CN108966501A - Improve the PCB plate production method that HDI plate leads to blind hole aligning accuracy - Google Patents
Improve the PCB plate production method that HDI plate leads to blind hole aligning accuracy Download PDFInfo
- Publication number
- CN108966501A CN108966501A CN201810891186.2A CN201810891186A CN108966501A CN 108966501 A CN108966501 A CN 108966501A CN 201810891186 A CN201810891186 A CN 201810891186A CN 108966501 A CN108966501 A CN 108966501A
- Authority
- CN
- China
- Prior art keywords
- blind hole
- hole
- aligning accuracy
- location hole
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000608 laser ablation Methods 0.000 claims abstract description 13
- 238000005530 etching Methods 0.000 claims description 3
- 238000002679 ablation Methods 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 5
- 238000005553 drilling Methods 0.000 description 3
- 208000003351 Melanosis Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses the PCB plate production methods that a kind of raising HDI plate leads to blind hole aligning accuracy, include the following steps.Step S1: go out to be used to assist the location hole of mechanical boring positioning by laser ablation while laser ablation blind hole.Step S2: in mechanical holes drilled through, pass through the location hole auxiliary positioning of laser ablation out.The PCB plate production method disclosed by the invention for improving HDI plate and leading to blind hole aligning accuracy, pass through the location hole that needs when ablation simultaneously goes out through-hole production when making laser blind hole, the location hole no longer practiced shooting out using X-RAY after pressing when through-hole drills using the location hole that this laser drill ablation goes out, it can then guarantee that logical blind hole positioning system is consistent, to guarantee logical blind hole matching when outer-layer circuit production.
Description
Technical field
The invention belongs to wiring board production technical fields, and in particular to a kind of PCB for improving HDI plate and leading to blind hole aligning accuracy
Board manufacturing method.
Background technique
Currently, the outer layer of existing HDI plate contains through-hole and blind hole simultaneously.In pcb board manufacturing process, occur leading to often blind
Hole mismatch problem, i.e. outer-layer circuit such as use blind hole alignment system when aligning, through-hole may deviation even collapse hole；As used
When through-hole alignment system, the possible deviation of blind hole even collapses hole.
Particularly, in highly dense wiring board, the weld-ring of blind hole and through-hole is smaller and smaller, leaves outer-layer circuit contraposition deviation for
Space very little, through-hole and blind hole deviation collapse hole problem and are easy to occur.It searches to the bottom reason, is because inside and outside current HDI plate
Layer is generally routed all very intensively, and blind hole and the requirement of internal layer PAD aligning accuracy are very high, so being to pass through crawl when laser beats blind hole
The internal layer PAD of secondary outer layer realizes positioning, to guarantee the aligning accuracy of blind hole and internal layer PAD.However, completing pressure in machine drilling
Positioning is realized after conjunction by X-RAY target practice hole.Above-mentioned two sets of positioning systems are inconsistent, generally can all generate deviation.If partially
Difference is larger, is difficult to combine in outer-layer circuit production, then will appear logical blind hole mismatch problem.Outer-layer circuit is such as with blind hole
Positioning system positioning production route, then possible through-hole meeting deviation even collapses hole, and vice versa.
Summary of the invention
The present invention is directed to the situation of the prior art, overcomes drawbacks described above, provides a kind of logical blind hole aligning accuracy of raising HDI plate
PCB plate production method.
The present invention uses following technical scheme, and the PCB plate production method for improving the logical blind hole aligning accuracy of HDI plate includes
Following steps:
Step S1: go out to be used to assist the location hole of mechanical boring positioning by laser ablation while laser ablation blind hole；
Step S2: in mechanical holes drilled through, pass through the location hole auxiliary positioning of laser ablation out.
According to the above technical scheme, in step sl, the diameter of the location hole is 3.2mm.
Including specific steps S1.1 and step S1.2 according to the above technical scheme, in step sl:
Step S1.1: cylinder is gone out by laser-induced thermal etching；
Step S1.2: it removes cylinder and obtains location hole.
