CN105338732A - Wire winding method for improving high speed differential signals - Google Patents
Wire winding method for improving high speed differential signals Download PDFInfo
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- CN105338732A CN105338732A CN201510909193.7A CN201510909193A CN105338732A CN 105338732 A CN105338732 A CN 105338732A CN 201510909193 A CN201510909193 A CN 201510909193A CN 105338732 A CN105338732 A CN 105338732A
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- Prior art keywords
- line
- speed differential
- signal
- high speed
- differential signals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
Abstract
The invention discloses a wire winding method for improving high speed differential signals, belongs to the field of signal integrity and aims at solving the technical problems that high speed differential signals are asymmetric and poor in signal quality. According to the technical scheme, differential lines comprise a first line and a second line, the first line and the second line are both extracted out of a pin end of a BGA chip of a PIGE signal, the first line passes through a PCB horizontally, protrusions are formed between the second line and the first line, each protrusion is in parallel with the first line, the shortest distance between the second line and the first line is St, the distance between each protrusion of the second line and the first line is S2, the length of protruding portions of the second line is S1, the length of sunken portions of the second line is S3, and the relation among St, S1, S2 and S3 meet the following conditions: S2= St+ 10 mil, S1= 30 mil, and S3= 70 mil.
Description
Technical field
The present invention relates to signal integrity field, be specifically related to a kind of method for winding improving high-speed differential signal.
Background technology
In server product design, the frequency of signal is progressively improving.Under high-speed transfer condition, signal quality problem will highlight further, how ensure that the transmission of high speed signal complete and accurate has been pendulum stubborn problem the most in face of research staff, the today especially under product trend toward miniaturization.Under the prerequisite of assurance function demand, components and parts are put and will be made full use of board space, and optimum can not be accomplished in the path of interlinked transfer line, and the differential signal transmission problem now brought is also more serious.
The limited high speed signal path flexibility that causes of components and parts putting position is larger, the transmission line be positioned at inside difference cabling is shorter than outside, according to the isometric requirement of differential signal, short transmission line need compensate according to the rule of 3W2S, when P/Nskew is larger, need the 3W2S number of compensation more, continuous multiple 3W2S will cause couple differential signals degree to reduce, the crosstalk strength difference that P/N is subject at 3W2S place strengthens, and further increases the asymmetry of differential signal.
For reducing high-speed differential signal asymmetry, suppress EMI, the method for winding improving couple differential signals degree is necessary.
Summary of the invention
Technical assignment of the present invention is for above deficiency, provides a kind of method for winding improving high-speed differential signal, solves the problem of high-speed differential signal asymmetry, poor signal quality.
Technical assignment of the present invention realizes in the following manner:
A kind of method for winding improving high-speed differential signal, described differential lines comprises First Line and the second line, First Line and the second line are all drawn from the leads ends of the bga chip of PICE signal, First Line is horizontal through pcb board, projection is formed between second line and First Line, and described projecting parallel is in First Line, second line and first-line beeline are St, second line is protruding is S2 with first-line distance, the length of the second line bossing is S1, the length of the second line sunk part is S3, St, S1, S2, relation between S3 meets: S2=St+10, S1=30, S3=70.
A kind of method for winding improving high-speed differential signal of the present invention compared with prior art has the following advantages: more traditional 3W2S can effectively improve the high-speed differential signal degree of coupling, reduce the asymmetry of high-speed differential signal, suppress EMI, improve signal quality, strengthen the reliability and stability of product.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the present invention is further described.
Accompanying drawing 1 be in embodiment 3W2S around isometric parameter schematic diagram;
Accompanying drawing 2 be in embodiment 3W2S around isometric simulation waveform schematic diagram;
Accompanying drawing 3 is around isometric parameter schematic diagram in embodiment;
Accompanying drawing 4 is around isometric parameters simulation waveform schematic diagram in embodiment;
Accompanying drawing 5 is the measured waveform schematic diagram that re-packs in embodiment.
