CN209882257U - Adjustable device applied to sintering of microstrip circuit board - Google Patents

Adjustable device applied to sintering of microstrip circuit board Download PDF

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Publication number
CN209882257U
CN209882257U CN201920572490.0U CN201920572490U CN209882257U CN 209882257 U CN209882257 U CN 209882257U CN 201920572490 U CN201920572490 U CN 201920572490U CN 209882257 U CN209882257 U CN 209882257U
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China
Prior art keywords
circuit board
microstrip circuit
sintering
crimping piece
crimping
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CN201920572490.0U
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Chinese (zh)
Inventor
熊胜尧
李宪军
罗武
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Sichuan Jiuzhou Electric Group Co Ltd
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Sichuan Jiuzhou Electric Group Co Ltd
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Abstract

The utility model discloses a device with adjustable be applied to microstrip circuit board sintering, the device include fixed plate, support plate, crimping piece and fastener, press from both sides the microwave subassembly between fixed plate and support plate through the fastener, be provided with the screw hole that is dot matrix and arranges on the support plate, the screw hole is used for bearing the crimping piece, and the crimping piece is used to the selectivity, realizes compressing tightly the fixed of microstrip circuit board of multiple shape and size. The utility model discloses a set up the screw hole that is the dot matrix and arranges on the support plate, the selectivity uses the crimping piece, can realize compressing tightly the fixed of the microstrip circuit board of multiple shape and size. The utility model discloses a commonality is strong, bonds at microstrip circuit board with conducting resin or soldering paste in the cavity back, can adjust according to microstrip circuit board's length, width, height, fixes compressing tightly microstrip circuit from three-dimensional space.

