KR20110024686A

KR20110024686A - Heat dissipating circuit board and method for manufacturing the same

Info

Publication number: KR20110024686A
Application number: KR1020090082791A
Authority: KR
Inventors: 안복만
Original assignee: 안복만
Priority date: 2009-09-03
Filing date: 2009-09-03
Publication date: 2011-03-09

Abstract

The present invention relates to a heat dissipation substrate and a method of manufacturing the same, and in particular, the present invention relates to a heat transfer passage formed through a conductive layer and an insulating layer on which a heat generating element is mounted, The filling material filled in the heat transfer passage allows the heat generated from the heat generating element to be more efficiently transferred to the heat sink, thereby releasing the heat of the heat generating element sufficiently and quickly. It can be made to adhere to a conductive layer, and can improve adhesiveness with a heat generating element.

Description

Heat dissipation substrate and its manufacturing method {HEAT DISSIPATING CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a heat dissipation substrate and a method of manufacturing the same, and more particularly, to a heat dissipation substrate having a heat dissipation plate for cooling the heat generating element and a method of manufacturing the same.

In general, the heat dissipation substrate has a single layer structure or a multilayer structure, and the heat generating elements are mounted according to the designed circuit pattern.

Heat generating devices such as light emitting diodes mounted on a heat dissipation substrate are becoming smaller and smaller while improving their performance. This means more heat is released on the surface area, which is constantly shrinking.

Conventionally, the heat of the heating element is released to the outside by using various heat radiating means. These heat radiating means is basically a method of naturally cooling by attaching a heat sink to the heat generating element, or by using a method of forced cooling by installing a cooling fan together with the heat sink.

However, in recent years, all electronic devices have been miniaturized, but since heat sinks must be installed for heat dissipation, the size of the heat sink does not minimize the overall size and does not sufficiently dissipate heat from the heat sink. Because of the poor heat dissipation performance and heat dissipation speed.

One aspect of the present invention provides a heat dissipation substrate capable of slimming the heat dissipation substrate while sufficiently and rapidly dissipating heat generated from a heat generating element mounted on the heat dissipation substrate, and a method of manufacturing the same.

To this end, a heat dissipation substrate according to an embodiment of the present invention includes a conductive layer on which a heat generating element is mounted, a heat dissipating plate dissipating heat generated by the heat generating element, an insulating layer provided between the conductive layer and the heat dissipating plate, and the heat generating element. A heat transfer passage formed through the conductive layer and the insulating layer so that heat generated by the heat transfer to the heat sink, and a filler filled in the heat transfer passage to bring the heating element into close contact with the conductive layer. .

The plurality of heat transfer paths, and the filler comprises a thermally conductive resin.

The heat transfer path may be disposed at regular intervals or in a plurality of groups in an area in which the heat generating element is mounted on the conductive layer.

In addition, the method for manufacturing a heat dissipation substrate according to an embodiment of the present invention provides a heat dissipation plate for heat dissipation, an insulating layer is formed on the heat dissipation plate, a conductive layer on which the heating element is mounted is formed on the insulating layer, and Forming a plurality of heat transfer passages through the conductive layer and the insulating layer, and filling fillers in the plurality of heat transfer passages so that the heat generating element is in close contact with the conductive layer.

The plurality of heat transfer paths may be formed to be arranged at regular intervals in an area in which the heat generating element is mounted in the conductive layer, or may be formed to be arranged in a plurality of groups.

According to the embodiment of the present invention described above, a heat transfer passage is formed through the conductive layer and the insulation layer on which the heat generating element is mounted, in the heat transfer substrate on which the heat sink, the insulation layer, and the conductive layer are stacked. The heat dissipation efficiency may be improved by filling the filler and effectively transferring heat generated by the heat generating element to the heat sink, thereby rapidly dissipating heat.

In addition, according to the embodiment of the present invention, the heating element can be in close contact with the conductive layer by the filler filled in the heat transfer passage can improve the adhesion with the heating element.

