CN113225938A - Method for manufacturing thermoelectric separation circuit board - Google Patents
Method for manufacturing thermoelectric separation circuit board Download PDFInfo
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- CN113225938A CN113225938A CN202110317654.7A CN202110317654A CN113225938A CN 113225938 A CN113225938 A CN 113225938A CN 202110317654 A CN202110317654 A CN 202110317654A CN 113225938 A CN113225938 A CN 113225938A
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- hole
- target
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- copper substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Abstract
The invention discloses a method for manufacturing a thermoelectric separation circuit board, which comprises the following steps: cutting and drilling a copper substrate in sequence, and drilling a plurality of CCD alignment holes, rivet holes and reserved holes on the copper substrate by drilling; cutting, drilling, copper deposition, plate electroplating, inner layer pattern, inner layer AOI, molding, browning, pressing, targeting and manufacturing pattern alignment holes are sequentially performed on the core plate; inner layer pattern: a target which can be identified by X-RAY is arranged on the lower surface of the core plate, and the target corresponds to the position of the reserved hole; shooting a target, and manufacturing a pattern alignment hole: the X-RAY machine can penetrate through a reserved hole in a copper substrate, identify the position of a target, and drill a registration hole with the diameter larger than that of the reserved hole, wherein the longitudinal center line of the registration hole is overlapped with the longitudinal center line of the target. In the manufacturing process, all working procedures are easy to control, the required cost is low, and the production efficiency is high; the alignment holes are manufactured to enable alignment references of all circuit layers to be the same, so that the alignment effect of patterns on the circuit board is improved, and the quality of thermoelectric separation circuit board products is improved.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for manufacturing a thermoelectric separation circuit board.
Background
The circuit part and the heat layer part of the thermoelectric separation copper substrate are on different circuit layers, the heat layer part is directly contacted with the heat dissipation part of the lamp bead, zero thermal resistance is realized, the best heat dissipation and heat conduction effect is achieved, and the thermoelectric separation circuit board has the following advantages: (1) the density of the copper base material is high, the self heat carrying capacity of the base plate is strong, and the heat conduction and the heat dissipation are good; (2) the lamp is suitable for matching a single high-power lamp bead, particularly COB (chip on board) packaging, so that the lamp achieves a better effect in use; (3) the copper base material has high density, strong heat bearing capacity and smaller volume under the same power; (4) a thermoelectric separation structure is adopted, and the thermal resistance between the thermoelectric separation structure and the lamp beads is zero, so that the light attenuation of the lamp beads is reduced, and the service life of the lamp beads is prolonged; (5) various surface treatments can be carried out according to different requirements, such as gold plating, gold melting, nickel palladium gold and the like, so that the reliability is excellent; (6) different structures can be manufactured according to different design requirements of the lamp. However, the copper substrate and the circuit layer core plate have different expansion and contraction coefficients, after lamination, the copper substrate cannot be penetrated by X-RAY, the pattern alignment reference of the core plate layer cannot be established, only the positioning hole drilled on the copper substrate can be used as the alignment basis, and the alignment references between different circuit layers are different, so that the problem of pattern dislocation is caused.
Disclosure of Invention
The invention provides a manufacturing method of a thermoelectric separation circuit board, aiming at solving the problem of figure dislocation caused by different alignment references between different circuit layers of the conventional thermoelectric separation circuit board.
A manufacturing method of a thermoelectric separation circuit board comprises the following steps:
cutting and drilling a copper substrate in sequence, wherein a boss is arranged on the copper substrate, and the longitudinal section of the copper substrate is in a shape of a Chinese character 'tu'; drilling a plurality of CCD alignment holes, rivet holes and reserved holes on a copper substrate;
cutting, drilling, copper deposition, plate electroplating, inner layer pattern, inner layer AOI, molding, browning, pressing, targeting and manufacturing pattern alignment holes are sequentially performed on the core plate;
drilling a core plate: drilling a CCD alignment hole and a rivet hole on the core plate corresponding to the positions of the CCD alignment hole and the rivet hole on the copper substrate, wherein the drilling belt proportional coefficient is consistent with the drilling belt proportional coefficient for drilling the copper substrate;
inner layer pattern: forming an inner layer pattern on the lower surface of the core plate, and arranging a target which can be identified by X-RAY, wherein the diameter of the target is smaller than that of the reserved hole, and the target corresponds to the position of the reserved hole;
molding: and (4) windowing the PP sheet and the core plate, wherein the windowing position corresponds to the boss position.
