CN106028642A - TR assembly multilayer circuit board and processing technology thereof - Google Patents
TR assembly multilayer circuit board and processing technology thereof Download PDFInfo
- Publication number
- CN106028642A CN106028642A CN201610452580.7A CN201610452580A CN106028642A CN 106028642 A CN106028642 A CN 106028642A CN 201610452580 A CN201610452580 A CN 201610452580A CN 106028642 A CN106028642 A CN 106028642A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hole
- multilamellar
- ground
- microstrip line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a TR assembly multilayer circuit board. The TR assembly multilayer circuit board comprises a multilayer FR4 circuit board, and is characterized in that the top of the multilayer FR4 circuit board is provided with an R04350 circuit board; the R04350 circuit board and the multilayer FR4 circuit board are compositely formed; blind hole ground holes are vertically formed in the R04350 circuit board; a communicated through hole ground hole is formed between the R04350 circuit board and the multilayer FR4 circuit board; the R04350 circuit board is provided with a microstrip line; a multifunctional chip is embedded in the R04350 circuit board; and the multifunctional chip is bond with a microstrip line gold wire. According to a processing technology of the TR assembly multilayer circuit board, the TR assembly multilayer circuit board is formed compositely, each layer of the circuit board is independently manufactured, the ground isolation technology that the through hole is combined with the blind hole is used, the interference is reduced to the maximum extent, and then the TR assembly multilayer circuit board is formed compositely.
Description
Technical field
The present invention relates to TR assembly manufacture field, particularly to a kind of TR assembly multilayer circuit board, with
And one TR assembly multilayer circuit board machining process.
Background technology
Tradition TR assembly design generally microwave signal uses microwave material, such as RO5880 or
The material circuit boards such as RO4350 are sintered on FR4 circuit board, and FR4 circuit board is used for providing power supply and control
Signal processed, in order to prevent interference, needs microwave signal, control signal and power supply signal when design
It is physically separated with metal bead, and is distributed on different circuit boards.
In traditional design use through hole Contact patch microstrip line is isolated, due to multilayer circuit board by
In a large amount of cabling of internal layer, through hole, in order to dodge internal layer cabling, can only select not walk line position and place,
Thus cannot ensure the intactly isolation of microwave signal.
Summary of the invention
The technical problem to be solved is to provide a kind of TR assembly multilayer circuit board and processing thereof
Technique, the ground isolation technology using through hole and blind hole to combine, at utmost reduce interference, existing to solve
There is the above-mentioned multinomial defect caused in technology.
For achieving the above object, the present invention provides following technical scheme: a kind of TR assembly multilamellar is electric
Road plate, including multilamellar FR4 circuit board, the top layer of described multilamellar FR4 circuit board is provided with R04350 electricity
Road plate, R04350 circuit board and multilamellar FR4 circuit board are composited, vertical on R04350 circuit board
It is provided with hole, blind hole ground, between R04350 circuit board and multilamellar FR4 circuit board, is provided with the hole, through hole ground communicated,
Described R04350 circuit board is provided with microstrip line, and R04350 circuit board is embedded with multifunction chip, many merits
Can chip and microstrip line gold wire bonding.
Preferably, it is provided with prepreg between described R04350 circuit board and multilamellar FR4 circuit board.
Preferably, oxygen-free copper carrier it is provided with between described multifunction chip and R04350 circuit board.
Preferably, described R04350 circuit board and multilamellar FR4 circuit board are additionally provided with the holding wire communicated
Blind hole.
A kind of TR assembly multilayer circuit board machining process, is composited by multilayer circuit board, ground floor
For R04350 circuit board, lower circuit plate is FR4 circuit board, comprises the following steps:
1) surface of R04350 circuit board and FR4 circuit board is furnished with microstrip line, makes circuit board；
2) through hole hole, ground and signal blind hole are made on R04350 circuit board and FR4 circuit board；
3) hole, blind hole ground is made on R04350 circuit board；
4) open-blind groove on R04350 circuit board, is provided with multifunction chip in blind slot, multifunction chip and
Microstrip line is connected by gold wire bonding technique；
5) R04350 circuit board and multilamellar FR4 circuit board are composited.
Preferably, described step 2) in, the through hole that R04350 circuit board and FR4 circuit board are arranged
Identical position corresponding with signal blind hole, hole, ground is arranged.
Preferably, described step 4) in, the gold wire bonding point of chip is put down with circuit board top layer microstrip line
OK.
Preferably, described step 5) in, by hot-press equipment by R04350 circuit board and multilamellar FR4
Circuit board hot pressing is combined.
Above technical scheme is used to provide the benefit that: the TR assembly multilayer circuit board processing of the present invention
Technique, uses the ground isolation technology that through hole and blind hole combine, at microstrip line both sides and multifunction chip etc.
Microwave device surrounding is a large amount of forms using blind hole ground connection in the case of through hole ground connection cannot realize, and protect
Card forms complete shading ring, it is ensured that ground connection nearby, at utmost reduces interference.
