CN107978829A - A kind of microwave components structure based on multilayer cabling - Google Patents
A kind of microwave components structure based on multilayer cabling Download PDFInfo
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- CN107978829A CN107978829A CN201711169871.6A CN201711169871A CN107978829A CN 107978829 A CN107978829 A CN 107978829A CN 201711169871 A CN201711169871 A CN 201711169871A CN 107978829 A CN107978829 A CN 107978829A
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- layer
- wire substrate
- microwave
- microwave components
- layer wire
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/121—Hollow waveguides integrated in a substrate
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of microwave components structure based on multilayer cabling, including multi-layer wire substrate, it is provided with the multi-layer wire substrate and divides the transmission path of microwave signal to chamber shielding cover board along what its transmission direction separated, the cavity being arranged side by side of more than 1 is provided with chamber shielding cover board is divided, the cavity wall end face of each cavity is connected with multi-layer wire substrate, and conductive copper layer is coated with the contact surface on multi-layer wire substrate with cavity wall, ground hole is provided with the multi-layer wire substrate of conductive copper layer bottom, thus the mutually independent subregion microwave signal transmission passage of closing is formed；The present invention by multi-layer wire substrate subregion, divide chamber shielding cover board to divide chamber to realize the good shielding of microwave signal to divide chamber to design, the structure of chamber is divided to greatly reduce the volume of microwave components using cavity compared to tradition, and preferable microwave components performance can be obtained, it can effectively reduce the space crosstalk and mutual coupling of microwave signal.
Description
Technical field
The present invention relates to a kind of microwave components structure based on multilayer cabling, belong to microwave components technical field.
Background technology
Microwave components are just developing towards miniaturization, high integration direction now, and multilayer routing technology is applied to microwave group
In part circuit design, such as LTCC Technology（LTCC）, multi-layer mixed pressing making sheet technology etc..Using multilayer routing technology energy
Microwave circuit integrated level is effectively improved, the power supply and control line connector of traditional microwave component are substituted with cabling inside substrate, mutually
Line is shorter, dramatically reduces microwave components circuit volume.But microwave circuit is different from low-frequency channel, the space spoke of microwave signal
Penetrate, mutual coupling effect can seriously affect the performance indicator of microwave components between conducting wire, as spurious signal suppress with small-signal decay if very
Hardly possible obtains preferable index.How high performance microwave components are realized using multilayer routing technology, microwave components structure design is just
Seem particularly significant.
The content of the invention
The technical problem to be solved in the present invention is：A kind of microwave components structure based on multilayer cabling is provided, it is micro- to solve
The problem of mutual coupling effect can seriously affect microwave components performance between the space radiation of ripple signal, conducting wire.
The technical scheme is that：A kind of microwave components structure based on multilayer cabling, including multi-layer wire substrate,
It is provided with the multi-layer wire substrate and divides the transmission path of microwave signal to chamber shielding cover board along what its transmission direction separated,
The cavity being arranged side by side of more than 1, the cavity wall end face of each cavity and multi-layer wire substrate are provided with chamber shielding cover board is divided
Connection, and conductive copper layer, the multilayer in conductive copper layer bottom are coated with the contact surface on multi-layer wire substrate with cavity wall
Ground hole is provided with circuit board, thus forms the mutually independent subregion microwave signal transmission passage of closing.
Flexible flat conductive layer is provided with the conductive copper layer.
The material of the flexible flat conductive layer is conductive rubber or conductive foam.
The thickness of the flexible flat conductive layer is 0.1-0.2mm.
Described point of chamber shielding cover board material is aluminium or copper.
The multi-layer wire substrate bottom is connected with bottom plate, and correspondence position is provided with ground hole on bottom plate.
The beneficial effects of the invention are as follows：The present invention by multi-layer wire substrate subregion, divide chamber shielding cover board to divide chamber to realize
The good shielding of microwave signal divides chamber to design, and divides the structure of chamber to greatly reduce microwave components using cavity compared to tradition
Volume, and preferable microwave components performance can be obtained, it can effectively reduce the space crosstalk and mutual coupling of microwave signal.
