CN113271709B - Multilayer printed circuit laminated structure and packaging structure of metal core plate - Google Patents

Multilayer printed circuit laminated structure and packaging structure of metal core plate Download PDF

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Publication number
CN113271709B
CN113271709B CN202110317590.0A CN202110317590A CN113271709B CN 113271709 B CN113271709 B CN 113271709B CN 202110317590 A CN202110317590 A CN 202110317590A CN 113271709 B CN113271709 B CN 113271709B
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frequency
printed circuit
metal core
groove
core
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CN113271709A (en
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王欢
王超
李洪
蔡雪芳
张文锋
鲁新建
罗亮平
王睿
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CETC 29 Research Institute
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CETC 29 Research Institute
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention relates to the technical field of microwave and millimeter wave circuits, and particularly discloses a multilayer printed circuit laminated structure of a metal core plate, which comprises two low-frequency core plates, two high-frequency core plates, the metal core plate and high-frequency core plate connecting pieces, wherein the high-frequency core plate connecting pieces penetrate through the metal core plates and are respectively connected with the two high-frequency core plates; the two high-frequency core plates are positioned at two sides of the metal core plate, and the two low-frequency core plates are respectively positioned at one sides of the two high-frequency core plates far away from the metal core plate; a first through hole is formed in the lamination formed by the two high-frequency core boards and the metal core board. And a package structure based on the multilayer printed circuit laminated structure; the invention arranges the metal core plate at the middle position, directly uses as microwave, and has the efficacy of improving the structural strength and the heat conduction characteristic of the circuit.

Description

Multilayer printed circuit laminated structure and packaging structure of metal core plate
Technical Field
The invention relates to the technical field of microwave and millimeter wave circuits, in particular to a multilayer printed circuit laminated structure and a packaging structure of a metal core plate.
Background
The microwave millimeter wave multilayer printed circuit is generally obtained by laminating high-frequency laminated board materials for multiple times, the interconnection among signals is in a microstrip line or strip line mode, an internal ground attribute layer is connected to the outer surface of the multilayer printed circuit through a via hole, and the outer surface is in contact with metal to realize grounding during installation.
Chinese patent CN 204836771U discloses a multilayer microwave digital composite substrate, which is composed of a lower digital multilayer board, a microwave multilayer board and an upper digital multilayer board from bottom to top; the functions of microwave telecommunication, microwave control and power supply are realized by three PCB substrates, and the functions are realized by one composite substrate.
Chinese patent CN108226870A discloses a microwave digital power supply composite substrate circuit and feeder device based on a sandwich structure, wherein the sandwich structure sequentially includes a control circuit printed board, a microstrip line and a power circuit printed board from top to bottom.
The integrated form disclosed in the above two patent documents has the following disadvantages:
the microwave circuit layer is positioned in the middle layer of the lamination, the ground attribute layer of the microwave circuit is required to be connected to the outer surface of the multilayer printed circuit structure through the via hole to realize signal grounding, and the via hole can show a strong inductance effect along with the increase of frequency, so that the grounding effect of the microwave signal is changed, when the frequency is higher than a millimeter wave frequency band, even grounding failure can occur, and the signal transmission is seriously influenced;
chinese patent CN 105407628B, discloses a microwave digital device and its processing method; the composite circuit board is mainly laminated with the metal shell after being filled with glue, and the metal shell is positioned on the surface of the composite board and is completely exposed.
Chinese patent CN 202503804U discloses a single-sided double-layer circuit board, which includes a circuit board with circuits printed on both sides, and a metal plate laminated on one side of the circuit board through an insulating layer. This patent covers metal substrate in circuit board one side, with the help of sheet metal's high thermal conductivity, does benefit to the heat dissipation.
In the two patent documents, the metal substrate is located on the outer surface of the laminated multilayer printed circuit, so that the structural strength and the heat conduction characteristic of the circuit are improved, but in the process of microwave ground, the microwave ground is still connected to the outer surface of the printed circuit board through the interlayer via hole and then is contacted with the metal layer, so that the inductance effect of the grounding via hole cannot be avoided, the grounding effect of microwave signals is poor, and the transmission characteristic of the signals is influenced.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a multilayer printed circuit laminated structure and a packaging structure of a metal core plate; the metal core plate is arranged in the middle position and directly used as a microwave, and meanwhile, the metal core plate has the effects of improving the structural strength and the heat conduction characteristic of a circuit.
