CN115207645A - Manufacturing method and structure of microstrip planar array antenna - Google Patents

Manufacturing method and structure of microstrip planar array antenna Download PDF

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Publication number
CN115207645A
CN115207645A CN202210901199.XA CN202210901199A CN115207645A CN 115207645 A CN115207645 A CN 115207645A CN 202210901199 A CN202210901199 A CN 202210901199A CN 115207645 A CN115207645 A CN 115207645A
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CN
China
Prior art keywords
coaxial connector
microstrip
solder
mounting
welding
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Pending
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CN202210901199.XA
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Chinese (zh)
Inventor
赵大伟
刘升华
梁坤
王敏
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Xi'an Tianyuan Electro Optical Technology Co ltd
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Xi'an Tianyuan Electro Optical Technology Co ltd
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Application filed by Xi'an Tianyuan Electro Optical Technology Co ltd filed Critical Xi'an Tianyuan Electro Optical Technology Co ltd
Priority to CN202210901199.XA priority Critical patent/CN115207645A/en
Publication of CN115207645A publication Critical patent/CN115207645A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Waveguide Aerials (AREA)

Abstract

The invention discloses a manufacturing method and a structure of a microstrip planar array antenna. The coaxial connectors are installed in groups, and the back plate is provided with a groove and a screw hole for the installation seat; and fixing the welded connector mounting seat assembly and the microstrip plate by using a fixture, backing a soldering lug in the middle, and heating and welding in an oven. And after welding, a glue film is padded between the back plate and the micro-strip plate, the back plate and the micro-strip plate are fixed by screws and then heated in an oven, and the bonding is completed after cooling and solidification. And finally, welding the tail pin of the connector with the microstrip plate to complete the manufacture of the integral microstrip planar array antenna. The mounting base has fewer mounting holes and small accumulated error, and is convenient for mounting the connector tail needle; the mounting seat is made of aluminum and is small in size, a soldering lug with low melting point temperature is selected, and the mounting seat basically cannot deform after the mounting seat is welded with the microwave board and cooled; the back plate and the microstrip plate are bonded by adopting an adhesive film, the curing temperature of the adhesive film is much lower than the welding temperature, the material is slightly influenced, and the whole microstrip array surface cannot deform.

