CN206992111U - Integrated protective circuit element - Google Patents

Integrated protective circuit element Download PDF

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Publication number
CN206992111U
CN206992111U CN201721006820.7U CN201721006820U CN206992111U CN 206992111 U CN206992111 U CN 206992111U CN 201721006820 U CN201721006820 U CN 201721006820U CN 206992111 U CN206992111 U CN 206992111U
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CN
China
Prior art keywords
chip module
circuit element
protection chip
protection
protective circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721006820.7U
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Chinese (zh)
Inventor
周全
李燕华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BrightKing Shenzhen Co Ltd
Original Assignee
BrightKing Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BrightKing Shenzhen Co Ltd filed Critical BrightKing Shenzhen Co Ltd
Priority to CN201721006820.7U priority Critical patent/CN206992111U/en
Application granted granted Critical
Publication of CN206992111U publication Critical patent/CN206992111U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of integrated protective circuit element, is related to over-voltage and over-current circuit protection technical field.The circuit element includes encapsulating housing; provided with two protection chip modules and one by protection chip module in the encapsulating housing; it is described to be located at by protection chip module between two protection chip modules; the arranged on left and right sides of each protection chip module is respectively equipped with a lead electrode; the lead electrode is extended to outside the encapsulating housing, forms the connection end of the protection circuit element.Integrated by protection chip module and protection chip module, can be completed by single or multiple welding, simplify the technological process complexity such as be respectively welded, encapsulate in traditional handicraft, reduce the consumption of resource.