Including specific steps S2.1 according to the above technical scheme, in step s 2:
Step S2.1: by with positioning the consistent locating pin auxiliary positioning of bore dia.
The PCB plate production method disclosed by the invention for improving HDI plate and leading to blind hole aligning accuracy, the beneficial effect is that, lead to
It crosses the ablation simultaneously when making laser blind hole and goes out the location hole needed when through-hole production, burnt when through-hole drills using this laser drill
The location hole for losing location hole out and no longer being practiced shooting out using X-RAY after pressing can then guarantee that logical blind hole positioning system is consistent,
Logical blind hole matching when to guarantee outer-layer circuit production.
Specific embodiment
The invention discloses the PCB plate production methods that a kind of raising HDI plate leads to blind hole aligning accuracy, below with reference to preferred reality
Example is applied, further description of the specific embodiments of the present invention.
Preferably, it is described improve HDI plate lead to blind hole aligning accuracy PCB plate production method the following steps are included:
Step S1: go out to be used to assist the location hole of mechanical boring positioning by laser ablation while laser ablation blind hole；
Step S2: in mechanical holes drilled through, pass through the location hole auxiliary positioning of laser ablation out.
Further, in step sl, the diameter of the location hole is 3.2mm.
Including specific steps S1.1 and step S1.2 further, in step sl:
Step S1.1: cylinder is gone out by laser-induced thermal etching；
Step S1.2: it removes cylinder and obtains location hole.
Including specific steps S2.1 further, in step s 2:
Step S2.1: by with positioning the consistent locating pin auxiliary positioning of bore dia.
According to above preferred embodiment, compared to old process, (pressing → X-RAY target practice → brownification/melanism → laser is straight
It is (fixed using the hole X-RAY to take hole (using the hole X-RAY coarse localization, the punching of crawl internal layer PAD precise positioning) → mechanical holes drilled through
Position) → plating → outer-layer circuit (crawl blind hole or through-hole positioning) → lower process), present patent application is disclosed to improve HDI
Plate leads to the PCB plate production method of blind hole aligning accuracy, passes through needs when ablation simultaneously goes out through-hole production when making laser blind hole
Location hole, no longer practiced shooting out using X-RAY after pressing when through-hole drills using the location hole that this laser drill ablation goes out
Location hole can then guarantee that logical blind hole positioning system is consistent, to guarantee logical blind hole matching when outer-layer circuit production.
According to above preferred embodiment, the disclosed pcb board for improving HDI plate and leading to blind hole aligning accuracy of present patent application
Production method, core element are, need ablation simultaneously to go out machine drilling location hole in laser drill；It is adopted when mechanical holes drilled through
The location hole positioning gone out with laser ablation.Therefore, it only ablation need to go out rear process machine drilling location hole in laser boring, be not necessarily to
Additional process or investment, can promote logical blind hole consistency.
For a person skilled in the art, technical solution documented by foregoing embodiments can still be repaired
Change or equivalent replacement of some of the technical features, it is all within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should be included in protection scope of the present invention.
Claims (4)
1. a kind of PCB plate production method for improving HDI plate and leading to blind hole aligning accuracy, which comprises the following steps:
Step S1: go out to be used to assist the location hole of mechanical boring positioning by laser ablation while laser ablation blind hole；
Step S2: in mechanical holes drilled through, pass through the location hole auxiliary positioning of laser ablation out.
2. the PCB plate production method according to claim 1 for improving HDI plate and leading to blind hole aligning accuracy, which is characterized in that
In step S1, the diameter of the location hole is 3.2mm.
3. the PCB plate production method according to claim 1 for improving HDI plate and leading to blind hole aligning accuracy, which is characterized in that
In step S1, including specific steps S1.1 and step S1.2:
Step S1.1: cylinder is gone out by laser-induced thermal etching；
Step S1.2: it removes cylinder and obtains location hole.
