CN113673199B - Design self-checking method, system and device for controllable depth drilling and storage medium - Google Patents

Design self-checking method, system and device for controllable depth drilling and storage medium Download PDF

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Publication number
CN113673199B
CN113673199B CN202111223909.XA CN202111223909A CN113673199B CN 113673199 B CN113673199 B CN 113673199B CN 202111223909 A CN202111223909 A CN 202111223909A CN 113673199 B CN113673199 B CN 113673199B
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target
depth
drilling
controllable
determining
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CN113673199A (en
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刘俊麟
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Suzhou Inspur Intelligent Technology Co Ltd
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Suzhou Inspur Intelligent Technology Co Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/398Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2115/00Details relating to the type of the circuit
    • G06F2115/12Printed circuit boards [PCB] or multi-chip modules [MCM]

Abstract

The invention discloses a design self-checking method, a system, a device and a storage medium for controllable depth drilling, which are used for determining target wiring and a target device pin which are required by the self-checking of the controllable depth drilling on a circuit board; acquiring size information of a target controllable depth drilled hole corresponding to a target wiring and a target device pin so as to detect whether the target controllable depth drilled hole meets the requirement of a safety distance; determining theoretical setting information of the target depth-controllable drilling hole according to the routing layer information so as to detect whether the actual setting information of the target depth-controllable drilling hole conforms to the theoretical setting information; determining the stub type of the drilling and removing of the target controllable depth drilling hole to detect whether the symbol, which is configured for the target controllable depth drilling hole and represents the stub type of the drilling and removing, is correct; and summarizing the detection results to obtain the self-detection result of the depth-controllable drilling hole on the circuit board. The method and the device reduce the checking workload and improve the reviewing efficiency; and the condition of omission is improved, and the accuracy of the evaluation result is improved.

Description

Design self-checking method, system and device for controllable depth drilling and storage medium
Technical Field
The invention relates to the field of board design self-inspection, in particular to a design self-inspection method, a system and a device for drilling holes with controllable depth and a storage medium.
Background
The server has very high requirements for the design quality, the signal transmission efficiency and the signal transmission quality of the board card. The board card is provided with a plurality of components and connectors (one end of each component is connected with a unitary component, and the other end of each component is provided with an interface for accessing external equipment so as to realize the connection of the components and the external equipment). At present, signal lines are connected between components with interactive requirements, signal lines are connected between connectors and corresponding components, the signal lines are mostly high-speed differential signal lines, in order to ensure the signal quality on the high-speed differential signal lines, a large number of CDD (Controlled Depth Drilling) processes, namely back Drilling processes, are used, and the process principle is as follows:
a Printed Circuit Board (PCB) of the Board card is provided with a via hole for connecting a component and a pin (pin) of the connector, so that the component and the connector are connected to the PCB, and a wire is led out from the pin via hole to establish connection between different components or between the component and the connector; the PCB is also provided with a via hole (called via hole) for high-speed differential signal line cross-layer routing so as to meet the routing arrangement of a plurality of signal lines in a limited space. If a pin only penetrates through the upper 3 layers and a wire connected with a via hole where the pin is located is only arranged on the upper 3 layers, the remaining 5 layers of pin via holes (called pin stubs (stub) which belong to a conductor) cannot play a role in signal transmission and can be used as an interference source to influence the signal quality; similarly, if the high-speed differential signal line routed across the layers goes from the first layer to the third layer, via holes (referred to as via stubs, which belong to conductors) of the remaining 5 layers do not perform a signal transmission function, but rather act as interference sources and affect the signal quality. Therefore, for a high-speed differential signal line with high signal quality requirement, the pin stub and the via stub need to be drilled out through a controllable deep drilling process, so as to reduce interference and improve signal quality.
At present, in the PCB Layout design process of a board card, a PCB design software (such as Cadence Allegro) autonomously performs the design of a controllable depth drilling hole, and the provided controllable depth drilling hole design steps are as follows: 1) finding out high-speed differential signal networks (comprising high-speed differential signal lines and pins connected with the high-speed differential signal lines) needing to use the controllable depth drilling, and defining the maximum stub lengths corresponding to the high-speed differential signal networks; 2) designing controllable depth drilling holes (such as drilling position, drilling depth, drilling diameter and other parameter designs of the controllable depth drilling holes) for the high-speed differential signal network; 3) according to the stub type (pin stub or via stub) drilled by the controllable depth drill hole, configuring a corresponding drill hole symbol (pin or via) for the controllable depth drill hole; 4) and summarizing the analyzed design of the controllable-depth drilling hole and the symbol of the controllable-depth drilling hole into a drilling hole file and/or a drilling hole table.
In the subsequent evaluation stage of the PCB Layout, whether the design of the controllable depth drilling hole meets the design requirement of the drilling hole is checked according to the drilling hole file and/or the drilling hole table, for example, whether the design of the controllable depth drilling hole has the problems of drilling missing, drilling more, wrong drilling symbols, insufficient safety distance and the like is checked, the Layout of the controllable depth drilling hole is usually manually checked by a Layout engineer at present, but the design of the controllable depth drilling hole is more, so that the workload of manual inspection is larger, and the evaluation efficiency is lower; moreover, the manual inspection is easy to miss inspection, so that the final evaluation result is not accurate enough.
