JP2011086838A - Electronic apparatus, and method of mounting circuit board used for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve positioning in connecting printed boards to each other without providing a positioning-dedicated component or the like, in an electronic apparatus using two or more printed boards. <P>SOLUTION: When connecting a first circuit board (rigid board 10) and a second circuit board (flexible board 20) to each other through a first connector (FPC connector 30) and a second connector, functional components and instruction means for manufacture/inspection arranged on the respective boards are used for positioning for the connection. The flexible board 20 is connected to the FPC connector 30 mounted on the rigid board 10 by moving the flexible board in parallel to a component mounting surface of the rigid board 10. In this case, the respective functional components of the rigid board 10 and predetermined parts of outlines of the respective instruction means for manufacture/inspection, and the respective functional components of the flexible board 20 and the predetermined parts of the outlines of the respective instruction means for manufacture/inspection are superposed on each other in a vertical viewpoint direction with respect to the component mounting surface of the rigid board 10. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic device and a circuit board mounting method used for the electronic device. For example, in a small electronic device such as a cellular phone, the first circuit board is a rigid board, and the second circuit is provided. When the board is composed of a flexible board, it is suitable for application in a case where the second circuit board is inserted into the connector mounted on the first circuit board. The present invention relates to an electronic device and a circuit board mounting method used for the electronic device.

  In an electronic device such as a cellular phone, an electric circuit is composed of two or more circuit boards, and these are connected via a connector or the like. Here, the circuit board is, for example, a rigid board in which a signal pattern is made of copper foil on a material made of glass epoxy such as FR4, or a copper foil on a flexible material such as polyimide. There is a flexible substrate on which a signal pattern is configured. These circuit boards are connected via various connectors mounted on the board main body, or the board main bodies are connected to each other by thermocompression bonding or the like to constitute an electric circuit of the electronic device. In particular, when the first circuit board is a rigid board and the second circuit board is a flexible board, the second circuit board is generally connected to the connector mounted on the first circuit board. Often implemented in a manner of inserting

  For example, as shown in FIG. 6, this type of electronic apparatus includes a rigid substrate 1, a flexible substrate 2, and an FPC (Flexible Printed Circuit) connector 3. The FPC connector 3 is configured to be inserted with a connector 2c provided at an end of the flexible substrate 2, and is generally widely used because it can be easily assembled and disassembled in the manufacturing and maintenance of electronic devices. . The FPC connector 3 is generally inserted by moving the flexible board 2 in parallel along the component mounting surface of the rigid board 1, and the lid is opened and closed for connection stability and prevention of disconnection. A mechanism is provided.

  Here, when the flexible board 2 is inserted into the FPC connector 3, since the tip of the flexible board 2 goes into the FPC connector 3, how much the flexible board 2 is inserted from the outside of the FPC connector 3. If it is not possible to see whether or not the insertion has been performed, a contact failure may occur or the flexible substrate 2 may be easily removed. In order to prevent such insufficient insertion, a mark is provided so that the insertion amount can be determined even when the flexible board 2 is inserted into the FPC connector 3. In this case, generally, the positioning guide 2g is provided by performing silk printing or the like on the flexible substrate 2. However, since the number of silk printing steps increases in the manufacturing process of the flexible substrate 2, the flexible substrate 2 There is a problem that the unit price increases.

  As another method for preventing insufficient insertion, there is a method of providing a positioning guide on the rigid substrate 1 side. This guide is formed by applying silk printing on the rigid substrate 1 side, or by forming a copper foil pattern on the rigid substrate 1, or by opening a solder resist, as shown in FIG. Provided on the substrate 1.

  However, in recent years, electronic devices such as mobile phones have been miniaturized, and a copper foil pattern or solder resist serving as a positioning guide can be freely placed on the first circuit board by high-density mounting and high-density wiring. There is a problem that can not be placed in. In particular, when a copper foil pattern is provided as a guide, there is a problem that wiring efficiency is lowered when an electric circuit is formed on a circuit board. Also, when attaching positioning guides with solder resist, it is necessary to provide solder resist openings in the ground potential copper foil pattern formed on a surface of a certain size. Thus, if it is intended to secure a ground potential copper foil pattern area formed on a surface of a certain size, the mounting density and wiring density of the circuit board are lowered, which is difficult to realize. In addition, the addition of silk printing has a problem that the unit price increases due to the addition of processes, like the flexible substrate 2.