The technical problem to be solved by the invention is as follows:
on the one hand, the method comprises the following steps of,
a multi-layer printed circuit laminated structure of a metal core plate comprises two low-frequency core plates, two high-frequency core plates, the metal core plate and high-frequency core plate connecting pieces which penetrate through the metal core plates and are respectively connected with the two high-frequency core plates; the two high-frequency core plates are positioned at two sides of the metal core plate, and the two low-frequency core plates are respectively positioned at one sides of the two high-frequency core plates far away from the metal core plate; a first through hole is formed in the lamination formed by the two high-frequency core boards and the metal core board.
According to the invention, the metal core plate is arranged in the middle of the whole structure, and the metal core is directly used as a signal ground for microwave or millimeter wave signal transmission, so that the high-frequency inductance effect caused by via hole grounding is avoided, and the electrical property of microwave or millimeter wave signals can be improved; the metal layer is arranged in the middle and directly used as microwave; meanwhile, the structure strength and the heat conduction characteristic of the circuit are improved.
The microwave or millimeter wave is positioned in the laminated structure, the outer surface of the laminated layer is not influenced, surface-mounted packaging devices can be mounted on the outer surfaces of the upper side and the lower side, the integration density is improved, and the area of the cloth plate can be reduced.
In some possible embodiments, in order to effectively realize the electrical connection of the two high-frequency core boards, pads are arranged on the sides of the two high-frequency core boards, which are far away from each other, and the pads are positioned at two ends of the first through hole; the first via hole is a metal solid via hole.
In some possible embodiments, in order to effectively implement the installation of the chip, the microwave or the millimeter wave device, the low-frequency core plate is provided with a first hollow groove, and the high-frequency core plate is provided with a second hollow groove, wherein the first hollow groove and the second hollow groove are sequentially communicated.
In some possible embodiments, the size of the first hollow-out groove is larger than that of the second hollow-out groove; and a high-frequency signal leading-out pattern is arranged on one side of the high-frequency core plate close to the first hollow groove.
The high-frequency signal leading-out pattern is used for indicating the electrical connection of the high-frequency core board and other devices.
In some possible embodiments, a groove is arranged on one side of the metal core board close to the high-frequency core board; the groove, the second hollow groove and the first hollow groove are communicated in sequence.
The purpose of the grooves is to allow the chip to be mounted on the core.
On the other hand, in the case of a liquid,
a multi-layer printed circuit packaging structure of a metal core board comprises the multi-layer printed circuit laminated structure, a box body for installing the multi-layer printed circuit laminated structure, a radio frequency connector and a transmission line connected with the multi-layer printed circuit laminated structure and the radio frequency connector respectively.
In some possible embodiments, the box body is provided with a stepped mounting groove, which comprises a first stepped groove, a second stepped groove and a third stepped groove, wherein the cross-sectional sizes of the first stepped groove, the second stepped groove and the third stepped groove are gradually decreased; multilayer printed circuit laminated structure installs in ladder groove two, the transmission line is installed in ladder groove one end bottom.
In some possible embodiments, the side of the transmission line close to the first stepped slot is connected with the high-frequency core board, and the end of the transmission line far away from the multilayer printed circuit laminated structure is connected with the radio-frequency connector.
In some possible embodiments, a gold strip is welded at one end of the transmission line close to the radio frequency connector, and the gold strip and the radio frequency connector are connected through the gold strip; the other end of the transmission line is welded with a gold wire and is connected with the high-frequency core board through the gold wire.
In some possible embodiments, the mounting groove is a hollow structure, and further includes a cover plate mounted on the box body to seal the mounting groove.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, high-frequency and low-frequency wiring is adopted for partitioning, the low-frequency signal wiring layer is made of low-frequency materials, and the high-frequency signal wiring layer is made of high-frequency materials, so that the electromagnetic compatibility among high-frequency and low-frequency signals is improved, meanwhile, the unnecessary consumption of high-frequency plates is reduced, and the cost is reduced;
according to the invention, the metal core plate is arranged in the middle, and the metal core plate is directly used as a signal ground for microwave or millimeter wave signal transmission, so that the high-frequency inductance effect caused by via hole grounding is avoided, and the electrical property of microwave or millimeter wave signals can be improved;
the surface of the metal core plate is milled and grooved, so that the height of the mounting interface of the microwave or millimeter wave device is adjusted, the mounting interface and the signal transmission line are positioned on the same plane, and the electrical property of microwave or millimeter wave signals can be improved;
the millimeter wave signal is positioned in the lamination layer, the outer surface of the lamination layer is not influenced, surface-mounted packaging devices can be mounted on the outer surfaces of two sides of the lamination layer, the integration density is improved, and the board distribution area can be reduced.
