CN103607847A - Isolation method for radio frequency printed board with combination of ground plane and pressing strips - Google Patents
Isolation method for radio frequency printed board with combination of ground plane and pressing strips Download PDFInfo
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- CN103607847A CN103607847A CN201310582558.0A CN201310582558A CN103607847A CN 103607847 A CN103607847 A CN 103607847A CN 201310582558 A CN201310582558 A CN 201310582558A CN 103607847 A CN103607847 A CN 103607847A
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- printed board
- ground plane
- press strip
- radio frequency
- isolation method
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Abstract
The invention discloses an isolation method for a radio frequency printed board with combination of a ground plane and pressing strips. Each function module on the printed board is independently segmented. An independent grounding layer is laid on each module. Independent earth grounding layers are independently arranged among the grounding layers so that all the grounding layers are completely isolated, and metal pressing strips are installed on the corresponding printed board surface of the independent earth grounding layers. Multiple function modules can be designed on the same printed board by the embodiment of the isolation method. With isolation of the metal pressing strips, electromagnetic radiation generated by each module can be effectively absorbed. With application of the method, an isolation cavity is more concise in design, a period for designing and processing the cavity is shortened and the period for designing and processing the printed board is also shortened so that cost in testing the printed board is reduced, installation and repairing are more convenient, and timeliness and economic performance are greatly enhanced.
Description
Technical field
The present invention relates to printed circuit board radio frequency isolation field, particularly relate to the isolation method that a kind of ground level for radio frequency printed board combines with press strip.
Background technology
The develop rapidly of microelectric technique, the appearance of particularly digitlization, high integration, high reliability and miniaturization chip components and parts, for electronic system product has been created strong condition to miniaturization, lightweight, development high-speed, highly reliable and multifunction direction.The digitlization of electronic product and high-speed, require circuit to work under higher switching speed in higher frequency and device, great changes have taken place for the circuit characteristic of its printed circuit board circuit characteristic and general low frequency printed circuit board, and the difficulty of design, Computer-Assisted Design, Manufacture And Test is larger.At a high speed, high-frequency circuit board is used widely in the electronic product of the systems such as IT, communication and guidance control, this has also proposed new requirement and challenge to printed circuit board and the design thereof of electronic devices and components is installed, the designing technique of printed circuit also must be tackled these challenges, to adapt to new high speed device application requirements.
At present, radio circuit technology is used more and more wider, and its performance index directly affect the quality of whole product, and the Anti-interference Design of radio circuit printed board is significant to reducing system electromagnetic radiation.Radio-frequency module all contains a plurality of function subregions, for preventing internal RF coupling, a barrier need to be set, and this barrier is the iron bar that the interval that stands in zero volt plane of reference top is suitable for be concerned about highest frequency (/ 20).General way is at present, and the cavity of module is divided into a plurality of very little separate space, and between plate, signal connects with shielding conductor, with the radiation effect between suppressing plate.This just causes a surface-mounted integrated circuit to cut apart because have the functional module of different frequency on plate, and the radio-frequency module that each is cut apart carries out loading chambers, not only can bring great workload to production management, simultaneously because cutting apart of module can cause a large amount of standalone module of appearance in whole equipment, take a large amount of spaces, do not meet high density, the high integration requirement of circuit design.
Summary of the invention
The object of this invention is to provide a kind of new PCB layout, the integrated polylith medium and low frequency module of energy, high-frequency model, radio-frequency module in a printed board, by different earth terminals, effectively the electromagnetic radiation between space is transferred on shell cavity by the metal bead being added in printed board, avoids defect of the prior art.
The present invention adopts following technical scheme: the isolation method that a kind of ground level for radio frequency printed board combines with press strip,
Step 1: carrying out the printed circuit board design initial stage, different according to the frequency of each module, printed board is divided into different isolated areas;
Step 2: when further printed circuit board designs, each isolated area lays the ground plane in this region;
Step 3: lay a ground plane independently largely again between the ground plane in separate region, and through hole is set in printed board, through hole passes this ground plane independently largely;
Step 4: the earth ground plane position corresponding at printing board surface arranges press strip, and pass the through hole in press strip and printed board with screw, press strip is tightly fixed in printed board;
Step 5: the printed board that installs device is fixed in isolated chambers.
In technique scheme, the ground plane of described the earth ground plane and each isolated area is not connected.
In technique scheme, described press strip is metal bead, and described screw is metallic screw.
In technique scheme, the place that described metal bead contacts with printed board arranges pad, and pad is connected with the earth ground plane.
In technique scheme, the width of described metal bead and pad is consistent.
In technique scheme, described module is connected the external shielding conductor connection of employing with the signal between module.
In technique scheme, described printed board isolated area is high-frequency region if, and the back side of the printed board of high-frequency region is welded direct to isolated chambers; Isolated area is medium and low frequency region if, and the back side of printed board is welded with device, and at the printed board back side, the position corresponding with front press strip installed press strip again.
In this programme, at the printed board design initial stage, by the different module of operating frequency is carried out to regionalization design, a kind of operational module is only designed in each piece region, on each region, independently lay again a ground plane, the circuit that makes this region can independently work on power and not by other regional effects, the radiation of electronic device is directly transferred in isolated chambers by the ground plane in this region.
