CN201374868Y - Circuit board structure - Google Patents
Circuit board structure Download PDFInfo
- Publication number
- CN201374868Y CN201374868Y CN200920001778U CN200920001778U CN201374868Y CN 201374868 Y CN201374868 Y CN 201374868Y CN 200920001778 U CN200920001778 U CN 200920001778U CN 200920001778 U CN200920001778 U CN 200920001778U CN 201374868 Y CN201374868 Y CN 201374868Y
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- circuit
- plate body
- area
- ground
- board structure
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Abstract
The utility model discloses a circuit board structure, which comprises a board body, a plurality of grounding holes and at least one component arranging area, wherein the board body is provided with a plurality of circuit layers, at least one electronic component and a grounding layer, and the grounding holes pass through the board body and are electrically connected with the grounding layer, and the grounding holes are arranged on the position outside the electronic component so as to prevent the electromagnetic wave from interfering the use of the circuit board. One circuit layer of the board body is also provided with a grounding area, and the grounding area corresponds to the position of the component arranging area, and the coverage area of the grounding area is overlapped with the area of the component arranging area so as to prevent the electromagnetic wave from interfering the use of the circuit board.
Description
Technical field
The utility model relates to a kind of board structure of circuit, and particularly relevant for a kind of board structure of circuit with ground hole and ground area, to prevent electromagnetic interference.
Background technology
In recent years, flourish along with electronic industry makes being widely used of electronic product, and demand increases day by day, and the circuit design of various electronic products becomes increasingly complex.(Printed circuitboard PCB) almost can appear in the middle of each electronic equipment printed circuit board (PCB).Nearly all electronic building brick all is (mount) to be installed on the printed circuit board (PCB) of different sizes in the equipment.Except fixing various electronic building bricks, the major function of printed circuit board (PCB) provides the mutual electric current connection of every assembly on it.
Along with the electronic building brick on the printed circuit board (PCB) and circuit are more and more intensive, function is become stronger day by day, and the service speed and the frequency of operation of electronic building brick are also more and more higher.Therefore, in order to increase the area that can connect up, printed circuit board (PCB) adopts a kind of multi-layer sheet (Multi-Layer Boards) structure at present mostly.
Yet, electronic building brick in running, can generate electromagnetic waves disturb near the operation of other electronic building brick, cause electronic building brick to be interfered and cause the situation of interpretation mistake or usefulness variation to take place.On the other hand, the circuit on the printed circuit board (PCB) time also has electromagnetic wave in running and produces, and line layer is positioned at the skin of whole printed circuit board arrangement, makes electromagnetic wave radiate easily.And improve when the frequency of operation of electronic building brick, the line loop operation frequency on the printed circuit board (PCB) also must and then improve, so printed circuit board (PCB) also has the problem that the electromagnetic interference phenomenon strengthens and produces.Producing the problem that the phase mutual interference causes usefulness to reduce owing to the phenomenon of electromagnetic interference can make between the electronic building brick in the electronic product, is a very important problem so how to suppress the generation of electromagnetic interference effectively.
Summary of the invention
In view of above problem, the utility model provides a kind of board structure of circuit, uses to solve to produce electromagnetic interference phenomenon, the problem that causes electronic building brick usefulness to reduce on the existing printed circuit board (PCB).
The utility model discloses a kind of board structure of circuit, and it includes a plate body, at least one part placement district and a ground area.Plate body has a plurality of circuit layers and at least one electronics spare part.The part placement district is arranged at a surface of plate body, electrically connects for the electronics spare part.The ground area is arranged on the circuit layer wherein and corresponding to the position in part placement district, and the scope of ground area overlaps mutually with the area in part placement district.
Board structure of circuit of the present utility model can produce shielding action effectively by the ground area is set, and intercept electromagnetic interference, so this case compared to existing technologies, and board structure of circuit of the present utility model has the advantage of the electromagnetic interference of preventing.
Above about the utility model content explanation and the explanation of following execution mode in order to demonstration with explain spirit of the present utility model and principle, and provide patent claim of the present utility model further to explain.
Description of drawings
Fig. 1 is the board structure of circuit schematic diagram according to the utility model first embodiment;
Fig. 2 is the generalized section of Fig. 1;
Fig. 3 is the board structure of circuit schematic diagram according to the utility model second embodiment;
Fig. 4 is the generalized section of Fig. 3;
Fig. 5 is the board structure of circuit schematic diagram according to the utility model the 3rd embodiment;
Fig. 6 is the board structure of circuit schematic diagram according to the utility model the 4th embodiment;
Fig. 7 is the board structure of circuit schematic diagram according to the utility model the 5th embodiment; And
Fig. 8 is the generalized section of Fig. 7.