In addition, according to an embodiment of the present invention, the heat transfer substrate and the filler filled in the heat transfer passage can effectively transfer the heat generated by the heat generating element to the heat sink to reduce the thickness of the heat sink such as heat sink substrate It can be manufactured slim.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a cross-sectional view of a heat radiation board according to an embodiment of the present invention.

As shown in FIG. 1, the heat dissipation substrate 10 according to the embodiment of the present invention includes a heat dissipation plate 11, an insulating layer 12, and a conductive layer 13.

The heat sink 11 receives heat generated from the heat generating element 20 mounted on the conductive layer 13 and discharges the heat to the side and the rear surface. The heat sink 11 is made of a heat conductive metal having high heat dissipation capability, for example, copper.

An insulating layer 12 is formed on the upper surface of the heat sink 11. The insulating layer 12 serves to electrically insulate the heat sink 11 and the conductive layer 13.

The material of the insulating layer 12 is made of glass fiber reinforced epoxy resin or glass fiber reinforced polyimide resin, thermally conductive resin, or the like.

The conductive layer 13 is formed on the insulating layer 12. The heat generating element 20 is mounted on the conductive layer 13. This conductive layer 13 consists of copper, for example.

The conductive layer 13 penetrates the conductive layer 13 and the insulating layer 12 so that the heating element 20 and the heat sink 11 can communicate with each other at a position corresponding to the region where the heating element 20 is mounted. A heat transfer path 14 is formed. Since the heat generated by the heat generating element 20 is transferred to the heat sink 11 immediately without passing through the conductive layer 13 and the insulating layer 12 by the heat transfer passage 14, the heat transfer is effectively performed and the heat sink 11 ) Can quickly release more heat.

The heat transfer passage 14 is densely arranged in a form in which the heat generating element 20 is mounted on the conductive layer 13 at a predetermined interval. In addition, the heat transfer passage 14 may be arranged in a plurality of groups locally in some cases without having to be arranged at regular intervals throughout the region in which the heat generating element 20 is mounted on the conductive layer 13. .

The heat transfer passage 14 is filled with a filler 15. The heat generated by the heat generating element 20 mounted on the conductive layer 13 to the filler 15 filled in the heat transfer path 14 can effectively heat transfer to the heat sink 11 as well as the heat generating element 20 It serves to be in close contact with the conductive layer 11. As a filler, for example, a thermally conductive resin is used. At this time, the more heat transfer paths 14 filled with the filler, the more the adhesive strength of the heating element 20 in close contact with the conductive layer 13 is increased.

2 shows a manufacturing process of a heat radiation board according to an embodiment of the present invention.

As shown in FIG. 2, the manufacturing process of the heat dissipation substrate according to the embodiment of the present invention includes providing a heat dissipation plate 11 having a predetermined thickness so as to discharge heat generated by the heat generating element 20 to the outside (100). ), A process 110 of forming an insulating layer 12 on the upper surface of the heat sink 11, and a process of forming a conductive layer 13 on which the heating element 20 is mounted on the insulating layer 12 ( 120, a process 130 for forming a heat transfer path 14 for transferring heat generated by the heat generating element mounted on the conductive layer 13 to the heat sink 11, and the heat generating element 20 includes a conductive layer ( The heat dissipation substrate 10 is manufactured through the process 140 of filling the filler so as to be in close contact with each other without falling onto 12).

Hereinafter, the manufacturing process of the heat radiation board 10 according to the embodiment of the present invention having the above-described configuration will be described in detail with reference to FIGS. 3A to 3F.

3A to 3F show a manufacturing process sequence of the heat radiation board according to the embodiment of the present invention.

As shown in FIG. 3A, a heat sink 11 for dissipating heat generated by the heat generating element 20 mounted on the conductive layer 13 to the outside is provided. The heat sink 11 is made of a thermally conductive metal having a high heat dissipation capability, such as copper or aluminium.

As shown in FIG. 3B, after forming the heat sink 11, an insulating layer 12 for electrically insulating the heat sink 11 and the conductive layer 13 is formed over the top surface of the heat sink 11.

