CN110611993B - PCB manufacturing process for heat dissipation of high-power electronic component - Google Patents
PCB manufacturing process for heat dissipation of high-power electronic component Download PDFInfo
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- CN110611993B CN110611993B CN201910821666.6A CN201910821666A CN110611993B CN 110611993 B CN110611993 B CN 110611993B CN 201910821666 A CN201910821666 A CN 201910821666A CN 110611993 B CN110611993 B CN 110611993B
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- heat
- heat conduction
- conduction channel
- manufacturing process
- prepreg
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Abstract
A PCB manufacturing process for heat dissipation of high-power electronic components comprises the following steps of sequentially laminating a copper foil, a prepreg and a heat energy transmission carrier and performing pre-pressing; heating the prepreg to enable the prepreg to flow after being heated to serve as glue to bond the heat energy transmission carrier and the copper foil; etching the copper foil to form a first heat conduction channel communicated to the prepreg; injecting a solvent through the first heat conduction channel, and dissolving the prepreg until the heat energy transmission carrier is reached, so as to form a second heat conduction channel communicated with the first heat conduction channel; after the prepreg in the fourth step is completely cured, completely pressing the prepreg; and filling heat conductors in the first heat conduction channel and the second heat conduction channel through electroplating deposition until the first heat conduction channel and the second heat conduction channel are at the same height with the copper foil. The upper surface of the heat conductor and the copper foil are adjusted to be in the same plane, so that the heat conduction function is strong.
Description
Technical Field
The invention relates to the technical field of PCB processing and manufacturing equipment, in particular to a PCB manufacturing process for heat dissipation of a high-power electronic component.
Background
The manufacturing process of the heat dissipation structure of the existing high-power electronic element is mainly formed by sequentially connecting a heat sink, an aluminum substrate, heat-conducting silicone grease, a heat dissipation plate and the like, and the high-power electronic element is connected with the aluminum substrate through the heat sink. The aluminum substrate is generally formed by sequentially overlapping a protective oil layer, a copper foil layer, an insulating layer and an aluminum plate layer, wherein the insulating layer plays a good and effective positive role in insulation, but also produces a negative heat insulation effect, and heat generated by the high-power electronic element cannot be rapidly led out in time, so that the service life of the high-power electronic element is greatly influenced. Therefore, it is necessary to innovate the existing manufacturing process and effectively solve the heat dissipation problem of the high-power electronic component.
Disclosure of Invention
The invention aims to provide a PCB manufacturing process for heat dissipation of a high-power electronic component, and solves the problem of poor heat dissipation of the existing PCB manufacturing process.
The technical solution of the invention is as follows: a PCB manufacturing process for heat dissipation of high-power electronic components comprises the following steps,
sequentially laminating a copper foil, a prepreg and a heat energy transmission carrier and performing pre-pressing;
heating the prepreg to enable the prepreg to flow after being heated to serve as glue to bond the heat energy transmission carrier and the copper foil;
etching the copper foil to form a first heat conduction channel communicated to the prepreg on the copper foil;
injecting a solvent through the first heat conduction channel, and dissolving the prepreg which is not completely cured in the third step until the heat energy transmission carrier, so as to form a second heat conduction channel communicated with the first heat conduction channel;
step five, after the prepreg in the step four is completely cured, completely pressing the prepreg;
and sixthly, filling heat conductors in the first heat conduction channel and the second heat conduction channel through electroplating deposition until the first heat conduction channel and the second heat conduction channel are at the same height with the copper foil.
Preferably, the first heat conduction channel is cylindrical.
Preferably, the solvent in the fourth step is acetone, and the acetone is injected into the first heat conduction channel by dropping.
Preferably, the second heat conduction channel is cylindrical.
Preferably, the solvent in the fourth step is acetone, and the acetone is injected into the first heat conducting channel by means of spraying.
Preferably, the solvent is sprayed around the axial axis of the first heat conducting channel.
Preferably, the depth of the first heat conduction channel is H, the radius of the bottom surface of the first heat conduction channel is R, and the included angle between the spraying direction of the solvent and the axial axis of the first heat conduction channel is a, where 0< a < arctan (R/H).
Preferably, the second heat conduction channel is in a truncated cone shape.
Preferably, the heat conductor is copper.
Preferably, the thermal energy transfer carrier is metallic copper.