Description

Adjustable device applied to sintering of microstrip circuit board
Technical Field
The utility model relates to an electron dress allies oneself with technical field, concretely relates to device with adjustable be applied to microstrip circuit board sintering.
Background
In recent years, as electronic devices have been reduced in size, weight, and reliability, a demand has been made for designing a unit structure such as a module and a suitable manufacturing process. The micro-assembly technology has important significance for reducing the volume and the weight of the microwave multifunctional module and meeting the requirements of miniaturization, light weight and high density of modern electronic weapon equipment. The large-area grounding sintering technology of the microstrip circuit board is an important ring in the micro-assembly technology, and the design of flexible and various convenient and easy-to-use pressing blocks for ensuring good grounding of the circuit board has important significance.
In the large-area grounding sintering technology of the microstrip circuit board, the microstrip circuit board is adhered in a cavity by conductive adhesive or soldering paste, after the adhesion is finished, a metal pressing block (which is consistent with the size and the shape of the microstrip circuit board and is higher than the depth of the cavity) which is prepared in advance is embedded in the cavity of a microwave assembly to apply pressure and compress the cavity, so that the microstrip circuit board is well contacted with the cavity, and then the microstrip circuit board is placed in a high-temperature oven at about 130 ℃ to be baked for two hours to solidify the conductive adhesive or the soldering paste. In order to ensure that the pressing block has the characteristics of high strength and high temperature resistance, an aluminum block or an iron block is generally adopted to be cast according to the appearance of the microstrip circuit board. Due to the fact that the shapes of the microstrip circuit boards are various under most conditions, the produced pressing blocks are suitable for the microstrip circuit boards tightly, and a large amount of materials are wasted. Particularly, in a scientific research stage, the number of products is small, any design problem needs to be changed into a circuit or an appearance, a processed pressing block is discarded after being used once, and the pressing block is required to be processed again after being changed in a later stage, so that the utilization rate of the pressing block is low, and the research and development cost and the research and development period are increased. Therefore, the adjustable device with flexibility, variety, convenience, good use and universality is designed to replace a pressing block, and the adjustable device has very important significance.
SUMMERY OF THE UTILITY MODEL
In order to solve the present briquetting suitability single that is used for the sintering of microstrip circuit board, the low-usage to and technical problem such as with high costs, the utility model provides a device with adjustable be applied to the sintering of microstrip circuit board, this adjustable device can the selective use crimping piece, realizes the crimping to the microstrip circuit board of multiple appearance and size, and the commonality is strong, just the utility model discloses a device with adjustable simple structure, convenient to use.
The utility model discloses a following technical scheme realizes:
the utility model provides a device with adjustable be applied to microstrip circuit board sintering, the device includes fixed plate, support plate, crimping piece and fastener, presss from both sides the microwave subassembly between fixed plate and support plate through the fastener, be provided with the screw hole that is the dot matrix and arranges on the support plate, the screw hole is used for bearing the crimping piece, and the crimping piece is pressed from both sides to the fixed of microstrip circuit board of multiple shape and size to the selectivity use, realizes compressing tightly.
The utility model discloses a set up the screw hole that is the dot matrix and arranges on the support plate, the selectivity uses the crimping piece, can realize compressing tightly the fixed of the microstrip circuit board of multiple shape and size. The utility model discloses a commonality is strong, bonds at microstrip circuit board with conducting resin or soldering paste in the cavity back, can adjust according to microstrip circuit board's length, width, height, fixes compressing tightly microstrip circuit from three-dimensional space.
Preferably, in order to facilitate installation and disassembly, the fixing plate is provided with a fastening threaded hole, the carrier plate is provided with a through hole, the fastening piece penetrates through the through hole of the carrier plate and then is connected with the fastening threaded hole of the fixing plate, and the microwave assembly is clamped between the fixing plate and the carrier plate by adjusting the fastening piece. The utility model discloses a fastener passes through fastening screw hole and through-hole, couples together fixed plate and support plate, and the microstrip subassembly of multiple appearance and size is pressed from both sides tight fixedly through adjusting the fastener can be realized.
Preferably, the depth of the crimp member through the threaded hole into the cavity of the microwave assembly is independently adjustable. The utility model discloses in, every crimping piece is independent adjustable, can realize more accurate crimping, improves the reliability and the stability of device.
Preferably, for the microstrip circuit board without the mounted components, a high-density paperboard with the same shape as the microstrip circuit board is arranged between the microstrip circuit board and the crimping piece, so that the pressure of the crimping piece is uniformly applied to the microstrip circuit board. The utility model discloses in, to the bare board that does not install components and parts, such as rogers5880 etc., the base plate is softer, has the high density cardboard of certain stress through the setting, makes the power of crimping piece evenly apply the soft base plate on, prevents that the base plate warp, guarantees that welding quality is reliable.
Preferably, for the micro-strip circuit board provided with the components, the components capable of bearing certain pressure on the circuit board are adjusted to ensure that the pressure is applied to the components; the components which can not bear pressure on the circuit board or the positions where the stress can affect the welding of the components do not need to be provided with the crimping pieces. The utility model discloses in, to the microstrip circuit board of installing components and parts, for example rogers4350B etc. in order to guarantee the reliability of device, need carry out more accurate selection and regulation to the crimping piece.