Description

Manufacturing method and structure of microstrip planar array antenna
Technical Field
The invention belongs to the technical field of antennas, and particularly relates to a manufacturing method of a microstrip planar array antenna.
Background
An antenna is one of indispensable components of a wireless communication system, and with the continuous development of radio technology and manufacturing technology, the requirements on the performance and size of the antenna are increasing day by day, and in recent years, microstrip array antennas are applied to various communication systems due to the characteristics of simple structure, reliability, light weight, easy conformation with a carrier, and the like. The microstrip planar array antenna assembly generally includes a microstrip plate, a coaxial connector, and a microstrip plate-fixed backplane structural component (hereinafter referred to as a backplane), and during an assembly process, the assembly and fixing method of the coaxial connector-backplane, the backplane-microstrip plate, and the microstrip plate-coaxial connector is often involved. The common method in the current industry is to fix the coaxial connector and the back plate by welding or screwing, fix the back plate and the microstrip plate by welding, and finally weld the tail pin of the coaxial connector and the microstrip plate. The position degree of the coaxial connector needs to be guaranteed by the machining precision of the corresponding mounting hole in the back plate, when the number of the coaxial connectors in the microstrip antenna is large, the accumulated error of the mounting hole positions in the back plate is increased, and the tail pin of the coaxial connector cannot be smoothly inserted into the through hole in the microstrip plate. In backplate and microstrip board welding process, welding temperature is higher usually, and the backplate material is for generally being silver-plated aluminum product, and microstrip board material is for taking the PCB board of metallic coating, and it is great when the position size of the array, high temperature welding finishes the cooling back, because the coefficient of thermal expansion of two kinds of materials is different, can lead to the position of the array to take place great deformation, influences microstrip antenna performance.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a new manufacturing process method to solve the problems of positional degree and overall structural deformation of the connector in the above background art.
In order to achieve the above object, the present invention provides a method for manufacturing a microstrip planar array antenna, comprising:
step 1, designing the structure of a fixing mode of a coaxial connector on a back plate, designing a plurality of groups of mounting seats according to the size and the number of the coaxial connectors, ensuring that a tail pin of the coaxial connector is not influenced by accumulated errors and is smoothly inserted into a through hole on a microstrip plate, and reserving a slot or a screw hole for the mounting seats in advance on the back plate;
step 2, fixing the coaxial connector and the mounting seat in a welding or screwing mode, and recording the melting point temperature of the used solder as A when the coaxial connector and the mounting seat are fixed in the welding mode;
step 3, fixing the assembly of the coaxial connector and the mounting seat with a clamping tool for the micro-strip plate, and padding a soldering lug between the assembly and the micro-strip plate, then heating and welding in an oven, wherein the temperature of the oven is B, the melting point temperature of the soldering lug is C, and the relation between the temperatures A, B and C is A > B > C;
step 4, after welding, a glue film is padded between the back plate and the microstrip plate, the curing temperature of the glue film is D, the back plate and the microstrip plate are fixed through screws and then heated in an oven, the temperature of the oven is F, and the relationship between the temperature C, D and the F is C > F > D, and after heating, cooling and curing are carried out to complete bonding;
and 5, welding the tail pin of the coaxial connector and the microstrip plate together to complete the manufacture of the integral microstrip planar array antenna.
Furthermore, the mounting seat is made of aluminum materials in advance, the surface of the mounting seat is plated with silver, and the thickness of a plating layer is 7-10 mu m.
Further, in step 2, when the coaxial connector is an SMP coaxial connector, solder wires or solder paste with a melting point of about 183-210 ℃ are used as solder for welding the coaxial connector and the mounting seat, the coaxial connector and the mounting seat are filled with the solder and then placed into an oven for heating, the oven temperature is set according to the melting point of the solder, and the heat preservation time is 15-20 minutes.
Furthermore, a solder filling ring is arranged in advance at the upper end of the mounting hole for mounting the coaxial connector, and in the step 2, the solder is filled between the coaxial connector and the mounting seat in a mode of placing the solder in the solder filling ring.