And (3) laminating: sequentially stacking the core plate, the cut PP sheet and the copper substrate and then pressing to form a multilayer plate;
shooting a target, and manufacturing a pattern alignment hole: the X-RAY machine can penetrate through a reserved hole in a copper substrate, the position of a target is identified, a registration hole with the diameter larger than that of the reserved hole is drilled, the longitudinal center line of the registration hole is overlapped with the longitudinal center line of the target, and the drill belt proportionality coefficient is compensated according to plate expansion and contraction.
Optionally, the multilayer board is cut and ground before targeting.
Optionally, after the copper substrate is drilled, the copper substrate is subjected to outer layer pattern etching and boss height detection in sequence.
Optionally, the target is a bonding pad, and the diameter of the bonding pad is 1.5-2.0 mm.
Optionally, the number of the rivet holes is an even number n, wherein n-2 rivet holes are symmetrically distributed in pairs, and the other pair of rivet holes are not symmetrically distributed.
Optionally, four CCD alignment holes are provided and respectively distributed at four corners of the multilayer board.
Optionally, the aperture of the preformed hole is 2.2-2.8 mm.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a method for manufacturing a thermoelectric separation circuit board, which has the advantages that each process is easy to control in the manufacturing process, the required cost is low, and the production efficiency is high; the alignment hole makes the alignment reference of each circuit layer the same, the alignment accuracy of the circuit pattern is high, the alignment effect of the pattern on the circuit board can be improved, and the quality of the thermoelectric separation circuit board product is improved.
Drawings
Fig. 1 is a first partial schematic view of a manufacturing process of a thermoelectric separation circuit board of the present invention:
FIG. 2 is a second schematic view of a portion of a thermoelectric separation circuit board according to the present invention during a manufacturing process;
FIG. 3 is a third schematic view of a thermoelectric separation circuit board according to a third embodiment of the present invention;
description of reference numerals: 1-a copper substrate; 2-PP sheet; 3-a core plate; 31-outer layer circuit; 32-inner line, 5-target; 61-CCD alignment holes; 62-rivet hole; 63-reserving holes; 64-alignment holes.
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments.
A manufacturing method of a thermoelectric separation circuit board comprises the following steps:
cutting, drilling, outer layer pattern etching and boss height detection are sequentially carried out on the copper substrate 1, a boss is arranged on the copper substrate 1, and the longitudinal section of the copper substrate 1 is in a shape of a Chinese character 'tu'; the drilling drills a plurality of CCD alignment holes 61, rivet holes 62, and prepared holes 63 in the copper substrate 1.
Referring to fig. 3, in some embodiments, the number of the rivet holes 62 is an even number n, where n-2 rivet holes are symmetrically distributed two by two, and another pair of the rivet holes are asymmetrically distributed, for example, 8 rivet holes 62 are provided, where 2 pairs of the rivet holes are vertically symmetrical, 1 pair of the rivet holes are horizontally symmetrical, and the asymmetrical rivet holes are designed to be fool-proof. CCD counterpoint hole 61 is provided with four, distributes respectively in the position department at four angles of pressfitting back multiply wood, and the aperture of preformed hole 63 is 2.2 ~ 2.8 mm.
The core plate 3 is sequentially subjected to cutting, drilling, copper deposition, plate electroplating, inner layer pattern, inner layer AOI, forming, browning, pressing, cutting and grinding, targeting and pattern alignment hole manufacturing.
Cutting the core plate 3 into preset sizes;
drilling a core plate: and drilling the CCD alignment hole 61 and the rivet hole 62 on the core plate 3 corresponding to the positions of the CCD alignment hole 61 and the rivet hole 62 on the copper substrate 1, wherein the drilling tape proportional coefficient is consistent with the drilling tape proportional coefficient for drilling the copper substrate 1, and then performing copper deposition and plate electricity on the core plate.
