CN104125713A - Layer switching via hole structure for improving high-speed signal quality - Google Patents
Layer switching via hole structure for improving high-speed signal quality Download PDFInfo
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- CN104125713A CN104125713A CN201410379258.7A CN201410379258A CN104125713A CN 104125713 A CN104125713 A CN 104125713A CN 201410379258 A CN201410379258 A CN 201410379258A CN 104125713 A CN104125713 A CN 104125713A
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- 238000012545 processing Methods 0.000 claims abstract description 16
- 238000010992 reflux Methods 0.000 claims abstract description 7
- 238000013461 design Methods 0.000 abstract description 8
- 230000011514 reflex Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000011160 research Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The invention provides a layer switching via hole structure for improving high-speed signal quality. The layer switching via hole of a high-speed serial bus is a drilled hole 10mil, a bonding pad 20mil is adopted, a reverse bonding pad is hollowed out by 60*60mil, and two pairs of differential reverse bonding pads are communicated; reflux ground holes are formed around the layer switching via hole, thereby providing a reflux path for a signal, and reducing crosstalk. Compared with the prior art, the layer switching via hole structure for improving high-speed signal quality has the advantages that an expanded square bonding pad is adopted, the reflex ground holes are added around, and spaced via hole structures are needed between the differential pair reverse bonding pads to adapt to a high-speed signal. By adopting the layer switching via hole structure, the signal integrity of a channel is enhanced, and the influences of loss factors such as crosstalk and reflection are reduced. Moreover, the structure further has the characteristics of reasonable design, simple structure, easiness in processing, convenience in use and the like, thus realizing a high use value.
Description
Technical field
The present invention relates to electronic technology field, specifically a kind of layer-exchange hole-through structure that improves high speed signal quality.
Background technology
FDR bus is as a kind of bussing technique of current high speed switch, and speed is up to 14Gpbs, and this bus relates to is straddle interconnected systems mostly, and transmission range is longer.Bus design is to insertion loss, and return loss index request is very high.The FDR signal quality criterion that MELLANOX chip producer provides is labeled in before 7Ghz frequency, be more than or equal to-25.03dB of insertion loss (IL), and return loss (RL) is less than-10 dB.And many plates interconnected systems generally need to pass through mainboard, backboard, a plurality of boards such as daughter board, total link length may be up to more than ten inches.In many plates are interconnected, FDR signal need be through sending, receiving terminal chip package, via hole, connector, the multiple loss factor such as transmission line.In FDR bus design, any one factor all will be paid attention to, crosstalk reduction as far as possible, and reflection, the impacts such as decay, could realize the optimal design of whole link.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of layer-exchange hole-through structure that improves high speed signal quality is provided.
Technical scheme of the present invention realizes in the following manner, and its structure high speed universal serial bus layer-exchange hole-through is used boring 10mil, pad 20mil, and anti-pad hollows out processing according to 60x60mil but the anti-pad of two pairs of differential pairs is UNICOMs; Layer-exchange hole-through surrounding is added the hole, ground of refluxing, and provides return flow path, crosstalk reduction to signal.
Above-mentioned anti-pad is according to the processing that hollows out of 30x60mil.
The via hole of above-mentioned anti-pad 30mil, is respectively anti-pad and does not process.
Above-mentioned anti-pad hollows out the interval that has 10mil between processing and anti-pad according to 60x60mil.
Advantage of the present invention is:
A kind of layer-exchange hole-through structure that improves high speed signal quality of the present invention compared to the prior art, adopt the square pad expanding, and add in surrounding the hole, ground of refluxing, between the anti-pad of differential pair, need the most applicable high speed signal of spaced via structure, this kind of layer-exchange hole-through structure improved the signal integrity of passage, crosstalk reduction, the impact of reflection equal loss factor, and the present invention also have reasonable in design, simple in structure, be easy to processing, the feature such as easy to use, thereby, there is good use value.
Embodiment
Below a kind of layer-exchange hole-through structure that improves high speed signal quality of the present invention is described in detail below.
A kind of layer-exchange hole-through structure that improves high speed signal quality of the present invention, a kind of with regard in the multiple loss factor of system bus of this patent, layer-exchange hole-through is research object on the impact of bus.If high-speed serial bus layer-exchange hole-through does not adopt any processing mode, the serious reflection of layer place generation can changed.
This patent is studied with regard to the layer-exchange hole-through of 4 kinds of different structures, finds out best layer-exchange hole-through structure.Use boring 10mil, pad 20mil, the via hole of anti-pad 30mil, being respectively anti-pad does not process, anti-pad is according to the processing that hollows out of 30x60mil, anti-pad hollows out the interval that has 10mil between processing and anti-pad according to 60x60mil, anti-pad hollows out processing according to 60x60mil but the anti-pad of two pairs of differential pairs is UNICOMs.Layer-exchange hole-through surrounding is added the hole, ground of refluxing, and provides return flow path, crosstalk reduction to signal.
