CN113352397A - Multilayer board drilling method, system, device, equipment and storage medium - Google Patents
Multilayer board drilling method, system, device, equipment and storage medium Download PDFInfo
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- CN113352397A CN113352397A CN202110726667.XA CN202110726667A CN113352397A CN 113352397 A CN113352397 A CN 113352397A CN 202110726667 A CN202110726667 A CN 202110726667A CN 113352397 A CN113352397 A CN 113352397A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The application relates to a method, a system, a device, equipment and a storage medium for drilling a multilayer board, wherein the method comprises the steps of determining an initial positioning hole drilled on the multilayer board for the first time; establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin; determining coordinates of drill holes to be drilled on the multilayer board under a coordinate system based on a preset first drill hole interval, a preset second drill hole interval and coordinates of initial positioning holes drilled for the first time, wherein the first drill hole interval indicates the distance between two adjacent positioning holes with the same vertical coordinate, and the second drill hole interval indicates the distance between two adjacent positioning holes with the same horizontal coordinate; and controlling the drilling equipment to drill the multilayer board according to the coordinates of the drill hole to be drilled. Because the coordinates of the drill holes to be drilled can be determined, the drilling equipment can sequentially drill the multilayer boards based on the coordinates.
Description
Technical Field
The present disclosure relates to printed circuit boards, and more particularly, to a method, system, device, apparatus, and storage medium for drilling a multi-layer board.
Background
The printed circuit board is a carrier of a control circuit on the electronic equipment and is an important electrical appliance on the electronic equipment. When the printed circuit board is produced in batch, the multilayer boards are often required to be drilled simultaneously, specifically, each bakelite board is fixed by a pin inserting machine, then the un-drilled position is searched on the bakelite board, and an area is randomly determined from the un-drilled position for drilling.
When the existing drilling scheme is adopted for drilling, the bakelite plate cannot be reasonably utilized due to the fact that the drilling is carried out in a disordered manner.
Disclosure of Invention
The application provides a method, a system, a device, equipment and a storage medium for drilling a multilayer board, which are used for solving the problem that bakelite boards cannot be reasonably utilized in the related art.
In a first aspect, there is provided a method of drilling a multi-layer board, comprising:
determining an initial positioning hole drilled on the multilayer board for the first time;
establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin;
determining coordinates of drill holes to be drilled in the multilayer board under the coordinate system based on a preset first drill hole interval, a preset second drill hole interval and coordinates of the initial positioning holes drilled for the first time, wherein the first drill hole interval indicates the distance between two adjacent positioning holes with the same vertical coordinate, and the second drill hole interval indicates the distance between two adjacent positioning holes with the same horizontal coordinate;
and controlling a drilling device to drill the multilayer board according to the coordinates of the drill hole to be drilled.
Optionally, determining a first drilled pilot hole in a multi-layer board comprises:
identifying an area on the multilayer board sprayed with a preset code;
and determining the area as the initial positioning hole drilled for the first time.
Optionally, determining coordinates of the drill holes to be drilled on the multilayer board in the coordinate system based on a preset first drill hole pitch, a preset second drill hole pitch and coordinates of the initially drilled pilot hole, including:
determining coordinates on the multilayer board for indicating the initial positioning holes in the rows of positioning holes based on the vertical coordinates of the initial positioning holes drilled for the first time and the second drilling distance;
determining any one initial positioning hole as a target positioning hole, and determining the coordinates of positioning holes in the same row as the target positioning hole on the multilayer board based on the abscissa of the target positioning hole and the first drilling distance;
and determining the coordinates of all the positioning holes in the same row as the target positioning holes as the coordinates of the drill holes to be drilled on the multilayer board.
Optionally, determining coordinates on the multi-layer board for indicating the pilot holes in each row of pilot holes based on the ordinate of the pilot hole drilled for the first time and the second drill hole pitch comprises:
obtaining a vertical coordinate of at least one point based on the vertical coordinate and the second borehole interval;
acquiring the size of the multilayer board in the longitudinal axis direction of the coordinate system;
determining a ordinate of a last point of the multilayer board in the longitudinal axis direction based on the dimension;
screening a target point with a vertical coordinate not larger than that of the last point from the at least one point based on the vertical coordinate of the at least one point;
and determining the coordinates of the target points as the coordinates of the initial positioning holes in the row positioning holes.