Preferably, the crimping member is a threaded rod and the fastening member is a screw.
Preferably, in order to facilitate the adjustment, the top end of the threaded rod is provided with a notch, and the threaded rod is adjusted through the notch. The utility model discloses in, the threaded rod top sets up the breach, and the screwdriver of convenient to use or other instruments are adjusted or are fastened the threaded rod.
Preferably, the diameter of the threaded hole is 1.6 mm. The utility model discloses in, the interval size between screw hole aperture size, screw hole and the screw hole all has an influence to the precision of device, and the screw hole is littleer, and the interval between the screw hole is littleer, and the device precision is high more.
The utility model discloses have following advantage and beneficial effect:
1. the utility model provides a device with adjustable, after microstrip circuit board bonds in the cavity with conducting resin or soldering paste, can adjust according to microstrip circuit board's length, width, height, come to fix the microstrip circuit from three-dimensional space and compress tightly. The utility model discloses a selective use threaded rod (selective use by the inboard threaded rod of sintering subassembly cavity), realized the crimping of microstrip circuit board in the microwave subassembly to multiple appearance and size, certain commonality has.
2. The utility model discloses an every threaded rod all can independently be adjusted, not only can use the bare board of not adorning components and parts, also can use the microstrip board that is equipped with components and parts. When the microstrip board provided with the components is pressed, the length of the threaded rod extending into the cavity can be adjusted according to the height of the component corresponding to each threaded rod, the operation is simple and convenient, and the device has certain universality.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
fig. 1 is a schematic view of the overall structure of the device of the present invention.
Fig. 2 is a schematic view of the bottom surface of the carrier plate of the present invention.
Fig. 3 is a cross-sectional view of the threaded rod of the present invention.
Fig. 4 is an overall sectional view of the adjustable device of fig. 3.
Reference numbers and corresponding part names in the drawings:
1-a fixing plate, 2-a carrier plate, 3-a crimping piece, 3-1-a crimping piece d, 4-a fastening piece, 5-a threaded hole, 6-a fastening threaded hole, 7-a through hole, 8-a microwave assembly cavity and 9-a microstrip circuit board.
Detailed Description
Hereinafter, the terms "include" or "may include" used in various embodiments of the present invention indicate the existence of the functions, operations or elements of the present invention, and do not limit the addition of one or more functions, operations or elements. Furthermore, as used in various embodiments of the present invention, the terms "comprises," "comprising," "includes," "including," "has," "having" and their derivatives are intended to refer only to the particular feature, number, step, operation, element, component, or combination of the foregoing, and should not be construed as first excluding the existence of, or adding to, one or more other features, numbers, steps, operations, elements, components, or combination of the foregoing.
In various embodiments of the present invention, the expression "or" at least one of a or/and B "includes any or all combinations of the words listed simultaneously. For example, the expression "a or B" or "at least one of a or/and B" may include a, may include B, or may include both a and B.
Expressions (such as "first", "second", and the like) used in various embodiments of the present invention may modify various constituent elements in various embodiments, but may not limit the respective constituent elements. For example, the above description does not limit the order and/or importance of the elements described. The foregoing description is for the purpose of distinguishing one element from another. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of various embodiments of the present invention.
It should be noted that: if it is described that one constituent element is "connected" to another constituent element, the first constituent element may be directly connected to the second constituent element, and a third constituent element may be "connected" between the first constituent element and the second constituent element. In contrast, when one constituent element is "directly connected" to another constituent element, it is understood that there is no third constituent element between the first constituent element and the second constituent element.
The terminology used in the various embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the various embodiments of the invention. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of the present invention belong. The terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their contextual meaning in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in various embodiments of the present invention.
To make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the following examples and drawings, and the exemplary embodiments and descriptions thereof of the present invention are only used for explaining the present invention, and are not intended as limitations of the present invention.
Example 1
The embodiment provides an adjustable device applied to sintering of a microstrip circuit board, as shown in fig. 1-2, the device comprises a fixing plate 1, a carrier plate 2, a crimping piece 3 and a fastening piece 4, a microwave assembly is clamped between the fixing plate 1 and the carrier plate 2 through the fastening piece 4, threaded holes 5 arranged in a dot matrix manner are arranged on a bottom plate of the carrier plate 2, the threaded holes 5 are used for bearing the crimping piece 3, and the crimping piece 3 is selectively used to realize the fixing and pressing of microstrip circuit boards 9 in various shapes and sizes. The microwave assembly comprises a microwave assembly cavity 8 and a microstrip circuit board 9 bonded in the cavity 8.
In this embodiment, the crimping member 3 is preferably a threaded rod, and the fastening member 4 is preferably a screw.