Inner layer pattern: forming an inner layer pattern on the surface of the core plate 3, and arranging a target 5 which can be identified by X-RAY, wherein the diameter of the target is smaller than that of the preformed hole 63, and the target 5 corresponds to the position of the preformed hole 63; in some embodiments, the target 5 is a pad, and the diameter of the pad 5 is 1.5-2.0 mm. And then, carrying out inner layer AOI on the core plate to ensure the quality of the core plate.
Molding: and (4) windowing the PP sheet 2 and the core plate 3, wherein the windowing position corresponds to the boss position.
And (3) laminating: and (3) sequentially stacking the core plate 3, the cut PP sheet 2 and the copper substrate 1, and then pressing to form the multilayer board. Specifically, the PP sheet 2 is disposed between the copper substrate 1 and the inner layer pattern of the core sheet.
Shooting a target, and manufacturing a pattern alignment hole: referring to the attached drawings 2-3, the X-RAY machine can penetrate through a reserved hole 63 on a copper substrate, identify the position of a target 5, drill a registration hole 64 with the diameter larger than that of the reserved hole, overlap the longitudinal center line of the registration hole 64 and the longitudinal center line of the target 5, and compensate the drill strip proportionality coefficient according to the plate expansion and contraction setting. The alignment holes are used for alignment in subsequent procedures such as pattern transfer and the like, so that the alignment reference of the outer layer circuit 31 and the inner layer circuit 32 on the upper surface and the lower surface of the core plate 3 is consistent, and the pattern alignment degree of the prepared circuit board is accurate.
The invention provides a method for manufacturing a thermoelectric separation circuit board, which has the advantages that each process is easy to control in the manufacturing process, the required cost is low, and the production efficiency is high; the alignment hole makes the alignment reference of each circuit layer the same, the alignment accuracy of the circuit pattern is high, the alignment effect of the pattern on the circuit board can be improved, and the quality of the thermoelectric separation circuit board product is improved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (7)
1. A manufacturing method of a thermoelectric separation circuit board is characterized in that: the method comprises the following steps:
cutting and drilling a copper substrate in sequence, wherein a boss is arranged on the copper substrate, and the longitudinal section of the copper substrate is in a shape of a Chinese character 'tu'; drilling a plurality of CCD alignment holes, rivet holes and reserved holes on a copper substrate;
cutting, drilling, copper deposition, plate electroplating, inner layer pattern, inner layer AOI, molding, browning, pressing, targeting and manufacturing pattern alignment holes are sequentially performed on the core plate;
drilling a core plate: drilling a CCD alignment hole and a rivet hole on the core plate corresponding to the positions of the CCD alignment hole and the rivet hole on the copper substrate, wherein the drilling belt proportional coefficient is consistent with the drilling belt proportional coefficient for drilling the copper substrate;
inner layer pattern: forming an inner layer pattern on the lower surface of the core plate, and arranging a target which can be identified by X-RAY, wherein the diameter of the target is smaller than that of the reserved hole, and the target corresponds to the position of the reserved hole;
molding: and (4) windowing the PP sheet and the core plate, wherein the windowing position corresponds to the boss position.
And (3) laminating: sequentially stacking the core plate, the cut PP sheet and the copper substrate and then pressing to form a multilayer plate;
shooting a target, and manufacturing a pattern alignment hole: the X-RAY machine can penetrate through a reserved hole in a copper substrate, the position of a target is identified, a registration hole with the diameter larger than that of the reserved hole is drilled, the longitudinal center line of the registration hole is overlapped with the longitudinal center line of the target, and the drill belt proportionality coefficient is compensated according to plate expansion and contraction.
2. The method of manufacturing a thermoelectric separation circuit board according to claim 1, wherein: and cutting and grinding the multilayer board before target shooting.
3. The method of manufacturing a thermoelectric separation circuit board according to claim 1, wherein: and after the copper substrate is drilled, sequentially carrying out outer layer pattern, outer layer etching and boss height detection on the copper substrate.