Therefore, how to provide a solution to the above technical problem is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a design self-checking method, a system, a device and a storage medium for a controllable depth drilling hole, which can automatically check whether the design of the controllable depth drilling hole meets the design requirement of the drilling hole, reduce the checking workload and improve the reviewing efficiency; and the condition of omission is improved, and the accuracy of the evaluation result is improved.
In order to solve the technical problem, the invention provides a design self-checking method of a controllable depth drilling hole, which is applied to a processor and comprises the following steps:
determining a target wiring and a target device pin which have the self-checking requirement of controllable depth drilling on the circuit board;
acquiring size information of a target controllable depth drilled hole corresponding to the target routing and the target device pin, and detecting whether the target controllable depth drilled hole meets a preset safety distance requirement or not based on the size information;
acquiring routing layer information of the target routing and the routing connected with the target device pin, and determining theoretical setting information of the target depth-controllable drilling according to the routing layer information so as to detect whether actual setting information of the target depth-controllable drilling conforms to the theoretical setting information;
determining the stub type of the target controllable depth drilling division to detect whether the symbol which is configured for the target controllable depth drilling and is used for representing the stub type of the drilling division is correct or not;
and summarizing the detection results to obtain the self-detection result of the depth-controllable drilling hole on the circuit board.
Optionally, determining that there are target traces and target device pins with controllable depth drilling self-checking requirements on the circuit board includes:
acquiring line width and line distance information of each wire from a design pattern of the circuit board, and solving impedance information of each wire according to the line width and line distance information of each wire;
grouping the wires according to the impedance information of the wires; wherein, the impedance information of the same group of wires is the same;
and determining the same group of wires corresponding to the target impedance with the design requirement of controllable depth drilling as the target wires, and determining a device pin connected with the target wires as the target device pin.
Optionally, obtaining size information of the target routing and the target depth-controllable drilled hole corresponding to the target device pin, so as to detect whether the target depth-controllable drilled hole meets a preset safety distance requirement based on the size information, including:
collecting the drilling diameter of the target depth-controllable drilling hole from the design graph of the circuit board, and judging whether the drilling diameter is within the range of the safety distance of a preset plane;
if the distance is within the range of the preset plane safety distance, acquiring the position distance between the drill top of the target depth-controllable drill hole and the last layer of routing connected with the via hole corresponding to the drill top, and judging whether the position distance is within the range of the preset layer safety distance;
if the target drilling depth is within the range of the preset bedding surface safety distance, determining that the target drilling depth controllable meets the preset safety distance requirement;
and if the target depth is not within the range of the preset plane safe interval and/or the range of the preset bedding surface safe interval, determining that the target depth-controllable drilling hole does not meet the requirement of the preset safe interval.
Optionally, obtaining a position distance between the drill top of the target controlled depth drill hole and the last layer of routing connected to the via hole corresponding to the drill top includes:
collecting the drilling depth of the target depth-controllable drilling hole from the design graph, and determining a first horizontal position where the drilling top of the target depth-controllable drilling hole is located according to the drilling depth;
and collecting a second horizontal position of the last layer of routing wire connected with the via hole corresponding to the target depth-controllable drilling hole from the design graph so as to obtain the position distance between the first horizontal position and the second horizontal position.
Optionally, obtaining routing layer information of the target routing and the routing connected to the target device pin, and determining theoretical setting information of the target controlled depth drilling according to the routing layer information, including:
collecting routing layer information of the target routing and the routing connected with the target device pin from the design pattern of the circuit board;
and determining the theoretical position and the theoretical drilling depth range of the target depth-controllable drilling according to the routing layer information.
Optionally, determining the stub type of the target controlled depth drill removal comprises:
determining the stub type of the target controllable depth drilling removal corresponding to the target routing as via stub;
and determining the stub type of the target controllable depth drilling division corresponding to the target device pin as the pin stub.
Optionally, before determining that there is a target trace and a target device pin required by the self-inspection of the controlled depth drilling on the circuit board, the design self-inspection method of the controlled depth drilling further includes:
acquiring the superposition data of the circuit board from the design graph of the circuit board;
judging whether the superposed data meets the target design requirement of the circuit board;
if yes, executing a step of determining that the circuit board has target wiring and target device pins required by the controllable depth drilling self-checking;
if not, the step of determining that the circuit board has the target wiring and the target device pin required by the controllable depth drilling self-checking is not executed.
