CN206061272U - A kind of high-speed high frequency printed board is across segmentation Wiring structure - Google Patents
A kind of high-speed high frequency printed board is across segmentation Wiring structure Download PDFInfo
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- CN206061272U CN206061272U CN201620763508.1U CN201620763508U CN206061272U CN 206061272 U CN206061272 U CN 206061272U CN 201620763508 U CN201620763508 U CN 201620763508U CN 206061272 U CN206061272 U CN 206061272U
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- segmentation
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- wiring structure
- high frequency
- printed board
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- 230000011218 segmentation Effects 0.000 title claims abstract description 43
- 230000000694 effects Effects 0.000 abstract description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The utility model discloses a kind of high-speed high frequency printed board is across segmentation Wiring structure, which includes pcb board, slot segmentation is provided with the pcb board, and parallel interval is provided with least two PCB traces on the pcb board, two PCB traces are arranged with the slot segmentation square crossing, wherein, several ground vias are provided with the outside of the slot segmentation between two PCB traces.Above-mentioned high-speed high frequency printed board increases ground via nearby across segmentation Wiring structure around slot segmentation and PCB trace, then return flow path can be formed in other GND plane layers by ground via across segmentation trace signal, so as to longitudinally obtain a shorter return flow path in PCB, so as to reduce across the segmentation effect such as cabling EMI and crosstalk.It is not only simple in structure, it is easy to accomplish；And low cost, reliability height.
Description
Technical field
This utility model belongs to printed board manufacturing technology, walks knot across segmentation more particularly, to a kind of high-speed high frequency printed board
Structure.
Background technology
In high speed/high-frequency design, cabling can bring impedance discontinuity problem across segmentation, can not only affect link itself
Insertion Loss/return loss performance, also brings along even more serious crosstalk, affects the performance of surrounding link.Therefore set high speed/high frequency is carried out
Need to avoid as far as possible when meter across segmentation cabling.But, due to the impact of the factor such as space on plate, do not ensure that
Cabling is all avoided across segmentation.
At present, the method that existing high speed/high frequency cabling must be conventional when segmentation is to bridge an electric capacity in segmentation portion
To optimize cabling performance.This mode needs to increase additional devices, haves the shortcomings that complex structure, high cost and reliability are low.
Utility model content
The purpose of this utility model is to provide a kind of high-speed high frequency printed board across segmentation Wiring structure, and which has structure letter
The characteristics of single, low cost and high reliability, to solve what prior art high speed high frequency printed board was present across segmentation Wiring structure
The problems referred to above.
It is that, up to this purpose, this utility model is employed the following technical solutions：
Across segmentation Wiring structure, which includes pcb board, is provided with slot segmentation on the pcb board for a kind of high-speed high frequency printed board,
And parallel interval is provided with least two PCB traces on the pcb board, two PCB traces are vertical with the slot segmentation to be handed over
Fork is arranged, wherein, several ground vias are provided with the outside of the slot segmentation between two PCB traces.
Especially, the ground via is set to 4, and be square distribution, and near two PCB traces and slot segmentation
Two sides cross point arrange.
Especially, any one or several groups generally circular in shape, square, oval or oblong of the ground via
Close.
Preferably, the ground via is generally circular in shape.
The beneficial effects of the utility model are that the high-speed high frequency printed board is across segmentation Wiring structure compared with prior art
Increase ground via nearby around slot segmentation and PCB trace, then can be by ground via at other across segmentation trace signal
GND plane layers form return flow path, so as to longitudinally obtain a shorter return flow path in PCB, so as to reduce across segmentation cabling
The effect such as EMI and crosstalk.It is not only simple in structure, it is easy to accomplish；And low cost, reliability height.
Description of the drawings
Fig. 1 is the structure of the high-speed high frequency printed board across segmentation Wiring structure of the offer of this utility model specific embodiment 1
Schematic diagram.
Specific embodiment
The technical solution of the utility model is further illustrated below in conjunction with the accompanying drawings and by specific embodiment.
Refer to shown in Fig. 1, Fig. 1 is the high-speed high frequency printed board of the offer of this utility model specific embodiment 1 across segmentation
The structural representation of Wiring structure.
In the present embodiment, a kind of high-speed high frequency printed board includes pcb board 1 across segmentation Wiring structure, sets on the pcb board 1
Be equipped with parallel interval on slot segmentation 2, and the pcb board 1 and be provided with two PCB traces 3, two PCB traces 3 with described point
2 square crossing of groove setting is cut, two PCB traces 3 form four cross points 4 with two sides of slot segmentation 2.