In this programme, in order to prevent that the radiation that high frequency, radio frequency electric device produce at work from affecting the work of other modules by spatial, independently large a ground plane will be laid between printed board upper module and the ground plane of module again, this ground plane is directly connected in isolated chambers, and the printing board surface that this ground plane is corresponding is again installed metal bead, metal bead is by metallic screw being fixed in printed board tightly, and metallic screw is through the earth ground plane in printed board and be connected with this ground plane.In order to guarantee that metal bead is connected with the effective of the earth ground plane, at printing board surface corresponding to the earth ground plane, many places pad is set, pad is connected with the earth ground plane, guarantee like this metal bead can with pad close contact.
In this programme, the electromagnetic radiation that may cause for the communication preventing between modules, module is connected the employing shielding conductor external world with the signal between module, does not carry out laying of holding wire between the module in printed board and module, by the screen on shielding conductor, effectively reduces electromagnetic radiation.
In this programme, when the module in whole printed board works on power, high frequency particularly, radio-frequency module can produce great electromagnetic radiation and transmit by space, and now because of the metal bead of printing board surface, will between each module, keep apart, radiation in space will between be radiated on metal bead, and radiation on metal bead is directly arrived outside shielding cavity by metallic screw, and with the earth ground plane in printed board, electromagnetic radiation is dissipated, form the zero potential on metal bead, effectively reduce the spacing electromagnetic radiation on equipment, guarantee the normal operation of each module.
The invention has the beneficial effects as follows: by adopting the mode of metal bead, only can guarantee just to shield a plurality of modules in printed board with a shielding cavity, reduced the processing of cavity, effectively promoted the integrated level of printed circuit, reduce the design cycle, and facilitate the later stage maintenance of equipment; Promote high frequency, the reliability of radio-frequency module in the total process of assembling of equipment.
Accompanying drawing explanation
Examples of the present invention will be described by way of reference to the accompanying drawings, wherein:
Fig. 1 is one embodiment of the present of invention structural representations;
Wherein: the 1st, printed board, the 2nd, ground plane, the 3rd, functional module, the 4th, the earth ground plane, the 5th, metal bead, the 6th, pad.
Embodiment
Disclosed all features in this specification, or the step in disclosed all methods or process, except mutually exclusive feature and/or step, all can combine by any way.
As shown in Figure 1, at the circuit design initial stage of printed board 1, printed board is divided into four different regions, on each region, design a kind of functional module 3, independent grounding layer 2 has been laid in the region of each functional module 3, between each ground plane 2, do not connect mutually, the module of the zones of different in printed board is operated in different frequencies.
On the clear position between each ground plane 2, lay separately one deck ground plane 4 independently largely, this earth ground plane 4 does not have any being connected with any one ground plane 2 in printed board, guarantees that the earth ground plane 4 keeps apart each functional module 3 completely.
On the surface of the printed board 1 of the earth ground plane 4 correspondences, be provided with many places pad 6, pad 6 is effectively connected with the earth ground plane.Then on the surface of the printed board 1 in the earth ground plane 4 correspondences, prevent metal bead 5, metal bead 5 is fixed on the surface of printed board 1 closely by metallic screw, and metal bead 5 is compressed on pad 6 closely.
During spacing distance in design between each region ground plane, by calculating the ground level in known independently large ground plane and the adjacent functional district at least 1mm of being separated by, pad and press strip width should be greater than highest frequency that printed board is used/20.By calculate we can learn if functional module operating frequency be 1GHz, the width of metal bead should be greater than 15mm so.
When design printed circuit board, if need the region cut apart more in printed board 1, when the ground plane 2 that particularly relates to each functional module 3 correspondence is cut apart, ground plane 2 in every one deck of printed board 1 is cut apart and be kept partitioning scheme consistent, and the conductive layer of each functional area and ground plane 2 are separate completely.Guarantee to cause electromagnetic interference because of partitioning scheme disunity.
As shown in Figure 1, if need the back side installing device of printed board again, with respect to the positive position that press strip is installed of printed board, at the printed board back side, metal bead is being installed so, by the back side, each region that device has been installed keeps apart completely, reduces the electromagnetic interference at the back side.
The present invention is not limited to aforesaid embodiment.The present invention expands to any new feature or any new combination disclosing in this manual, and the arbitrary new method disclosing or step or any new combination of process.
Claims (7)
1. the isolation method combining with press strip for the ground level of radio frequency printed board, is characterized in that:
Step 1: carrying out the printed circuit board design initial stage, different according to the frequency of each module, printed board is divided into different isolated areas;
Step 2: when further printed circuit board designs, each isolated area lays the ground plane in this region;
Step 3: lay a ground plane independently largely again between the ground plane in separate region, and through hole is set in printed board, through hole passes this ground plane independently largely;
Step 4: the earth ground plane position corresponding at printing board surface arranges press strip, and pass the through hole in press strip and printed board with screw, press strip is tightly fixed in printed board;
Step 5: the printed board that installs device is fixed in isolated chambers.