The invention has the beneficial effects that:
according to the manufacturing process, the first heat conduction channel and the second heat conduction channel are respectively arranged on the copper foil and the prepreg, and the heat conductors are filled in the first heat conduction channel and the second heat conduction channel in an electroplating mode, so that the upper surface of the heat conductor and the copper foil are adjusted to be the same plane, the heat dissipation structure obtained by the manufacturing process can rapidly guide heat generated by the high-power electronic element to the heat energy transmission carrier through the heat conductors, and the heat conduction and heat dissipation functions of the heat dissipation structure are greatly enhanced.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic illustration of the present invention after electroplating deposition;
FIG. 3 is a schematic structural diagram of the second embodiment;
FIG. 4 is a schematic illustration of a second embodiment after electroplating deposition;
Detailed Description
The invention is further illustrated by the following examples in connection with the accompanying drawings.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
In a first embodiment, as shown in fig. 1 and fig. 2, a PCB manufacturing process for dissipating heat of a high-power electronic component includes the following steps,
sequentially laminating a copper foil 1, a prepreg 2 and a heat energy transmission carrier 3 and performing pre-pressing;
step two, heating the prepreg 2 to enable the prepreg 2 to flow after being heated to serve as glue to bond the heat energy transmission carrier 3 and the copper foil 1;
etching the copper foil 1 to form a first heat conduction channel 101 communicated to the prepreg 2 on the copper foil 1;
step four, injecting a solvent through the first heat conduction channel 101, and dissolving the prepreg 2 which is not completely cured in the step three until the heat energy transmission carrier 3, so as to form a second heat conduction channel 201 communicated with the first heat conduction channel 101;
step five, after the prepreg 2 in the step four is completely cured, completely pressing;
and sixthly, filling the first heat conduction channel 101 and the second heat conduction channel 201 with a heat conductor 4 through electroplating deposition until the first heat conduction channel and the second heat conduction channel are at the same height with the copper foil 1, welding the heat conductor 4 with the bottom of the high-power electronic component, and connecting the bottom of the high-power electronic component with the heat conductor 4 by adjusting the upper surface of the heat conductor 4 and the copper foil 1 to be in the same plane, so that heat generated by the high-power electronic component can be quickly guided to the heat energy transmission carrier 3 through the heat conductor 4, and the heat conduction and heat dissipation functions of the high-power electronic component are greatly enhanced.
Preferably, the first heat conduction channel 101 is cylindrical, the solvent in the fourth step is acetone, the acetone is injected into the first heat conduction channel 101 in a dropping mode, and the second heat conduction channel 201 is cylindrical, so that the shape formed by combining the first heat conduction channel 101 and the second heat conduction channel 201 can form a cylinder, heat generated by the high-power electronic component is quickly guided to the heat energy transmission carrier 3, and the heat conduction efficiency is improved.
Preferably, the heat conductor 4 is copper.
Preferably, the thermal energy transport carrier 3 is metallic copper.
In a second embodiment, as shown in fig. 3 and 4, a PCB manufacturing process for dissipating heat of a high-power electronic component includes the following steps,
sequentially laminating a copper foil 1, a prepreg 2 and a heat energy transmission carrier 3 and performing pre-pressing;
step two, heating the prepreg 2 to enable the prepreg 2 to flow after being heated to serve as glue to bond the heat energy transmission carrier 3 and the copper foil 1;
etching the copper foil 1 to form a first heat conduction channel 101 communicated to the prepreg 2 on the copper foil 1;
step four, injecting a solvent through the first heat conduction channel 101, and dissolving the prepreg 2 which is not completely cured in the step three until the heat energy transmission carrier 3, so as to form a second heat conduction channel 201 communicated with the first heat conduction channel 101;
step five, after the prepreg 2 in the step four is completely cured, completely pressing;
and sixthly, filling the first heat conduction channel 101 and the second heat conduction channel 201 with a heat conductor 4 through electroplating deposition until the first heat conduction channel and the second heat conduction channel are at the same height with the copper foil 1, welding the heat conductor 4 with the bottom of the high-power electronic component, and connecting the bottom of the high-power electronic component with the heat conductor 4 by adjusting the upper surface of the heat conductor 4 and the copper foil 1 to be in the same plane, so that heat generated by the high-power electronic component can be quickly guided to the heat energy transmission carrier 3 through the heat conductor 4, and the heat conduction and heat dissipation functions of the high-power electronic component are greatly enhanced. .