In addition to the electronic devices described above, as a related technique of this type, for example, there is a positioning method described in Patent Document 1.
In this positioning method, a reference hole or mark is formed in the same arrangement as at least two or more of a plurality of electrodes, and a guide hole or a reference hole formed in the guide part is formed on the positioning hole. Using a reference plate with a guide plate, insert a guide part or a part that has a function of absorbing the processing accuracy of the positioning hole into the positioning hole of the reference plate, thereby positioning the electrode and the guide part through the reference plate. I do.

  Moreover, the printed wiring board unit described in Patent Document 2 includes a first printed wiring board and a second printed wiring board overlaid on the first printed wiring board. The first printed wiring board has an outer shape larger than the outer shape of the second printed wiring board, and includes a first connection pad on the surface. The second printed wiring board corresponds to the position of the second connection pad provided on the one surface opposite to the first connection pad and the position of the second connection pad on the other surface. And a position confirmation pad provided. The first connection pad is formed to extend outward from the outer edge of the second printed wiring board when the first and second printed wiring boards are overlapped with each other. Then, the position of the first connection pad and the position confirmation pad is detected and positioned by an image device or the like.

JP 2006-005188 A JP 2009-099915 A

However, the related technology has the following problems.
That is, in the positioning method described in Patent Document 1, dedicated members, holes, and jigs for use in positioning, such as guide pins and reference holes, are required, and the above problem cannot be solved.

  In the printed wiring board unit described in Patent Document 2, a connection pad is provided, and alignment is performed by bringing them into contact with each other. The connection pad is unnecessary for the product function for a high-density mounting and high-density wiring circuit board of a small electronic device such as a mobile phone, and there is a problem that it is difficult to reduce the size of the electronic device.

  This invention has been made in view of the above circumstances, and when two or more circuit boards are used, positioning when connecting circuit boards is realized without providing positioning-specific components. It is an object of the present invention to provide an electronic device to be used and a circuit board mounting method used for the electronic device.

  In order to solve the above-mentioned problems, a first configuration of the present invention includes first and second circuit boards configured to be connectable to each other, and the first and second circuit boards have a predetermined function. Are mounted with functional parts for realizing the above, and are provided with manufacturing inspection instruction means for indicating the position of the predetermined jig and tool and the functional parts at the time of manufacture and inspection of the circuit board. According to the device, each of the functional parts and each of the manufacturing inspection instruction means is partially connected when the first circuit board and the second circuit board are connected to each other. It is characterized by the shape used for positioning.

  A second configuration of the present invention includes first and second circuit boards configured to be connectable to each other, and the first and second circuit boards have functional components for realizing a predetermined function. A circuit board mounting method used for electronic devices, each of which is mounted and provided with a manufacturing inspection instruction means for indicating a position of a predetermined jig and a functional component at the time of manufacture and inspection of the circuit board. Therefore, when the first circuit board and the second circuit board are connected to each other, the shape of each of the functional parts and part of the instruction means for manufacturing inspection is secondarily used for positioning for connection. It is characterized by use.

  According to the configuration of the present invention, when a plurality of circuit boards are connected, the positioning can be reliably performed without providing a positioning-dedicated means, and an increase in cost due to the positioning-dedicated means can be avoided.

1 is a perspective view illustrating a configuration of a main part of an electronic device according to a first embodiment of the present invention. It is a disassembled perspective view of the electronic device of FIG. It is a perspective view which shows the structure of the principal part of the electronic device which is 2nd Embodiment of this invention. It is a disassembled perspective view of the electronic device of FIG. It is a reverse perspective view of the flexible substrate 20A in FIG. It is a perspective view which shows the structure of the principal part of an electronic device. It is a perspective view which shows the structure of the principal part of another electronic device.

