CN205755040U - A kind of X frequency range TR assembly - Google Patents
A kind of X frequency range TR assembly Download PDFInfo
- Publication number
- CN205755040U CN205755040U CN201620617852.XU CN201620617852U CN205755040U CN 205755040 U CN205755040 U CN 205755040U CN 201620617852 U CN201620617852 U CN 201620617852U CN 205755040 U CN205755040 U CN 205755040U
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- circuit board
- hole
- multilamellar
- assembly
- frequency range
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Abstract
The utility model discloses a kind of X frequency range TR assembly, including casing and the circuit board being arranged on casing internal, including casing cover plate, line sectioned housing and chassis backplane, described casing cover plate, line sectioned housing and chassis backplane stack successively；Circuit board arranges in online sectioned housing, described circuit board is composited by R04350 circuit board and multilamellar FR4 circuit board, hole, blind hole ground vertically it is provided with on R04350 circuit board, the hole, through hole ground communicated it is provided with between R04350 circuit board and multilamellar FR4 circuit board, described R04350 circuit board is provided with microstrip line, R04350 circuit board is embedded with multifunction chip, multifunction chip and microstrip line gold wire bonding, use the ground isolation technology that through hole and blind hole combine, at utmost reduce interference, improve the integrated level of whole device simultaneously.
Description
Technical field
This utility model relates to TR assembly field, particularly to a kind of X frequency range TR assembly.
Background technology
Tradition TR assembly design generally microwave signal uses microwave material, such as material circuit such as RO5880 or RO4350
Plate is sintered on FR4 circuit board, and FR4 circuit board is used for providing power supply and control signal, in order to prevent interference, needs when design
Microwave signal, control signal and power supply signal metal bead are physically separated, and are distributed on different circuit boards, logical
Cross structure central dividing plate and be sintered in the front and back of dividing plate, main power and control signal employing port form respectively by external electricity
Road controls, and traditional structure cavity is generally milling cutter milling chamber, and circuit board is divided into the irregular unit of multiple independence, and lamination is mutual the most again
The mode of connection, so complete machine integrated level is the highest, small product size is bigger, it is difficult to realize the design requirement of array antenna.
Traditional design uses through hole Contact patch microstrip line is isolated, walk in a large number due to internal layer due to circuit board
Line, through hole, in order to dodge internal layer cabling, can only select not walk line position and place, thus cannot ensure the complete of microwave signal
Ground isolation.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of X frequency range TR assembly, uses through hole and blind hole to combine
Ground isolation technology, at utmost reduce interference, improve the integrated level of whole device simultaneously, with solve prior art causes
Above-mentioned multinomial defect.
For achieving the above object, the technical scheme that this utility model offer is following: a kind of X frequency range TR assembly, including casing
Be arranged on the circuit board of casing internal, including casing cover plate, line sectioned housing and chassis backplane, described casing cover plate, line are cut
Cut cavity and chassis backplane stacks successively；Circuit board arranges in online sectioned housing, described circuit board by R04350 circuit board and
Multilamellar FR4 circuit board is composited, and R04350 circuit board is vertically provided with hole, blind hole ground, R04350 circuit board and multilamellar FR4 electricity
Being provided with the hole, through hole ground communicated between the plate of road, described R04350 circuit board is provided with microstrip line, and R04350 circuit board is embedded with many merits
Energy chip, multifunction chip and microstrip line gold wire bonding.
Preferably, on described chassis backplane, corresponding circuits plate is provided with circular hole, and circuit board exports microwave signal, circle by circular hole
Hole is directly docked with outside by insulator sintered form.
Preferably, it is provided with prepreg between described R04350 circuit board and multilamellar FR4 circuit board.
Preferably, oxygen-free copper carrier it is provided with between described multifunction chip and R04350 circuit board.
Preferably, described R04350 circuit board and multilamellar FR4 circuit board are additionally provided with the holding wire blind hole communicated.
Use above technical scheme to provide the benefit that: the ground using through hole and blind hole to combine of this utility model structure every
From technology, cannot make in a large number in the case of realizing through hole ground connection in microwave device surroundings such as microstrip line both sides and multifunction chips
Form with blind hole ground connection, it is ensured that form complete shading ring, it is ensured that ground connection nearby, at utmost reduces interference.