In addition, the present invention also has the characteristics that：First, microwave components are simple in structure, technique is realisation strong；Second, can pole
Big raising using polylaminate wiring technique microwave components performance indicator, for based on LTCC, multi-layer mixed pressing making sheet technology it is micro-
Ripple component provides a kind of effective and feasible construction design method.
Brief description of the drawings
Fig. 1 is the structure diagram of the present invention；
In figure：1st, multi-layer wire substrate, 2, divide chamber shielding cover board, 3, cavity, 4, cavity wall, 5, flexible flat conductive layer, 6, bottom plate,
7th, ground hole.
Embodiment
Below in conjunction with the accompanying drawings and invention is described further in specific embodiment：
As shown in Figure 1, a kind of microwave components structure based on multilayer cabling of the present embodiment, including multi-layer wire substrate 1, laminates
1 bottom of line substrate is connected on bottom plate 6, and bottom plate 6 realizes the support to multi-layer wire substrate 1, is set on multi-layer wire substrate 1
Have and divide the transmission path of microwave signal to chamber shielding cover board 2 along what its transmission direction separated, set on chamber shielding cover board 2 is divided
Multiple cavitys 3 side by side, 4 end face of cavity wall of each cavity 3 are connected with multi-layer wire substrate 1, and on multi-layer wire substrate 1 with chamber
Conductive copper layer is coated with the contact surface of wall 4, ground hole 7 is provided with the multi-layer wire substrate 1 of conductive copper layer bottom,
Correspondence position on bottom plate 6 is also equipped with ground hole 7, and the mutually independent subregion microwave signal transmission for thus forming closing leads to
Road.
Flexible flat conductive layer 5 is provided with conductive copper layer, the material selection of flexible flat conductive layer 5 is with highly conductive
The flexible conducting material of rate, such as conductive rubber or conductive foam, thickness 0.1-0.2mm, which can fill
The gap of binding site between substrate conducting layers of copper and shielding cover board, makes the conductive copper layer and cavity wall 4 on 1 surface of multi-layer wire substrate
End face comes into full contact with, and forms the component with good isolation characteristic and divides cavity configuration.
Described point of 2 material of chamber shielding cover board is and the aluminium or copper added easy to machine with high conductivity, it can effectively shield electricity
The space propagation of magnetic wave.
The production method of above-mentioned microwave components structure is as follows：
Subregion is carried out to microwave signal transmission path in multi-layer wire substrate 1 first, zonal approach covers copper and ground connection by surface
The method in hole 7 is realized.
Secondly carry out dividing chamber to handle accordingly on chamber shielding cover board 2 is divided, dividing chamber shielding cover board 2 and multi-layer wire substrate
1 lying copper region domain（Conductive copper layer）Contact site filling flexible planar conductive material, formed with good isolation characteristic group
Part divides cavity configuration, effectively reduces the space crosstalk and mutual coupling of microwave signal.
Above content is that a further detailed description of the present invention in conjunction with specific preferred embodiments, it is impossible to is assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of not departing from present inventive concept, some simple deduction or replace can also be made, should all be considered as belonging to the present invention's
Protection domain.
Claims (6)
1. a kind of microwave components structure based on multilayer cabling, including multi-layer wire substrate（1）, it is characterised in that：Described more
Layer circuit board（1）On be provided with the conduction for separating the transmission path of microwave signal along its transmission direction and divide chamber shielding cover board
（2）, dividing chamber shielding cover board（2）On be provided with the cavity being arranged side by side of more than 1（3）, each cavity（3）Cavity wall（4）End
Face and multi-layer wire substrate（1）Connection, and in multi-layer wire substrate（1）Upper and cavity wall（4）Contact surface at coated with conduction
Layers of copper, the multi-layer wire substrate in conductive copper layer bottom（1）On be provided with ground hole（7）, thus form the separate of closing
Subregion microwave signal transmission passage.