  The first circuit board is mounted with a first connector for connecting the second circuit board by translating along the component mounting surface of the first circuit board, and the second circuit board is mounted. The substrate is provided with a second connector for connecting to the first connector. Predetermined parts of the outer shapes of the functional parts and the manufacturing inspection instruction means of the first circuit board, and predetermined outer shapes of the functional parts and the manufacturing inspection instruction means of the second circuit board. Are overlapped with each other in the vertical viewpoint direction with respect to the component mounting surface of the first circuit board, thereby realizing an electronic apparatus configured to perform the positioning.

The first circuit board is mounted with a first connector for connecting the second circuit board by moving the second circuit board perpendicularly to the component mounting surface of the first circuit board, and the second circuit board is mounted. The circuit board is provided with a second connector for connecting to the first connector.
When the first connector on the first circuit board cannot be directly viewed, the functional parts and the manufacturing inspection instruction means of the first and second circuit boards are used instead of the first connector. It is set as the structure used for the said positioning. At least one of the first circuit board and the second circuit board is formed of a flexible substrate.

Embodiment 1

FIG. 1 is a perspective view showing a configuration of a main part of an electronic apparatus according to the first embodiment of the present invention.
The electronic apparatus of this form has a rigid substrate 10 and a flexible substrate 20 as shown in FIG.
The rigid substrate 10 is provided with a circuit pattern (not shown) for constituting an electric circuit of the electronic device on the substrate body, and an insulating sheet 11 is affixed as a functional component for realizing a predetermined function, for example. In addition, a mounting component 12 such as a semiconductor chip is soldered, and an FPC connector 30 for electrically and mechanically connecting the flexible substrate 20 is mounted. For example, positioning holes 10h and 10h are provided as manufacturing inspection instruction means for instructing the positions of a predetermined jig and tool and the functional parts at the time of manufacturing and inspection of the rigid substrate 10. The flexible substrate 20 is provided with a signal pattern (not shown) for forming an electric circuit of the electronic device on the substrate body. For example, external holes 20h and 20h are provided as instruction means for manufacturing inspection of the flexible substrate 20. The connector 20c for connecting to the FPC connector 30 is provided at the end.

  The FPC connector 30 mounted on the rigid board 10 is configured to be connected by translating the flexible board 20 along the component mounting surface of the rigid board 10. In this electronic apparatus, when the rigid board 10 and the flexible board 20 are connected to each other via the FPC connector 30 and the connector 20c, each of the functional parts and the manufacturing inspection instruction means provided in each board body are provided. The shape of the portion is used as a secondary accessory for positioning for connection.In particular, in this embodiment, each functional component provided on the rigid substrate 10 and a predetermined portion of the outer shape of each manufacturing inspection instruction means, The positioning is performed by overlapping each functional component provided on the flexible substrate 20 and a predetermined portion of the outer shape of each manufacturing inspection instruction means in the direction of the vertical viewpoint with respect to the component mounting surface of the rigid substrate 10. By connecting the rigid substrate 10 and the flexible substrate 20, the electric circuits divided and formed on each substrate are integrated and operate as an electronic device.

FIG. 2 is an exploded perspective view of the electronic device of FIG.
A circuit pattern is formed on the rigid substrate 10 together with the mounting component 12. However, in order to perform various inspections in the manufacturing process of the electronic device, a plurality of test lands for electrical inspection are used as shown in FIG. 13 is provided. In this inspection, the voltage and signal of the electric circuit are observed from the test land 13 by using a probe pin or the like. Further, the positioning holes 10h, 10h of the rigid substrate 10 are used for positioning when the rigid substrate 10 is fixed to jigs and tools or the insulating sheet 11 is stuck at the time of inspection.

  The outer holes 20h, 20h of the flexible substrate 20 are used as manufacturing inspection instruction means for indicating the positions of predetermined jigs and functional parts when the flexible substrate 20 is manufactured and inspected. The insulating sheet 11 is for preventing a short circuit caused by the test land 13 on the rigid substrate 10 coming into contact with other components or circuit patterns, and is configured to cover the test land 13. As shown in FIG. 10, it is composed of an insulating film having an adhesive process on the back surface. Further, the insulating sheet 11 is provided with a positioning hole 11h having the same diameter as the positioning hole 10h of the rigid substrate 10 in order to facilitate positioning when being attached to the rigid substrate 10. The insulating sheet 11 is affixed after the rigid substrate 10 is inspected. The outer shape of the insulating sheet 11 is formed so as to overlap the hole of the outer hole 20 h of the flexible substrate 20 in the vertical viewpoint direction.