In order to solve the above technical problem, the present invention further provides a design self-checking system for controlled depth drilling, which is applied to a processor, and comprises:
the determining module is used for determining a target routing and a target device pin which have the controllable depth drilling self-checking requirement on the circuit board;
the safety detection module is used for acquiring the size information of the target controllable depth drilled hole corresponding to the target wiring and the target device pin so as to detect whether the target controllable depth drilled hole meets the preset safety distance requirement or not based on the size information;
the setting detection module is used for acquiring the target wiring and wiring level information of the wiring connected with the target device pin, and determining theoretical setting information of the target depth-controllable drilling hole according to the wiring level information so as to detect whether the actual setting information of the target depth-controllable drilling hole conforms to the theoretical setting information;
the symbol detection module is used for determining the stub type of the drilling division of the target controllable depth drilling hole so as to detect whether the symbol which is configured for the target controllable depth drilling hole and is used for representing the stub type of the drilling division is correct or not;
and the collecting module is used for collecting all detection results to obtain the self-detection result of the depth-controllable drilling hole on the circuit board.
In order to solve the above technical problem, the present invention further provides a design self-inspection device for depth-controllable drilling, comprising:
a memory for storing a computer program;
a processor for implementing the steps of any of the above-described controlled depth drilling design self-test methods when executing the computer program.
In order to solve the above technical problem, the present invention further provides a computer-readable storage medium, having a computer program stored thereon, where the computer program, when executed by a processor, implements the steps of any one of the above methods for designing and self-testing a controlled-depth borehole.
The invention provides a design self-checking method of controllable depth drilling, which is applied to a processor and used for determining a target wiring and a target device pin which are required by the self-checking of the controllable depth drilling on a circuit board; acquiring size information of a target controllable depth drilled hole corresponding to a target wiring and a target device pin, and detecting whether the target controllable depth drilled hole meets the preset safety distance requirement or not based on the size information; acquiring the wiring level information of the target wiring and the wiring connected with the target device pin, and determining the theoretical setting information of the target depth-controllable drilling hole according to the wiring level information so as to detect whether the actual setting information of the target depth-controllable drilling hole conforms to the theoretical setting information; determining the stub type of the drilling and removing of the target controllable depth drilling hole to detect whether the symbol, which is configured for the target controllable depth drilling hole and represents the stub type of the drilling and removing, is correct; and summarizing the detection results to obtain the self-detection result of the depth-controllable drilling hole on the circuit board. Therefore, the method and the device can automatically check whether the design of the depth-controllable drilling hole meets the design requirement of the drilling hole, reduce the checking workload and improve the reviewing efficiency; and the condition of omission is improved, and the accuracy of the evaluation result is improved.
The invention also provides a design self-checking system, a device and a storage medium for the controllable depth drilling, and the design self-checking system, the device and the storage medium have the same beneficial effects as the design self-checking method.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed in the prior art and the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a flowchart of a design self-checking method for controlled depth drilling according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a controlled depth drill according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a design self-checking system for controlled depth drilling according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a design self-checking device for controlled depth drilling according to an embodiment of the present invention.
Detailed Description
The core of the invention is to provide a design self-checking method, a system, a device and a storage medium for the controllable depth drilling, which can automatically check whether the design of the controllable depth drilling meets the design requirement of the drilling, reduce the checking workload and improve the reviewing efficiency; and the condition of omission is improved, and the accuracy of the evaluation result is improved.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a flowchart of a design self-checking method for controlled depth drilling according to an embodiment of the present invention.
The design self-checking method of the controllable depth drilling hole is applied to a processor and comprises the following steps:
step S1: and determining target wiring and a target device pin which have the self-checking requirement of the controllable depth drilling on the circuit board.
Specifically, the circuit board is provided with a plurality of devices (components and connectors), and the devices with interaction requirements are connected through wiring. Some device pins and walk the line and can use controllable degree of depth drilling to carry out stub and bore except, some device pins and walk the line and can not use controllable degree of depth drilling to carry out stub and bore except, and this is decided by device pin and the signal quality requirement of walking the line transmission, and the higher device pin of the signal quality requirement of transmission just needs to use controllable degree of depth drilling to carry out stub with walking the line and bores except. It can be appreciated that the device pin and trace for stub drilling out using controlled depth drilling has the self-check requirement for controlled depth drilling. Based on this, this application confirms that there is the target of controllable degree of depth drilling self-checking demand to walk line and target device pin on the circuit board at first, for follow-up controllable degree of depth drilling self-checking provides the basis.
Step S2: and acquiring the size information of the target controllable depth drilling hole corresponding to the target wiring and the target device pin so as to detect whether the target controllable depth drilling hole meets the preset safety distance requirement or not based on the size information.
Specifically, the method and the device for detecting the safe distance of the first controllable-depth drill hole obtain the size information of the first controllable-depth drill hole corresponding to the target routing, and detect whether the first controllable-depth drill hole meets the preset safe distance requirement or not based on the size information of the first controllable-depth drill hole; if the requirement of the preset safety interval is met, the size information of the designed first controllable-depth drill hole does not need to be modified; and if the preset safety spacing requirement is not met, modifying the size information of the designed first controllable depth drilling hole until the size information meets the preset safety spacing requirement.
Similarly, the size information of a second controllable depth drill hole (the first controllable depth drill hole and the second controllable depth drill hole are collectively referred to as a target controllable depth drill hole) corresponding to the target device pin is obtained, so that whether the second controllable depth drill hole meets the preset safety distance requirement or not is detected based on the size information of the second controllable depth drill hole; if the requirement of the preset safety interval is met, the size information of the designed second controllable-depth drill hole does not need to be modified; and if the preset safety spacing requirement is not met, modifying the size information of the designed second controllable depth drilling hole until the size information meets the preset safety spacing requirement.