Drawings
FIG. 1 is a schematic view of a multilayer printed circuit laminate structure according to the present invention;
FIG. 2 is a schematic view of a package structure according to the present invention;
FIG. 3 is an enlarged view taken at A in FIG. 2 according to the present invention;
FIG. 4 is a schematic view of the mounting position of the surface device of the multilayer printed circuit laminated structure in the invention;
wherein: 11. a low frequency core board; 12. a high-frequency core board; 13. a metal core plate; 14. a first via hole; 141. a pad; 142. a resin; 15. a device mounting groove; 151. a high-frequency signal lead-out pattern; 152. a groove; 16. Surface mounting the packaged device; 2. a cover plate; 3. a box body; 4. a radio frequency connector; 41. a metal inner conductor; 42. Grooving the cavity; 5. a transmission line; 6. a screw; 7. gold bands; 8. gold wire.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail and completely with reference to the accompanying drawings. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the detailed description of the embodiments of the present invention provided below is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention.
In the description of the present invention, it is to be understood that the terms indicating an orientation or positional relationship are based on the orientation or positional relationship shown in the drawings only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the drawings of the present invention, it should be understood that different technical features which are not mutually substituted are shown in the same drawing only for the convenience of simplifying the drawing description and reducing the number of drawings, and the embodiment described with reference to the drawings does not indicate or imply that all the technical features in the drawings are included, and thus the present invention is not to be construed as being limited thereto.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. Reference herein to "first," "second," and similar words, does not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. In the implementation of the present application, "and/or" describes an association relationship of associated objects, which means that there may be three relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In the description of the embodiments of the present application, the meaning of "a plurality" means two or more unless otherwise specified. For example, the plurality of positioning posts refers to two or more positioning posts. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The present invention will be described in detail below.
On the one hand, the method comprises the following steps of,
as shown in fig. 1, a multilayer printed circuit laminated structure of a metal core 13 includes two low frequency core 11, two high frequency core 12, a metal core 13, and high frequency core 12 connectors passing through the metal core 13 and respectively connected to the two high frequency core 12; the two high-frequency core plates 12 are positioned at two sides of the metal core plate 13, and the two low-frequency core plates 11 are respectively positioned at one sides of the two high-frequency core plates 12 far away from the metal core plate 13; the first via hole 14 is provided in the stack formed by the two high-frequency core boards 12 and the metal core board 13.
According to the invention, the metal core plate 13 is arranged in the middle of the whole structure, and the metal core is directly used as a signal ground for microwave or millimeter wave signal transmission, so that the high-frequency inductance effect caused by via hole grounding is avoided, and the electrical property of microwave or millimeter wave signals can be improved; the metal layer is arranged in the middle and directly used as microwave; meanwhile, the structure strength and the heat conduction characteristic of the circuit are improved.
In some possible embodiments, in order to effectively achieve the electrical connection of the two high-frequency core boards 12, a pad 141 is provided on a side of the two high-frequency core boards 12 away from each other, the pad 141 being located at both ends of the first via hole 14; the first via hole 14 is a metal solid via hole, and a gap between the metal solid via hole and the metal core is filled with resin 142.
In some possible embodiments, in order to effectively implement the installation of the chip, the microwave or the millimeter wave device, the low-frequency core plate 11 is provided with a first hollow groove, and the high-frequency core plate 12 is provided with a second hollow groove, wherein the first hollow groove and the second hollow groove are sequentially communicated.
The first hollow groove and the second hollow groove are communicated to form a device mounting groove 15; the purpose of this arrangement is to make the devices mounted on the high-frequency core board 12 and the metal core board 13 be located inside the laminated structure, without affecting the outer surface of the laminate, so that the surface-mounted package devices 16 can be mounted on the outer surfaces of both the upper and lower sides as shown in fig. 1, thereby improving the integration density and reducing the board layout area.