  A general flexible substrate having circuit patterns on both sides is composed of a copper foil layer that forms a signal pattern formed on both sides of a polyimide layer, and a coverlay layer that functions as an insulating layer with polyimide or the like. Depending on the application, a silver shield may be formed on the coverlay layer, and the silver shield is electrically connected to the copper foil under the coverlay layer. A top coating is applied on the silver shield for insulation, and a mounting component that constitutes an electric circuit may be mounted on the flexible substrate 20. The flexible substrate 20 in FIG. 2 is incorporated and connected to the FPC connector 30 so that the silver shield faces the rigid substrate 10. Although the top coating is applied on the silver shield, the insulating property of the top coating may be deteriorated due to scratches. At this time, when the silver shield comes into contact with the test lands 13 on the rigid substrate 10, the test lands 13 are short-circuited to cause an operation failure. The insulating sheet 11 functions to prevent a short circuit.

Next, processing contents of the circuit board mounting method used for the electronic apparatus of this embodiment will be described.
In this electronic apparatus, when the rigid board 10 and the flexible board 20 are connected to each other via the FPC connector 30 and the connector 20c, each functional component provided in each board body and a part of each manufacturing inspection instruction means. This shape is used as a secondary accessory for positioning for connection. In this embodiment, the flexible substrate 20 is connected to the FPC connector 30 mounted on the rigid substrate 10 by translating along the component mounting surface of the rigid substrate 10. In this case, the predetermined parts of the outer shape of each functional component and each manufacturing inspection instruction means provided on the rigid substrate 10 and the predetermined outer shape of each functional component and each manufacturing inspection instruction means provided on the flexible substrate 20 are specified. The above positioning is performed by superimposing these parts in the vertical viewpoint direction with respect to the component mounting surface of the rigid board 10.

  That is, when connecting the flexible substrate 20 and the FPC connector 30 on the rigid substrate 10, the flexible substrate 20 is inserted into the FPC connector 30. At this time, in order to confirm whether or not the front end of the flexible board 20 is inserted into the FPC connector 30 with an accurate insertion amount, the outer hole 20h of the flexible board 20 and the insulation stuck on the rigid board 10 are used. The outer edge of the sheet 11 is confirmed from a vertical viewpoint, and if the outer hole 20h of the flexible board 20 and the outer edge of the insulating sheet 11 coincide with each other on the vertical viewpoint, the FPC connector 30 is flexible. The substrate 20 is inserted with an accurate insertion amount. As a result, reliability of assembly is ensured, contact failure due to insufficient insertion and the like are prevented, and operational reliability of the electronic device is ensured.

  As described above, in the first embodiment, the positioning by silk printing for positioning is performed by using the outer shape hole 20h of the flexible substrate 20 and the outer shape of the insulating sheet 11 attached on the rigid substrate 10 for positioning. Even if it is not, the insertion amount of the FPC connector 30 is visually confirmed. For this reason, an increase in the cost of the flexible substrate 20 is avoided, and at the same time, the flexible substrate 20 is accurately inserted into the FPC connector 30, so that problems such as poor contact due to insufficient insertion are avoided, and connection reliability is improved. Alternatively, the insertion amount of the FPC connector 30 can be visually confirmed even if the rigid substrate 10 does not have a copper foil pattern for positioning, a solder resist removal, or a guide by silk printing, so that the silk of the rigid substrate 10 can be visually confirmed. Cost increase due to additional printing is avoided. Moreover, since it is not necessary to secure a copper foil pattern for a guide or a solder resist region on the rigid substrate 10, it is possible to effectively utilize the electric circuit pattern region and the mounted component region on the rigid substrate 10, and to achieve high density. Wiring and high-density mounting are possible, and the electronic device can be miniaturized.