Optionally, determining coordinates of each pilot hole on the multilayer board in the same row as the target pilot hole based on the abscissa of the target pilot hole and the first drilling pitch comprises:
determining the abscissa of at least one point based on the abscissa of the target positioning hole and the first drilling distance;
acquiring the size of the multilayer board in the direction of a transverse axis of the coordinate system;
determining an abscissa of a last point of the multilayer board in the transverse axis direction based on the dimension;
screening a target point of which the abscissa is not larger than the abscissa of the last point from the at least one point based on the abscissa of the at least one point;
and determining the coordinates of the target point as the coordinates of each positioning hole in the same row as the target positioning hole on the multilayer board.
Optionally, controlling a drilling device to drill the multilayer board according to the coordinates of the drill hole to be drilled, including:
classifying the drill holes to be drilled according to the coordinates of the drill holes to be drilled to obtain at least one drill hole set, wherein the drill holes in each drill hole set have the same vertical coordinate;
and controlling the drilling equipment to drill the multilayer board one by one according to the sequence of the vertical coordinates from small to large and the drilling sets in the at least one drilling set.
In a second aspect, there is provided a drilling system comprising:
multilayer boards, drilling devices and drilling equipment for the multilayer boards;
the drilling device of the multilayer board is used for determining an initial positioning hole drilled on the multilayer board for the first time; establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin; determining coordinates of drill holes to be drilled in the multilayer board under the coordinate system based on a preset first drill hole interval, a preset second drill hole interval and coordinates of the initial positioning holes drilled for the first time, wherein the first drill hole interval indicates the distance between two adjacent positioning holes with the same vertical coordinate, and the second drill hole interval indicates the distance between two adjacent positioning holes with the same horizontal coordinate; and controlling a drilling device to drill the multilayer board according to the coordinates of the drill hole to be drilled.
In a third aspect, there is provided a multi-layer board drilling apparatus comprising:
the first determining unit is used for determining an initial positioning hole drilled on the multilayer board for the first time;
the establishing unit is used for establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin;
a second determination unit configured to determine coordinates of drill holes to be drilled in the multilayer board in the coordinate system based on a preset first drill hole pitch indicating a distance between two adjacent positioning holes having the same ordinate, a second drill hole pitch indicating a distance between two adjacent positioning holes having the same abscissa, and coordinates of the initial positioning hole drilled for the first time;
and the control unit is used for controlling the drilling equipment to drill the multilayer board according to the coordinates of the drill hole to be drilled.
In a fourth aspect, an electronic device is provided, comprising: the system comprises a processor, a memory and a communication bus, wherein the processor and the memory are communicated with each other through the communication bus;
the memory for storing a computer program;
the processor is configured to execute the program stored in the memory, and implement the method for drilling a multilayer board according to the first aspect.
A fifth aspect provides a computer-readable storage medium storing a computer program which, when executed by a processor, implements the method of drilling a multi-layer board according to the first aspect.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: according to the technical scheme provided by the embodiment of the application, the initial positioning hole drilled on the multilayer board for the first time is determined; establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin; determining coordinates of drill holes to be drilled on the multilayer board under a coordinate system based on a preset first drill hole interval, a preset second drill hole interval and coordinates of initial positioning holes drilled for the first time, wherein the first drill hole interval indicates the distance between two adjacent positioning holes with the same vertical coordinate, and the second drill hole interval indicates the distance between two adjacent positioning holes with the same horizontal coordinate; and controlling the drilling equipment to drill the multilayer board according to the coordinates of the drill hole to be drilled. Because the coordinates of the drill holes to be drilled can be determined, the drilling equipment can sequentially drill the multilayer boards based on the coordinates.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a schematic flow chart of a method for drilling a multilayer board according to an embodiment of the present application;
FIG. 2 is a schematic flow chart of a method for drilling a multilayer board according to an embodiment of the present application;
FIG. 3 is a schematic structural view of a drilling apparatus for multi-layer boards according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a drilling system in an embodiment of the present application;
fig. 5 is a schematic structural diagram of an electronic device in an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The embodiment of the application provides a multilayer board drilling method, which can be applied to any electronic equipment, and as shown in fig. 1, the method comprises the following steps:
In application, the initially drilled initial positioning hole can be any drilled hole in the multilayer board, namely, a drilled hole can be randomly drilled in the multilayer board as the initially drilled initial positioning hole. Typically will be in the upper left, upper right, lower left or lower right corner of the multiwall sheet.