Embodiment
With reference to Figure of description and specific embodiment, a kind of method for winding improving high-speed differential signal of the present invention is described in detail below.
Embodiment:
A kind of method for winding improving high-speed differential signal of the present invention, differential lines comprises First Line and the second line, First Line and the second line are all drawn from the leads ends of the bga chip of PICE signal, First Line is horizontal through pcb board, projection is formed between second line and First Line, and described projecting parallel is in First Line, second line and first-line beeline are St, second line is protruding is S2 with first-line distance, the length of the second line bossing is S1, the length of the second line sunk part is S3, St, S1, S2, relation between S3 meets: S2=St+10mil, S1=30mil, S3=70mil.
Comparatively large for P/N signal skew, the problem that 3W2S number is more, carry out following analytical test:
1), for current design, high-speed line space layout is first completed;
2), at the bga chip of PCIE signal go out pin end according to 3W2S around isometric, its simulation waveform as shown in Figure 2;
3), in same area according to method for winding of the present invention around isometric, its simulation waveform is as shown in Figure 4;
3), carry out signal eye diagram test, it re-packs measured waveform as shown in Figure 5;
In sum, adopt new for isometric method, can effectively improve the high-speed differential signal degree of coupling, reduce the asymmetry of high-speed differential signal, suppress EMI, improve signal quality.
By embodiment above, described those skilled in the art can be easy to realize the present invention.But should be appreciated that the present invention is not limited to above-mentioned embodiment.On the basis of disclosed execution mode, described those skilled in the art can the different technical characteristic of combination in any, thus realizes different technical schemes.Except the technical characteristic described in specification, be the known technology of those skilled in the art.
Claims (1)
1. one kind is improved the method for winding of high-speed differential signal, it is characterized in that described differential lines comprises First Line and the second line, First Line and the second line are all drawn from the leads ends of the bga chip of PICE signal, First Line is horizontal through pcb board, projection is formed between second line and First Line, and described projecting parallel is in First Line, second line and first-line beeline are St, second line is protruding is S2 with first-line distance, the length of the second line bossing is S1, the length of the second line sunk part is S3, St, S1, S2, relation between S3 meets: S2=St+10mil, S1=30mil, S3=70mil.
Priority Applications (1)
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CN201510909193.7A CN105338732A (en) | 2015-12-09 | 2015-12-09 | Wire winding method for improving high speed differential signals |
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CN201510909193.7A CN105338732A (en) | 2015-12-09 | 2015-12-09 | Wire winding method for improving high speed differential signals |
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CN201510909193.7A Pending CN105338732A (en) | 2015-12-09 | 2015-12-09 | Wire winding method for improving high speed differential signals |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106455307A (en) * | 2016-12-20 | 2017-02-22 | 郑州云海信息技术有限公司 | Wire winding design method and PCB |
CN107783027A (en) * | 2017-10-13 | 2018-03-09 | 福州创实讯联信息技术有限公司 | A kind of Integrity Testing of high-speed differential signal |
CN109379832A (en) * | 2018-09-19 | 2019-02-22 | 中国电子科技集团公司第五十二研究所 | A kind of difference line compensation method improving differential signal anti-interference ability |
CN111031668A (en) * | 2019-11-21 | 2020-04-17 | 苏州浪潮智能科技有限公司 | Concave winding differential wire, printed circuit board and design method |
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CN106455307A (en) * | 2016-12-20 | 2017-02-22 | 郑州云海信息技术有限公司 | Wire winding design method and PCB |
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CN109379832A (en) * | 2018-09-19 | 2019-02-22 | 中国电子科技集团公司第五十二研究所 | A kind of difference line compensation method improving differential signal anti-interference ability |
CN111031668A (en) * | 2019-11-21 | 2020-04-17 | 苏州浪潮智能科技有限公司 | Concave winding differential wire, printed circuit board and design method |
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Application publication date: 20160217 |