Embodiment 2

FIG. 3 is a perspective view showing a configuration of a main part of an electronic apparatus according to the second embodiment of the present invention.
In the electronic apparatus of this embodiment, as shown in FIG. 3, an insulating sheet 11A, a flexible board 20A, and a stacking connector 40 having different configurations are provided in place of the insulating sheet 11, the flexible board 20, and the FPC connector 30 in FIG. In addition, a reinforcing plate 21 is newly provided. The stacking connector 40 is mounted on the rigid board 10 and is connected by moving the flexible board 20 </ b> A perpendicularly to the component mounting surface of the rigid board 10. In particular, in this embodiment, when the stacking connector 40 on the rigid board 10 cannot be directly viewed, the insulating sheet 11A is used as a positioning guide instead of the stacking connector 40.

4 is an exploded perspective view of the electronic device of FIG. 3, and FIG. 5 is an inverted perspective view of the flexible substrate 20A in FIG.
As shown in FIG. 5, the flexible substrate 20 </ b> A is mounted with a mounting component 22 that constitutes an electric circuit and a stacking connector 41 that is electrically and mechanically engaged with the stacking connector 40 on the rigid substrate 10. The reinforcing plate 21 is provided on the mounting back surface of the stacking connector 41. When the stacking connector 41 is fitted to the stacking connector 40 of the rigid board 10, stress is concentrated on a part of the soldering connection portion of the stacking connector 41. To prevent damage.

  Similarly to the insulating sheet 11, the insulating sheet 11A is configured to cover the test land 13 on the rigid board 10, and when the flexible board 20A and the rigid board 10 are assembled, the test land 13 and the flexible board 20A are assembled. The electrical short circuit with the upper mounting component 22 is prevented. Further, the outer shape of the insulating sheet 11A is such that when the flexible substrate 20A and the rigid substrate 10 are assembled, the outer shape of the insulating sheet 11A and the outer shape of the reinforcing plate 21 of the flexible substrate 20A overlap two or more sides in the vertical viewpoint direction. It is formed as follows.

  In this electronic apparatus, when the flexible board 20A and the rigid board 10 are connected, the stacking connector 41 and the stacking connector 40 on both boards are fitted and connected. At this time, since the outer shape of the reinforcing plate 21 is larger than the outer shape of the stacking connector 40, it is difficult to position the connectors, and if the stacking connectors 40 and 41 are forcibly fitted and connected with the positioning being insufficient, the connectors May be damaged. For this reason, in this embodiment, when the stacking connectors 40 and 41 are connected to each other, at least two sides of the reinforcing plate 21 and the rigid board are arranged so that positioning can be performed from above the reinforcing plate 21. By positioning at least two outer sides of the insulating sheet 11A affixed on 10 so as to overlap in the vertical viewpoint direction, the stacking connectors 40 and 41 are fitted and connected at a normal position.

  As described above, in the second embodiment, the positioning copper is used by positioning at least two sides of the reinforcing plate 21 of the flexible substrate 20A and the outer shape of the insulating sheet 11A of the rigid substrate 10 as positioning guides. Even without a foil pattern, solder resist removal, and silk printing guide, the connecting and fitting positions of the stacking connectors 40 and 41 can be adjusted from the top of the reinforcing plate 21, so an increase in cost due to the addition of silk printing is avoided. The Moreover, since it is not necessary to secure a copper foil pattern for a guide or a solder resist area on the rigid board 10, it is possible to effectively use the electric circuit pattern area and the mounting component area on the rigid board 10, and to provide high density wiring. In addition, high-density mounting is possible, and the electronic device can be downsized. Further, since the fitting connection of the stacking connectors 40 and 41 is reliably performed, not only the stacking connectors 40 and 41 are prevented from being damaged but also the reliability of the connection fitting is improved.

The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to the embodiment, and even if there is a design change without departing from the gist of the present invention, Included in the invention.
For example, in each of the above embodiments, the outer shape of the insulating sheets 11 and 11A is used for positioning, but is not limited to the insulating sheet. For example, even if the outer shape of at least two sides or more of the reinforcing plate 21 in the second embodiment and the mounting component 12 on the rigid board 10 are configured to overlap in the vertical viewpoint direction, it is substantially the same as the above embodiment. The effects and effects are obtained.

