CN104378912A - Design method of PCB (printed circuit board) controllable impedance through holes - Google Patents
Design method of PCB (printed circuit board) controllable impedance through holes Download PDFInfo
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- CN104378912A CN104378912A CN201410729718.4A CN201410729718A CN104378912A CN 104378912 A CN104378912 A CN 104378912A CN 201410729718 A CN201410729718 A CN 201410729718A CN 104378912 A CN104378912 A CN 104378912A
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Abstract
The invention provides a design method of PCB (printed circuit board) controllable impedance through holes. A PCB is provided with a central signal through hole; ground through holes are arranged around the central signal through hole; the ground through holes function in shielding thus a uniformly distributed impedance is generated; the four ground through holes are arranged around the central signal through hole in a circle replacing a traditional uniformly-distributed shield; capacitance is generated between each ground through hole and the central signal through hole; the calculation of the capacitances is determined by the diameter and dielectric constant of the central signal through hole and distances between the central signal through hole and the ground through holes; the ground through holes around the central signal through hole provide a reflow path for signals; an inductance loop is generated between the central signal through holes and the ground through holes; an adjustable impedance vertical channel is accordingly generated; moderate parameters are calculated and selected, thus allowing transmission line impedance continuity and signal completeness.
Description
Technical field
The present invention relates to circuit board production techniques field, a kind of via design method that specifically PCB impedance is controlled.
Background technology
Along with the raising of message transmission rate, signal integrity carries out most important for transfer of data smoothly, and each impedance mismatching on high speed signal path may produce signal jitter thus affect signal quality.Due to the raising of the signal density on PCB, just need more signal transmitting layer, and by inter-level interconnects realize transmission be also inevitable, these through holes will cause the discontinuous of transmission line impedance, and a large amount of shakes can be produced according to data rate size, therefore, we need to find a kind of method to control the impedance of through hole, to ensure the continuity of impedance.
Summary of the invention
The object of this invention is to provide a kind of via design method that PCB impedance is controlled.
The object of the invention is to realize in the following manner, pcb board arranges center signal through hole, ground connection via hole is arranged on the surrounding of signal via, ground connection via hole shielding generation equally distributed impedance of surrounding, four grounded via hole is lined up a circle and be instead of traditional even earth shield around center signal via hole, electric capacity is formed between each ground connection via hole and signal via, signal via diameter is depended in the calculating of capacitance, dielectric constant and the distance between signal via and ground connection via hole, the ground connection via hole of signal via periphery provides return flow path for signal, and an inductor loop is formed between signal via and ground connection via hole, so just produce the vertical channel of an impedance adjustable, select suitable parameter to ensure transmission line impedance continuity by calculating, thus ensure that signal integrity.
The invention has the beneficial effects as follows: the via design method that a kind of PCB impedance disclosed by the invention is controlled, a kind of similar coaxial through-hole structure newly can be utilized to the severe impedance mismatch problem avoiding standard through-hole to occur, ground connection via hole is arranged on the surrounding of signal via by this structure with a kind of special configuration.This new method produces the vertical channel of an impedance adjustable, thus it is interconnected that track impedance can be made to obtain the interlayer of accurate match, improves signal integrity.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
With reference to Figure of description, method of the present invention is described in detail below.
The via design method that PCB impedance is controlled, concrete steps are as follows:
The present invention utilizes a kind of similar coaxial through-hole structure newly, ground connection via hole is arranged on the surrounding of center signal through hole by this structure with a kind of special configuration, ground connection via hole produces an equally distributed impedance in the surrounding earth shield of center signal through hole, and the ground connection that four grounded via hole lines up a circle around center signal through hole instead of traditional even earth shield mode.Wherein form electric capacity between each ground connection via hole and signal via, the diameter of center signal through hole, dielectric constant and the distance between signal via and ground connection via hole are depended in the calculating of capacitance.The ground connection via hole of center signal bore periphery provides return flow path for signal, and an inductor loop is formed between signal via and ground connection via hole, so just produce the vertical channel of an impedance adjustable, select suitable parameter to ensure transmission line impedance continuity by calculating, thus ensure that signal integrity.
Except the technical characteristic described in specification, be the known technology of those skilled in the art.