As shown in FIG. 3C, after the insulating layer 12 is formed on the top surface of the heat sink 11, the conductive layer 13 on which the heating element is mounted is formed on the insulating layer 12. The conductive layer 13 is made of a conductive material such as copper.

As shown in FIG. 3D, the conductive layer 13 is formed on the insulating layer 12, and then the heating element 20 and the heating element 20 are positioned at a position corresponding to the region where the heating element 20 is mounted on the conductive layer 13. A plurality of heat transfer paths 14 penetrating the conductive layer 13 and the insulating layer 12 are formed to allow the heat sink 11 to communicate with each other.

Since the heat transfer path 14 is formed through the conductive layer 13 and the insulating layer, the heat generated by the heat generating element 20 does not pass through the conductive layer 13 and the insulating layer 12 immediately without a heat sink ( 11) is delivered. Accordingly, a larger amount of heat can be quickly released through the heat sink 11.

As described above, the heat transfer passage 14 is densely arranged in a form in which the heat generating element 20 is mounted on the conductive layer 13 at regular intervals or arranged in a plurality of groups locally.

The heat transfer path 14 may be formed by drilling, or by forming a hole through a process such as exposure, development, and etching.

As shown in FIG. 3E, after the heat transfer passage 14 is formed, the filler 15 is filled in the heat transfer passage 14 such that the heating element 20 is in close contact with the conductive layer 13. The heat generating element 20 is attracted to the conductive layer 11 by the filler 15 filled in the heat transfer path 14 and is in close contact with the conductive layer 11. As a result, the strength of the heating element being in close contact with the conductive layer 13 may be improved to effectively prevent the heating element 20 from falling apart from the conductive layer 13 or openings due to various influences such as external impact.

As shown in FIG. 3F, after the filler 15 is filled in the heat transfer path 14, the conductive layer 13 is subjected to a soldering process such as cream soldering, and then the heating device 20 is mounted on the heat dissipation substrate 10. Will be.

4 shows a completed state of the heat radiation board according to the embodiment of the present invention.

As shown in FIG. 4, a heat generating element 20 is mounted on the heat dissipation substrate 10 according to the embodiment of the present invention. The heating element 20 is mounted on the heat dissipation substrate 10 through a soldering process such as cream soldering.

1 is a schematic configuration diagram of a heat radiation board according to an embodiment of the present invention.

2 is a control flowchart of a manufacturing method of a heat radiation board according to an embodiment of the present invention.

3A to 3F are views illustrating a manufacturing process of a heat radiation board according to an embodiment of the present invention.

4 is a view showing a completed state of the heat radiation board according to an embodiment of the present invention.

[Description of the Reference Numerals]

10: heat sink 11: heat sink

12: insulating layer 13: conductive layer

14: heat transfer path 15: filler

20: heating element

Claims

A conductive layer on which a heating element is mounted;

A heat sink for dissipating heat generated by the heat generating element;

An insulating layer provided between the conductive layer and the heat sink;

Filler which fills the heat transfer passage and the heat transfer passage formed through the conductive layer and the insulating layer to heat the heat generated by the heat generating element to the heat sink, and the heat generating element is in close contact with the conductive layer Radiating substrate comprising a.

The method of claim 1,

The heat transfer substrate comprising a plurality of the heat transfer passage, the filler is a thermally conductive resin.

The method of claim 2,

The heat transfer path is a heat dissipation substrate comprising a plurality of groups or are arranged at regular intervals in the area in which the heating element is mounted on the conductive layer.

Providing a heat sink for heat dissipation;

Forming an insulating layer on the heat sink;

Forming a conductive layer on which the heating element is mounted;

Forming a plurality of heat transfer passages through the conductive layer and the insulating layer;

And filling a filler into the plurality of heat transfer passages so that the heat generating element is in close contact with the conductive layer.

The method of claim 4, wherein

And the plurality of heat transfer passages are formed to be arranged at regular intervals in an area in which the heat generating element is mounted in the conductive layer, or are formed to be arranged in a plurality of groups.