  The present invention can be applied to all electronic devices using a plurality of circuit boards, and is particularly effective when applied to small electronic devices such as mobile phones and PHS (Personal Handyphone System).

10 Rigid board (first circuit board)
10h Positioning hole (Instruction means for manufacturing inspection)
11, 11A Insulation sheet (functional parts)
12 Mounting parts (functional parts)
13 Test land (functional parts)
20, 20A Flexible substrate (second circuit board)
20h External hole (Instruction means for manufacturing inspection)
20c connector (second connector)
21 Reinforcement plate (functional parts)
22 Mounting parts (functional parts)
30 FPC connector (first connector)
40 Stacking connector (first connector)
41 Stacking connector (second connector)

Claims (12)

First and second circuit boards configured to be connectable to each other, the first and second circuit boards are each mounted with functional components for realizing a predetermined function, and the circuit Electronic equipment provided with manufacturing inspection instruction means for instructing the position of a predetermined jig and tool and functional parts at the time of manufacturing and inspection of a substrate,
Each functional part and each manufacturing inspection instruction means,
An electronic apparatus, wherein when the first circuit board and the second circuit board are connected to each other, a part of the shape is used as a secondary shape for positioning for connection. The first circuit board is:
A first connector is mounted for connecting the second circuit board by translating along the component mounting surface of the first circuit board;
The second circuit board is:
The electronic apparatus according to claim 1, further comprising a second connector for connecting to the first connector. A predetermined portion of the outer shape of each of the functional parts of the first circuit board and the instruction means for manufacturing inspection;
A predetermined portion of the outer shape of each functional component of the second circuit board and each instruction means for manufacturing inspection;
The electronic apparatus according to claim 2, wherein the positioning is performed by overlapping the first circuit board in a vertical viewpoint direction with respect to the component mounting surface. The first circuit board is:
A first connector is mounted for connecting the second circuit board by moving perpendicularly to a component mounting surface of the first circuit board;
The second circuit board is:
The electronic apparatus according to claim 1, further comprising a second connector for connecting to the first connector.   When the first connector on the first circuit board cannot be directly viewed, the functional parts and the manufacturing inspection instruction means of the first and second circuit boards are used instead of the first connector. The electronic apparatus according to claim 4, wherein the electronic apparatus is configured to be used for the positioning.   6. The electronic apparatus according to claim 1, wherein at least one of the first circuit board and the second circuit board is a flexible board. First and second circuit boards configured to be connectable to each other, the first and second circuit boards are each mounted with functional components for realizing a predetermined function, and the circuit A circuit board mounting method used in an electronic apparatus provided with a manufacturing inspection instruction means for indicating a position of a predetermined jig and tool and a functional component at the time of manufacturing and inspecting a board,
When connecting the first circuit board and the second circuit board to each other,
A circuit board mounting method characterized in that a part of the shape of each functional component and each manufacturing inspection instruction means is used for positioning for connection. The first circuit board is mounted with a first connector for connecting the second circuit board by translating along the component mounting surface of the first circuit board,
The circuit board mounting method according to claim 7, wherein the second circuit board is provided with a second connector for connecting to the first connector.   Predetermined portions of the outer shapes of the functional parts and the manufacturing inspection instruction means on the first circuit board, and predetermined outer shapes of the functional parts and the manufacturing inspection instruction means of the second circuit board. The circuit board mounting method according to claim 8, wherein the positioning is performed by overlapping the first part and the second part in a vertical viewpoint direction with respect to the component mounting surface of the first circuit board. The first circuit board is:
A first connector is mounted for connecting the second circuit board by moving perpendicularly to a component mounting surface of the first circuit board;
The second circuit board is:
The circuit board mounting method according to claim 7, further comprising a second connector for connecting to the first connector.   When the first connector on the first circuit board cannot be directly viewed, the functional parts and the manufacturing inspection instruction means of the first and second circuit boards are used instead of the first connector. The circuit board mounting method according to claim 10, wherein the circuit board mounting method is used for the positioning.   The circuit board mounting method according to claim 7, wherein at least one of the first circuit board and the second circuit board is formed of a flexible substrate.

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