Claims (1)
1. the via design method that a PCB impedance is controlled, it is characterized in that on pcb board, arrange center signal through hole, ground connection via hole is arranged on the surrounding of signal via, ground connection via hole shielding generation equally distributed impedance of surrounding, four grounded via hole is lined up a circle and be instead of traditional even earth shield around center signal via hole, electric capacity is formed between each ground connection via hole and signal via, signal via diameter is depended in the calculating of capacitance, dielectric constant and the distance between signal via and ground connection via hole, the ground connection via hole of signal via periphery provides return flow path for signal, and an inductor loop is formed between signal via and ground connection via hole, so just produce the vertical channel of an impedance adjustable, select suitable parameter to ensure transmission line impedance continuity by calculating, thus ensure that signal integrity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410729718.4A CN104378912A (en) | 2014-12-05 | 2014-12-05 | Design method of PCB (printed circuit board) controllable impedance through holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410729718.4A CN104378912A (en) | 2014-12-05 | 2014-12-05 | Design method of PCB (printed circuit board) controllable impedance through holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104378912A true CN104378912A (en) | 2015-02-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410729718.4A Pending CN104378912A (en) | 2014-12-05 | 2014-12-05 | Design method of PCB (printed circuit board) controllable impedance through holes |
Country Status (1)
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| CN (1) | CN104378912A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028642A (en) * | 2016-06-22 | 2016-10-12 | 安徽天兵电子科技有限公司 | TR assembly multilayer circuit board and processing technology thereof |
| CN106061101A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Signal line protection method and apparatus, printed circuit board, and mobile terminal |
| CN107072056A (en) * | 2017-05-31 | 2017-08-18 | 郑州云海信息技术有限公司 | A kind of design method of optimization PCIE connector area signal qualitys |
| CN107135605A (en) * | 2017-06-09 | 2017-09-05 | 郑州云海信息技术有限公司 | A kind of design method of new matched termination impedance |
| CN108495514A (en) * | 2018-03-07 | 2018-09-04 | 中国船舶重工集团公司第七二三研究所 | A kind of compression joint type connector pore model processing method |
| CN109089375A (en) * | 2018-09-26 | 2018-12-25 | 郑州云海信息技术有限公司 | A kind of analysis method and system that signal integrity is influenced for pcb board via hole |
| CN109637808A (en) * | 2019-01-11 | 2019-04-16 | 广西芯百特微电子有限公司 | A kind of novel capacitor and device |
| WO2021051446A1 (en) * | 2019-09-20 | 2021-03-25 | 苏州浪潮智能科技有限公司 | Printed circuit board and electronic product |
| CN113170577A (en) * | 2018-12-19 | 2021-07-23 | 索尼集团公司 | Substrate and electronic device |
| WO2022262335A1 (en) * | 2021-06-18 | 2022-12-22 | 中兴通讯股份有限公司 | Shielding structure and circuit board |
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| CN1799290A (en) * | 2003-06-02 | 2006-07-05 | 日本电气株式会社 | Compact via transmission line for printed circuit board and its designing method |
| CN102800644A (en) * | 2012-09-05 | 2012-11-28 | 无锡江南计算技术研究所 | Double data rate (DDR) signal wiring encapsulation substrate and DDR signal wiring encapsulation method |
| CN104093270A (en) * | 2014-07-08 | 2014-10-08 | 西安电子工程研究所 | Interlayer signal transmission structure of microwave mixed printed circuit board |
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Patent Citations (6)
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| US5302923A (en) * | 1992-07-16 | 1994-04-12 | Hewlett-Packard Company | Interconnection plate having high frequency transmission line through paths |
| JPH09321501A (en) * | 1996-05-30 | 1997-12-12 | Mitsubishi Electric Corp | Multilayer high frequency circuit board |
| JP2001068596A (en) * | 1999-08-27 | 2001-03-16 | Sharp Corp | Dielectric circuit substrate and mm-wave semiconductor device including the same |
| CN1799290A (en) * | 2003-06-02 | 2006-07-05 | 日本电气株式会社 | Compact via transmission line for printed circuit board and its designing method |
| CN102800644A (en) * | 2012-09-05 | 2012-11-28 | 无锡江南计算技术研究所 | Double data rate (DDR) signal wiring encapsulation substrate and DDR signal wiring encapsulation method |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028642A (en) * | 2016-06-22 | 2016-10-12 | 安徽天兵电子科技有限公司 | TR assembly multilayer circuit board and processing technology thereof |
| CN106061101A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Signal line protection method and apparatus, printed circuit board, and mobile terminal |
| CN106061101B (en) * | 2016-06-28 | 2018-09-18 | 广东欧珀移动通信有限公司 | Signal wire guard method, device, printed circuit board and terminal device |
| CN107072056B (en) * | 2017-05-31 | 2019-09-27 | 郑州云海信息技术有限公司 | A kind of design method optimizing PCIE connector area signal quality |
| CN107072056A (en) * | 2017-05-31 | 2017-08-18 | 郑州云海信息技术有限公司 | A kind of design method of optimization PCIE connector area signal qualitys |
| CN107135605A (en) * | 2017-06-09 | 2017-09-05 | 郑州云海信息技术有限公司 | A kind of design method of new matched termination impedance |
| CN108495514A (en) * | 2018-03-07 | 2018-09-04 | 中国船舶重工集团公司第七二三研究所 | A kind of compression joint type connector pore model processing method |
| CN109089375A (en) * | 2018-09-26 | 2018-12-25 | 郑州云海信息技术有限公司 | A kind of analysis method and system that signal integrity is influenced for pcb board via hole |
| CN109089375B (en) * | 2018-09-26 | 2021-07-27 | 郑州云海信息技术有限公司 | Analysis method and system for influence of PCB (printed circuit board) via hole on signal integrity |
| CN113170577A (en) * | 2018-12-19 | 2021-07-23 | 索尼集团公司 | Substrate and electronic device |
| US12028968B2 (en) | 2018-12-19 | 2024-07-02 | Sony Group Corporation | Substrate and electronic device |
| CN109637808A (en) * | 2019-01-11 | 2019-04-16 | 广西芯百特微电子有限公司 | A kind of novel capacitor and device |
| CN109637808B (en) * | 2019-01-11 | 2024-02-23 | 芯百特微电子(无锡)有限公司 | Novel capacitor and device |
| WO2021051446A1 (en) * | 2019-09-20 | 2021-03-25 | 苏州浪潮智能科技有限公司 | Printed circuit board and electronic product |
| WO2022262335A1 (en) * | 2021-06-18 | 2022-12-22 | 中兴通讯股份有限公司 | Shielding structure and circuit board |
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Application publication date: 20150225 |
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| WD01 | Invention patent application deemed withdrawn after publication |