CN201213154Y - Back cavity micro-band antenna - Google Patents
Back cavity micro-band antenna Download PDFInfo
- Publication number
- CN201213154Y CN201213154Y CNU2008200348950U CN200820034895U CN201213154Y CN 201213154 Y CN201213154 Y CN 201213154Y CN U2008200348950 U CNU2008200348950 U CN U2008200348950U CN 200820034895 U CN200820034895 U CN 200820034895U CN 201213154 Y CN201213154 Y CN 201213154Y
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- cavity
- band plate
- little band
- hole
- metallic cavity
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Abstract
The utility model provides a cavity-backed microstrip antenna, which solves the problems that the prior multilayer microstrip antenna has complicated processing technology and poor heat radiation property. The cavity-backed microstrip antenna comprises a metal cavity body and a microstrip plate, wherein a U-shaped slot is etched on a copper foil on the back surface of the microstrip plate, a metal probe is welded on the back surface of the microstrip plate, and a medium housing is wrapped around the metal probe. A microstrip plate is inlaid in the cavity mouth of the metal cavity body and is sealed, and the metal probe and the medium housing are penetrated out from the hole at the bottom of the metal cavity body. Compared with the traditional multilayer microstrip antenna, the utility model has the advantages of simple structure, easy assembly, high mechanical strength, good temperature stability and non-debugging, in addition, the utility model can ensure enough band width and gain.
Description
Technical field
The utility model belongs to microwave technical field, is specifically related to a kind of back cavity type microstrip antenna.
Background technology
Microstrip antenna because in light weight, section is little, machining accuracy is high, be easy to numerous advantages such as integrated has been applied in radar, communication, navigation and electronic countermeasures field more and more at large.But multi-layer microstrip antenna also brings some problems to processing and manufacturing when obtaining wider bandwidth.
Traditional multi-layer microstrip antenna is in order to obtain enough bandwidth, the cross-section structure complexity, existing little belt has froth bed again, need viscose glue between layer and the layer, need vacuum thermosetting in incubator after finish the location, the processing technology complexity is very high to technological requirement, the heat dissipation characteristics of antenna is poor, suction easily under wet environment.And thermal coefficient of expansion difference between the different materials, the change that can bring the telecommunication performance.
The utility model content
In order to solve existing multi-layer microstrip antenna processing technology complexity, the heat dissipation characteristics of antenna is poor, the problem that absorbs water easily under wet environment.The purpose of this utility model is to provide a kind of assembling simple in structure easy, need not debug the back cavity type single layer microstrip antenna that temperature stability is good.
Technical solution of the present utility model is as follows:
The back cavity type microstrip antenna, comprise little band plate 1 and metallic cavity 2, the back side of little band plate 1 is covered with covers Copper Foil 3, covering the geometric center of Copper Foil 3 and the geometric center of little band plate 1 overlaps, the geometric center of little band plate 1 is provided with plated-through hole 8, the front of little band plate 1 is provided with weld-ring 6, and the center of the center of weld-ring 6 and plated-through hole 8 overlaps;
Cover that etching has U type groove 7 on the Copper Foil 3, the thickness of U type groove 7 and the thickness that covers Copper Foil 3 equate that metal probe 4 is positioned at U type groove 7;
The geometric center of little band plate 1 and metallic cavity 2 overlaps, and little band plate 1 is inlaid in the accent position of metallic cavity 2, and encapsulation process, and the back side of little band plate 1 is in metallic cavity 2 chambeies;
The chamber of metallic cavity 2 is 12 millimeters deeply.
Compare with traditional multi-layer microstrip antenna, the utility model is simple in structure, and assembling is easy, the mechanical strength height, and temperature stability is good, need not debugging, and can guarantee enough bandwidth and gain.
Description of drawings
Fig. 1 is the utility model profile;
Fig. 2 is the utility model vertical view;
Fig. 3 is the little band plate structural representation of the utility model;
Fig. 4 is the utility model metallic cavity stereogram;
Fig. 5 is the antenna standing wave resolution chart of the utility model embodiment;
Fig. 6 is the antenna gain curve of the utility model embodiment;
Fig. 7 is the centre frequency E face directional diagram of the utility model embodiment;
Fig. 8 is the centre frequency H face directional diagram of the utility model embodiment.