4. the PCB plate production method according to claim 1 for improving HDI plate and leading to blind hole aligning accuracy, which is characterized in that
In step S2, including specific steps S2.1:
Step S2.1: by with positioning the consistent locating pin auxiliary positioning of bore dia.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810891186.2A CN108966501B (en) | 2018-08-03 | 2018-08-03 | PCB manufacturing method for improving HDI board through blind hole alignment precision |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810891186.2A CN108966501B (en) | 2018-08-03 | 2018-08-03 | PCB manufacturing method for improving HDI board through blind hole alignment precision |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108966501A true CN108966501A (en) | 2018-12-07 |
| CN108966501B CN108966501B (en) | 2020-05-26 |
Family
ID=64468446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810891186.2A Active CN108966501B (en) | 2018-08-03 | 2018-08-03 | PCB manufacturing method for improving HDI board through blind hole alignment precision |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108966501B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191598A (en) * | 2019-06-12 | 2019-08-30 | 景旺电子科技(龙川)有限公司 | A kind of multiple-plate manufacturing technique method of FPC |
| CN111006588A (en) * | 2019-12-25 | 2020-04-14 | 深圳市明信测试设备有限公司 | Test fixture and detection method for detecting PCBA (printed circuit board assembly) board by using laser sensor |
| CN111644754A (en) * | 2020-05-22 | 2020-09-11 | 中国科学院西安光学精密机械研究所 | High-precision laminated grating unit and preparation method thereof |
| CN111885834A (en) * | 2020-08-03 | 2020-11-03 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of 5G high-frequency board with interlayer accurate alignment |
| CN113369719A (en) * | 2021-05-14 | 2021-09-10 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
| CN115243452A (en) * | 2022-07-23 | 2022-10-25 | 常州澳弘电子股份有限公司 | Blind hole plugging process for HDI board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040118602A1 (en) * | 2002-12-24 | 2004-06-24 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board with embedded capacitors and manufacturing method thereof |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| CN103096855A (en) * | 2010-03-11 | 2013-05-08 | 宝洁公司 | Process for making an embossed web |
| CN106413287A (en) * | 2016-05-27 | 2017-02-15 | 胜宏科技（惠州）股份有限公司 | HDI through and blind hole electroplating method |
-
2018
- 2018-08-03 CN CN201810891186.2A patent/CN108966501B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040118602A1 (en) * | 2002-12-24 | 2004-06-24 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board with embedded capacitors and manufacturing method thereof |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| CN103096855A (en) * | 2010-03-11 | 2013-05-08 | 宝洁公司 | Process for making an embossed web |
| CN106413287A (en) * | 2016-05-27 | 2017-02-15 | 胜宏科技（惠州）股份有限公司 | HDI through and blind hole electroplating method |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191598A (en) * | 2019-06-12 | 2019-08-30 | 景旺电子科技(龙川)有限公司 | A kind of multiple-plate manufacturing technique method of FPC |
| CN111006588A (en) * | 2019-12-25 | 2020-04-14 | 深圳市明信测试设备有限公司 | Test fixture and detection method for detecting PCBA (printed circuit board assembly) board by using laser sensor |
| CN111644754A (en) * | 2020-05-22 | 2020-09-11 | 中国科学院西安光学精密机械研究所 | High-precision laminated grating unit and preparation method thereof |
| CN111885834A (en) * | 2020-08-03 | 2020-11-03 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of 5G high-frequency board with interlayer accurate alignment |
| CN113369719A (en) * | 2021-05-14 | 2021-09-10 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
| CN113369719B (en) * | 2021-05-14 | 2023-01-31 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
| CN115243452A (en) * | 2022-07-23 | 2022-10-25 | 常州澳弘电子股份有限公司 | Blind hole plugging process for HDI board |
| CN115243452B (en) * | 2022-07-23 | 2023-10-03 | 常州澳弘电子股份有限公司 | Blind hole plugging process of HDI board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108966501B (en) | 2020-05-26 |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: PCB board manufacturing method for improving alignment accuracy of through blind hole of HDI board Effective date of registration: 20211103 Granted publication date: 20200526 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2021330002146 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20200526 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2021330002146 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A PCB board manufacturing method to improve the alignment accuracy of HDI board through blind holes Granted publication date: 20200526 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2024330000090 |