Step S3: and acquiring the wiring layer information of the target wiring and the wiring connected with the target device pin, and determining the theoretical setting information of the target depth-controllable drilling hole according to the wiring layer information so as to detect whether the actual setting information of the target depth-controllable drilling hole conforms to the theoretical setting information.
Specifically, the method and the device obtain routing layer information of the target routing (namely the target routing is arranged on the fourth layer of the circuit board and the position of the target routing, which is crossed with the layer), and determine theoretical setting information of the first controlled-depth drilling hole corresponding to the target routing according to the routing layer information of the target routing so as to detect whether actual setting information of the first controlled-depth drilling hole conforms to the theoretical setting information; if the first controllable depth drilling hole accords with the theoretical setting information, the original setting of the first controllable depth drilling hole is not required to be modified; if the information does not conform to the theoretical setting information, the original setting (such as the setting of the drilling position, the drilling depth and the like) of the first controllable depth drilling needs to be modified.
Similarly, the method and the device for setting the depth-controllable drill hole obtain the routing layer information of the routing connected with the target device pin (namely the routing connected with the target device pin is arranged on the fourth layer of the circuit board and the position of the target device pin connected with the routing), and determine the theoretical setting information of the second depth-controllable drill hole corresponding to the target device pin according to the routing layer information of the target device pin so as to detect whether the actual setting information of the second depth-controllable drill hole conforms to the theoretical setting information of the second depth-controllable drill hole; if the second controllable depth drilling hole accords with the theoretical setting information, the original setting of the second controllable depth drilling hole is not required to be modified; if the theoretical setting information is not met, the original setting of the second controlled depth borehole needs to be modified.
Step S4: and determining the stub type of the target controllable depth drilling division to detect whether the symbol which is configured for the target controllable depth drilling and is used for representing the stub type of the drilling division is correct.
Specifically, it can be understood that if the stub type actually drilled and removed by the target controlled depth drilling is matched with the drilling symbol configured for the target controlled depth drilling, that is, the stub type drilled and removed by the target controlled depth drilling, which is characterized by the drilling symbol configured for the target controlled depth drilling, is the same as the stub type actually drilled and removed by the target controlled depth drilling, it is determined that the drilling symbol configured for the target controlled depth drilling is correct; otherwise, determining that the borehole symbol configured for the target controlled depth borehole is wrong.
Based on the method, the stub type actually drilled and removed by the target depth-controllable drilling hole is determined so as to detect whether the drilling hole symbol configured for the target depth-controllable drilling hole is correct or not; if the target drilling depth is correct, the drilling symbols configured by the target drilling with the controllable depth do not need to be modified; if not, the drilling symbol of the target depth-controllable drilling configuration needs to be modified into a correct symbol.
Step S5: and summarizing the detection results to obtain the self-detection result of the depth-controllable drilling hole on the circuit board.
Specifically, this application gathers whether above-mentioned controllable degree of depth drilling satisfies the detection result of predetermineeing safe interval requirement, whether the actual setting information of controllable degree of depth drilling accords with its theoretical setting information and whether the drilling sign of controllable degree of depth drilling configuration is correct, obtains the self-checking result of controllable degree of depth drilling on the circuit board, supplies the Layout engineer to refer to.
The invention provides a design self-checking method of controllable depth drilling, which is applied to a processor and used for determining a target wiring and a target device pin which are required by the self-checking of the controllable depth drilling on a circuit board; acquiring size information of a target controllable depth drilled hole corresponding to a target wiring and a target device pin, and detecting whether the target controllable depth drilled hole meets the preset safety distance requirement or not based on the size information; acquiring the wiring level information of the target wiring and the wiring connected with the target device pin, and determining the theoretical setting information of the target depth-controllable drilling hole according to the wiring level information so as to detect whether the actual setting information of the target depth-controllable drilling hole conforms to the theoretical setting information; determining the stub type of the drilling and removing of the target controllable depth drilling hole to detect whether the symbol, which is configured for the target controllable depth drilling hole and represents the stub type of the drilling and removing, is correct; and summarizing the detection results to obtain the self-detection result of the depth-controllable drilling hole on the circuit board. Therefore, the method and the device can automatically check whether the design of the depth-controllable drilling hole meets the design requirement of the drilling hole, reduce the checking workload and improve the reviewing efficiency; and the condition of omission is improved, and the accuracy of the evaluation result is improved.
On the basis of the above-described embodiment:
as an optional embodiment, determining a target trace and a target device pin on a circuit board with a controllable depth drilling self-checking requirement includes:
acquiring the line width and line distance information of each wire from the design pattern of the circuit board, and solving the impedance information of each wire according to the line width and line distance information of each wire;
grouping the wires according to the impedance information of the wires; wherein, the impedance information of the same group of wires is the same;
the same group of wires corresponding to the target impedance with the design requirement of the controllable depth drilling are determined as target wires, and a device pin connected with the target wires is determined as a target device pin.