Further, in step 2, when the coaxial connector is an SMA coaxial connector, the coaxial connector and the mounting seat are fixed by screws.
Furthermore, in step 3, the soldering lug is cut according to the shape of the coaxial connector, and holes are punched around the end face of the coaxial connector to avoid short circuit between the tail pin and the non-radiation slot face of the microstrip antenna caused by the contact of the melted soldering tin with the tail pin of the connector.
The invention also provides a microstrip planar array antenna structure which comprises a back plate, a microstrip plate, coaxial connectors and mounting seats, wherein a plurality of mounting holes for mounting the coaxial connectors are formed in each mounting seat, the number of the mounting holes is required to ensure that tail pins of the coaxial connectors are smoothly inserted into through holes in the microstrip plate without being influenced by accumulated errors, the coaxial connectors are welded with the mounting seats and then welded with the microstrip plate, the back plate is bonded with the microstrip plate, slots or screw holes are reserved in the back plate for the mounting seats and used for enabling a combination of the coaxial connectors and the mounting seats to penetrate through, and the tail pins of the coaxial connectors penetrate through the through holes in the microstrip plate and are welded with the microstrip plate.
Further, the mounting seat is made of aluminum materials, the surface of the mounting seat is plated with silver, and the thickness of a plating layer is 7-10 mu m.
Furthermore, a solder filling ring is designed at the upper end of the mounting hole, and a solder wire or solder paste for welding the mounting seat and the coaxial connector is placed in the solder filling ring.
Further, the coaxial connector is an SMP coaxial connector and/or an SMA coaxial connector.
Advantageous effects
Firstly, the coaxial connectors are installed in groups, the number of holes required to be processed in the installation base is small, the accumulated error is small, the tail pins of the coaxial connectors can be easily inserted into the metalized through holes corresponding to the microstrip board, the problem of position degree is solved, and the rate of finished products is improved;
secondly, when the connector-mounting seat assembly and the microstrip plate are welded, a soldering lug with relatively low temperature is selected, and meanwhile, the aluminum mounting seat is small in size, so that the mounting seat is basically not deformed after the welding is finished and the cooling is carried out;
thirdly, the back plate and the microstrip plate are bonded by adopting the adhesive film, the curing temperature of the adhesive film is much lower than the welding temperature, the influence on the material is small, and the whole microstrip array surface cannot deform.
Drawings
Fig. 1 is a front view of the overall structure of the microstrip array antenna of the present invention.
Fig. 2 is a rear view of the overall structure of the microstrip array antenna of the present invention.
Fig. 3 is a schematic diagram of the SMP coaxial connector, the mounting seat a, the mounting seat b, and the microstrip plate of the present invention being welded together.
Fig. 4 is a schematic view of the welding of the SMA coaxial connector, the mounting base c, and the microstrip plate according to the present invention.
Fig. 5 is a schematic diagram of the bonding of the back plate and the microstrip plate.
Reference numerals
1SMP connector, 2 mounting seats a, 3 mounting seats b, 4 backboard, 5SMA connector, 6 mounting seats c, 7 microstrip board
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
Example 1
This embodiment is used to describe the manufacturing method of the microstrip planar array antenna of the present invention in detail.
The manufacturing method of the microstrip planar array antenna comprises the following steps:
step 1, designing the structure of a fixing mode of a coaxial connector on a back plate, designing a plurality of groups of mounting seats according to the size and the number of the coaxial connectors, ensuring that a tail pin of the coaxial connector is not influenced by accumulated errors and is smoothly inserted into a through hole on a microstrip plate, and reserving a slot or a screw hole for the mounting seats in advance on the back plate; the mounting seat is made of aluminum materials in advance, the surface of the mounting seat is subjected to silver plating treatment, and the thickness of a plating layer is 7-10 mu m.
Step 2, fixing the coaxial connector and the mounting seat in a welding or screwing mode, and recording the melting point temperature of the used solder as A when the coaxial connector and the mounting seat are fixed in the welding mode;
when the coaxial connector is an SMP coaxial connector, solder wires or solder paste with the melting point of about 183-210 ℃ are adopted as solder when the coaxial connector is welded with the mounting seat, the coaxial connector and the mounting seat are filled with the solder and then placed into an oven for heating, the temperature of the oven is set according to the melting point of the solder, and the coaxial connector is taken out after the welding is finished. The upper end of the mounting hole for mounting the coaxial connector is provided with a solder filling ring in advance, and the solder between the coaxial connector and the mounting seat is filled in a mode of placing the solder in the solder filling ring.
