CN101827498B - Alignment process of matrix-shaped laser drilling blind hole of circuit board - Google Patents
Alignment process of matrix-shaped laser drilling blind hole of circuit board Download PDFInfo
- Publication number
- CN101827498B CN101827498B CN 201010167691 CN201010167691A CN101827498B CN 101827498 B CN101827498 B CN 101827498B CN 201010167691 CN201010167691 CN 201010167691 CN 201010167691 A CN201010167691 A CN 201010167691A CN 101827498 B CN101827498 B CN 101827498B
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- blind hole
- laser
- matrix
- wiring board
- contraposition
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Abstract
The invention discloses an alignment process of a matrix-shaped laser drilling blind hole of a circuit board, which comprises the following steps that: 1) laser blind hole matrixes are arranged around the laser drilling circuit board, blind hole tin rings are arranged on the peripheries of the laser blind holes, and the laser blind holes are not covered with solder masks; 2) the blind holes of the laser blind hole matrixes are connected into a chain shape through inner and outer circuits; and 3) when the film is used for transferring outer graphics, the laser blind hole matrixes are utilized to achieve precise alignment. The blind hole matrixes are additionally arranged on the periphery of the laser drilling circuit board and are designed into a chain shape, so that not only the precise alignment can be achieved when the outer graphics are transferred through the film or the solder masks are produced, but also the resistance values of the two ends of the chain can be measured through a resistance gauge so as to know whether the laser blind holes in the laser drilling circuit board are copperized well or reliably conducted, thereby greatly improving detection efficiency and yield of products.
Description
Technical field
The invention belongs to the wiring board design field, especially relate to a kind of can be used for the wiring board outer graphics and shift the time or the laser drilling blind hole contraposition technology of resistance weldering wiring board rectangular of accurate contraposition when making through the film.
Background technology
Along with the develop rapidly of microelectric technique, make the manufacturing of wiring board volume develop, so the figure of printed circuit also is more next month trickle leadization, microporeization and thin spaceization towards laminationization, direction such as multi-functional.For more and more miniature via hole and blind hole between the live width that improves more and more narrow and the multilayer circuit board different aspects, thus, the laser drill technology has obtained using widely when the making of multilayer circuit board.But the wiring board of laser drill is because aperture and the Xi Quan of its laser blind hole is often especially little, shifts through the film or hinders when welding contraposition carrying out outer graphics, is good at realizing accurate contraposition.And, also be difficult to realize precisely control, thereby cause product unstable, or rate of finished products is low for whether producing a desired effect in the copper facing process in the laser blind hole.
Summary of the invention
The object of the present invention is to provide a kind of accurate laser drilling blind hole contraposition technology of the wiring board rectangular of contraposition can be used for shifting outer printed circuit figure or resistance weldering contraposition the time through the film.Solve the defective that prior art exists.
For realizing above-mentioned purpose, the present invention adopts following technical scheme:
A kind of laser drilling blind hole contraposition technology of wiring board rectangular comprises the steps:
1) the laser blind hole matrix is set around the laser drill wiring board; Described laser blind hole week is along being provided with blind hole Xi Quan; Described blind hole tin circle width is 3～4mil (mil is a mil, every mil=0.0254cm), and described laser blind hole does not all cover the resistance weldering;
2) blind hole with described laser blind hole matrix connects into chain form through internal layer and outer circuit;
When 3) carrying out the outer graphics transfer, utilize the laser blind hole matrix to realize accurate contraposition through the film.
Preferably: described laser blind hole matrix is four, is arranged at respectively to treat four corners of laser drill wiring board, and each matrix is the form setting of 10x10.
A kind of laser drilling blind hole contraposition technology of wiring board rectangular comprises the steps:
1) the laser blind hole matrix is set around the laser drill wiring board, described laser blind hole week, described blind hole tin circle width was 3～4mil along being provided with blind hole Xi Quan, and described laser blind hole does not all cover the resistance weldering;
2) blind hole with described laser blind hole matrix connects into chain form through internal layer and outer circuit;
When 3) the resistance weldering is made, utilize the laser blind hole matrix to realize accurate contraposition.
Preferably: described laser blind hole matrix is four, is arranged at respectively to treat four corners of laser drill wiring board, and each matrix is the form setting of 10x10.