2. a kind of ground level for radio frequency printed board according to claim 1 and the isolation method that press strip combines, the ground plane that it is characterized by described the earth ground plane and each isolated area is not connected.
3. a kind of ground level for radio frequency printed board according to claim 1 and the isolation method that press strip combines, press strip shown in it is characterized by is metal bead, described screw is metallic screw.
4. a kind of ground level for radio frequency printed board according to claim 3 and the isolation method that press strip combines, is characterized by the place that described metal bead contacts with printed board pad be set, and pad is connected with the earth ground plane.
5. a kind of ground level for radio frequency printed board according to claim 4 and the isolation method that press strip combines, the width that it is characterized by described metal bead and pad is consistent.
6. a kind of ground level for radio frequency printed board according to claim 1 and the isolation method that press strip combines, is characterized by described printed board isolated area high-frequency region if, and the back side of the printed board of high-frequency region is welded direct to cavity; Isolated area is medium and low frequency region if, and the back side of printed board is welded with device, and at the printed board back side, the position corresponding with front press strip installed press strip again.
7. a kind of ground level for radio frequency printed board according to claim 1 and the isolation method that press strip combines, is characterized by described module and be connected the external shielding conductor connection of employing with the signal between module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310582558.0A CN103607847A (en) | 2013-11-20 | 2013-11-20 | Isolation method for radio frequency printed board with combination of ground plane and pressing strips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310582558.0A CN103607847A (en) | 2013-11-20 | 2013-11-20 | Isolation method for radio frequency printed board with combination of ground plane and pressing strips |
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| CN103607847A true CN103607847A (en) | 2014-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310582558.0A Pending CN103607847A (en) | 2013-11-20 | 2013-11-20 | Isolation method for radio frequency printed board with combination of ground plane and pressing strips |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106209122A (en) * | 2016-07-18 | 2016-12-07 | 孙海华 | The radio frequency integrated structure of transmitter |
| CN109688693A (en) * | 2018-12-26 | 2019-04-26 | 广州中海达卫星导航技术股份有限公司 | A kind of pcb board, pcb board and data radio station based on data radio station |
| CN113316330A (en) * | 2021-05-25 | 2021-08-27 | 中国电子科技集团公司第二十九研究所 | Embedded synthetic network substrate lamination based on multiple times of lamination and design method |
| WO2024131221A1 (en) * | 2022-12-22 | 2024-06-27 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing high-layer-count multilayer circuit board with local multi-frequency compatibility |
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| CN1801645A (en) * | 2004-11-15 | 2006-07-12 | Tdk株式会社 | High frequency module |
| CN101043788A (en) * | 2006-03-21 | 2007-09-26 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit boards |
| CN101174611A (en) * | 2006-10-30 | 2008-05-07 | 三星电子株式会社 | Multi-ground shielding semiconductor package, method of fabricating the package, and method of preventing noise using multi-ground shielding |
| US20110222247A1 (en) * | 2010-03-12 | 2011-09-15 | Ricoh Company, Limited. | Printed wiring board |
| US20120217048A1 (en) * | 2005-08-08 | 2012-08-30 | Rf Micro Devices, Inc. | Electronic modules having grounded electromagnetic shields |
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2013
- 2013-11-20 CN CN201310582558.0A patent/CN103607847A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1801645A (en) * | 2004-11-15 | 2006-07-12 | Tdk株式会社 | High frequency module |
| US20120217048A1 (en) * | 2005-08-08 | 2012-08-30 | Rf Micro Devices, Inc. | Electronic modules having grounded electromagnetic shields |
| CN101043788A (en) * | 2006-03-21 | 2007-09-26 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit boards |
| CN101174611A (en) * | 2006-10-30 | 2008-05-07 | 三星电子株式会社 | Multi-ground shielding semiconductor package, method of fabricating the package, and method of preventing noise using multi-ground shielding |
| US20110222247A1 (en) * | 2010-03-12 | 2011-09-15 | Ricoh Company, Limited. | Printed wiring board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106209122A (en) * | 2016-07-18 | 2016-12-07 | 孙海华 | The radio frequency integrated structure of transmitter |
| CN109688693A (en) * | 2018-12-26 | 2019-04-26 | 广州中海达卫星导航技术股份有限公司 | A kind of pcb board, pcb board and data radio station based on data radio station |
| CN109688693B (en) * | 2018-12-26 | 2021-08-10 | 广州中海达卫星导航技术股份有限公司 | PCB, PCB based on data transmission radio station and data transmission radio station |
| CN113316330A (en) * | 2021-05-25 | 2021-08-27 | 中国电子科技集团公司第二十九研究所 | Embedded synthetic network substrate lamination based on multiple times of lamination and design method |
| CN113316330B (en) * | 2021-05-25 | 2022-07-22 | 中国电子科技集团公司第二十九研究所 | Multiple lamination-based built-in synthetic network substrate lamination and design method |
| WO2024131221A1 (en) * | 2022-12-22 | 2024-06-27 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing high-layer-count multilayer circuit board with local multi-frequency compatibility |
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Application publication date: 20140226 |