In application, in order to identify the initial positioning hole on the multilayer board, a preset code can be sprayed on the drilled initial positioning hole, and the initial positioning hole drilled for the first time is identified by identifying the area sprayed with the preset code on the multilayer board.
And 102, establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin.
It should be understood that when the initial positioning hole drilled for the first time is the origin of coordinates, the coordinates of the initial positioning hole are (0, 0).
Taking the example that the initial positioning hole drilled for the first time is located at the upper left corner of the multilayer board, the horizontal axis and the vertical axis of the coordinate system of the multilayer board established at this time can be the directions along the two sides of the upper left corner of the package.
And 103, determining the coordinates of the drill holes to be drilled on the multilayer board under a coordinate system based on the preset first drill hole interval, the preset second drill hole interval and the coordinates of the initial positioning holes drilled for the first time.
Wherein the first drilling pitch indicates a distance between two adjacent positioning holes having the same ordinate, and the second drilling pitch indicates a distance between two adjacent positioning holes having the same abscissa.
In application, the first drilling interval and the second drilling interval can be set by people according to experience.
In application, when determining the coordinates of the drilled holes to be drilled on the multilayer board, the method can be realized in the following two ways:
the method comprises the steps of determining the coordinates of initial positioning holes in each row of positioning holes in the longitudinal axis direction of a coordinate system based on the longitudinal coordinates of the initial positioning holes drilled for the first time and the distance between the second drilling holes, and then determining the coordinates of drilling holes to be drilled in the multilayer board based on the coordinates of the initial positioning holes in each row of positioning holes.
In a specific implementation, please refer to fig. 2, step 103 may include the following steps:
and step 201, determining coordinates on the multilayer board for indicating the initial positioning holes in the rows of positioning holes based on the vertical coordinates of the initial positioning holes drilled for the first time and the second drilling distance.
Defining the second drilling interval as y, the ordinate of the initial positioning hole drilled for the first time is (0,0), and then the coordinate of the initial positioning hole in the row of positioning holes nearest to the initial positioning hole drilled for the first time is (0, y).
In application, since the size of the multi-layer plate is usually limited, in order to save calculation amount, the coordinates of the initial positioning hole in each row of positioning holes are determined by combining the size of the multi-layer plate.
Specifically, a vertical coordinate of at least one point is obtained based on the vertical coordinate and the second drilling distance; acquiring the size of the multilayer board in the longitudinal axis direction of a coordinate system; determining the ordinate of the last point of the multilayer board in the longitudinal axis direction based on the size; screening a target point of which the vertical coordinate is not larger than the vertical coordinate of the last point from the at least one point based on the vertical coordinate of the at least one point; and determining the coordinates of the target points as the coordinates of the initial positioning holes in each row of positioning holes.
Defining the first drilling interval as x, the coordinate of the target pilot hole as (0, y), and the coordinate of the pilot hole closest to the target pilot hole in the same row as the target pilot hole as (x, y).
In application, since the size of the multi-layer plate is usually limited, in order to save calculation amount, the coordinates of the initial positioning hole in each row of positioning holes are determined by combining the size of the multi-layer plate.
Specifically, the abscissa of at least one point is determined based on the abscissa of the target positioning hole and the first drilling distance; acquiring the size of the multilayer board in the direction of a transverse shaft of a coordinate system; determining the abscissa of the last point of the multilayer board in the direction of the transverse axis based on the size; screening a target point of which the abscissa is not larger than the abscissa of the last point from the at least one point based on the abscissa of the at least one point; and determining the coordinates of the target point as the coordinates of each positioning hole in the same row as the target positioning hole on the multilayer board.
And step 203, determining the coordinates of each positioning hole in the same row with the target positioning hole as the coordinates of the drill hole to be drilled on the multilayer board.
And secondly, determining the coordinates of the initial positioning holes in the rows of positioning holes in the transverse axis direction of the coordinate system based on the transverse coordinates of the initial positioning holes drilled for the first time and the first drilling distance, and then determining the coordinates of the drill holes to be drilled in the multilayer board based on the coordinates of the initial positioning holes in the rows of positioning holes.
This process is similar to the process in the first mode, and the specific implementation is not described.