Wherein, Reference numeral:
100 board structure of circuit, 110 plate bodys
112 circuit layer 112a ground planes
114 electronics spare parts, 116 inactive area
120 ground holes, 210 part placement districts
220 ground areas
Embodiment
Fig. 1 is the board structure of circuit schematic diagram according to the utility model first embodiment.Fig. 2 is the generalized section of Fig. 1.Be used for the computer main frame panel of computer installation or the tellite of other electronic equipment according to board structure of circuit disclosed in the utility model.Board structure of circuit 100 includes a plate body 110, at least one part placement district 210 and a ground area 220.In the present embodiment, plate body 110 is a multilayer board, and plate body 110 has a plurality of circuit layers 112 and at least one electronics spare part 114.Part placement district 210 is arranged at a surface of plate body 110, in order to electronics spare part 114 electrically to be set thereon.Ground area 220 is arranged on the wherein circuit layer in each circuit layer 112, and the position of ground area 220 is corresponding to the position in part placement district 210.And between the ground area 220 on each circuit layer 112 and the corresponding circuit layer with ground hole 120 conductings, so that each circuit layer 112 and ground area 220 are electrically connected, increase the area of ground connection.In addition, the scope of ground area 220 overlaps mutually with the area in part placement district 210.In other words, the area of ground area 220 is greater than or equal to the area in part placement district 210 at least.
A plurality of circuit layers 112 include ground plane 112a, line layer 112b, bus plane 112c and insulating barrier (not shown).Wherein, has the circuit (not shown) that layout (layout) is finished on the line layer 112b, and electronics spare part 114 is for example with surface mount technology (Surface Mounted Technology, SMT) or alternate manner be arranged on the plate body 110, and electrically connect with circuit on the line layer 112b.Bus plane 112c is connected in the power supply of supply plate body 110 electric power, in order to drive the circuit and the electronics spare part 114 that is arranged on the plate body 110 on the plate body 110.And, between above-mentioned each layer, be provided with insulating barrier, in order to separating each layer, and utilize a plurality of ground holes 120 to run through plate body 110 between each circuit layer 112 and electrically conduct mutually.In addition, be full of in the ground hole 120 or the coating of coating metal, and utilize this coating so that connect line layer 112b, bus plane 112c or the ground plane 112a at ground hole 120 two ends and be electrically connected to each other.
The multilayer board of being given an example in the present embodiment is a four-layer structure, yet the utility model is not limited to the multilayer board of four-layer structure, in foundation other embodiment of the present utility model, plate body 110 also can be six layers, eight layers or the multilayer board of the more number of plies.In addition, present embodiment does not limit putting in order of each circuit layer 112, can change according to the actual track design.
When actual operation, owing in utilization or operation, be processing at a high speed in the computer installation, read or be read data, and must use the electronics spare part 114 that belongs to high-performance and high speed operating frequency, therefore, be easy to generate unnecessary radiated noise and cause the phenomenon of electromagnetic interference.Thus, electronics spare part 114 on the plate body 110 can be subjected to the noise that the electronics spare part 114 of other easy radiated noise in the computer installation given off easily and disturb, and causes producing the phase mutual interference between the electronics spare part 114 and the problem that causes interpretation mistake, usefulness to reduce.
As Fig. 1 and shown in Figure 2, in the present embodiment, be provided with electronics spare part 114 in the part placement district 210 on the plate body 110, it for example is a quartz oscillator, and the wherein circuit layer increase in circuit layer 112 is provided with ground area 220, in order to the problem of phase mutual interference between the insulating electron spare part 114 in addition.Moreover, wherein one deck of circuit layer 112 is a ground plane 112a, with each ground hole 120 be arranged at part placement district 210 around, and each ground hole 120 runs through plate body 110, each ground hole 120 and ground plane 112a are electrically connected, the noise that electronics spare part 114 can be given off is directed to ground plane 112a via each ground hole 120, to reduce the problem of noise jamming on the plate body 110 effectively.
Fig. 3 is the board structure of circuit schematic diagram according to the utility model second embodiment.Fig. 4 is the generalized section of Fig. 3.As shown in Figure 3 and Figure 4, electronics spare part 114 is an I/O connector.Similarly, also can pass through above-mentioned board structure of circuit 100, and reduce the Electromagnetic Interference that is produced on the plate body 110 effectively.
Fig. 5 is the board structure of circuit schematic diagram according to the utility model the 3rd embodiment.Fig. 6 is the board structure of circuit schematic diagram according to the utility model the 4th embodiment.Fig. 7 is the board structure of circuit schematic diagram according to the utility model the 5th embodiment.Fig. 8 is the generalized section of Fig. 7.The partial component of the 3rd embodiment, the 4th embodiment and the 5th embodiment and the foregoing description is roughly the same, and same or analogous assembly label is represented same or analogous assembly, its allocation position and function are same as the previously described embodiments or similar, therefore no longer given unnecessary details, below only illustrated in detail with regard to difference.