When the coaxial connector is an SMA coaxial connector, the coaxial connector and the mounting seat are fixed by screws.
Step 3, fixing the assembly of the coaxial connector and the mounting seat with a clamping tool for the micro-strip plate, and padding a soldering lug between the assembly and the micro-strip plate, then heating and welding in an oven, wherein the temperature of the oven is B, the melting point temperature of the soldering lug is C, and the relation between the temperatures A, B and C is A > B > C;
in some embodiments of the invention, the oven temperature is set to about 150 ℃, so that the heating temperature is 183 ℃ lower than the melting point of the solder when the coaxial connector is welded with the mounting seat and 130 ℃ higher than the melting point of the soldering lug on the premise of not damaging the SMP/SMA, and the welding time is 15-20 minutes.
In some embodiments of the present invention, the soldering lug should be cut according to the shape of the coaxial connector, and a hole is punched around the end surface of the coaxial connector for avoiding, so as to avoid short circuit between the tail pin and the non-radiative gap surface of the microstrip antenna caused by the contact of the soldering tin with the tail pin of the connector after melting.
And 4, after welding, padding an adhesive film between the back plate and the microstrip plate, wherein the curing temperature of the adhesive film is D, the back plate and the microstrip plate are heated in an oven after being fixed by screws, the temperature of the oven is F, and the relationship between the temperature C, D and the F is C > F > D, and cooling and curing are carried out after heating to complete bonding.
In some embodiments of the present invention, the structural adhesive film between the non-radiative gap side of the microstrip panel and the back panel is model number Redox 312, and the structural adhesive film is placed in an oven to be heated at 110 ℃ for 30 minutes and then cooled and cured.
And 5, welding the tail pin of the coaxial connector and the microstrip plate together to complete the manufacture of the integral microstrip planar array antenna.
Example 2
This embodiment is at first to the fixed mode of coaxial connector on the backplate, structurally improves, designs multiunit mount pad according to coaxial connector size and quantity, can be a set of by 3 to 8 connectors, and coaxial connector adopts the mode of welding or spiral shell dress to fix with the mount pad, reserves fluting and screw for the mount pad on the backplate. And fixing the welded connector-mounting seat assembly and the microstrip plate together by using a special tool fixture, padding a soldering lug between the connector-mounting seat assembly and the microstrip plate, selecting a soldering lug with the melting point temperature of about 140 ℃, and heating and welding in an oven. After welding, a glue film with the curing temperature of about 100 ℃ is filled between the back plate and the microstrip plate, the back plate and the microstrip plate are fixed through screws and then heated in a temperature box, and the bonding is completed after cooling and curing. And finally, welding the tail pin of the connector and the microstrip plate together to complete the manufacture of the integral microstrip planar array antenna.
Example 3
The present embodiment describes the manufacturing method of the microstrip planar array antenna in detail with specific products.
Step 1, as shown in figure 1, the mounting seat a, the mounting seat b and the mounting seat c are made of aluminum materials, the surfaces of the mounting seats are plated with silver, and the thickness of a plating layer is 7-10 microns.
And 2, fixing the coaxial connector and the mounting seat in a welding or screwing mode.
The SMP coaxial connector is assembled to the mounting seats a and b, and the upper end of the connector mounting hole of the mounting seat is designed with a solder filling ring, and solder wires or solder paste are placed in the ring, as shown in fig. 2. And (3) selecting a solder with a melting point of about 183-210 ℃, putting the solder into an oven for heating after filling, setting the temperature according to the melting point of the solder, and keeping the temperature for 15-20 minutes.
The SMA coaxial connector is fitted to the mounting block c and fixed with screws as shown in fig. 3.
Step 3, welding the assembly formed by welding and screwing in the step 2 with the microstrip plate, and padding a soldering lug between the assembly and the microstrip plate, referring to fig. 2 and 3, wherein the soldering lug can be made of a tin-bismuth material, the melting point is about 130 ℃, the assembly is fixed by using tools and then the assembly is integrally placed in an oven for heating and welding, and the specific steps are as follows:
a) The soldering lug is cut according to the shapes of the connection mounting seat a, the mounting seat b and the mounting seat c, and holes are punched around the end faces of the SMP coaxial connector and the SMA coaxial connector for avoiding, so that the short circuit between the tail pin and the non-radiation gap face of the microstrip antenna caused by the contact of soldering tin with the tail pin of the connector after melting is avoided;
b) After the mounting seat a, the mounting seat b and the mounting seat c are assembled on the non-radiation gap surface of the microstrip plate, the straightness of 1 mounting seat a and 4 mounting seats b is ensured by a tool;
c) After the mounting seat a, the mounting seat b and the mounting seat c are assembled on the non-radiation gap surface of the microstrip plate, applying pre-pressure by using a clamp, wherein the pre-pressure is ensured by a torque wrench;
d) Putting the materials into an oven for welding, wherein the temperature of the oven is set to be about 150 ℃ (under the premise of not damaging SMP/SMA, the heating temperature is 183 ℃ lower than the melting point of the welding wire and 130 ℃ higher than the melting point of the soldering lug), and the welding time is 15-20 minutes;
and 4, bonding the micro-strip plate and the back plate after welding is finished, as shown in fig. 4, padding a structural adhesive film (model number is Redox 312) between the non-radiation gap surface of the micro-strip plate and the back plate, fixing the periphery of the micro-strip plate and the back plate by using screws, pressing the middle area by using a heavy object, heating the micro-strip plate in an oven at the temperature of 110 ℃ for 30 minutes, and then cooling and curing the micro-strip plate.
And 5, welding the tail pins of the SMP coaxial connector and the SMA coaxial connector with the surfaces with the radiation gaps of the microstrip plate, and manually welding the tail pins of the connectors with the microstrip plate to ensure that the tail pins are communicated with the surfaces with the radiation gaps of the microstrip plate, wherein the consumption of soldering tin is controlled in the process to avoid excessive soldering tin from permeating into the back surface.
By the method and the process, the welding position degree of the coaxial connector and the flatness of the antenna array surface can be effectively ensured under the condition of not influencing the performance of the microstrip array antenna, and the electrical and structural design requirements of the microstrip array antenna are met.
Example 4
This embodiment is used to describe the microstrip planar array antenna structure of the present invention in detail.
The microstrip planar array antenna structure is manufactured by the method in embodiment 1, and comprises a back plate, a microstrip plate, coaxial connectors and mounting seats, wherein each mounting seat is provided with a plurality of mounting holes for mounting the coaxial connectors, the number of the mounting holes is required to ensure that tail pins of the coaxial connectors are smoothly inserted into through holes in the microstrip plate without being influenced by accumulated errors, the coaxial connectors are welded with the mounting seats and then welded with the microstrip plate, the back plate is bonded with the microstrip plate, slots or screw holes are reserved in the back plate for the mounting seats for the assembly of the coaxial connectors and the mounting seats to pass through, and the tail pins of the coaxial connectors pass through the through holes in the microstrip plate and are welded with the microstrip plate.
Wherein, the mounting seat is made of aluminum material, the surface is plated with silver, and the thickness of the plating layer is 7-10 μm.
And a solder filling ring is designed at the upper end of the mounting hole, and a solder wire or solder paste for welding the mounting seat and the coaxial connector is placed in the solder filling ring.
Wherein the coaxial connector is an SMP coaxial connector and/or an SMA coaxial connector.
The invention has the following advantages:
the coaxial connectors are installed in groups, the number of holes required to be processed in the installation seat is small, the accumulated error is small, the tail pins of the coaxial connectors can be easily inserted into the metalized through holes corresponding to the microstrip plate, the problem of position degree is solved, and the rate of finished products is improved.
According to the invention, when the connector-mounting seat assembly and the microstrip plate are welded, the soldering lug with relatively low temperature is selected, and meanwhile, the aluminum mounting seat has small size, so that the mounting seat basically cannot deform after the welding is finished and the mounting seat is cooled;
the back plate and the microstrip plate are bonded by adopting the adhesive film, the curing temperature of the adhesive film is much lower than the welding temperature, the influence on the material is small, and the whole microstrip array surface cannot deform.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalents, improvements, etc. made within the principle of the present invention are included in the scope of the present invention.