Specifically, the impedance of the traces on the circuit board is required to comply with the corresponding specification, for example, in an intel platform, the impedance standard of the traces is 85 ohms in the case of UPI (super Interconnect interface) and PCIE (Peripheral Component Interconnect Express), the impedance standard of the traces is 90 ohms in the case of USB (Universal Serial Bus), and the impedance standard of the traces is 100 ohms in the case of LAN (Local Area Network). At present, the 85 ohm impedance wiring requires better signal quality, and the controllable depth drilling design is generally only performed on the 85 ohm impedance wiring (of course, the controllable depth drilling design can also be performed on the other ohm impedance wiring according to the requirement).
Based on this, this application is specifically gathered the line width line spacing information of each line from the design figure of circuit board to obtain the impedance information of each line according to the line width line spacing information of each line, and divide into groups each line according to the impedance information of each line, it is specifically that the impedance information of same group line is the same, then it all confirms the same group line that has the target impedance of controllable depth drilling design demand to correspond to be the target line that has controllable depth drilling self-checking demand to have the same group line, and confirm device pin that the target line is connected as the target device pin that has controllable depth drilling self-checking demand.
As an optional embodiment, the size information of the target controlled depth drilled hole corresponding to the target routing and the target device pin is obtained to detect whether the target controlled depth drilled hole meets the preset safety distance requirement based on the size information, including:
collecting the drilling diameter of the target depth-controllable drilling hole from the design graph of the circuit board, and judging whether the drilling diameter is within the range of the safety distance of the preset plane;
if the distance is within the range of the preset plane safety distance, acquiring the position distance between the drill top of the target depth-controllable drill hole and the last layer of routing connected with the via hole corresponding to the drill top, and judging whether the position distance is within the range of the preset layer safety distance;
if the target drilling depth is within the range of the preset bedding surface safety distance, determining that the target drilling depth controllable meets the preset safety distance requirement;
and if the target depth is not within the range of the preset plane safe interval and/or the range of the preset bedding surface safe interval, determining that the target depth-controllable drilling hole does not meet the preset safe interval requirement.
Specifically, the preset safety spacing requirement of the present application includes a planar safety spacing requirement and a bedding safety spacing requirement. It should be noted that the planar safety spacing requirement relates to manufacturing accuracy, and the planar safety spacing requirement relates to signal quality.
Referring to fig. 2, the method collects the drilling diameter of the target depth-controllable drilling hole from the design pattern of the circuit board, and judges whether the drilling diameter of the target depth-controllable drilling hole is within the range of the preset plane safety interval; if the target drilling depth is not within the range of the preset plane safe distance, determining that the target drilling depth can not meet the preset safe distance requirement; if the distance is within the range of the preset plane safety distance (meeting the requirement of the plane safety distance), acquiring the position distance between the drill top of the target depth-controllable drill hole and the last layer of routing connected with the via hole corresponding to the drill top, and judging whether the position distance between the drill top and the last layer of routing is within the range of the preset layer safety distance; if the target drilling depth is not within the range of the preset bedding surface safety interval, determining that the target drilling depth can not meet the preset safety interval requirement; and if the target drilling depth is within the range of the preset safety interval of the bedding surface (the requirement of the safety interval of the bedding surface is met), determining that the target drilling depth controllable hole meets the requirement of the preset safety interval.
As an optional embodiment, obtaining a position distance between a drill top of a target controlled depth drill hole and a last layer of routing connected to a via hole corresponding to the drill top includes:
collecting the drilling depth of the target depth-controllable drilling hole from the design graph, and determining a first horizontal position where the drilling top of the target depth-controllable drilling hole is located according to the drilling depth;
and collecting a second horizontal position where the last layer of routing wire connected with the via hole corresponding to the target depth-controllable drilling hole is located from the design graph so as to obtain the position distance between the first horizontal position and the second horizontal position.
Specifically, as shown in fig. 2, the drilling depth of the target depth-controllable drilling hole is collected from the design graph, the drilling depth of the target depth-controllable drilling hole can represent the position of the drill top of the target depth-controllable drilling hole, that is, the first horizontal position of the drill top of the target depth-controllable drilling hole can be determined according to the drilling depth of the target depth-controllable drilling hole, then the second horizontal position of the last layer of routing line connected with the via hole corresponding to the target depth-controllable drilling hole is collected from the design graph, so as to obtain the position distance between the first horizontal position and the second horizontal position, and thus, whether the position distance between the first horizontal position and the second horizontal position is within the preset safety distance range of the bedding surface is judged.
As an optional embodiment, the method for obtaining the routing layer information of the target routing and the routing connected to the target device pin, and determining the theoretical setting information of the target depth-controllable drilling according to the routing layer information includes:
collecting the target wire and the wire layer information of the wire connected with the pin of the target device from the design pattern of the circuit board;
and determining the theoretical position and the theoretical drilling depth range of the target depth-controllable drilling according to the routing layer information.