4. The method of manufacturing a thermoelectric separation circuit board according to claim 1, wherein: the target is a bonding pad, and the diameter of the bonding pad is 1.5-2.0 mm.
5. The method of manufacturing a thermoelectric separation circuit board according to claim 1, wherein: the number of the rivet holes is an even number n, wherein n-2 rivet holes are symmetrically distributed in pairs, and the other pair of rivet holes are not symmetrically distributed.
6. The method of manufacturing a thermoelectric separation circuit board according to claim 1, wherein: the CCD is counterpointed the hole and is provided with four, distributes respectively in the position department at multiply wood four angles.
7. The method of manufacturing a thermoelectric separation circuit board according to claim 1, wherein: the aperture of the preformed hole is 2.2-2.8 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110317654.7A CN113225938B (en) | 2021-03-25 | 2021-03-25 | Method for manufacturing thermoelectric separation circuit board |
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| CN202110317654.7A CN113225938B (en) | 2021-03-25 | 2021-03-25 | Method for manufacturing thermoelectric separation circuit board |
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| CN113225938A true CN113225938A (en) | 2021-08-06 |
| CN113225938B CN113225938B (en) | 2022-12-09 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573468A (en) * | 2021-09-22 | 2021-10-29 | 四川英创力电子科技股份有限公司 | Multilayer circuit board and production method |
| CN113784549A (en) * | 2021-09-08 | 2021-12-10 | 广东和鑫达电子股份有限公司 | Novel X-RAY target hole design method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3541072A1 (en) * | 1984-11-26 | 1986-06-05 | Matsushita Electric Works, Ltd., Kadoma, Osaka | METHOD FOR DRILLING REFERENCE HOLES IN MULTI-LAYER PRINTED COMPOSITE BOARDS |
| CN105472892A (en) * | 2015-12-30 | 2016-04-06 | 东莞生益电子有限公司 | Fabrication method of circuit board |
| CN105491818A (en) * | 2015-11-23 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Manufacturing method for buried circuit board with high alignment precision |
| CN106851970A (en) * | 2017-02-27 | 2017-06-13 | 深圳市仁创艺电子有限公司 | The preparation method that a kind of thermoelectricity separates metal substrate |
| CN108322993A (en) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | A kind of the pcb board part and its processing method of thermoelectricity separation |
| CN111246656A (en) * | 2020-01-10 | 2020-06-05 | 昆山首源电子科技有限公司 | Thermoelectric separation copper-based circuit board for LED and preparation method thereof |
-
2021
- 2021-03-25 CN CN202110317654.7A patent/CN113225938B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3541072A1 (en) * | 1984-11-26 | 1986-06-05 | Matsushita Electric Works, Ltd., Kadoma, Osaka | METHOD FOR DRILLING REFERENCE HOLES IN MULTI-LAYER PRINTED COMPOSITE BOARDS |
| CN105491818A (en) * | 2015-11-23 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Manufacturing method for buried circuit board with high alignment precision |
| CN105472892A (en) * | 2015-12-30 | 2016-04-06 | 东莞生益电子有限公司 | Fabrication method of circuit board |
| CN106851970A (en) * | 2017-02-27 | 2017-06-13 | 深圳市仁创艺电子有限公司 | The preparation method that a kind of thermoelectricity separates metal substrate |
| CN108322993A (en) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | A kind of the pcb board part and its processing method of thermoelectricity separation |
| CN111246656A (en) * | 2020-01-10 | 2020-06-05 | 昆山首源电子科技有限公司 | Thermoelectric separation copper-based circuit board for LED and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784549A (en) * | 2021-09-08 | 2021-12-10 | 广东和鑫达电子股份有限公司 | Novel X-RAY target hole design method |
| CN113573468A (en) * | 2021-09-22 | 2021-10-29 | 四川英创力电子科技股份有限公司 | Multilayer circuit board and production method |
| CN113573468B (en) * | 2021-09-22 | 2021-12-07 | 四川英创力电子科技股份有限公司 | Multilayer circuit board and production method |
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| CN113225938B (en) | 2022-12-09 |
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