Using line cutting to be split by separate cavities, circuit board remains the circuit board of monoblock regular shape, so can use
PCB multilamellar mixed pressure technology, by multilamellar cabling by the microwave of circuit board, power supply, controls to be integrated on one block of multi-layer sheet, with tradition
Circuit compares saving product space about 50%, is greatly improved product integrated level.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model circuit board；
Fig. 2 is the structural representation of this utility model casing.
Wherein, 1--FR4 circuit board, 2--R04350 circuit board, 3--prepreg, hole, 4--blind hole ground, 5--through hole ground
Hole, 6--holding wire blind hole, 7--microstrip line, 8--multifunction chip, 9--oxygen-free copper carrier, 10--casing cover plate, 11--line are cut
Cut cavity, 12--chassis backplane.
Detailed description of the invention
Describe preferred implementation of the present utility model below in conjunction with the accompanying drawings in detail.
Fig. 1 shows detailed description of the invention of the present utility model: a kind of X frequency range TR assembly, including casing be arranged on casing
Internal circuit board, including casing cover plate 10, line sectioned housing 11 and chassis backplane 12, described casing cover plate 10, line cut chamber
Body 11 and chassis backplane 12 stack successively；Circuit board is arranged in online sectioned housing 11, and described circuit board is by R04350 circuit board 2
It is composited with multilamellar FR4 circuit board 1, R04350 circuit board 2 is vertically provided with hole 4, blind hole ground, R04350 circuit board 2 and multilamellar
Being provided with the hole 5, through hole ground communicated between FR4 circuit board 1, described R04350 circuit board 2 is provided with microstrip line 7, R04350 circuit board 2
It is embedded with multifunction chip 8, multifunction chip 8 and microstrip line 7 gold wire bonding.
On chassis backplane 12, corresponding circuits plate is provided with circular hole, and circuit board exports microwave signal by circular hole, and circular hole is by absolutely
Edge sintered form directly docks with outside.
Line sectioned housing 11 for microstrip line submatrix interconnection line at, line sectioned housing 11 have 1mm height, 2.5mm width
Degree door opening shape vacancy is dodged.
Prepreg 3, multifunction chip 8 and R04350 electricity it is provided with between R04350 circuit board 2 and multilamellar FR4 circuit board 1
It is provided with oxygen-free copper carrier 9, R04350 circuit board 2 and multilamellar FR4 circuit board 1 between road plate 2 and is additionally provided with the holding wire blind hole communicated
6。
The ground isolation technology that the employing through hole of this utility model structure and blind hole combine, at microstrip line both sides and Multifunctional core
The microwave device surroundings such as sheet are a large amount of forms using blind hole ground connection in the case of through hole ground connection cannot realize, it is ensured that formed complete
Shading ring, it is ensured that ground connection nearby, at utmost reduces interference.
Using line cutting to be split by separate cavities, circuit board remains the circuit board of monoblock regular shape, so can use
PCB multilamellar mixed pressure technology, by multilamellar cabling by the microwave of circuit board, power supply, controls to be integrated on one block of multi-layer sheet, with tradition
Circuit compares saving product space about 50%, is greatly improved product integrated level.
Because the design uses multi-layer sheet technology, the 2nd layer is intactly plane layer, and other internal layers have to be walked in a large number
Line, and 1-2 layer blind hole ground connection is owing to will not punch whole circuit board, it is possible to place the most continuously, do not worry beating
To other internal layer holding wires, the farthest integrity of the ground shading ring of protection microwave signal, reach emulation expection microwave
Energy.
Multifunction chip in circuit board, merit divide chip and transmit-receive switch control chip to use groove form of sinking to place, knot
Close the open-blind groove technology of circuit board, it is ensured that the silk pressing bonding point of these chips is parallel with circuit board top layer microstrip line, it is ensured that micro-
Signal integrity in ripple signals transmission.
Microstrip line is that a banding is led (holding wire), and opens by a kind of dielectric isolation between ground level.Printed conductor
Thickness, width, printed conductor and the distance on stratum and dielectric dielectric constant determine the characteristic impedance of microstrip line.If
The thickness of line, width and and ground level between distance be controllable, then its characteristic impedance also can control.