See also shown in Figure 5ly, in the present embodiment, be provided with a plurality of ground holes 120 around the plate body 110, that is ground hole 120 be set, and avoid the circuit zone of layout in the edges of boards compartment of terrain of plate body 110.See also shown in Figure 6, in the present embodiment, have more an inactive area 116 on the plate body 110, this inactive area 116 is for example for excising in advance or zone to be excised when plate body 110 is made, it for example is a perforate, each ground hole 120 compartment of terrain be arranged at inactive area 116 around, the radiation signal that produced to prevent on the plate body 110 disturbs and rushes down outward by this inactive area 116.See also Fig. 7 and shown in Figure 8, in the present embodiment, each ground hole 120 compartment of terrain around plate body 110 around with around the inactive area 116.
From the above, each ground hole 120 is disposed at around the plate body 110 and the position beyond the electronics spare part 114.In other words, each ground hole 120 is the positions that are arranged on the plate body 110 without any configuration.Thus, the electromagenetic wave radiation that is produced when circuit operates on the plate body 110 can promptly be got rid of, and solves Electromagnetic Interference (Electro magnetic Interference, EMI) phenomenon that is produced on the plate body 110.
In sum, since board structure of circuit of the present utility model be by arrange at plate body ground hole and The ground area, the Electromagnetic Interference that plate body is produced is isolated or derives, and can not affect the fortune of plate body Make usefulness, overall efficiency is improved, compared to prior art, board structure of circuit of the present utility model can be effective Prevent electromagnetic interference.
Claims (6)
1, a kind of board structure of circuit is characterized in that, includes:
One plate body, this plate body have a plurality of circuit layers and at least one electronics spare part;
At least one part placement district that electrically connects for this electronics spare part that uses is arranged at a surface of this plate body; And
One ground area is arranged on this circuit layer wherein and corresponding to the position in this part placement district, the scope of this ground area overlaps mutually with the area in this part placement district.
2, board structure of circuit as claimed in claim 1 is characterized in that, this electronics spare part is a quartz oscillator or an I/O connector.
3, board structure of circuit as claimed in claim 1 is characterized in that, also includes a plurality of ground holes, be arranged at this part placement district around and run through this plate body, this plate body also has a ground plane, and respectively this ground hole and this ground plane electric connection.
4, board structure of circuit as claimed in claim 3 is characterized in that, respectively this ground hole be provided with this plate body around.
5, board structure of circuit as claimed in claim 3 is characterized in that, this plate body has an inactive area, and respectively this ground hole be arranged at this inactive area around.
6, board structure of circuit as claimed in claim 3 is characterized in that, respectively this ground hole be provided with this plate body around, and this plate body has an inactive area, respectively this ground hole be arranged at this inactive area around.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200920001778U CN201374868Y (en) | 2009-02-25 | 2009-02-25 | Circuit board structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN200920001778U CN201374868Y (en) | 2009-02-25 | 2009-02-25 | Circuit board structure |
Publications (1)
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CN201374868Y true CN201374868Y (en) | 2009-12-30 |
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CN200920001778U Expired - Fee Related CN201374868Y (en) | 2009-02-25 | 2009-02-25 | Circuit board structure |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102468534A (en) * | 2010-11-04 | 2012-05-23 | 北京和协航电科技有限公司 | Single-layer double-frequency microstrip antenna |
CN103311227A (en) * | 2012-03-09 | 2013-09-18 | 富士康(昆山)电脑接插件有限公司 | Chip module and circuit board |
CN106028642A (en) * | 2016-06-22 | 2016-10-12 | 安徽天兵电子科技有限公司 | TR assembly multilayer circuit board and processing technology thereof |
CN106061097A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Mobile terminal and PCB |
CN107087342A (en) * | 2016-02-16 | 2017-08-22 | 中兴通讯股份有限公司 | A kind of pcb board and its processing method and device crimped for connector |
CN107454744A (en) * | 2017-07-03 | 2017-12-08 | 深圳天珑无线科技有限公司 | The encapsulation of electronic component and its method for packing and circuit board |
CN110784999A (en) * | 2019-10-29 | 2020-02-11 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCBA manufacturing method, PCB and SMT template |
-
2009
- 2009-02-25 CN CN200920001778U patent/CN201374868Y/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102468534A (en) * | 2010-11-04 | 2012-05-23 | 北京和协航电科技有限公司 | Single-layer double-frequency microstrip antenna |
CN103311227A (en) * | 2012-03-09 | 2013-09-18 | 富士康(昆山)电脑接插件有限公司 | Chip module and circuit board |
CN107087342A (en) * | 2016-02-16 | 2017-08-22 | 中兴通讯股份有限公司 | A kind of pcb board and its processing method and device crimped for connector |
CN106028642A (en) * | 2016-06-22 | 2016-10-12 | 安徽天兵电子科技有限公司 | TR assembly multilayer circuit board and processing technology thereof |
CN106061097A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Mobile terminal and PCB |
CN107454744A (en) * | 2017-07-03 | 2017-12-08 | 深圳天珑无线科技有限公司 | The encapsulation of electronic component and its method for packing and circuit board |
CN110784999A (en) * | 2019-10-29 | 2020-02-11 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCBA manufacturing method, PCB and SMT template |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091230 Termination date: 20160225 |