In this embodiment, the fixed plate 1 and the carrier plate 2 clamp the bonded microwave module by the fastening member 4. For convenient dismantlement, the fixed plate is the screw hole, and the support plate is the through-hole. The two are connected by a fastener 4, and the component to be sintered can be ensured to be tightly contacted with the carrier plate 2 by adjusting the fastener 4. The fastening piece 4 penetrates through the through hole of the carrier plate 2 and then is connected with the threaded hole of the fixing plate 1, the aperture of the through hole of the carrier plate is larger than the diameter of the fastening piece 4 and smaller than the diameter of the fastening piece head of the fastening piece 4, so that the fastening piece is prevented from falling out of the through hole, and the fastening piece can be ensured to be reliably connected with the fixing plate 1 and the carrier plate 2. The support plate 2 is used for bearing the crimping piece 3, has many threaded holes of arranging neatly on the 2 bottom surfaces of support plate, and every threaded hole can correspond and pass a crimping piece 3, and the similar dot matrix picture of threaded hole (the dot matrix picture is arranged by many pixels and constitutes, and the pixel is the minimum unit that constitutes the dot matrix picture, and the pixel is higher, and the dot matrix picture is more clear), and the threaded hole is less, and the interval between the threaded hole is less, and the device precision is higher. The crimping piece 3 can be adjusted up and down according to the height of the pressed object through the threaded hole of the carrier plate 2, namely the depth of the crimping piece extending into the cavity is adjusted. One end of the crimping piece 3 can be provided with a cross-shaped notch, so that the crimping piece 3 can be adjusted conveniently by using a screwdriver or other tools.
As shown in fig. 2, a bottom view of the carrier plate 2 is schematically shown, a circle in the figure is a threaded hole 5, in this embodiment, the threaded hole 5 is a threaded hole with a diameter of 1.6mm in national standard, and if more precision is required, a smaller threaded hole and a crimping piece can be customized. The figure is the outline of a certain microstrip circuit board to be sintered, which crimping pieces are needed according to the outline, the crimping pieces on the microstrip circuit board are needed, and the crimping pieces at other positions can be omitted.
The working principle of the adjustable device of the embodiment is as follows:
the micro-strip circuit board 9 to be sintered and the cavity 8 are cleaned and evenly coated with soldering paste or other materials which can be used for bonding the micro-strip circuit board 9, the micro-strip circuit board 9 is bonded in the cavity 8 of the microwave assembly, after the micro-strip circuit board is lightly extruded by a tool, the bottom surface of the carrier plate 2 provided with the crimping piece 3 faces the microwave assembly to be crimped, and the crimping piece on the micro-strip circuit board 9 can be ensured to be placed in the cavity.
The fixing plate 1 and the carrier plate 2 are connected by the fastening piece 4, the microwave assembly cavity 8 is clamped between the fixing plate 1 and the carrier plate 2, and after the fixing plate 1 and the carrier plate 2 are tightened by the adjusting fastening piece 4, each pressure welding piece 3 on the carrier plate 2 can be adjusted again, so that a certain pressure is applied to the pressed microstrip circuit board 8 or a component.
Example 2
Based on above-mentioned embodiment 1, this embodiment 2 provides an adjustable device, and the device considers that because of the crimping piece 3 connects the connection that belongs to local point, and there is certain space between adjacent crimping piece 3 moreover, to softer microstrip board such as rogers5880 etc. changeability, can't realize SMT automatic assembly components and parts, is bare board during the bonding. In order to reduce the damage to the flexible substrate, a high-density paperboard cushion with certain stress can be cut according to the appearance of the printed board between the bonded flexible substrate and the crimping piece, so that the force of the crimping piece is uniformly applied to the flexible substrate, the substrate is prevented from being denatured, and the reliable welding quality is ensured. For hard micro-strip boards such as rogers4350B, it is sometimes necessary to perform SMT automated assembly of components before bonding. Fig. 3 and 4 are cross-sectional views of an embodiment of this type, in which a component-equipped microstrip circuit board 9 has been glued into a cavity. a. b and c are listed three components, and all the components can bear certain pressure. The central position of the component is pressed by the crimping part 3 to the greatest extent, the crimping part 3 is adjusted, and certain pressure is applied to the component. For a component which cannot bear pressure or a place where the stress can affect the welding of the component, such as the crimping piece d on the upper side of the component c in the figure, the application of the force by the crimping piece d can affect the reliability of the component c, and the position does not need the crimping of the crimping piece d.
As shown in fig. 4, the fixing plate is connected to the carrier plate by the fastening member, the cavity of the microwave module is sandwiched between the fixing plate and the carrier plate, and after the fixing member is adjusted to tighten the fixing plate and the carrier plate, each pressing member on the carrier plate can be adjusted again to ensure that a certain pressure is applied to the pressed microstrip circuit board or component.
The utility model discloses a reasonable structural design presss from both sides the microwave subassembly or the module that the sintering is good between fixed plate and support plate through the fastener, has guaranteed the in close contact with by sintering subassembly and support plate.
The utility model discloses an at the orderly screw hole of support plate bottom surface processing range, under the condition of guaranteeing support plate intensity, for improving the utility model discloses a precision, the interval between screw hole, two screw holes should be as little as possible. Each threaded hole can correspondingly penetrate through one crimping piece, and the crimping of the micro-strip circuit board in the microwave assembly with various shapes and sizes is realized by selectively using the crimping pieces (selectively using the crimping pieces on the inner sides of the cavities of the assemblies to be sintered), so that certain universality is realized.
The utility model discloses every crimping piece all can independently be adjusted in, not only can use the bare board of not adorning components and parts, also can use the microstrip board that is equipped with components and parts. When the microstrip board provided with the components is pressed, the length of the compression joint piece extending into the cavity can be adjusted according to the height of the component corresponding to each compression joint piece, the operation is simple and convenient, and the device has certain universality.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above description is only the embodiments of the present invention, and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (7)