Description

Integrated protective circuit element
Technical field
It the utility model is related to over-voltage and over-current circuit protection technical field, more particularly to a kind of integrated protective circuit element.
Background technology
Traditional over-voltage over-current protection circuit, protected chip are to be welded on respectively in the form of finished product with protection chip On circuit board, it is respectively necessary for being processed into the form of plug-in unit or paster by protection chip and protection chip, is welded on pcb board circuit On circuit is played a protective role, but traditional circuit element needs to make multiple pads, to ensure that enough elements can be with Welding is in the line, it is necessary to expend more spaces, and each component needs to be made as finished product to be used, each component Technique it is lengthy and jumbled, process management and control inconvenience, the human and material resources resource of consuming is larger.
Utility model content
Technical problem to be solved in the utility model is how to provide that a kind of manufacture craft is simple, it is a variety of to have to circuit The integrated protective circuit element of defencive function.
In order to solve the above technical problems, technical solution adopted in the utility model is:A kind of integrated protective circuit element, It is characterized in that:Including encapsulating housing, provided with two protection chip modules and one by protection chip dies in the encapsulating housing Block, it is described by protection chip module between two protection chip modules, each arranged on left and right sides difference for protecting chip module Provided with a lead electrode, the lead electrode is extended to outside the encapsulating housing, forms the connection of the protection circuit element End.
Further technical scheme is:The encapsulating housing, which includes lower end, has the shell of opening and by the shell Closure of openings cover plate.
Further technical scheme is:The protection chip module includes two lead electrodes and positioned at described in two PPTC chips between lead electrode.
Further technical scheme is:It is described that two electrode slices are included and positioned at two electrodes by protection chip module TVS chips between piece.
Further technical scheme is:It is described that two electrode slices are included and positioned at two electrodes by protection chip module MOV chips between piece.
Further technical scheme is:It is described that three electrode slices are included and positioned at electrode two-by-two by protection chip module TVS chips between piece.
Further technical scheme is:It is described that three electrode slices are included and positioned at electrode two-by-two by protection chip module MOV chips between piece.
Further technical scheme is:It is described that three electrode slices and a MOV chip are included by protection chip module Between two electrode slices being located therein with a GDT chip, described MOV chips, described GDT chips are located at two other Between electrode slice.
Further technical scheme is:It is described protection chip module and by between each device in protection chip module with And protect chip module and welded between protection chip module by solder.
Further technical scheme is:The making material of the encapsulating housing is insulation high-temperature-resistant material.
It is using beneficial effect caused by above-mentioned technical proposal:Integrated by protection chip module and protection chip module Together, it can be completed by single or multiple welding, simplify and the complicated technique stream such as be respectively welded, encapsulate in traditional handicraft Journey, reduce the consumption of resource;Together with chip and PPTC integrated chips, multi-functional protective effect can be played to circuit, Solve the irrealizable function of discrete component, while solve the problems, such as that multiple element protection takes PCB space.
Brief description of the drawings
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is the dimensional structure diagram of integrated protective circuit element described in the utility model embodiment;
Fig. 2 is the cross section structure diagram of integrated protective circuit element described in the utility model embodiment one;
Fig. 3 is the decomposition texture schematic diagram of integrated protective circuit element described in the utility model embodiment one;
Fig. 4 is the cross section structure diagram of integrated protective circuit element described in the utility model embodiment two;
Fig. 5 is the decomposition texture schematic diagram of integrated protective circuit element described in the utility model embodiment two;
Fig. 6 is the cross section structure diagram of integrated protective circuit element described in the utility model embodiment three;
Fig. 7 is the decomposition texture schematic diagram of integrated protective circuit element described in the utility model embodiment three;
Fig. 8 is the cross section structure diagram of integrated protective circuit element described in the utility model embodiment four;
Fig. 9 is the decomposition texture schematic diagram of integrated protective circuit element described in the utility model embodiment four;
Figure 10 is the cross section structure diagram of integrated protective circuit element described in the utility model embodiment five;
Figure 11 is the decomposition texture schematic diagram of integrated protective circuit element described in the utility model embodiment five;
Wherein:1st, shell 2, cover plate 3, TVS chips 4, PPTC chips 5, lead electrode 6, electrode slice 7, solder 8, MOV chips 9th, GDT chips.
Embodiment
With reference to the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear Chu, it is fully described by, it is clear that described embodiment is only part of the embodiment of the present utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belong to the scope of the utility model protection.
Many details are elaborated in the following description in order to fully understand the utility model, but this practicality is new Type can also be different from other manner described here using other to be implemented, and those skilled in the art can be without prejudice to this reality With doing similar popularization in the case of new intension, therefore the utility model is not limited by following public specific embodiment.
Overall, the utility model discloses a kind of integrated protective circuit element, including encapsulating housing, the encapsulating housing Two are inside provided with by protection chip module and a protection chip module.The protection chip module is positioned at two by protection chip Between module, a lead electrode 5 is each respectively equipped with by the arranged on left and right sides of protection chip module, the lead electrode 5 extends Outside to the encapsulating housing, the connection end of the protection circuit element is formed, as shown in Figure 1.
Embodiment one
As shown in Fig. 2-Fig. 3, the utility model embodiment discloses a kind of integrated protective circuit element, including encapsulating shell Body, the encapsulating housing include shell 1 and cover plate 2.It is described by protection chip module positioned at two protection chip modules between, institute Stating protection chip module includes two lead electrodes 5 and the PPTC chips 4 between two lead electrodes 5;It is described Two electrode slices 6 and the TVS chips 3 between two electrode slices 6 are included by protection chip module.
Embodiment two
As shown in fig. 4-5, the utility model embodiment discloses a kind of integrated protective circuit element, including encapsulating shell Body, the encapsulating housing include shell 1 and cover plate 2.It is described by protection chip module positioned at two protection chip modules between, institute Stating protection chip module includes two lead electrodes 5 and the PPTC chips 4 between two lead electrodes 5;It is described Two electrode slices 6 and the MOV chips 8 between two electrode slices 6 are included by protection chip module.
Embodiment three
As Figure 6-Figure 7, the utility model embodiment discloses a kind of integrated protective circuit element, including encapsulating shell Body, the encapsulating housing include shell 1 and cover plate 2.It is described by protection chip module positioned at two protection chip modules between, institute Stating protection chip module includes two lead electrodes 5 and the PPTC chips 4 between two lead electrodes 5;It is described Three electrode slices 6 and the TVS chips 3 between electrode slice 6 two-by-two are included by protection chip module.
Example IV
As illustrated in figs. 8-9, the utility model embodiment discloses a kind of integrated protective circuit element, including encapsulating shell Body, the encapsulating housing include shell 1 and cover plate 2.It is described by protection chip module positioned at two protection chip modules between, institute Stating protection chip module includes two lead electrodes 5 and the PPTC chips 4 between two lead electrodes 5;It is described Three electrode slices 6 and the MOV chips 8 between electrode slice two-by-two are included by protection chip module.
Embodiment five
As shown in Figure 10-Figure 11, the utility model embodiment discloses a kind of integrated protective circuit element, including encapsulating shell Body, the encapsulating housing include shell 1 and cover plate 2.It is described by protection chip module positioned at two protection chip modules between, institute Stating protection chip module includes two lead electrodes 5 and the PPTC chips 4 between two lead electrodes 5;It is described Three electrode slices 6 and a MOV chip 8 and a GDT chip 9, described MOV chips 8 are included by protection chip module Between two electrode slices 6 therein, described GDT chips 9 are located between two other electrode slice 6.
The difference of embodiment one and embodiment two is:The single TVS chips that embodiment one is protected, what embodiment two was protected It is single MOV chips, both protection philosophies are identical, the difference is that protection chip type is different.Embodiment one and embodiment three Difference be:The single TVS chips of one use of embodiment, embodiment three have used multiple to improve product tolerance power TVS chips are superimposed.The difference of embodiment two and example IV is:Embodiment two is single MOV chips, embodiment three, is used Multiple MOV chips superpositions, realize multichannel protection, and both protection philosophies are identical, and the former belongs to single channel protection, and the latter can be real Existing multichannel protection.The difference of embodiment three, example IV and embodiment five is:Embodiment three and example IV are all to use two It is individual same kind of by protection chip, embodiment five use two it is different by protection chip.
Further, the single chip or multiple identical or not protected can be contained by being protected in chip module Welded together with by protection chip by electrode slice.Described can be square, circular by protection chip module or other are polygon Shape.The electrode slice can be square, circular or other polygons.The making material of the electrode slice can be fine copper, it is silver-plated, Nickel plating or other materials.The lead electrode includes two parts, and a part is the lamellar morphology such as square, circular, polygon;It is another Part is cylindricality, and sectional area is the shapes such as circular, square or polygon.The making material of the lead electrode can be fine copper, Silver-plated, nickel plating or other materials.The protection chip, can be macromolecular thermosensitive resistor chip (PPTC) or negative temperature coefficient heat The protection type circuit chips such as quick resistance chip (NTC).The protection chip can be square, circular or other shapes.It is described outer Shell and cover plate, its material can be plastics, ceramics or other insulation high-temperature-resistant materials.
Integrated by protection chip module and protection chip module, can be completed by single or multiple welding, letter Change and the complicated technological process such as be respectively welded, encapsulate in traditional handicraft, reduced the consumption of resource;Chip and PPTC chipsets Into together, multi-functional protective effect can be played to circuit, the irrealizable function of discrete component is solved, solves simultaneously The problem of multiple element protection takes PCB space.

