding rod 110 of each pickup head 88 is lowered. Thus, the die 108 is sucked and held by the suction nozzle of the holding rod 110 and picked up from the die assembly 106. A thrust mechanism (not shown) that pushes up the die 108 from below is provided below the die assembly holding device 86. When the die 108 is attracted by the suction nozzle, the die 108 is moved upward by the thrust mechanism. By being pushed up, the pickup of the die 108 is supported.

  Next, each pickup head 88 that picks up the die 108 is moved by the head moving device 90 above the die conveyance table 124 of the shuttle mechanism 92 corresponding to itself. Incidentally, when the die 108 is picked up by the pickup head 88, the die conveyance table 124 is positioned at the base end portion of the shuttle main body 122 (the position where the die conveyance table 124 is indicated by a solid line in FIG. 3). . Then, the holding rod 110 of each pickup head 88 is lowered, and supply of negative pressure to the suction nozzle is stopped, so that the picked up die 108 is delivered to the shuttle nozzle of the die transfer table 124.

  Then, each die conveyance table 124 that has received the die 108 at the base end portion of each shuttle body 122 is slid toward the distal end portion, and the distal end portion of each shuttle body 122 (the die conveyance table 124 is indicated by a dotted line in FIG. 3). Die 108 is fed at the position where That is, the two positions indicated by the dotted line of the die carrier 124 in FIG. 3 are the supply positions of the die 108 by the supply device 80, and the dies 108 supplied at these positions are the mounting head 28 of the electronic component mounting machine 16. Held by.

  As described above, the electronic component mounting apparatus 12 employs the supply device 80 having a width twice that of the electronic component mounting machine 16. Therefore, the die feeder 82 of the supply device 80 can accommodate a relatively large die assembly 106 and can supply the die 108 from the large die assembly 106. In addition, the die 108 can be supplied from one supply device 80 to the two electronic component mounting machines 16, and the die 108 can be supplied efficiently. More specifically, the die feeder 82 is provided with two pickup heads 88 and two shuttle mechanisms 92. That is, two paths for supplying the die 108 from one die assembly 106 are formed corresponding to the two electronic component mounting machines 16. This makes it possible to supply the die 108 more efficiently.

  The supply device 80 is fixed to each of the two electronic component mounting machines 16 by a clamp mechanism 78, and the relatively large supply device 80 is fixedly connected to each of the two electronic component mounting machines 16. Has been. As a result, it is possible to disperse the load applied to each connecting portion, and to securely fix the supply device 80 to the electronic component mounting device 12, and to prevent the supply device 80 from rattling, tilting, and the like. . Furthermore, when the supply device 80 is mounted on the electronic component mounting device 12, each of the two electronic component mounting machines 16 and the supply device 80 are electrically connected. Thereby, it is possible to transmit information regarding the supply device 80, specifically, whether or not the supply device 80 is attached to the electronic component mounting device 16, information regarding the supply die 108, and the like, for each electronic component mounting machine 16. It becomes.

<Modification 1>
In the supply device 80 of the above embodiment, the mounting plate 84 is provided with the die supply machine 82, and the die 108 is supplied from the die supply machine 82 to each of the two electronic component mounting machines 16, but different types are provided. It is also possible to employ a supply device that can supply the electronic components to each of the two electronic component mounting machines 16. A supply device capable of supplying such different types of electronic components to each of the two electronic component mounting machines 16 is shown as a supply device 140 of Modification 1 in FIG. Since the supply device 140 of the first modification has a configuration that is relatively similar to the supply device 80 of the above-described embodiment, the same reference numerals are used for the same components as those of the supply device 80, and the description thereof is omitted. It shall be simplified.

  In the supply apparatus 140 according to the first modification, a die supply machine 142, a flux supply machine 144, and a device pallet 146 are provided on the mounting plate 84. The die feeder 142 includes a die assembly holding device 86, a pickup head 88, a head moving device 90, and a shuttle mechanism 92. Unlike the die feeder 82 of the feeding device 80, one die assembly. There is one path for supplying the die 108 from 106. From this die supply machine 142, the die 108 is supplied to one of the two electronic component mounting machines 16 (electronic component mounting machine shown on the right side of the drawing) 16a.

  Moreover, the flux supply machine 144 is provided so that it may extend toward the one electronic component mounting machine 16a. Specifically, the flux feeder 144 has a main body base 148 having a generally elongated shape, and the main body base 148 extends in the Y-axis direction so that the base plate 148 has a base end side portion thereof. While being fixed to the upper surface, the tip side portion extends from the mounting plate 84. A flux tray 150 in which flux is stored is disposed on the top surface of the tip of the main body base 148 extending from the mounting plate 84. Thereby, the flux tray 150 extends on the frame part 20 of the electronic component mounting machine 16a in a state where the supply device 140 is attached to the electronic component mounting apparatus 12, and the flux can be supplied to the electronic component mounting machine 16a. It is said that.