Specifically, the method collects the trace level information of the target trace from the design pattern of the circuit board (i.e. the target trace is arranged on the layer number of the circuit board and the position of the target trace across the layers), it can be understood that, the position where the target trace generates the cross-layer is the via position corresponding to the target trace, and the purpose of the first controlled depth drilling corresponding to the target trace is to drill out the stub (called via stub) of the via corresponding to the target trace, the position of the first controlled-depth borehole corresponding to the target trace is at the via stub position corresponding to the target trace, and it can be understood that the first controlled depth drilling hole corresponding to the target trace can only drill the via stub portion corresponding to the target trace, and cannot drill the portion (i.e. the via portion for transmitting signals) connecting the trace on the via hole corresponding to the target trace, and a certain safety distance is required to be left, therefore, certain drilling depth range requirements are required for the first controllable depth drilling corresponding to the target routing.
Based on this, the routing layer information of the target routing can be collected from the design graph of the circuit board, and then the theoretical position and the theoretical drilling depth range of the first controllable-depth drilling hole corresponding to the target routing are determined according to the routing layer information of the target routing so as to detect whether the actual position and the actual drilling depth range designed by the first controllable-depth drilling hole corresponding to the target routing meet the theoretical requirements or not (for example, the actual position designed by the first controllable-depth drilling hole corresponding to the target routing does not meet the theoretical requirements, the situations of drilling missing and drilling multiple can be obtained, and the actual drilling depth range designed by the first controllable-depth drilling hole corresponding to the target routing does not meet the theoretical requirements, and the situation of drilling too deep can be obtained).
Similarly, in the application, the routing layer information of the routing connected with the target device pin (that is, the routing connected with the target device pin is arranged on the fourth layer of the circuit board and the position of the target device pin connected with the routing) is collected from the design graph of the circuit board, it can be understood that the position of the target device pin is the position of the via hole corresponding to the target device pin, and the purpose of the second controllable depth drilling corresponding to the target device pin is to drill out the stub (referred to as pin stub) of the via hole corresponding to the target device pin, so that the position of the second controllable depth drilling corresponding to the target device pin is at the position of the stub corresponding to the target device pin, and it can be understood that the second controllable depth drilling corresponding to the target device pin can only drill the pin stub part corresponding to the target device pin and cannot drill the part (that is, the via hole part for transmitting signals) connected with the routing on the via hole corresponding to the target device pin, and a certain safety distance is required to be reserved, so that certain drilling depth range requirements are required for the second controllable depth drilling corresponding to the target device pin.
Based on the method, the routing layer information of the routing connected with the target device pin can be collected from the design graph of the circuit board, then the theoretical position and the theoretical drilling depth range of the second controllable depth drilling hole corresponding to the target device pin are determined according to the routing layer information of the routing connected with the target device pin, and whether the actual position and the actual drilling depth range of the second controllable depth drilling hole corresponding to the target device pin meet the theoretical requirements or not is detected (for example, the actual position and the actual drilling depth range of the second controllable depth drilling hole corresponding to the target device pin do not meet the theoretical requirements, the situations of drilling missing and drilling multiple can be obtained, and the situation that the drilling is too deep can be obtained due to the fact that the actual drilling depth range designed by the second controllable depth drilling hole corresponding to the target device pin does not meet the theoretical requirements).
As an alternative embodiment, determining the stub type of the target controlled depth drill division includes:
determining the stub type of the target controllable depth drilling removal corresponding to the target routing as via stub;
and determining the stub type of the target controllable depth drilling division corresponding to the target device pin as the pin stub.
Specifically, the stub type of the drilling division of the first controllable-depth drilling corresponding to the target routing is determined as via stub, whether the drilling symbol configured for the first controllable-depth drilling is correct or not is detected, and if the drilling symbol configured for the first controllable-depth drilling is via (indicating that the stub type of the drilling division of the first controllable-depth drilling is via stub), the drilling symbol configured for the first controllable-depth drilling is determined to be correct; and if the drilling symbol of the first controllable depth drilling configuration is pin (indicating that the stub type of the first controllable depth drilling division is pin stub), determining that the drilling symbol of the first controllable depth drilling configuration is wrong.
Similarly, the stub type of the drilling division of the second controllable depth drilling corresponding to the target device pin is determined as the pin stub to detect whether the drilling symbol configured for the second controllable depth drilling is correct, and if the drilling symbol configured for the second controllable depth drilling is the pin (indicating that the stub type of the drilling division of the first controllable depth drilling is the pin stub), the drilling symbol configured for the second controllable depth drilling is determined to be correct; if the borehole symbol of the second controlled depth borehole configuration is via (indicating that the stub type of the second controlled depth borehole division is via stub), it is determined that the borehole symbol of the second controlled depth borehole configuration is wrong.
As an optional embodiment, before determining that there are target traces and target device pins on the circuit board that are required for the controlled depth drilling self-test, the design self-test method for controlled depth drilling further includes:
acquiring the superposed data of the circuit board from the design graph of the circuit board;
judging whether the superposed data meets the target design requirement of the circuit board;
if yes, executing a step of determining that the circuit board has target wiring and target device pins required by the controllable depth drilling self-checking;
if not, the step of determining that the circuit board has the target wiring and the target device pin required by the controllable depth drilling self-checking is not executed.