And 104, controlling the drilling equipment to drill the multilayer board according to the coordinates of the drill hole to be drilled.
In order to improve the efficiency of drilling, when drilling the multilayer board, the multilayer board may be drilled in units of rows.
Specifically, the drill holes to be drilled are classified according to the coordinates of the drill holes to be drilled to obtain at least one drill hole set, and the drill holes in each drill hole set have the same vertical coordinate; and controlling the drilling equipment to drill the multilayer board one by one according to the sequence of the vertical coordinates from small to large and the drilling sets in the at least one drilling set.
Since the boreholes in a set of boreholes have the same ordinate, the boreholes in the same set of boreholes lie in the same row in the direction of the abscissa.
In application, after one row of drill holes are drilled on the multilayer board according to one drill hole set, the drilling equipment is moved to the other row according to coordinates, and the multilayer board is drilled according to the drill hole sets one by one.
In other embodiments, the multi-layer board may be drilled in units of drilled holes located in the same row in the longitudinal direction, and will not be described herein.
According to the technical scheme provided by the embodiment of the application, the initial positioning hole drilled on the multilayer board for the first time is determined; establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin; determining coordinates of drill holes to be drilled on the multilayer board under a coordinate system based on a preset first drill hole interval, a preset second drill hole interval and coordinates of initial positioning holes drilled for the first time, wherein the first drill hole interval indicates the distance between two adjacent positioning holes with the same vertical coordinate, and the second drill hole interval indicates the distance between two adjacent positioning holes with the same horizontal coordinate; and controlling the drilling equipment to drill the multilayer board according to the coordinates of the drill hole to be drilled. Because the coordinates of the drill holes to be drilled can be determined, the drilling equipment can sequentially drill the multilayer boards based on the coordinates.
Based on the same concept, the embodiment of the present application provides a multilayer board drilling device, and the specific implementation of the device can refer to the description in the method embodiment section, and repeated details are not repeated, as shown in fig. 3, the device mainly includes:
a first determining unit 301, configured to determine an initial positioning hole drilled in a multilayer board for the first time;
the establishing unit 302 is used for establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin;
a second determining unit 303, configured to determine coordinates of drill holes to be drilled on the multilayer board in a coordinate system based on a preset first drill hole pitch, a second drill hole pitch, and coordinates of an initial positioning hole to be drilled for the first time, where the first drill hole pitch indicates a distance between two adjacent positioning holes having the same ordinate, and the second drill hole pitch indicates a distance between two adjacent positioning holes having the same abscissa;
and the control unit 304 is used for controlling the drilling equipment to drill the multilayer board according to the coordinates of the drill hole to be drilled.
Optionally, the first determining unit 301 is configured to:
identifying an area on the multilayer board sprayed with a preset code;
the area is determined as the initial pilot hole drilled for the first time.
Optionally, the second determining unit 303 is configured to:
determining coordinates on the multilayer board, which are used for indicating the initial positioning holes in the rows of positioning holes, based on the vertical coordinates of the initial positioning holes drilled for the first time and the second drilling distance;
determining any one initial positioning hole as a target positioning hole, and determining the coordinates of all positioning holes in the same row as the target positioning hole on the multilayer board based on the abscissa of the target positioning hole and the first drilling distance;
and determining the coordinates of each positioning hole in the same row with the target positioning hole as the coordinates of the drill hole to be drilled on the multilayer board.
Optionally, the second determining unit 303 is configured to:
obtaining a vertical coordinate of at least one point based on the vertical coordinate and the second drilling distance;
acquiring the size of the multilayer board in the longitudinal axis direction of a coordinate system;
determining the ordinate of the last point of the multilayer board in the longitudinal axis direction based on the size;
screening a target point of which the vertical coordinate is not larger than the vertical coordinate of the last point from the at least one point based on the vertical coordinate of the at least one point;
and determining the coordinates of the target points as the coordinates of the initial positioning holes in each row of positioning holes.
Optionally, the second determining unit 303 is configured to:
determining the abscissa of at least one point based on the abscissa of the target positioning hole and the first drilling distance;
acquiring the size of the multilayer board in the direction of a transverse shaft of a coordinate system;
determining the abscissa of the last point of the multilayer board in the direction of the transverse axis based on the size;
screening a target point of which the abscissa is not larger than the abscissa of the last point from the at least one point based on the abscissa of the at least one point;
and determining the coordinates of the target point as the coordinates of each positioning hole in the same row as the target positioning hole on the multilayer board.