  In addition, a device pallet 146 is provided so as to extend toward the other of the two electronic component mounting machines 16 (electronic component mounting machine shown on the left side of the drawing) 16b. Specifically, the device pallet 146 has a generally long plate shape, and is fixed to the upper surface of the mounting plate 84 at the proximal end portion thereof, and the distal end portion extends from the mounting plate 84. Yes. Then, with the supply device 140 attached to the electronic component mounting device 12, the tip of the device pallet 146 extends onto the frame portion 20 of the electronic component mounting machine 16b. The device pallet 146 can be mounted with a tape feeder 74, and the electronic component mounting machine 16b can be supplied with electronic components from taped components stored in the tape feeder 74. ing.

<Modification 2>
In the supply devices 80 and 140 according to the above-described embodiment and the first modification, electronic components are supplied to each of the two electronic component mounting machines 16, but only one of the two electronic component mounting machines 16 has an electronic component. It is also possible to employ a supply device capable of supplying. A supply device capable of supplying an electronic component to such a single electronic component mounting machine 16 is shown in FIG. The supply device 160 according to the second modification has substantially the same configuration as the supply device 80 according to the above-described embodiment. Therefore, the same reference numerals are used for the components having the same functions as those of the supply device 80, and description thereof is omitted or simplified Shall be performed.

  In the supply device 160 of the second modification, the die supply machine 162 is provided on the mounting plate 84. The die feeder 162 includes a die assembly holding device 86, a pickup head 88, a head moving device 90, and a shuttle mechanism 92. Unlike the die feeder 82 of the feeding device 80, one die assembly. There is one path for supplying the die 108 from 106. The die 108 is supplied from the die supply machine 162 to the electronic component mounting machine 16b.

  On the other hand, an electronic component is not supplied from the supply device 160 to the other electronic component mounting machine 16a. This electronic component mounting machine 16a performs an operation for applying an adhesive on a circuit board. It is supposed to be a working machine that performs. Specifically, a dispenser head 166 is attached to the X-axis slider 66 of the moving device 30 of the electronic component placement machine 16a instead of the placement head 28, and the dispenser head 166 applies an adhesive onto the circuit board. It has come to be. Thereby, in the electronic component mounting machine 16a to which no electronic component is supplied, it is possible to perform a work different from the mounting work, and it is possible to operate the electronic component mounting apparatus 12 efficiently.

<Modification 3>
In the supply devices 80, 140, and 160 of the above-described embodiment and modifications 1 and 2, the die supply units 82, 162, and the like are disposed on the mounting plate 84 that is twice the width of the electronic component mounting unit 16. However, it is also possible to employ a supply device having a mounting plate that is narrower than the mounting plate 84. A supply apparatus having such a narrow mounting plate is shown in FIG. The supply device 170 of Modification 3 has substantially the same configuration as that of the supply device 140 of Modification 1 except for the mounting plate 172. Therefore, the components having the same functions as the supply device 140 are the same. The description will be omitted or simplified using reference numerals.

  The width of the mounting plate 172 of the supply device 170 of Modification 3 is about 1.6 times the width of the electronic component mounting machine 16. For this reason, the mounting plate 172 is attached to the entire region in the width direction of the front end portion of the electronic component mounting machine 16a, but about 2/3 in the width direction of the front end portion of the electronic component mounting machine 16b. It is attached. On the mounting plate 172, similarly to the supply device 140, a die supply unit 142 and a flux supply unit 144 are disposed, and the die 108 and the flux can be supplied to the electronic component mounting unit 16a. ing.

  On the other hand, an electronic component is not supplied from the supply device 170 to the other electronic component mounting machine 16b, but a device pallet 76 is attached to the electronic component mounting machine 16b. A tape feeder 74 can be attached to 76. For this reason, the electronic component mounting machine 16b can be supplied with electronic components from taped components stored in the tape feeder 74.

  The mounting plate 172 is fixed to the electronic component mounting machine 16a by a clamp mechanism 78 provided in the electronic component mounting machine 16a. The clamping mechanism 78 provided in the electronic component mounting machine 16b is a device pallet. Since it is used to fix 76, it is fixed to the electronic component mounting machine 16 b by a mechanism different from the clamp mechanism 78. Specifically, a solenoid 176 is provided at the front end of the electronic component mounting machine 16b, and the solenoid 176 projects a solenoid pin (not shown) in an excited state.

  On the other hand, the mounting plate 172 has a fitting hole (not shown) at a position facing the solenoid 176 when the supply device 170 is attached to the electronic component mounting device 12. When the supply device 170 is attached to the electronic component mounting device 12, the solenoid 176 is energized so that the solenoid pin is fitted in the fitting hole, and the mounting plate 172, that is, the supply device 170. Is fixed to the electronic component mounting machine 16b. Accordingly, the supply device 170 is also fixed to each of the two electronic component mounting machines 16 in the same manner as the supply device 80 and the like, thereby dispersing the load applied to the connection part to each electronic component mounting machine 16. At the same time, the supply device 170 can be securely fixed to the electronic component mounting device 12.