Laser drill plate of the present invention is the plank after the laser drill.Need when laser drill, add the laser blind hole matrix is set, carry out corresponding operation with convenient back operation.Blind hole designs the demand of wiring board according to electronic device in the described plate, is the hole for realizing that its electronic product function designs; Blind hole in the blind hole matrix is the contraposition of operation, test etc. afterwards for ease.Outer film operation is in order to produce copper wire and the operation of pad on the wiring board; After making skin; During the resistance weldering circuit pack is built; The not oxidated or corrosion with protection circuit, pad partly then exposes, with mounting electronic; These pad locations need be opened a window bigger than pad usually when making resistance weldering figure, cause pad bad to prevent the resistance weldering from going on the pad.The effect of Xi Quan is similar with pad, and only the position at Xi Quan place is in the position in a hole, if in the pad center of a circle through hole or blind hole are arranged, this is Xi Quan, the effect of the scolder foothold when playing scolding tin.
The present invention compared with prior art has following advantage and beneficial effect:
The present invention is through all along increasing the blind hole matrix at the laser drill wiring board; And these matrix design are become chain form; Not only can carry out to realize accurate contraposition when perhaps making was welded in resistance when outer graphics shifted through the film, and can learn just whether copper facing well reaches reliable conducting in the interior laser blind hole of laser drill wiring board through the resistance value at ohmer chain two ends; Detection efficiency greatly improves, and has improved the rate of finished products of product greatly.
Description of drawings
Fig. 1 is a blind hole matrix sketch map of the present invention;
Fig. 2 is the outer lead design diagram that connects in blind hole matrix of the present invention place;
Fig. 3 is the catenation principle figure of laser blind hole matrix place's blind hole of the present invention and lead;
Fig. 4 is blind hole and the Xi Quan and the resistance unsolder window construction sketch map of blind hole matrix of the present invention.
Embodiment
Embodiment 1
Carry out the transfer of outer printed circuit figure through the film
Concrete technological process
1) (shown in Figure 1 at the laser drill wiring board; Among the figure: 101 is unit in the plate, and 102 are the blind hole matrix) around the laser blind hole matrix is set, arranged in matrix is 4; Each is the form setting of 10x10; Described laser blind hole week, described laser blind hole does not all cover the resistance weldering, and was as shown in Figure 4 along being provided with blind hole Xi Quan;
2) blind hole with described laser blind hole matrix is linked into chain form through internal layer and outer circuit, and is as shown in Figure 2; The catenation principle of blind hole and lead is as shown in Figure 3, promptly with time outer layer conductor 302 blind hole 303 is realized that chain-type is connected through top layer lead 301;
When 3) carrying out the outer graphics transfer, utilize the laser blind hole matrix to realize accurate contraposition through the film.
The laser blind hole diameter at edges of boards matrix place is got the size of minimum laser blind hole diameter in the unit, and the tin circle size of the laser blind hole at edges of boards matrix place is got the size of minimum laser blind hole Xi Quan in the unit, perhaps fixing 3mil (that is: the 0.075mm that adopts.This is the minimal design value) Xi Quan.As long as the laser blind hole contraposition at four matrix places of edges of boards does not have the problem of holes etc., then the laser blind hole contraposition in the unit must no problem.As long as see during contraposition that four matrix alignment situation of edges of boards are just passable, be beneficial to and observe and operation.
These 100 laser blind holes are linked to be the design of a chain bar shaped through making inferior skin and being connected of top layer circuit these 100 laser blind holes.The resistance value at the two ends through measuring this chain just can learn in the laser blind hole that whether copper facing well and reliable conducting, can measure reliability of products and with low cost easily.
The laser drill plate is hindered the weldering contraposition
1) (shown in Figure 1 at the laser drill wiring board; Among the figure: 101 is unit in the plate, and 102 are the blind hole matrix) around the laser blind hole matrix is set, arranged in matrix is 4; Each is the form setting of 10x10; Described laser blind hole week, described laser blind hole does not all cover the resistance weldering, and was as shown in Figure 4 along being provided with blind hole Xi Quan;
2) blind hole with described laser blind hole matrix is linked into chain form through internal layer and outer circuit, and is as shown in Figure 2; The catenation principle of blind hole and lead is as shown in Figure 3, promptly with time outer layer conductor 302 blind hole 303 is realized that chain-type is connected through top layer lead 301;
3) resistance weldering is 2mil from the size of windowing of Xi Quan, and weld not Shang blind hole Xi Quan with resistance during contraposition is standard, as long as see that four matrix alignment situation of edges of boards are just passable during contraposition, is beneficial to observation and operates, and can realize accurate contraposition.