In some possible embodiments, the size of the first hollow-out groove is larger than that of the second hollow-out groove; and a high-frequency signal leading-out pattern 151 is arranged on one side of the high-frequency core plate 12 close to the first hollow groove.
When the high-frequency signal is transmitted in the printed board, the high-frequency signal is a strip line signal buried in the printed board and is electrically connected with the chip on the metal core board 13; the high frequency signal leading-out pattern arranged on the high frequency core plate 12 is a connection point for electrical connection with a chip, so the low frequency core plate 11 and the high frequency core plate 12 are grooved, after the grooving, the upper layer core plate material of the original strip line structure is lost and becomes an air layer, the strip line structure of the original signal is damaged and becomes a micro-strip line structure, the 50 ohm line widths of the two structures are different, therefore, the transition between different line widths is completed by using the position of the high frequency signal leading-out pattern 151, the preferred high frequency signal leading-out pattern 151 is a trapezoidal transition pattern, the strip line buried in the high frequency signal leading-out pattern is led out and transited to the micro-strip line structure, and the high frequency signal leading-out pattern is installed in electrical communication with the outside.
In some possible embodiments, in order to adjust the height of the chip mounting interface to be in the same plane as the signal transmission line 42, the electrical performance of the signal can be improved; a groove 152 is formed in one side, close to the high-frequency core plate 12, of the metal core plate 13; the groove 152, the second hollow groove and the first hollow groove are communicated in sequence.
The purpose of the grooves 152 is to allow the chip to be mounted on the core board.
In order to facilitate the definition of the opening position of the groove 152, the metal core milling pattern for determining the chip mounting position is provided on the metal core plate 13 to determine the chip mounting position, and further determine the position of the groove 152, preferably, the shape of the groove 152 is slightly larger than the chip itself, specifically, 0.1mm larger than the shape of the chip to be mounted in the signal transmission direction, which is to avoid the influence on the transmission performance due to the excessively large gap in the transmission direction. In the non-signal transmission direction, namely the direction perpendicular to the transmission direction of the transmission signal, the size has no quantification requirement, and the operation space for the tweezers can be reserved conveniently when the tweezers are installed as long as the size is larger than the appearance of the chip.
Preferably, as shown in fig. 1, the depth of the groove 152 may be 0mm, and the 0mm described herein means that the groove 152 is not milled, and may be smaller than the thickness of the metal core plate 13;
the purpose of this is to: the height position of the input/output port of the mounting chip can be effectively adjusted, so that the input/output port of the chip and the high-frequency signal lead-out pattern 151 on the printed board are at the same height, therefore, whether to mill the groove 152 can be selected according to the height position of the chip port, and if the height position is at the same height, milling is not needed.
As shown in fig. 1, the first hollow-out groove, the second hollow-out groove, and the groove 152 may be disposed on the upper side, the lower side, or both the upper side and the lower side, which may be freely selected according to design conditions.
On the other hand, in the case of a liquid,
as shown in fig. 2, fig. 3 and fig. 4, a multi-layer printed circuit package structure of a metal core board includes the above-mentioned multi-layer printed circuit laminated structure, a box 3 for mounting the multi-layer printed circuit laminated structure, a radio frequency connector 4, and a transmission line 42 respectively connected to the multi-layer printed circuit laminated structure and the radio frequency connector 4.
Preferably, the transmission line 42 is a microstrip transmission line 42.
Preferably, the multilayer printed circuit laminated structure is arranged in the box body 3 through a screw 6, and the radio frequency connector 4 is arranged on the outer side of the box body 3;
in some possible embodiments, the box body 3 is provided with a stepped mounting groove, which includes a first stepped groove, a second stepped groove and a third stepped groove, wherein the cross-sectional dimensions of the first stepped groove, the second stepped groove and the third stepped groove are gradually decreased; the multilayer printed circuit laminated structure is arranged in the second step groove, and the transmission line 42 is arranged at the bottom of one end of the step groove.
The surface mount package device 16 is mounted on the upper and/or lower surface of the multilayer printed circuit stack structure and is located in the first stepped groove and/or the second stepped groove.