2. the microwave components structure according to claim 1 based on multilayer cabling, it is characterised in that：In the conductive copper layer
On be provided with flexible flat conductive layer（5）.
3. the microwave components structure according to claim 2 based on multilayer cabling, it is characterised in that：The flexible flat is led
Electric layer（5）Material be conductive rubber or conductive foam.
4. the microwave components structure according to claim 2 based on multilayer cabling, it is characterised in that：The flexible flat is led
Electric layer（5）Thickness be 0.1-0.2mm.
5. the microwave components structure according to claim 1 based on multilayer cabling, it is characterised in that：Described point of chamber screening cover
Plate（2）Material is aluminium or copper.
6. the microwave components structure according to claim 1 based on multilayer cabling, it is characterised in that：The multilayer wiring base
Plate（1）Bottom is connected with bottom plate（6）, in bottom plate（6）Upper correspondence position is provided with ground hole（7）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711169871.6A CN107978829B (en) | 2017-11-22 | 2017-11-22 | Microwave assembly structure based on multilayer wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711169871.6A CN107978829B (en) | 2017-11-22 | 2017-11-22 | Microwave assembly structure based on multilayer wiring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107978829A true CN107978829A (en) | 2018-05-01 |
| CN107978829B CN107978829B (en) | 2021-03-26 |
Family
ID=62010702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711169871.6A Active CN107978829B (en) | 2017-11-22 | 2017-11-22 | Microwave assembly structure based on multilayer wiring |
Country Status (1)
| Country | Link |
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| CN (1) | CN107978829B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109215859A (en) * | 2018-08-10 | 2019-01-15 | 深圳市信维通信股份有限公司 | A kind of strip line/microstrip line of transmitting radio frequency signal |
| CN115066137A (en) * | 2022-06-30 | 2022-09-16 | 中航光电科技股份有限公司 | Multilayer microwave assembly, double-layer pressing microwave assembly and implementation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202455648U (en) * | 2011-12-30 | 2012-09-26 | 成都芯通科技股份有限公司 | Structure for increasing printed circuit board (PCB) inner layer wiring isolation degree |
| CN205104865U (en) * | 2015-10-30 | 2016-03-23 | 陆汉斌 | Aluminum alloy multilayer chute solidus ware |
| CN205755040U (en) * | 2016-06-22 | 2016-11-30 | 安徽天兵电子科技有限公司 | A kind of X frequency range TR assembly |
| WO2017111917A1 (en) * | 2015-12-21 | 2017-06-29 | Intel Corporation | Microelectronic devices with embedded substrate cavities for device to device communications |
-
2017
- 2017-11-22 CN CN201711169871.6A patent/CN107978829B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202455648U (en) * | 2011-12-30 | 2012-09-26 | 成都芯通科技股份有限公司 | Structure for increasing printed circuit board (PCB) inner layer wiring isolation degree |
| CN205104865U (en) * | 2015-10-30 | 2016-03-23 | 陆汉斌 | Aluminum alloy multilayer chute solidus ware |
| WO2017111917A1 (en) * | 2015-12-21 | 2017-06-29 | Intel Corporation | Microelectronic devices with embedded substrate cavities for device to device communications |
| CN205755040U (en) * | 2016-06-22 | 2016-11-30 | 安徽天兵电子科技有限公司 | A kind of X frequency range TR assembly |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109215859A (en) * | 2018-08-10 | 2019-01-15 | 深圳市信维通信股份有限公司 | A kind of strip line/microstrip line of transmitting radio frequency signal |
| CN109215859B (en) * | 2018-08-10 | 2023-12-19 | 深圳市信维通信股份有限公司 | Strip line/microstrip line for transmitting radio frequency signals |
| CN115066137A (en) * | 2022-06-30 | 2022-09-16 | 中航光电科技股份有限公司 | Multilayer microwave assembly, double-layer pressing microwave assembly and implementation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107978829B (en) | 2021-03-26 |
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