Because the design uses multi-layer sheet technology, the 2nd layer is intactly plane layer, other internal layers
Have a large amount of cabling, and 1-2 layer blind hole ground connection is owing to will not punch whole circuit board, it is possible to press
Place continuously according to needs, do not worry getting to other internal layer holding wires, farthest protection microwave letter
Number the integrity of ground shading ring, reach emulation expection microwave property.
Accompanying drawing explanation
Fig. 1 is the structural representation of the multilayer circuit board that present invention process is made.
Wherein, 1--FR4 circuit board, 2--R04350 circuit board, 3--prepreg, 4--blind hole ground
Hole, 5--through hole ground hole, 6--holding wire blind hole, 7--microstrip line, 8--multifunction chip, 9--without
Oxygen copper carrier.
Detailed description of the invention
Describe the preferred embodiment of the present invention below in conjunction with the accompanying drawings in detail.
Fig. 1 shows the detailed description of the invention of the present invention: a kind of TR assembly multilayer circuit board, including many
Layer FR4 circuit board 1, the top layer of described heating circuit plate is provided with R04350 circuit board 2, R04350 electricity
Road plate 2 and multilamellar FR4 circuit board 1 are composited, and R04350 circuit board 2 is vertically provided with blind hole ground
Hole 4, is provided with the hole 5, through hole ground communicated between R04350 circuit board 2 and multilamellar FR4 circuit board 1,
Described R04350 circuit board 2 is provided with microstrip line 7, and R04350 circuit board 2 is embedded with multifunction chip 8,
Multifunction chip 8 and microstrip line 7 gold wire bonding.
Prepreg 3, Multifunctional core it is provided with between R04350 circuit board 2 and multilamellar FR4 circuit board 1
It is provided with oxygen-free copper carrier 9, R04350 circuit board 2 and multilamellar between sheet 8 and R04350 circuit board 2
FR4 circuit board 1 is additionally provided with the holding wire blind hole 6 communicated.
A kind of TR assembly multilayer circuit board machining process, is composited by multilayer circuit board, ground floor
For R04350 circuit board, lower circuit plate is FR4 circuit board, comprises the following steps:
1) surface of R04350 circuit board and FR4 circuit board is furnished with microstrip line, makes circuit board；
2) through hole hole, ground and signal blind hole are made on R04350 circuit board and FR4 circuit board；
3) hole, blind hole ground is made on R04350 circuit board；
R04350 circuit board is corresponding with signal blind hole identical with the hole, through hole ground arranged on FR4 circuit board
Position is arranged
4) open-blind groove on R04350 circuit board, is provided with multifunction chip in blind slot, multifunction chip and
Microstrip line is connected by gold wire bonding technique, is provided with non-oxidation copper and carries between multifunction chip and blind slot
Body, the gold wire bonding point of chip is parallel with circuit board top layer microstrip line；
5) R04350 circuit board and multilamellar FR4 circuit board are composited, by hot-press equipment by R04350
Circuit board and the circuit board hot pressing of multilamellar FR4 are combined, and are provided with prepreg between multilayer circuit board.
Use the ground isolation technology that through hole and blind hole combine, micro-at microstrip line both sides and multifunction chip etc.
Wave device surrounding is a large amount of forms using blind hole ground connection in the case of through hole ground connection cannot realize, it is ensured that
Form complete shading ring, it is ensured that ground connection nearby, at utmost reduce interference.
Because the design uses multi-layer sheet technology, the 2nd layer is intactly plane layer, other internal layers
Have a large amount of cabling, and 1-2 layer blind hole ground connection is owing to will not punch whole circuit board, it is possible to press
Place continuously according to needs, do not worry getting to other internal layer holding wires, farthest protection microwave letter
Number the integrity of ground shading ring, reach emulation expection microwave property.
Multifunction chip in circuit board, merit divide chip and transmit-receive switch control chip to use groove to sink shape
Formula is placed, the open-blind groove technology of combined circuit plate, it is ensured that the silk pressing bonding point of these chips and circuit
Plate top layer microstrip line is parallel, it is ensured that the signal integrity during microwave signal transmission.
Microstrip line is that a banding is led (holding wire), and opens by a kind of dielectric isolation between ground level.
The thickness of printed conductor, width, printed conductor and the distance on stratum and dielectric dielectric constant are certainly
Determine the characteristic impedance of microstrip line.If the thickness of line, width and and ground level between distance be
Controllable, then its characteristic impedance also can control.
Integrated circuit is used as the billon silk of connecting line, also known as ball bonding spun gold or lead-in wire spun gold.Jin Han
Amount>=99.99%, trace additives summation<0.01%.There are three kinds of γ type, c-type and FA type etc.,
Latter two is for being bonded at a high speed.Trace element is that beryllium, copper, silver etc. have crystal grain thinning, improves and ties
Brilliant temperature and the effect of strengthening gold.Use coreless induction furnace vacuum melting, secondary remelting and crystallographic orientation, ingot casting
After homogenization, cold working is become a useful person.Or manufacture with liquid extrusion process.Bonding gold wire is microelectronics industry
Important materials, as connecting line between chip and lead frame.