Optionally, the control unit 304 is configured to:
classifying the drill holes to be drilled according to the coordinates of the drill holes to be drilled to obtain at least one drill hole set, wherein the drill holes in each drill hole set have the same vertical coordinate;
and controlling the drilling equipment to drill the multilayer board one by one according to the sequence of the vertical coordinates from small to large and the drilling sets in the at least one drilling set.
Based on the same concept, the embodiment of the present application provides a drilling system, and the specific implementation of the system may refer to the description of the method embodiment section, and repeated descriptions are omitted, as shown in fig. 4, the system mainly includes:
a multilayer board 401, a multilayer board drilling device 402 and drilling equipment 403;
the multilayer board drilling device 402 is used for determining an initial positioning hole drilled on the multilayer board 401 for the first time; establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin; determining coordinates of drill holes to be drilled in the multilayer board 401 under a coordinate system based on a preset first drill hole interval, a preset second drill hole interval and coordinates of initial positioning holes drilled for the first time, wherein the first drill hole interval indicates the distance between two adjacent positioning holes with the same vertical coordinate, and the second drill hole interval indicates the distance between two adjacent positioning holes with the same horizontal coordinate; the drilling device 403 is controlled to drill the multilayer board 401 according to the coordinates of the drill hole to be drilled.
Based on the same concept, an embodiment of the present application further provides an electronic device, as shown in fig. 5, the electronic device mainly includes: a processor 501, a memory 502 and a communication bus 503, wherein the processor 501 and the memory 502 communicate with each other through the communication bus 503. The memory 502 stores a program executable by the processor 501, and the processor 501 executes the program stored in the memory 502, so as to implement the following steps:
determining an initial positioning hole drilled on the multilayer board for the first time;
establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin;
determining coordinates of drill holes to be drilled on the multilayer board under a coordinate system based on a preset first drill hole interval, a preset second drill hole interval and coordinates of initial positioning holes drilled for the first time, wherein the first drill hole interval indicates the distance between two adjacent positioning holes with the same vertical coordinate, and the second drill hole interval indicates the distance between two adjacent positioning holes with the same horizontal coordinate;
and controlling the drilling equipment to drill the multilayer board according to the coordinates of the drill hole to be drilled.
The communication bus 503 mentioned in the electronic device may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The communication bus 503 may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one thick line is shown in FIG. 5, but this is not intended to represent only one bus or type of bus.
The Memory 502 may include a Random Access Memory (RAM) or a non-volatile Memory (non-volatile Memory), such as at least one disk Memory. Alternatively, the memory may be at least one memory device located remotely from the aforementioned processor 501.
The Processor 501 may be a general-purpose Processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc., and may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic devices, discrete gates or transistor logic devices, and discrete hardware components.
In still another embodiment of the present application, there is also provided a computer-readable storage medium having stored therein a computer program which, when run on a computer, causes the computer to execute the method of drilling a multilayer board described in the above-described embodiment.
In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, cause the processes or functions described in accordance with the embodiments of the application to occur, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored on a computer readable storage medium or transmitted from one computer readable storage medium to another, for example, from one website site, computer, server, or data center to another website site, computer, server, or data center via wire (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wirelessly (e.g., infrared, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device, such as a server, a data center, etc., that includes one or more of the available media. The available media may be magnetic media (e.g., floppy disks, hard disks, tapes, etc.), optical media (e.g., DVDs), or semiconductor media (e.g., solid state drives), among others.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A method of drilling a multi-layer board, comprising:
determining an initial positioning hole drilled on the multilayer board for the first time;
establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin;
determining coordinates of drill holes to be drilled in the multilayer board under the coordinate system based on a preset first drill hole interval, a preset second drill hole interval and coordinates of the initial positioning holes drilled for the first time, wherein the first drill hole interval indicates the distance between two adjacent positioning holes with the same vertical coordinate, and the second drill hole interval indicates the distance between two adjacent positioning holes with the same horizontal coordinate;
and controlling a drilling device to drill the multilayer board according to the coordinates of the drill hole to be drilled.
2. The method of claim 1, wherein determining a first drilled pilot hole in a multi-layer board comprises:
identifying an area on the multilayer board sprayed with a preset code;
and determining the area as the initial positioning hole drilled for the first time.