Claims (10)

  1. A kind of 1. integrated protective circuit element, it is characterised in that:Two protections are provided with including encapsulating housing, in the encapsulating housing Chip module and one by protection chip module, it is described by protection chip module between two protection chip modules, each The arranged on left and right sides of protection chip module is respectively equipped with a lead electrode (5), and the lead electrode (5) extends to the encapsulation Outside housing, the connection end of the protection circuit element is formed.
  2. 2. integrated protective circuit element as claimed in claim 1, it is characterised in that:The encapsulating housing has including lower end to be opened The shell (1) and the cover plate (2) by the closure of openings of the shell (1) of mouth.
  3. 3. integrated protective circuit element as claimed in claim 1, it is characterised in that:The protection chip module draws including two Line electrode (5) and the PPTC chips (4) between two lead electrodes.
  4. 4. integrated protective circuit element as claimed in claim 1, it is characterised in that:It is described to include two by protection chip module Electrode slice (6) and the TVS chips (3) between two electrode slices (6).
  5. 5. integrated protective circuit element as claimed in claim 1, it is characterised in that:It is described to include two by protection chip module Electrode slice (6) and the MOV chips (8) between two electrode slices (6).
  6. 6. integrated protective circuit element as claimed in claim 1, it is characterised in that:It is described to include three by protection chip module Electrode slice (6) and the TVS chips (3) between electrode slice two-by-two (6).
  7. 7. integrated protective circuit element as claimed in claim 1, it is characterised in that:It is described to include three by protection chip module Electrode slice (6) and the MOV chips (8) between electrode slice two-by-two.
  8. 8. integrated protective circuit element as claimed in claim 1, it is characterised in that:It is described to include three by protection chip module Electrode slice (6) and a MOV chip (8) and a GDT chip (9), two electricity that described MOV chips (8) are located therein Between pole piece (6), described GDT chips (9) are located between two other electrode slice (6).
  9. 9. integrated protective circuit element as claimed in claim 1, it is characterised in that:It is described to protect chip module and by protection core In piece module between each device and protection and is welded chip module between protection chip module by solder (7).
  10. 10. integrated protective circuit element as claimed in claim 1, it is characterised in that:The making material of the encapsulating housing is Insulation high-temperature-resistant material.
CN201721006820.7U 2017-08-13 2017-08-13 Integrated protective circuit element Expired - Fee Related CN206992111U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721006820.7U CN206992111U (en) 2017-08-13 2017-08-13 Integrated protective circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721006820.7U CN206992111U (en) 2017-08-13 2017-08-13 Integrated protective circuit element

Publications (1)

Publication Number Publication Date
CN206992111U true CN206992111U (en) 2018-02-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721006820.7U Expired - Fee Related CN206992111U (en) 2017-08-13 2017-08-13 Integrated protective circuit element

Country Status (1)

Country Link
CN (1) CN206992111U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107706176A (en) * 2017-08-13 2018-02-16 广东百圳君耀电子有限公司 Integrated protective circuit element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107706176A (en) * 2017-08-13 2018-02-16 广东百圳君耀电子有限公司 Integrated protective circuit element
CN107706176B (en) * 2017-08-13 2023-10-24 广东百圳君耀电子有限公司 Integrated protection circuit element

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Granted publication date: 20180209