Furthermore, the design pattern of the circuit board is drawn according to the target design requirement of the circuit board (the number of layers of the circuit board which are arranged together and the specific devices and circuits on each layer are arranged), and the subsequent self-checking error caused by the drawing error of the design pattern of the circuit board is considered, so that the method collects the stacking data of the circuit board (representing the structure of the circuit board) from the design pattern of the circuit board and then judges whether the collected stacking data of the circuit board meets the target design requirement of the circuit board; if the target design requirements of the circuit board are met, executing a step of determining target wiring and a target device pin with controllable depth drilling self-checking requirements on the circuit board; if the target design requirement of the circuit board is not met, the step of determining the target wiring and the target device pin with the controllable depth drilling self-checking requirement on the circuit board is not executed, the design graph of the circuit board is modified to enable the design graph to meet the target design requirement of the circuit board, and then the step of determining the target wiring and the target device pin with the controllable depth drilling self-checking requirement on the circuit board is executed, namely the controllable depth drilling self-checking operation is executed, so that self-checking errors caused by drawing errors of the design graph of the circuit board are avoided.
In addition, a Skill programming language built in the Cadence Allegro of the PCB design software provides rich interactive functions, and the self-checking tool for realizing the design self-checking method of the controllable-depth drilling can be written by researching the Cadence Skill programming language.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a design self-checking system for controlled depth drilling according to an embodiment of the present invention.
The design self-checking system of the controllable depth drilling is applied to a processor and comprises:
the device comprises a determining module 1, a control module and a control module, wherein the determining module is used for determining a target wiring and a target device pin which have controllable depth drilling self-checking requirements on a circuit board;
the safety detection module 2 is used for acquiring the size information of the target controllable depth drilled hole corresponding to the target wiring and the target device pin so as to detect whether the target controllable depth drilled hole meets the preset safety distance requirement or not based on the size information;
the setting detection module 3 is used for acquiring the wiring level information of the target wiring and the wiring connected with the target device pin, and determining the theoretical setting information of the target depth-controllable drilling hole according to the wiring level information so as to detect whether the actual setting information of the target depth-controllable drilling hole conforms to the theoretical setting information;
the symbol detection module 4 is configured to determine a stub type of the drilling and dividing of the target controllable depth drill hole, and detect whether a symbol representing the stub type of the drilling and dividing configured for the target controllable depth drill hole is correct;
and the summarizing module 5 is used for summarizing the detection results to obtain the self-detection result of the depth-controllable drilling hole on the circuit board.
For introduction of the design self-checking system provided in the present application, reference is made to the above-mentioned embodiment of the design self-checking method, which is not described herein again.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a design self-inspection device for controlled depth drilling according to an embodiment of the present invention.
The design self-checking device of the controllable depth drilling hole comprises:
a memory 6 for storing a computer program;
a processor 7 for implementing the steps of any of the above described methods of self-testing of the design of controlled depth drilling when executing a computer program.
For introduction of the design self-checking apparatus provided in the present application, reference is made to the above-mentioned embodiment of the design self-checking method, which is not described herein again.
The present application further provides a computer readable storage medium, on which a computer program is stored, which, when executed by a processor, implements the steps of any of the above-mentioned methods for designing a self-test for controlled-depth drilling.
For introduction of the computer-readable storage medium provided in the present application, please refer to the above-mentioned embodiments of the design self-checking method, which is not described herein again.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (8)

1. A design self-checking method of a controllable depth drilling hole is applied to a processor and comprises the following steps:
determining a target wiring and a target device pin which have the self-checking requirement of controllable depth drilling on the circuit board;
acquiring size information of a target controllable depth drilled hole corresponding to the target routing and the target device pin, and detecting whether the target controllable depth drilled hole meets a preset safety distance requirement or not based on the size information;
acquiring routing layer information of the target routing and the routing connected with the target device pin, and determining theoretical setting information of the target depth-controllable drilling according to the routing layer information so as to detect whether actual setting information of the target depth-controllable drilling conforms to the theoretical setting information;
determining the stub type of the target controllable depth drilling division to detect whether the symbol which is configured for the target controllable depth drilling and is used for representing the stub type of the drilling division is correct or not;
summarizing the detection results to obtain a self-detection result of the depth-controllable drilling hole on the circuit board;
acquiring the size information of the target routing and the target depth-controllable drilling hole corresponding to the target device pin, and detecting whether the target depth-controllable drilling hole meets the requirement of a preset safety interval based on the size information, wherein the method comprises the following steps:
collecting the drilling diameter of the target depth-controllable drilling hole from the design graph of the circuit board, and judging whether the drilling diameter is within the range of the safety distance of a preset plane;
if the distance is within the range of the preset plane safety distance, acquiring the position distance between the drill top of the target depth-controllable drill hole and the last layer of routing connected with the via hole corresponding to the drill top, and judging whether the position distance is within the range of the preset layer safety distance;
if the target drilling depth is within the range of the preset bedding surface safety distance, determining that the target drilling depth controllable meets the preset safety distance requirement;
if the target depth-controllable drilling hole is not in the range of the preset plane safe interval and/or the range of the preset bedding surface safe interval, determining that the target depth-controllable drilling hole does not meet the preset safe interval requirement;
wherein, confirm that there is the target of controllable degree of depth drilling self-checking demand to walk line and target device pin on the circuit board, include:
acquiring line width and line distance information of each wire from a design pattern of the circuit board, and solving impedance information of each wire according to the line width and line distance information of each wire;
grouping the wires according to the impedance information of the wires; wherein, the impedance information of the same group of wires is the same;
and determining the same group of wires corresponding to the target impedance with the design requirement of controllable depth drilling as the target wires, and determining a device pin connected with the target wires as the target device pin.