Claims (10)

1. A manufacturing method of a microstrip planar array antenna is characterized by comprising the following steps:
step 1, designing the structure of a fixing mode of a coaxial connector on a back plate, designing a plurality of groups of mounting seats according to the size and the number of the coaxial connectors, ensuring that a tail pin of the coaxial connector is not influenced by accumulated errors and is smoothly inserted into a through hole on a microstrip plate, and reserving a slot or a screw hole for the mounting seats in advance on the back plate;
step 2, fixing the coaxial connector and the mounting seat in a welding or screwing mode, and recording the melting point temperature of the used solder as A when the coaxial connector and the mounting seat are fixed in the welding mode;
step 3, fixing the assembly of the coaxial connector and the mounting seat with the microstrip plate by using a jig, padding a soldering lug between the assembly and the microstrip plate, and then heating and welding in an oven, wherein the temperature of the oven is B, the melting point temperature of the soldering lug is C, and the relation between the temperature A, B and C is A > B > C;
step 4, after welding is finished, a glue film is padded between the back plate and the microstrip board, the curing temperature of the glue film is D, the back plate and the microstrip board are heated in an oven after being fixed through screws, the temperature of the oven is F, and the relationship between the temperature C, D and F is C > F > D, and after heating, cooling and curing are carried out to finish bonding;
and 5, welding the tail pin of the coaxial connector and the microstrip plate together to complete the manufacture of the integral microstrip planar array antenna.
2. The manufacturing method according to claim 1, wherein the mount pad is previously made of aluminum material, surface-silver-plated, and the plating thickness is 7 to 10 μm.
3. The manufacturing method according to claim 1, wherein in step 2, when the coaxial connector is an SMP coaxial connector, solder wires or solder paste having a melting point of about 183 ℃ to 210 ℃ are used as solder for soldering the coaxial connector to the mounting base, the coaxial connector and the mounting base are filled with the solder and then placed in an oven for heating, the oven temperature is set according to the melting point of the solder, and the holding time is 15 to 20 minutes.
4. The manufacturing method according to claim 3, wherein a solder-filled ring is provided in advance at an upper end of the mounting hole for mounting the coaxial connector, and in step 2, solder is filled between the coaxial connector and the mounting seat by placing solder in the solder-filled ring.
5. The method of manufacturing of claim 1, wherein in step 2, when the coaxial connector is an SMA coaxial connector, the coaxial connector is secured to the mounting base with screws.
6. The manufacturing method of claim 1, wherein in step 3, the soldering lug is cut according to the shape of the coaxial connector and punched around the end face of the coaxial connector for avoiding the soldering tin from contacting the tail pin of the connector after melting, so as to prevent the tail pin from short-circuiting with the non-radiation slot face of the microstrip antenna.
7. The utility model provides a microstrip plane array antenna structure, its characterized in that includes backplate, microstrip board, coaxial connector and mount pad, sets up a plurality of mounting holes that are used for installing a plurality of coaxial connector on every mount pad, the quantity of mounting hole guarantees that coaxial connector tail needle does not receive the influence of cumulant error to insert the via hole on the microstrip board smoothly, and coaxial connector welds with the microstrip board again with the mount pad after welding, and the backplate bonds with the microstrip board, reserves fluting or screw for the mount pad on the backplate for the assembly of coaxial connector and mount pad passes, and coaxial connector's tail needle passes the via hole on the microstrip board and welds with the microstrip board.
8. The microstrip planar array antenna structure according to claim 7, wherein the mounting seat is made of aluminum, the surface is plated with silver, and the thickness of the plating layer is 7-10 μm.
9. The microstrip planar array antenna structure of claim 7, wherein the upper end of the mounting hole is designed with a solder-filled ring, and solder wires or solder paste for soldering the mounting socket and the coaxial connector are placed in the solder-filled ring.
10. The microstrip planar array antenna structure of claim 7, wherein the coaxial connector is an SMP coaxial connector and/or an SMA coaxial connector.
CN202210901199.XA 2022-07-28 2022-07-28 Manufacturing method and structure of microstrip planar array antenna Pending CN115207645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210901199.XA CN115207645A (en) 2022-07-28 2022-07-28 Manufacturing method and structure of microstrip planar array antenna

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210901199.XA CN115207645A (en) 2022-07-28 2022-07-28 Manufacturing method and structure of microstrip planar array antenna

Publications (1)

Publication Number Publication Date
CN115207645A true CN115207645A (en) 2022-10-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210901199.XA Pending CN115207645A (en) 2022-07-28 2022-07-28 Manufacturing method and structure of microstrip planar array antenna

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