Integrated circuit is used as the billon silk of connecting line, also known as ball bonding spun gold or lead-in wire spun gold.Gold content >=
99.99%, trace additives summation < 0.01%.Having three kinds of γ type, c-type and FA type etc., latter two is for being bonded at a high speed.Micro-
Secondary element is that beryllium, copper, silver etc. have crystal grain thinning, improves recrystallization temperature and the effect of strengthening gold.Use coreless induction furnace vacuum melting,
Secondary remelting and crystallographic orientation, ingot casting cold working after homogenization is become a useful person.Or manufacture with liquid extrusion process.Bonding gold wire is micro-
The important materials of electronics industry, as connecting line between chip and lead frame.
Above-described is only preferred implementation of the present utility model, it is noted that for the ordinary skill of this area
For personnel, on the premise of creating design without departing from this utility model, it is also possible to making some deformation and improvement, these all belong to
In protection domain of the present utility model.
Claims (5)
1. an X frequency range TR assembly, including casing and the circuit board being arranged on casing internal, it is characterised in that include cabinet cover
Plate, line sectioned housing and chassis backplane, described casing cover plate, line sectioned housing and chassis backplane stack successively；Circuit board is arranged
In cutting on line cavity, described circuit board is composited by R04350 circuit board and multilamellar FR4 circuit board, on R04350 circuit board
Vertically it is provided with hole, blind hole ground, between R04350 circuit board and multilamellar FR4 circuit board, is provided with the hole, through hole ground communicated, described R04350
Circuit board is provided with microstrip line, and R04350 circuit board is embedded with multifunction chip, multifunction chip and microstrip line gold wire bonding.
X frequency range TR assembly the most according to claim 1, it is characterised in that on described chassis backplane, corresponding circuits plate is provided with
Circular hole, circuit board exports microwave signal by circular hole, and circular hole is directly docked with outside by insulator sintered form.
X frequency range TR assembly the most according to claim 1, it is characterised in that described R04350 circuit board and multilamellar FR4 circuit
Prepreg it is provided with between plate.
X frequency range TR assembly the most according to claim 1, it is characterised in that described multifunction chip and R04350 circuit board
Between be provided with oxygen-free copper carrier.
X frequency range TR assembly the most according to claim 1, it is characterised in that described R04350 circuit board and multilamellar FR4 circuit
Plate is additionally provided with the holding wire blind hole communicated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620617852.XU CN205755040U (en) | 2016-06-22 | 2016-06-22 | A kind of X frequency range TR assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620617852.XU CN205755040U (en) | 2016-06-22 | 2016-06-22 | A kind of X frequency range TR assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755040U true CN205755040U (en) | 2016-11-30 |
Family
ID=57383100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620617852.XU Active CN205755040U (en) | 2016-06-22 | 2016-06-22 | A kind of X frequency range TR assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205755040U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107978829A (en) * | 2017-11-22 | 2018-05-01 | 贵州航天计量测试技术研究所 | A kind of microwave components structure based on multilayer cabling |
-
2016
- 2016-06-22 CN CN201620617852.XU patent/CN205755040U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107978829A (en) * | 2017-11-22 | 2018-05-01 | 贵州航天计量测试技术研究所 | A kind of microwave components structure based on multilayer cabling |
| CN107978829B (en) * | 2017-11-22 | 2021-03-26 | 贵州航天计量测试技术研究所 | Microwave assembly structure based on multilayer wiring |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 241000 Anhui Wuhu Yijiang High-tech Zone South District small and medium enterprises Pioneer Park 8 workshop 01 room Patentee after: Anhui heavenly electronic Polytron Technologies Inc Address before: 241000 Wuhu, Wuhu, Anhui Yijiang District high tech Zone South District small and medium enterprises Pioneer Park 8 workshop 01 room Patentee before: ANHUI TIANBING ELECTRONIC TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: X frequency channel TR subassembly multilayer circuit board Effective date of registration: 20190306 Granted publication date: 20161130 Pledgee: Huizhou Merchants Bank, Wuhu, Yijiang branch Pledgor: Anhui heavenly electronic Polytron Technologies Inc Registration number: 2019340000126 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200727 Granted publication date: 20161130 Pledgee: Huizhou Merchants Bank, Wuhu, Yijiang branch Pledgor: Anhui heavenly electronic Polytron Technologies Inc. Registration number: 2019340000126 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Anhui chuangsi Electronic Technology Co.,Ltd. Assignor: Anhui heavenly electronic Polytron Technologies Inc. Contract record no.: X2021980005101 Denomination of utility model: An X-band TR module Granted publication date: 20161130 License type: Exclusive License Record date: 20210625 |
|
| EE01 | Entry into force of recordation of patent licensing contract |