The bottom of the second stepped groove serves as a supporting surface of the multilayer printed circuit laminated structure, and the transmission line 42 is bonded to the bottom of the first stepped groove and is connected with the radio frequency connector 4 and the multilayer printed circuit laminated structure.
In some possible embodiments, the side of the transmission line 42 close to the first stepped slot is connected to the high-frequency core 12, and the end thereof away from the multilayer printed circuit laminated structure is connected to the radio-frequency connector 4.
In some possible embodiments, a gold strip 7 is welded to one end of the transmission line 42 close to the radio frequency connector 4, and the gold strip 7 is connected with the radio frequency connector 4; the other end of the transmission line 42 is welded with a gold wire 8, and is connected with the high-frequency signal leading-out pattern 151 on the high-frequency core board 12 through the gold wire 8.
Preferably, the outer side of the box body 3 is provided with a cavity slot 42 for installing the radio frequency connector 4, the radio frequency connector 4 is installed in the cavity slot 42, and the metal inner conductor 41 of the radio frequency connector enters the box body 3; the transmission line 42 welded with the gold strip 7 is wrapped on the metal inner conductor 41 of the radio frequency connector 4 in a wrapping mode, and therefore the radio frequency connector 4 is electrically communicated with the transmission line 42.
In some possible embodiments, the mounting groove is a hollow structure, and further includes a cover plate 2 mounted on the box body 3 to seal the mounting groove.
Preferably, the cover plate 2 and the box body 3 are connected in a laser seal welding mode; and the sealing performance is ensured.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.

Claims (9)

1. A multi-layer printed circuit packaging structure of a metal core board is characterized by comprising a multi-layer printed circuit laminated structure, a box body for installing the multi-layer printed circuit laminated structure, a radio frequency connector and a transmission line, wherein the transmission line is respectively connected with the multi-layer printed circuit laminated structure and the radio frequency connector;
the multilayer printed circuit laminated structure comprises two low-frequency core plates, two high-frequency core plates, a metal core plate and high-frequency core plate connecting pieces which penetrate through the metal core plate and are respectively connected with the two high-frequency core plates; the two high-frequency core plates are positioned at two sides of the metal core plate, and the two low-frequency core plates are respectively positioned at one sides of the two high-frequency core plates far away from the metal core plate; a first through hole is formed in the lamination formed by the two high-frequency core boards and the metal core board.
2. The metal core multilayer printed circuit packaging structure of claim 1, wherein the box body is provided with a stepped mounting groove comprising a first stepped groove, a second stepped groove and a third stepped groove, the cross-sectional dimensions of which are gradually reduced; multilayer printed circuit laminated structure installs in ladder groove two, the transmission line is installed in ladder groove one end bottom.
3. The package of claim 2, wherein the side of the transmission line adjacent to the first step slot is connected to the high frequency core, and the end of the transmission line away from the multilayer printed circuit laminate is connected to the rf connector.
4. The package structure of claim 3, wherein a gold strap is soldered to the end of the transmission line near the rf connector, and the gold strap is connected to the rf connector; the other end of the transmission line is welded with a gold wire and is connected with the high-frequency core board through the gold wire.
5. The package structure of multi-layer printed circuit of metal core as claimed in any one of claims 2-4, wherein the mounting slot is hollowed out, further comprising a cover plate mounted on the box body for closing the mounting slot.
6. The multi-layer printed circuit packaging structure of the metal core board as claimed in claim 5, wherein a bonding pad is disposed at a side of the two high frequency core boards away from each other, and the bonding pad is disposed at two ends of the first via hole; the first via hole is a metal solid via hole.
7. The metal core multilayer printed circuit package structure of claim 6, wherein the low frequency core is provided with a first hollow groove, and the high frequency core is provided with a second hollow groove, wherein the first hollow groove and the second hollow groove are sequentially communicated.
8. The metal core multilayer printed circuit package structure of claim 7, wherein the size of the first opening is larger than the size of the second opening; and a high-frequency signal leading-out pattern is arranged on one side of the high-frequency core plate close to the first hollow groove.
9. The package structure of claim 7, wherein a groove is formed on a side of the metal core board close to the high frequency core board; the groove, the second hollow groove and the first hollow groove are communicated in sequence.
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