1. The utility model provides a be applied to adjustable device of microstrip circuit board sintering which characterized in that, the device includes fixed plate (1), support plate (2), crimping piece (3) and fastener (4), presss from both sides the microwave subassembly between fixed plate (1) and support plate (2) through fastener (4), be provided with screw hole (5) that are the dot matrix and arrange on support plate (2), screw hole (5) are used for bearing crimping piece (3), and selective use crimping piece (3) realize compressing tightly the fixed of microstrip circuit board of multiple shape and size.
2. The adjustable device applied to microstrip circuit board sintering of claim 1, wherein the fixing plate (1) is provided with a fastening threaded hole (6), the carrier plate (2) is provided with a through hole (7), the fastening member (4) penetrates through the through hole (7) of the carrier plate (2) and is connected with the fastening threaded hole (6) of the fixing plate (1), and the microwave assembly is clamped between the fixing plate (1) and the carrier plate (2) by adjusting the fastening member (4).
3. The adjustable device applied to sintering of microstrip circuit boards according to claim 1, wherein the depth of the crimping piece (3) entering the cavity of the microwave assembly through the threaded hole (5) is independently adjustable.
4. The adjustable device applied to the sintering of the microstrip circuit board as claimed in claim 1, wherein for the microstrip circuit board without mounted components, a high-density paper board with the same shape as the microstrip circuit board is arranged between the microstrip circuit board and the crimping piece (3), so that the pressure of the crimping piece (3) is uniformly applied to the microstrip circuit board.
5. The adjustable device applied to the sintering of the microstrip circuit board as claimed in claim 1, wherein for the microstrip circuit board with the components, the crimping member (3) is adjusted to ensure that the pressure is applied to the components, wherein the components on the circuit board can bear a certain pressure; the components which can not bear pressure on the circuit board or the positions where the stress can affect the welding of the components do not need to be provided with the crimping parts (3).
6. The adjustable device for sintering microstrip circuit boards according to any of claims 1-5, wherein the crimping member (3) is a threaded rod and the fastening member (4) is a screw.
7. The adjustable device for sintering microstrip circuit boards according to claim 6, wherein the threaded rod is provided with a notch at its top end, and the threaded rod is adjusted through the notch.
CN201920572490.0U 2019-04-23 2019-04-23 Adjustable device applied to sintering of microstrip circuit board Active CN209882257U (en)

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CN201920572490.0U CN209882257U (en) 2019-04-23 2019-04-23 Adjustable device applied to sintering of microstrip circuit board

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Application Number Priority Date Filing Date Title
CN201920572490.0U CN209882257U (en) 2019-04-23 2019-04-23 Adjustable device applied to sintering of microstrip circuit board

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113109692A (en) * 2021-03-31 2021-07-13 中国电子科技集团公司第十三研究所 Microstrip circuit debugging method and adjusting module
CN113629470A (en) * 2021-07-27 2021-11-09 北京无线电测量研究所 Multi-form pressure transmission device and method for micro-strip sheet brazing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113109692A (en) * 2021-03-31 2021-07-13 中国电子科技集团公司第十三研究所 Microstrip circuit debugging method and adjusting module
CN113629470A (en) * 2021-07-27 2021-11-09 北京无线电测量研究所 Multi-form pressure transmission device and method for micro-strip sheet brazing

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