The outside of the slot segmentation 2 is provided with four grounded via 5 between two PCB traces 3, described four connect
Ground via 5 is square distribution, and the close cross point 4 is arranged.
The four grounded via 5 adopts circular port, can be by ground via 5 at other across segmentation trace signal
GND plane layers form return flow path, so as to obtain a shorter return flow path in 1 longitudinal direction of pcb board, so as to reduce walking across segmentation
The effect such as line EMI and crosstalk.
Prove Jing after test, about 69.6% is reduced using Wiring structure its single line Insertion Loss for setting up ground via, two-wire
Between isolation improve about 59.7%.
Above example simply elaborates ultimate principle of the present utility model and characteristic, and this utility model does not receive above-mentioned example
Limit, on the premise of without departing from this utility model spirit and scope, this utility model also has various change and change, these changes
Change and change and both fall within the range of claimed this utility model.The claimed scope of this utility model will by appended right
Ask book and its equivalent thereof.
Claims (4)
1. across segmentation Wiring structure, which includes pcb board, and slot segmentation is provided with the pcb board for a kind of high-speed high frequency printed board, and
On the pcb board, parallel interval is provided with least two PCB traces, two PCB traces and the slot segmentation square crossing
Arrange, it is characterised in that between two PCB traces, be provided with several ground vias on the outside of the slot segmentation.
2. high-speed high frequency printed board according to claim 1 is across segmentation Wiring structure, it is characterised in that the ground via
4 are set to, be square distribution, and are arranged near the cross point of two PCB traces with two sides of slot segmentation.
3. high-speed high frequency printed board according to claim 1 and 2 is across segmentation Wiring structure, it is characterised in that the ground connection
Any one or several combinations generally circular in shape, square, oval or oblong of via.
4. high-speed high frequency printed board according to claim 1 is across segmentation Wiring structure, it is characterised in that the ground via
It is generally circular in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620763508.1U CN206061272U (en) | 2016-07-19 | 2016-07-19 | A kind of high-speed high frequency printed board is across segmentation Wiring structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620763508.1U CN206061272U (en) | 2016-07-19 | 2016-07-19 | A kind of high-speed high frequency printed board is across segmentation Wiring structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206061272U true CN206061272U (en) | 2017-03-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620763508.1U Active CN206061272U (en) | 2016-07-19 | 2016-07-19 | A kind of high-speed high frequency printed board is across segmentation Wiring structure |
Country Status (1)
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| CN (1) | CN206061272U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108093558A (en) * | 2017-12-14 | 2018-05-29 | 郑州云海信息技术有限公司 | A kind of motherboard design method for reducing radiation effect |
| CN111212515A (en) * | 2019-12-28 | 2020-05-29 | 惠州Tcl移动通信有限公司 | PCB and terminal equipment adopting same |
-
2016
- 2016-07-19 CN CN201620763508.1U patent/CN206061272U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108093558A (en) * | 2017-12-14 | 2018-05-29 | 郑州云海信息技术有限公司 | A kind of motherboard design method for reducing radiation effect |
| CN111212515A (en) * | 2019-12-28 | 2020-05-29 | 惠州Tcl移动通信有限公司 | PCB and terminal equipment adopting same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181113 Address after: 214135 No. 18 Qingyuan Road, Wuxi New District, Wuxi City, Jiangsu Province C207-2, 530 Building, Sensor Network University Science Park, Taihu International Science Park Patentee after: P.C.B.A. ELECTRONIC (WUXI) LTD. Address before: 214028 C508, 530 Building, Sensor Network University Science Park, Taihu International Science Park, No. 18 Qingyuan Road, Wuxi National High-tech Industrial Development Zone, Wuxi City, Jiangsu Province Patentee before: WUXI JUN'AN ELECTRONIC TECHNOLOGY CO.,LTD. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 11-3 Hongyi Road, Xinwu District, Wuxi City, Jiangsu Province, 214028 Patentee after: Wuxi Synchronous Electronic Technology Co.,Ltd. Country or region after: China Address before: 214135 No. 18 Qingyuan Road, Wuxi New District, Wuxi City, Jiangsu Province C207-2, 530 Building, Sensor Network University Science Park, Taihu International Science Park Patentee before: P.C.B.A. ELECTRONIC (WUXI) LTD. Country or region before: China |