Use the emulation tool modeling of 3 D electromagnetic field, via structure is analyzed, draw frequency domain S parameter insertion return loss curvilinear trend figure, can draw the trend of the insertion return loss of four kinds of different differential lines layer-exchange hole-through structures.Before 10G, the Insertion Loss of four kinds of different structures does not also have much variations, and 10G later difference is comparatively obvious.Insertion Loss value variation tendency is continuously every <60x60antipad, to have interval according to non-processor antipad<30x60antipad<60x60anti pad, along with anti-pad optimal way difference, trend is different, because Insertion Loss is-dB, loss value is the bigger the better.
As for same pad processing mode, cause that the reason that signal effect is different is: 60x60antipad continuously every with spaced processing mode, compare crosstalk larger.Between two differential pairs, antipad need to separate, and can reduce to crosstalk between two signals.Through research methods such as contrast simulation test analysis, can sum up and adopt the square pad expanding, and add in surrounding the hole, ground of refluxing, between the anti-pad of differential pair, need the most applicable high speed signal of spaced via structure, this kind of layer-exchange hole-through structure improved the signal integrity of passage, crosstalk reduction, the impact of reflection equal loss factor.
In the High Speed System of design, veneer has bus more than 10Gbps speed, all adopts layer-exchange hole-through structure.Transmission channel layer-exchange hole-through place, impedance is still 100 ohm, does not bring unnecessary reflection, thereby has also reduced the loss of transmission line, has optimized system.
The QPI of a new generation is up to 9.6Gpbs, and FDR bus is especially up to 14Gbps.Various key elements on many plates of high speed serialization Difference signal pair transmission link have proposed higher performance requirement, comprise device package, connector, transmission line, layer-exchange hole-through etc.Weaken various loss factors is signal stabilizations as far as possible, the assurance of transmitting.
General QPI, PCIE, SAS, the universal serial bus interconnecting between the chip chambers such as FDR and plate can reduce high speed signal as far as possible change layer when design, but necessary to change layer be unavoidable.For high speed signal, cabling changes layer and brings the impact of signal quality particularly to highlight.The residual branch of via hole causes reflection, and via hole parasitic capacitance inductance produces change in the instantaneous impedance and causes reflection, causes intersymbol interference, causes receiver erroneous judgement.So need process layer-exchange hole-through when high speed signal PCBLAYOUT designs, reduce signal and change the harmful effect that layer brings.
A kind of its processing and fabricating of layer-exchange hole-through structure that improves high speed signal quality of the present invention is very simple and convenient, can process shown in to specifications.
Except the technical characterictic described in specification, be the known technology of those skilled in the art.
Claims (4)
1. improve a layer-exchange hole-through structure for high speed signal quality, it is characterized in that high-speed serial bus layer-exchange hole-through is used boring 10mil, pad 20mil, anti-pad hollows out processing according to 60x60mil but the anti-pad of two pairs of differential pairs is UNICOMs; Layer-exchange hole-through surrounding is added the hole, ground of refluxing, and provides return flow path, crosstalk reduction to signal.
2. a kind of layer-exchange hole-through structure that improves high speed signal quality according to claim 1, is characterized in that anti-pad is according to the processing that hollows out of 30x60mil.
3. a kind of layer-exchange hole-through structure that improves high speed signal quality according to claim 1, is characterized in that being respectively the via hole of anti-pad 30mil anti-pad and not processing.
4. a kind of layer-exchange hole-through structure that improves high speed signal quality according to claim 1, is characterized in that anti-pad hollows out the interval that has 10mil between processing and anti-pad according to 60x60mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410379258.7A CN104125713A (en) | 2014-08-04 | 2014-08-04 | Layer switching via hole structure for improving high-speed signal quality |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410379258.7A CN104125713A (en) | 2014-08-04 | 2014-08-04 | Layer switching via hole structure for improving high-speed signal quality |
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| Publication Number | Publication Date |
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| CN104125713A true CN104125713A (en) | 2014-10-29 |
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| CN201410379258.7A Pending CN104125713A (en) | 2014-08-04 | 2014-08-04 | Layer switching via hole structure for improving high-speed signal quality |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108829937A (en) * | 2018-05-24 | 2018-11-16 | 郑州云海信息技术有限公司 | A method of optimization PCB high speed signal via hole |
| CN110470978A (en) * | 2019-09-19 | 2019-11-19 | 浪潮商用机器有限公司 | A kind of test method and test device of PCB anti-pad |
| CN112135414A (en) * | 2020-09-11 | 2020-12-25 | 浪潮电子信息产业股份有限公司 | Printed circuit board and method, device and equipment for adjusting wiring of hollowed area of printed circuit board |
-
2014
- 2014-08-04 CN CN201410379258.7A patent/CN104125713A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108829937A (en) * | 2018-05-24 | 2018-11-16 | 郑州云海信息技术有限公司 | A method of optimization PCB high speed signal via hole |
| CN108829937B (en) * | 2018-05-24 | 2022-02-18 | 郑州云海信息技术有限公司 | Method for optimizing PCB high-speed signal via hole |
| CN110470978A (en) * | 2019-09-19 | 2019-11-19 | 浪潮商用机器有限公司 | A kind of test method and test device of PCB anti-pad |
| CN112135414A (en) * | 2020-09-11 | 2020-12-25 | 浪潮电子信息产业股份有限公司 | Printed circuit board and method, device and equipment for adjusting wiring of hollowed area of printed circuit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141029 |
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| WD01 | Invention patent application deemed withdrawn after publication |