  A connector connecting portion (not shown) is provided in the vicinity of the solenoid 176 of the electronic component mounting machine 16b, and a connector (not shown) corresponding to the connector connecting portion is provided on the mounting plate 172. Yes. Thereby, also in the supply apparatus 170, each of the two electronic component mounting machines 16 and the supply apparatus 170 are electrically connected.

  Incidentally, in the above-described embodiments and modifications, the electronic circuit component mounting system 10 is an example of an on-board working system, and the electronic component mounting machine 16 and the supply devices 80, 140, 160, which constitute the electronic circuit component mounting system 10. Reference numeral 170 denotes an example of a work machine and a supply device. The conveying device 26, the mounting head 28, the dispenser head 166, and the moving device 30 of the electronic component mounting machine 16 are examples of the conveying device, the working head, and the moving device. The die feeders 82, 142, and 162 are examples of the die feeder, and the die assembly holding device 86 and the pickup head 88 constituting the die feeders 82, 142, and 162 are a die assembly holding device, It is an example of a pickup head. Furthermore, the connector 130 and the connector connecting portion 132 are examples of a supply device side terminal and a work machine side terminal, and the clamp mechanism 78 and the solenoid 176 are examples of a fixing mechanism.

  In addition, this invention is not limited to the said Example and modification, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, the fixing mechanism for fixing the supply device to the two or more electronic component mounting machines 16 may be a structure that can mechanically fix the supply device to the electronic component mounting machine 16. A structure in which a fixed state and an open state can be switched by operation may be used, or a structure in which the supply device is fixed to the electronic component mounting machine 16 by bolt fastening or the like may be used.

  In the above-described embodiments and modifications, the supply devices 80, 140, 160, and 170 are provided with the die supply device 82, the tape feeder 74, the flux supply device 144, and the like, but supply other types of mounting parts. Possible devices can be provided. Specifically, it is possible to provide supply devices having various structures such as a tray-type supply device, a conductive ball supply device, and a bulk feeder.

  Moreover, in the said Example and modification, the dispenser head 166 is employ | adopted as a work head of the electronic component mounting machine 16 to which an electronic component is not supplied, The electronic component mounting machine 16 apply | coats the adhesive agent etc. to a circuit board. Although it is configured to perform work, it may be configured to perform other work. For example, various operations such as an operation for fixing an electronic component to a circuit board by thermocompression bonding, pressing, etc., an operation for inspecting the mounting state of the electronic component on the circuit board, an operation for obtaining information on the circuit board, etc. It is possible to perform the work.

  Further, in the electronic circuit component mounting system 10 of the above-described embodiment and the modified example, the electronic component mounting machines 16 having the same size are arranged, but various sizes of electronic component mounting machines are arranged to have different sizes. You may comprise so that a supply apparatus may be fixedly provided in a some adjacent electronic component mounting machine.

10: Electronic circuit component mounting system (for substrate work system) 16: Electronic component mounting machine (work machine) 26: Conveying device 28: Mounting head (working head) 30: Moving device
78: Clamp mechanism (fixing mechanism) 80: Supply device 82: Die supply device 86: Die assembly holding device 88: Pickup head 130: Connector (supply device side terminal) 132: Connector connecting portion (work machine side terminal) 140: Feeder 142: Die feeder 160: Feeder 162: Die feeder 166: Dispenser head (working head) 170: Feeder 176: Solenoid (fixing mechanism)

Claims (6)

A plurality of working machines arranged, the circuit board being transported over the one arranged on the upstream side from the one arranged on the upstream side of the plurality of working machines, and the plurality of working machines on the circuit board In the work system against the board that performs the work on the circuit board by sequentially performing the work by each of the above,
Each of the plurality of work machines is
A transport device that transports the circuit board; a work head that performs work on the circuit board; and a moving device that moves the work head to an arbitrary position.
The board-to-board working system is
A supply device is provided which is fixed to each of two or more work machines adjacent to each other among the plurality of work machines by a fixing mechanism and supplies an electronic component to at least one of the two or more work machines. Anti-substrate work system. The supply device is
2. The apparatus according to claim 1, further comprising two or more supply device side terminals provided corresponding to the two or more work machines and connected to a work machine side terminal provided in each of the two or more work machines. The board-to-board working system described in 1. The supply device is
The on-board working system according to claim 1, wherein an electronic component is supplied to the two or more working machines. The supply device is
Having a die feeder for supplying dies from a die assembly formed by dicing a wafer;
The die feeder is
A die assembly holding device for holding the die assembly;
Pick up dies from the die assembly provided corresponding to the two or more work machines and held by the die assembly holding device, and supply the picked-up dies to the one corresponding to the two or more work machines. The system according to claim 3, further comprising two or more pickup heads. The supply device is
Electronic components are not supplied to at least one working machine of the two or more working machines,
The working head of the at least one working machine includes:
3. The on-board work system according to claim 1, wherein the work system is for performing a work different from a work for mounting an electronic component on a circuit board. The two or more work machines are arranged adjacent to each other, and the dimensions of the two or more work machines in the arrangement direction are the same,
6. The substrate working system according to claim 1, wherein a dimension of the supply device in the arrangement direction is an integral multiple of a dimension of each of the two or more work machines. .

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