Above-described is only the preferred embodiment of the present invention, it is noted that general for this area
For logical technical staff, without departing from the concept of the premise of the invention, it is also possible to make some changes
Shape and improvement, these broadly fall into protection scope of the present invention.
Claims (8)
1. a TR assembly multilayer circuit board, including multilamellar FR4 circuit board, it is characterised in that described many
It is multiple that the top layer of layer FR4 circuit board is provided with R04350 circuit board, R04350 circuit board and multilamellar FR4 circuit board
Conjunction forms, and R04350 circuit board is vertically provided with hole, blind hole ground, R04350 circuit board and multilamellar FR4 circuit
Being provided with the hole, through hole ground communicated between plate, described R04350 circuit board is provided with microstrip line, R04350 circuit board
It is embedded with multifunction chip, multifunction chip and microstrip line gold wire bonding.
TR assembly multilayer circuit board the most according to claim 1, it is characterised in that described R04350
It is provided with prepreg between circuit board and multilamellar FR4 circuit board.
X frequency range TR assembly multilayer circuit board the most according to claim 1, it is characterised in that described
Oxygen-free copper carrier it is provided with between multifunction chip and R04350 circuit board.
TR assembly multilayer circuit board the most according to claim 1, it is characterised in that described R04350
Circuit board and multilamellar FR4 circuit board are additionally provided with the holding wire blind hole communicated.
5. produce a TR assembly multilayer circuit board machining process described in claim 1-4 any one, by
Multilayer circuit board is composited, and ground floor is R04350 circuit board, and lower circuit plate is FR4 circuit board,
It is characterized in that, comprise the following steps:
1) surface of R04350 circuit board and FR4 circuit board is furnished with microstrip line, makes circuit board；
2) through hole hole, ground and signal blind hole are made on R04350 circuit board and FR4 circuit board；
3) hole, blind hole ground is made on R04350 circuit board；
4) open-blind groove on R04350 circuit board, is provided with multifunction chip, multifunction chip and blind slot in blind slot
Between be provided with non-oxidation copper carrier；Multifunction chip is connected by gold wire bonding technique with microstrip line；
5) R04350 circuit board and multilamellar FR4 circuit board are composited.
TR assembly multilayer circuit board machining process the most according to claim 5, it is characterised in that institute
State step 2) in, R04350 circuit board is corresponding with signal blind hole with the hole, through hole ground arranged on FR4 circuit board
Identical position is arranged.
TR assembly multilayer circuit board machining process the most according to claim 5, it is characterised in that institute
State step 4) in, the gold wire bonding point of chip is parallel with circuit board top layer microstrip line.
TR assembly multilayer circuit board machining process the most according to claim 5, it is characterised in that institute
State step 5) in, by hot-press equipment, R04350 circuit board and the circuit board hot pressing of multilamellar FR4 are combined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610452580.7A CN106028642A (en) | 2016-06-22 | 2016-06-22 | TR assembly multilayer circuit board and processing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610452580.7A CN106028642A (en) | 2016-06-22 | 2016-06-22 | TR assembly multilayer circuit board and processing technology thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106028642A true CN106028642A (en) | 2016-10-12 |
Family
ID=57086325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610452580.7A Pending CN106028642A (en) | 2016-06-22 | 2016-06-22 | TR assembly multilayer circuit board and processing technology thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106028642A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981720A (en) * | 2017-01-12 | 2017-07-25 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The integrated TR components of millimeter wave tile style phased array antenna |
| CN108304646A (en) * | 2018-01-30 | 2018-07-20 | 中国电子科技集团公司第三十八研究所 | A kind of multidisciplined modeling and design method of multichannel chip TR components |
| CN110337175A (en) * | 2019-07-05 | 2019-10-15 | 上海航天电子通讯设备研究所 | X-band four-way TR component multilayer board |
| CN112437535A (en) * | 2020-11-02 | 2021-03-02 | 中国电子科技集团公司第三十八研究所 | Radio frequency front end with high stability |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981720A (en) * | 2017-01-12 | 2017-07-25 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The integrated TR components of millimeter wave tile style phased array antenna |
| CN106981720B (en) * | 2017-01-12 | 2020-07-17 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Integrated TR subassembly of millimeter wave tile formula phased array antenna |
| CN108304646A (en) * | 2018-01-30 | 2018-07-20 | 中国电子科技集团公司第三十八研究所 | A kind of multidisciplined modeling and design method of multichannel chip TR components |
| CN108304646B (en) * | 2018-01-30 | 2021-07-23 | 中国电子科技集团公司第三十八研究所 | Multidisciplinary modeling and design method of multichannel chip type TR (transmitter-receiver) component |
| CN110337175A (en) * | 2019-07-05 | 2019-10-15 | 上海航天电子通讯设备研究所 | X-band four-way TR component multilayer board |
| CN112437535A (en) * | 2020-11-02 | 2021-03-02 | 中国电子科技集团公司第三十八研究所 | Radio frequency front end with high stability |
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Application publication date: 20161012 |
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