Specific embodiments
As Fig. 1-shown in Figure 8, a specific embodiments of the present utility model is as follows:
A kind of back cavity type microstrip antenna, comprise little band plate 1 and metallic cavity 2, it is characterized in that: the back side of little band plate 1 is covered with covers Copper Foil 3, covering the geometric center of Copper Foil 3 and the geometric center of little band plate 1 overlaps, the geometric center of little band plate 1 is provided with plated-through hole 8, the front of little band plate 1 is provided with weld-ring 6, and the center of the center of weld-ring 6 and plated-through hole 8 overlaps;
Cover that etching has U type groove 7 on the Copper Foil 3, the thickness of U type groove 7 and the thickness that covers Copper Foil 3 equate that metal probe 4 is positioned at U type groove 7;
The geometric center of little band plate 1 and metallic cavity 2 overlaps, and little band plate 1 is inlaid in the accent position of metallic cavity 2, and encapsulation process, and the back side of little band plate 1 is in metallic cavity 2 chambeies;
The chamber of metallic cavity 2 is 12 millimeters deeply.
The size of whole unit is 120mm * 102mm, and bonding by special gelatin between little band plate and the metallic cavity, little band plate is rectangular, embeds among the metallic cavity.As shown in Figure 3, little band plate front etch, only keep center bonding pads, pad diameter 3mm, the reverse side Copper Foil is the rectangular area of 78mm * 71mm, and the Copper Foil zone contains U-lag (changing each parameter scalable coupling), and probe passes plated-through hole, pad place soldering in little band plate front guarantees to contact well with the Copper Foil of little band plate reverse side.
Little band plate is selected composite microwave medium substrate RO4350 for use, dielectric thickness 1.524mm, copper thickness 18um, dielectric constant 3.48, plated-through hole diameter 1.4mm.
The metal backing chamber plays a part to support little band plate, and size is 120mm * 102mm.As shown in Figure 4, the dark 12mm in chamber, for the consideration of weight and intensity, cavity is selected aluminium for use.Frame is the position of unit hold-down screw for four jiaos, and by glue bond, contact width is 5mm between little band plate and the metal backing chamber, little band plate extension has bound edge and the little band plate flush of height 1.524mm, width is 1mm, owing to connect glue certain thickness is arranged, and the contact-making surface of 5mm need mill 0.2mm downwards.The gap that also need leave 0.5mm simultaneously between bound edge and the little band plate guarantees to connect effective sealing of glue.The bottom outlet of N Connector is left in the bottom surface in metal backing chamber, and diameter is about 4.2mm.
The antenna element feed adopts the feedback of the coaxial end, and probe location is the geometric center of little band plate.Probe diameter is 1.27mm, and probe location must not be offset above 0.1mm.
U type groove and chamber have guaranteed that deeply antenna has enough bandwidth and gain.Result such as Fig. 5 of present embodiment test, Fig. 6, Fig. 7, shown in Figure 8.
Claims (4)
1. back cavity type microstrip antenna, comprise little band plate (1) and metallic cavity (2), it is characterized in that: the back side of little band plate (1) is covered with covers Copper Foil (3), covering the geometric center of Copper Foil (3) and the geometric center of little band plate (1) overlaps, the geometric center of little band plate (1) is provided with plated-through hole (8), the front of little band plate (1) is provided with weld-ring (6), and the center of the center of weld-ring (6) and plated-through hole (8) overlaps;
Metal probe (4) one ends pass plated-through hole (8) and and weld-ring (6) weld, metal probe (4) periphery is enclosed with medium socket (5), medium socket (5) and metal probe (4) hole (10) in the middle part of the metallic cavity (2) passes;
Covering the last etching of Copper Foil (3) has U type groove (7), and the thickness of U type groove (7) equates that with the thickness that covers Copper Foil (3) metal probe (4) is positioned at U type groove (7);
Metallic cavity (2) is blind cavity configuration, and metallic cavity (2) accent outer is provided with the flange that section is a rectangle (9), and the geometric center place of metallic cavity (2) is provided with hole (10);
The geometric center of little band plate (1) and metallic cavity (2) overlaps, and little band plate (1) is inlaid in the accent position of metallic cavity (2), and the back side of little band plate (1) is in metallic cavity (2) chamber.
2. the said back cavity type microstrip antenna of claim 1, it is characterized in that: U type groove (7) is an axial symmetry with the cross central line of little band plate (1), 22.5 millimeters of bottom land inboard and plated-through hole (8) centre distances, two inwalls of U type groove (7) are parallel, and distance is 12 millimeters, bottom land is vertical with cell wall, and groove inwall length is 38 millimeters, 5 millimeters of groove widths.
3. the said back cavity type microstrip antenna of claim 1 is characterized in that: little band plate (1) employing composite microwave medium substrate R04350.