3. The method of claim 1, wherein determining coordinates of the drill holes to be drilled in the multi-layer board in the coordinate system based on a preset first drill hole pitch, a second drill hole pitch and coordinates of the initially drilled pilot hole comprises:
determining coordinates on the multilayer board for indicating the initial positioning holes in the rows of positioning holes based on the vertical coordinates of the initial positioning holes drilled for the first time and the second drilling distance;
determining any one initial positioning hole as a target positioning hole, and determining the coordinates of positioning holes in the same row as the target positioning hole on the multilayer board based on the abscissa of the target positioning hole and the first drilling distance;
and determining the coordinates of all the positioning holes in the same row as the target positioning holes as the coordinates of the drill holes to be drilled on the multilayer board.
4. The method of claim 3, wherein determining coordinates on the lam for indicating initially-positioned holes in each row of pilot holes based on the ordinate of the initially-drilled initially-positioned hole and the second drill hole pitch comprises:
obtaining a vertical coordinate of at least one point based on the vertical coordinate and the second borehole interval;
acquiring the size of the multilayer board in the longitudinal axis direction of the coordinate system;
determining a ordinate of a last point of the multilayer board in the longitudinal axis direction based on the dimension;
screening a target point with a vertical coordinate not larger than that of the last point from the at least one point based on the vertical coordinate of the at least one point;
and determining the coordinates of the target points as the coordinates of the initial positioning holes in the row positioning holes.
5. The method of claim 3, wherein determining coordinates of each pilot hole on the multi-layer board in a same row as the target pilot hole based on the abscissa of the target pilot hole and the first drill hole pitch comprises:
determining the abscissa of at least one point based on the abscissa of the target positioning hole and the first drilling distance;
acquiring the size of the multilayer board in the direction of a transverse axis of the coordinate system;
determining an abscissa of a last point of the multilayer board in the transverse axis direction based on the dimension;
screening a target point of which the abscissa is not larger than the abscissa of the last point from the at least one point based on the abscissa of the at least one point;
and determining the coordinates of the target point as the coordinates of each positioning hole in the same row as the target positioning hole on the multilayer board.
6. The method of claim 1, wherein controlling a drilling apparatus to drill the multi-layer board in accordance with the coordinates of the hole to be drilled comprises:
classifying the drill holes to be drilled according to the coordinates of the drill holes to be drilled to obtain at least one drill hole set, wherein the drill holes in each drill hole set have the same vertical coordinate;
and controlling the drilling equipment to drill the multilayer board one by one according to the sequence of the vertical coordinates from small to large and the drilling sets in the at least one drilling set.
7. A drilling system, comprising:
multilayer boards, drilling devices and drilling equipment for the multilayer boards;
the drilling device of the multilayer board is used for determining an initial positioning hole drilled on the multilayer board for the first time; establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin; determining coordinates of drill holes to be drilled in the multilayer board under the coordinate system based on a preset first drill hole interval, a preset second drill hole interval and coordinates of the initial positioning holes drilled for the first time, wherein the first drill hole interval indicates the distance between two adjacent positioning holes with the same vertical coordinate, and the second drill hole interval indicates the distance between two adjacent positioning holes with the same horizontal coordinate; and controlling a drilling device to drill the multilayer board according to the coordinates of the drill hole to be drilled.
8. A multi-layer board drilling apparatus, comprising:
the first determining unit is used for determining an initial positioning hole drilled on the multilayer board for the first time;
the establishing unit is used for establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin;
a second determination unit configured to determine coordinates of drill holes to be drilled in the multilayer board in the coordinate system based on a preset first drill hole pitch indicating a distance between two adjacent positioning holes having the same ordinate, a second drill hole pitch indicating a distance between two adjacent positioning holes having the same abscissa, and coordinates of the initial positioning hole drilled for the first time;
and the control unit is used for controlling the drilling equipment to drill the multilayer board according to the coordinates of the drill hole to be drilled.
9. An electronic device, comprising: the system comprises a processor, a memory and a communication bus, wherein the processor and the memory are communicated with each other through the communication bus;
the memory for storing a computer program;
the processor, executing the program stored in the memory, implements the method for drilling a multilayer board according to any one of claims 1 to 6.
10. A computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the method of drilling a multiwall sheet according to any of claims 1-6.
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