The laser blind hole diameter at edges of boards matrix place is got the size of minimum laser blind hole diameter in the unit, and the tin circle size of the laser blind hole at edges of boards matrix place is got the size of minimum laser blind hole Xi Quan in the unit, perhaps fixing 3mil (that is: the 0.075mm that adopts.This is the minimal design value) Xi Quan.As long as the laser blind hole contraposition at four matrix places of edges of boards does not have the problem of holes etc., then the laser blind hole contraposition in the unit must no problem.As long as see during contraposition that four matrix alignment situation of edges of boards are just passable, be beneficial to and observe and operation.Being provided with of resistance weldering and Xi Quan is as shown in Figure 4, and among the figure, 401 are green oil resistance weldering, and 402 is laser blind hole, and 403 is blind hole Xi Quan, and 404 are resistance unsolder window.
These 100 laser blind holes are linked to be the design of a chain bar shaped through making inferior skin and being connected of top layer circuit these 100 laser blind holes.The resistance value at the two ends through measuring this chain just can learn in the laser blind hole that whether copper facing well and reliable conducting, can measure reliability of products and with low cost easily.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (6)
1. the laser drilling blind hole contraposition technology of a wiring board rectangular comprises the steps:
1) the laser blind hole matrix is set around the laser drill wiring board, described laser blind hole week, described laser blind hole did not all cover the resistance weldering along being provided with blind hole Xi Quan;
2) blind hole with described laser blind hole matrix connects into chain form through internal layer and outer circuit;
When 3) carrying out the outer graphics transfer, utilize the laser blind hole matrix to realize contraposition through the film.
2. the laser drilling blind hole contraposition technology of wiring board rectangular as claimed in claim 1, it is characterized in that: described laser blind hole matrix is four, is arranged at respectively to treat four corners of laser drill wiring board, each matrix is the form setting of 10x10.
3. the laser drilling blind hole contraposition technology of wiring board rectangular as claimed in claim 1 is characterized in that: described blind hole tin circle width is 3～4mil.
4. the laser drilling blind hole contraposition technology of a wiring board rectangular comprises the steps:
1) edge is provided with the laser blind hole matrix around the laser drill wiring board, and described laser blind hole week, described laser blind hole did not all cover the resistance weldering along being provided with blind hole Xi Quan;
2) blind hole with described laser blind hole matrix connects into chain form through internal layer and outer circuit;
When 3) the resistance weldering is made, utilize the laser blind hole matrix to realize contraposition.
5. the laser drilling blind hole contraposition technology of wiring board rectangular as claimed in claim 4, it is characterized in that: described laser blind hole matrix is four, is arranged at respectively to treat four corners of laser drill wiring board, each matrix is the form setting of 10x10.
6. the laser drilling blind hole contraposition technology of wiring board rectangular as claimed in claim 5 is characterized in that: described blind hole tin circle width is 3～4mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010167691 CN101827498B (en) | 2010-04-30 | 2010-04-30 | Alignment process of matrix-shaped laser drilling blind hole of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010167691 CN101827498B (en) | 2010-04-30 | 2010-04-30 | Alignment process of matrix-shaped laser drilling blind hole of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101827498A CN101827498A (en) | 2010-09-08 |
| CN101827498B true CN101827498B (en) | 2012-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010167691 Expired - Fee Related CN101827498B (en) | 2010-04-30 | 2010-04-30 | Alignment process of matrix-shaped laser drilling blind hole of circuit board |
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| Country | Link |
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| CN (1) | CN101827498B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102044446B (en) * | 2010-10-27 | 2012-10-10 | 深南电路有限公司 | Manufacturing method for blind hole windowing contraposition target of packaging baseplate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002290035A (en) * | 2001-03-26 | 2002-10-04 | Ibiden Co Ltd | Method of manufacturing multilayer printed wiring board |
| CN1842249A (en) * | 2005-03-29 | 2006-10-04 | 日本航空电子工业株式会社 | High precision connector member and manufacturing method thereof |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
-
2010
- 2010-04-30 CN CN 201010167691 patent/CN101827498B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002290035A (en) * | 2001-03-26 | 2002-10-04 | Ibiden Co Ltd | Method of manufacturing multilayer printed wiring board |
| CN1842249A (en) * | 2005-03-29 | 2006-10-04 | 日本航空电子工业株式会社 | High precision connector member and manufacturing method thereof |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
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| Publication number | Publication date |
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| CN101827498A (en) | 2010-09-08 |
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| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Jiang Xuefei Inventor after: Liu Dong Inventor after: Peng Weihong Inventor before: Liu Dong |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: LIU DONG TO: JIANG XUEFEI LIU DONG PENG WEIHONG |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20200430 |