4. the said back cavity type microstrip antenna of claim 1, it is characterized in that: the cavity depth of metallic cavity (2) is 12 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200348950U CN201213154Y (en) | 2008-04-28 | 2008-04-28 | Back cavity micro-band antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200348950U CN201213154Y (en) | 2008-04-28 | 2008-04-28 | Back cavity micro-band antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201213154Y true CN201213154Y (en) | 2009-03-25 |
Family
ID=40497332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200348950U Expired - Lifetime CN201213154Y (en) | 2008-04-28 | 2008-04-28 | Back cavity micro-band antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201213154Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346386A (en) * | 2013-06-18 | 2013-10-09 | 哈尔滨工业大学 | Omnibearing broadband form attaching antenna for plane communication |
| CN103904423A (en) * | 2012-12-28 | 2014-07-02 | 中国航空工业第六○七研究所 | Low profile broadband medium back cavity four radiator antenna unit |
| CN104600432A (en) * | 2014-12-30 | 2015-05-06 | 北京理工雷科电子信息技术有限公司 | Small wide-beam microstrip antenna |
| CN104659479A (en) * | 2013-11-20 | 2015-05-27 | 三星电子株式会社 | Microstrip patch antenna in cavity-backed structure including via-hole |
| CN106028642A (en) * | 2016-06-22 | 2016-10-12 | 安徽天兵电子科技有限公司 | TR assembly multilayer circuit board and processing technology thereof |
| CN107146940A (en) * | 2017-05-16 | 2017-09-08 | 中国电子科技集团公司第三十六研究所 | A kind of conformal communication antenna and its installation method |
| CN107171052A (en) * | 2017-05-16 | 2017-09-15 | 中国电子科技集团公司第三十六研究所 | A kind of communication antenna and its installation and removal method |
| CN109904584A (en) * | 2019-01-29 | 2019-06-18 | 中国电子科技集团公司第三十八研究所 | A kind of dual polarized microstrip patch antenna unit and antenna array |
-
2008
- 2008-04-28 CN CNU2008200348950U patent/CN201213154Y/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103904423A (en) * | 2012-12-28 | 2014-07-02 | 中国航空工业第六○七研究所 | Low profile broadband medium back cavity four radiator antenna unit |
| CN103904423B (en) * | 2012-12-28 | 2016-07-13 | 中国航空工业第六○七研究所 | A kind of low section broadband medium back of the body chamber four radiator antenna unit |
| CN103346386B (en) * | 2013-06-18 | 2015-04-29 | 哈尔滨工业大学 | Omnibearing broadband form attaching antenna for plane communication |
| CN103346386A (en) * | 2013-06-18 | 2013-10-09 | 哈尔滨工业大学 | Omnibearing broadband form attaching antenna for plane communication |
| US10122091B2 (en) | 2013-11-20 | 2018-11-06 | Samsung Electronics Co., Ltd. | Microstrip patch antenna in cavity-backed structure including via-hole |
| CN104659479A (en) * | 2013-11-20 | 2015-05-27 | 三星电子株式会社 | Microstrip patch antenna in cavity-backed structure including via-hole |
| CN104659479B (en) * | 2013-11-20 | 2021-10-15 | 三星电子株式会社 | Microstrip patch antenna in cavity-backed structure including via hole |
| CN104600432A (en) * | 2014-12-30 | 2015-05-06 | 北京理工雷科电子信息技术有限公司 | Small wide-beam microstrip antenna |
| CN104600432B (en) * | 2014-12-30 | 2017-08-25 | 北京理工雷科电子信息技术有限公司 | One kind miniaturization broad beam microstrip antenna |
| CN106028642A (en) * | 2016-06-22 | 2016-10-12 | 安徽天兵电子科技有限公司 | TR assembly multilayer circuit board and processing technology thereof |
| CN107171052A (en) * | 2017-05-16 | 2017-09-15 | 中国电子科技集团公司第三十六研究所 | A kind of communication antenna and its installation and removal method |
| CN107171052B (en) * | 2017-05-16 | 2019-09-13 | 中国电子科技集团公司第三十六研究所 | A kind of communication antenna and its installation and removal method |
| CN107146940A (en) * | 2017-05-16 | 2017-09-08 | 中国电子科技集团公司第三十六研究所 | A kind of conformal communication antenna and its installation method |
| CN109904584A (en) * | 2019-01-29 | 2019-06-18 | 中国电子科技集团公司第三十八研究所 | A kind of dual polarized microstrip patch antenna unit and antenna array |
| CN109904584B (en) * | 2019-01-29 | 2021-08-03 | 中国电子科技集团公司第三十八研究所 | Dual-polarized microstrip patch antenna unit and antenna array |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090325 |
|
| CX01 | Expiry of patent term |