Preferably, the first heat conducting channel 101 is cylindrical, the solvent in the fourth step is acetone, the acetone is injected into the first heat conducting channel 101 in a spraying manner, the solvent is sprayed around the axial axis of the first heat conducting channel 101, the depth of the first heat conducting channel 101 is H, the radius of the bottom surface of the first heat conducting channel 101 is R, and the included angle between the spraying direction of the solvent and the axial axis of the first heat conducting channel 101 is a, where 0< a < arctan (R/H), and the second heat conducting channel 201 is in a circular truncated cone shape, so that the shape formed by combining the first heat conducting channel 101 and the second heat conducting channel 201 forms a horn shape, heat generated by the high-power electronic component is rapidly diffused to the heat energy transmission carrier 3, and the heat conducting efficiency is improved.
Preferably, the heat conductor 4 is copper.
Preferably, the thermal energy transport carrier 3 is metallic copper.
Claims (8)
1. A PCB manufacturing process for heat dissipation of high-power electronic components is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
sequentially laminating a copper foil (1), a prepreg (2) and a heat energy transmission carrier (3) and performing pre-pressing;
step two, heating the prepreg (2) to enable the prepreg (2) to flow after being heated to serve as glue to bond the heat energy transmission carrier (3) and the copper foil (1);
etching the copper foil (1) to form a first heat conduction channel (101) communicated to the prepreg (2) on the copper foil (1);
step four, injecting a solvent through the first heat conduction channel (101), and dissolving the prepreg (2) which is not completely cured in the step three until the heat energy transmission carrier (3) so as to form a second heat conduction channel (201) communicated with the first heat conduction channel (101), wherein the solvent is acetone, and is injected into the first heat conduction channel (101) in a dropping or spraying manner;
step five, after the prepreg (2) in the step four is completely cured, completely pressing;
and sixthly, filling a heat conductor (4) in the first heat conduction channel (101) and the second heat conduction channel (201) through electroplating deposition until the first heat conduction channel and the second heat conduction channel are at the same height with the copper foil (1).
2. The PCB manufacturing process for heat dissipation of high-power electronic components as claimed in claim 1, wherein the PCB manufacturing process comprises the following steps: the first heat conducting channel (101) is cylindrical.
3. The PCB manufacturing process for heat dissipation of high-power electronic components as claimed in claim 1, wherein the PCB manufacturing process comprises the following steps: the second heat conducting channel (201) is cylindrical.
4. The PCB manufacturing process for heat dissipation of high-power electronic components as claimed in claim 1, wherein the PCB manufacturing process comprises the following steps: the solvent is sprayed around along the axial axis of the first heat conducting channel (101).
5. The PCB manufacturing process for heat dissipation of high-power electronic components as claimed in claim 1, wherein the PCB manufacturing process comprises the following steps: the depth of the first heat conduction channel (101) is H, the radius of the bottom surface of the first heat conduction channel (101) is R, the included angle between the spraying direction of the solvent and the axial axis of the first heat conduction channel (101) is a, and a is more than 0 and less than arctan (R/H).
6. The PCB manufacturing process for heat dissipation of high-power electronic components as claimed in claim 1, wherein the PCB manufacturing process comprises the following steps: the second heat conduction channel (201) is in a circular truncated cone shape.
7. The PCB manufacturing process for heat dissipation of high-power electronic components as claimed in claim 1, wherein the PCB manufacturing process comprises the following steps: the heat conductor (4) is made of copper.
8. The PCB manufacturing process for heat dissipation of high-power electronic components as claimed in claim 1, wherein the PCB manufacturing process comprises the following steps: the heat energy transmission carrier (3) is made of metal copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910821666.6A CN110611993B (en) | 2019-09-02 | 2019-09-02 | PCB manufacturing process for heat dissipation of high-power electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910821666.6A CN110611993B (en) | 2019-09-02 | 2019-09-02 | PCB manufacturing process for heat dissipation of high-power electronic component |
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| Publication Number | Publication Date |
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| CN110611993A CN110611993A (en) | 2019-12-24 |
| CN110611993B true CN110611993B (en) | 2021-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910821666.6A Active CN110611993B (en) | 2019-09-02 | 2019-09-02 | PCB manufacturing process for heat dissipation of high-power electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20110024686A (en) * | 2009-09-03 | 2011-03-09 | 안복만 | Heat dissipating circuit board and method for manufacturing the same |
| CN201878420U (en) * | 2010-11-09 | 2011-06-22 | 深圳市富翔科技有限公司 | Radiating PCB (printed circuit board) structure |
| CN103079364B (en) * | 2012-12-27 | 2015-09-16 | 深圳市五株科技股份有限公司 | A kind of manufacture craft of local pressing copper billet height heat radiating metal base circuit board |
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