CN108495514A - A kind of compression joint type connector pore model processing method - Google Patents
A kind of compression joint type connector pore model processing method Download PDFInfo
- Publication number
- CN108495514A CN108495514A CN201810186369.4A CN201810186369A CN108495514A CN 108495514 A CN108495514 A CN 108495514A CN 201810186369 A CN201810186369 A CN 201810186369A CN 108495514 A CN108495514 A CN 108495514A
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- CN
- China
- Prior art keywords
- connector
- model
- joint type
- compression joint
- type connector
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The present invention proposes a kind of model treatment method in compression joint type connector hole.An appropriate thick and short conducting wire is pulled out at the contact point in connector Yu connector hole as actual compression joint type connector pore model input port；Contact point is the circular inner diameter of a certain height in connector hole, and the line of pull-out is as thick as possible and short, and thick and short conducting wire can reduce signal transmission impedance, to reduce model error；Meanwhile contacting points position can upwardly or downwardly be modified this connector pore model error into line displacement；In addition, the position for pulling out conducting wire can be on bus plane, it can also be on signals layer, or in the dielectric layer, only influenced by the correction amount of contact point and model error.The present invention provides facility when connecting backboard, for high speed link signal completeness simulation.
Description
Technical field
The invention belongs to signal simulation technical fields, and in particular to a kind of compression joint type connector pore model processing method, it can
To be applied to high-frequency link signal integrity simulation.
Background technology
With.In complicated signal system, the transmission of data-signal and control signal is all to pass through the back of the body between multimode
Plate is realized.With the sharp increase of required signaling traffic to be processed, signal density of the individual module on backboard, signal speed also with
Increase, when working frequency reach 10Gbps or more be even up to 25Gbps when, it is virtually impossible to avoid to signal integrity generate
It influences.Currently, in signal integrity simulation, software can be used to carry out strip line, microstrip line and the via in link
Perfection modeling.Meanwhile the model of connector can also be by obtaining at device manufacturer.However, as depicted in figs. 1 and 2, compression joint type
The contact point (input port) in connector hole is the circular inner diameter of a certain height in the aperture of connector hole.Since software modeling is necessary
Using model surface section as the input port of model, therefore, it is difficult to be modeled to compression joint type connector hole.This is signal
The high speed full link emulation of integrity techniques field brings difficulty.
Invention content
The present invention proposes a kind of model treatment method in compression joint type connector hole, when connecting backboard, believes for high-speed link
Number completeness simulation provides facility.
In order to solve the above technical problem, the present invention provides a kind of model treatment methods in compression joint type connector hole, are connecing
An appropriate thick and short conducting wire is pulled out at plug-in unit and the contact point in connector hole as actual compression joint type connector pore model
Input port.Since contact point is the circular inner diameter of a certain height in connector hole before, the line pulled out is as thick as possible and short,
Thick and short conducting wire can reduce signal transmission impedance, to reduce model error.Meanwhile contacting points position can upwards or
Downwards into line displacement to be modified to this connector pore model error.In addition, the position for pulling out conducting wire can be in bus plane
On, it can also be on signals layer, or in the dielectric layer, only influenced by the correction amount of contact point and model error.It therefore can
Perfect closing to reality situation.
Compared with prior art, the present invention its remarkable advantage is,
Institute's established model of the present invention be on the basis of original compression joint type connector hole realistic model, close to connector with
The contact point in connector hole nearby pulls out a conducting wire, i.e. input transmission line, the position of input transmission line as the case may be may be used
Just in contacting points position, can also upwardly or downwardly be slightly offset in contact point, to be modified to model error.
Meanwhile this conducting wire pulled out is appropriate thick and short, so that signal transmission impedance reduces.The method can more accurately realize pressure
Formula connector pore model is connect, and this model can be applied to common single network model, be also applied for the differential networks of high speed
Model is brought conveniently for subsequent signal integrity field high-frequency link direction.
Description of the drawings
Fig. 1 is the contact structures schematic diagram of connector and connector hole；
Fig. 2 is the model schematic in existing compression joint type connector hole；
Fig. 3 is model front view of the present invention；
Fig. 4 is model side view of the present invention.
Specific implementation mode
It is readily appreciated that, technical solution according to the present invention, in the case where not changing the connotation of the present invention, this field
Those skilled in the art can imagine compression joint type connector of the present invention hole model treatment method numerous embodiments.Cause
This, detailed description below and attached drawing are only the exemplary illustrations to technical scheme of the present invention, and are not to be construed as this hair
Bright whole is considered as limitation or restriction to technical solution of the present invention.
As shown in Figure 1, connector and the circular inner diameter that the contact point in connector hole is a certain height inside connector hole, just
This circular inner diameter is input port in the case of often.However since this circular inner diameter is inside model, accordingly, it is difficult to software to defeated
Inbound port is modeled.