2. The method according to claim 1, wherein obtaining the position distance between the drill top of the target controlled depth drill hole and the last layer of trace connected to the via hole corresponding to the target controlled depth drill hole comprises:
collecting the drilling depth of the target depth-controllable drilling hole from the design graph, and determining a first horizontal position where the drilling top of the target depth-controllable drilling hole is located according to the drilling depth;
and collecting a second horizontal position of the last layer of routing wire connected with the via hole corresponding to the target depth-controllable drilling hole from the design graph so as to obtain the position distance between the first horizontal position and the second horizontal position.
3. The method according to claim 1, wherein the obtaining of the trace level information of the target trace and the trace connected to the target device pin, and determining the theoretical setting information of the target controlled depth drilling according to the trace level information comprises:
collecting routing layer information of the target routing and the routing connected with the target device pin from the design pattern of the circuit board;
and determining the theoretical position and the theoretical drilling depth range of the target depth-controllable drilling according to the routing layer information.
4. The method of claim 1, wherein determining the stub type of the target controlled depth borehole removal comprises:
determining the stub type of the target controllable depth drilling removal corresponding to the target routing as via stub;
and determining the stub type of the target controllable depth drilling division corresponding to the target device pin as the pin stub.
5. The method for design self-test of controlled depth drilling according to any of claims 1-4, wherein before determining the target trace and target device pin on the circuit board that are required for self-test of controlled depth drilling, the method further comprises:
acquiring the superposition data of the circuit board from the design graph of the circuit board;
judging whether the superposed data meets the target design requirement of the circuit board;
if yes, executing a step of determining that the circuit board has target wiring and target device pins required by the controllable depth drilling self-checking;
if not, the step of determining that the circuit board has the target wiring and the target device pin required by the controllable depth drilling self-checking is not executed.
6. A design self-checking system for controlled depth drilling, applied to a processor, comprising:
the determining module is used for determining a target routing and a target device pin which have the controllable depth drilling self-checking requirement on the circuit board;
the safety detection module is used for acquiring the size information of the target controllable depth drilled hole corresponding to the target wiring and the target device pin so as to detect whether the target controllable depth drilled hole meets the preset safety distance requirement or not based on the size information;
the setting detection module is used for acquiring the target wiring and wiring level information of the wiring connected with the target device pin, and determining theoretical setting information of the target depth-controllable drilling hole according to the wiring level information so as to detect whether the actual setting information of the target depth-controllable drilling hole conforms to the theoretical setting information;
the symbol detection module is used for determining the stub type of the drilling division of the target controllable depth drilling hole so as to detect whether the symbol which is configured for the target controllable depth drilling hole and is used for representing the stub type of the drilling division is correct or not;
the collecting module is used for collecting all detection results to obtain a self-detection result of the depth-controllable drilling hole on the circuit board;
the safety detection module is specifically configured to:
collecting the drilling diameter of the target depth-controllable drilling hole from the design graph of the circuit board, and judging whether the drilling diameter is within the range of the safety distance of a preset plane;
if the distance is within the range of the preset plane safety distance, acquiring the position distance between the drill top of the target depth-controllable drill hole and the last layer of routing connected with the via hole corresponding to the drill top, and judging whether the position distance is within the range of the preset layer safety distance;
if the target drilling depth is within the range of the preset bedding surface safety distance, determining that the target drilling depth controllable meets the preset safety distance requirement;
if the target depth-controllable drilling hole is not in the range of the preset plane safe interval and/or the range of the preset bedding surface safe interval, determining that the target depth-controllable drilling hole does not meet the preset safe interval requirement;
wherein, confirm that there is the target of controllable degree of depth drilling self-checking demand to walk line and target device pin on the circuit board, include:
acquiring line width and line distance information of each wire from a design pattern of the circuit board, and solving impedance information of each wire according to the line width and line distance information of each wire;
grouping the wires according to the impedance information of the wires; wherein, the impedance information of the same group of wires is the same;
and determining the same group of wires corresponding to the target impedance with the design requirement of controllable depth drilling as the target wires, and determining a device pin connected with the target wires as the target device pin.
7. A self-checking device for design of controlled depth drilling, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the controlled depth drilling design self-test method of any of claims 1-5 when executing the computer program.
8. A computer-readable storage medium, having stored thereon a computer program which, when being executed by a processor, carries out the steps of the method of controlled depth drilling design self-test as claimed in any one of claims 1 to 5.
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