As shown in Fig. 2, be compression joint type connector in the prior art hole realistic model, however due to as input port
Contact point is the internal diameter of a certain height in connector hole, this contact point may be in signals layer, it is also possible in bus plane, it is also possible to
Dielectric layer, therefore the model and imperfect, to bring difficulty for the emulation of follow-up signal integrality field high-frequency link.
Such as Fig. 3, shown in Fig. 4, compression joint type connector pore model provided by the invention, this model includes：Signal input port
1, function pads 2 (pad of connecting wire), anti-pad 3, bus plane 4, signals layer 5, dielectric layer 6, (this biography of input transmission line 7
Defeated line must can be in signals layer, can be in bus plane, can also be in dielectric layer), output port 8, (this letter of output signal line 9
Number line must be in signals layer), non-functional pad 10 (pad for being not connected to conducting wire), (this stub can use back drill technique to stub 11
Perform etching removal), air column 12；
In above-mentioned model, input transmission line 7 be on the basis of existing compression joint type connector hole realistic model,
The conducting wire that contact point close to connector with connector hole nearby pulls out, the position of input transmission line 7 is as the case may be
It can also can upwardly or downwardly be slightly offset in contact point just in contacting points position, to be repaiied to model error
Just.Meanwhile this conducting wire pulled out is appropriate thick and short, so that signal transmission impedance reduces.The method can be relatively accurate more real
Existing compression joint type connector pore model, and this model can be applied to common single network model, be also applied for the difference of high speed
Network model is brought conveniently for subsequent signal integrity field high-frequency link direction.
Modeling method of the present invention is simple, can automatically be given birth to by the softwares such as HFSS or integrated small software via wizard
At.
The model pad may have non-functional pad according to actual demand, it is also possible to without non-functional pad.
It is eight layers that the model treatment method, which can be applied to lamination, and it is other any layers that can also be applied to lamination
Number.
The model anti-pad shape can be oval, can be rectangle, can also be other irregular shapes.
The model can be applied to single-terminal network, can also apply to differential networks.
The case where model can be applied to back drill, the case where can also apply to no back drill.
Claims (3)
1. the model of a kind of model treatment method in compression joint type connector hole, compression joint type connector hole includes signal input part
Mouth, function pads, anti-pad, bus plane, signals layer, dielectric layer, output port, output signal line, non-functional pad, stub,
Air column, which is characterized in that further include input transmission line, the input transmission line 7 is the contact in connector and connector hole
The conducting wire pulled out at point.
2. the model treatment method in compression joint type connector as described in claim 1 hole, which is characterized in that the input transmission line
It can suitably upwardly or downwardly, and slightly with connector and the contacting points position in connector hole with the contacting points position in connector hole
Micro- offset.
3. the model treatment method in compression joint type connector as described in claim 1 hole, which is characterized in that the input transmission line
Positioned at signals layer or it is located at bus plane, or is located at dielectric layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810186369.4A CN108495514A (en) | 2018-03-07 | 2018-03-07 | A kind of compression joint type connector pore model processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810186369.4A CN108495514A (en) | 2018-03-07 | 2018-03-07 | A kind of compression joint type connector pore model processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108495514A true CN108495514A (en) | 2018-09-04 |
Family
ID=63341710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810186369.4A Pending CN108495514A (en) | 2018-03-07 | 2018-03-07 | A kind of compression joint type connector pore model processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108495514A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0468598A (en) * | 1990-07-09 | 1992-03-04 | Hitachi Ltd | Multilayer circuit board |
| CN1916915A (en) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业（深圳）有限公司 | Method for improving resistance of via hole |
| CN102065630A (en) * | 2009-11-13 | 2011-05-18 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board (PCB) with high-speed differential signal wiring structure |
| CN103717012A (en) * | 2012-09-28 | 2014-04-09 | 杭州华三通信技术有限公司 | PCB board via impedance control method and structure |
| CN104378912A (en) * | 2014-12-05 | 2015-02-25 | 浪潮集团有限公司 | Design method of PCB (printed circuit board) controllable impedance through holes |
-
2018
- 2018-03-07 CN CN201810186369.4A patent/CN108495514A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0468598A (en) * | 1990-07-09 | 1992-03-04 | Hitachi Ltd | Multilayer circuit board |
| CN1916915A (en) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业（深圳）有限公司 | Method for improving resistance of via hole |
| CN102065630A (en) * | 2009-11-13 | 2011-05-18 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board (PCB) with high-speed differential signal wiring structure |
| CN103717012A (en) * | 2012-09-28 | 2014-04-09 | 杭州华三通信技术有限公司 | PCB board via impedance control method and structure |
| CN104378912A (en) * | 2014-12-05 | 2015-02-25 | 浪潮集团有限公司 | Design method of PCB (printed circuit board) controllable impedance through holes |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180904 |