CN212393058U - Pressing jig for printed circuit board - Google Patents
Pressing jig for printed circuit board Download PDFInfo
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- CN212393058U CN212393058U CN202021741745.0U CN202021741745U CN212393058U CN 212393058 U CN212393058 U CN 212393058U CN 202021741745 U CN202021741745 U CN 202021741745U CN 212393058 U CN212393058 U CN 212393058U
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- printed circuit
- circuit board
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Abstract
The utility model discloses a pressfitting tool for printed circuit board. The pressing jig for the printed circuit board comprises a bottom plate for placing the printed circuit board; and the cover plate is matched with the bottom plate and used for covering the printed circuit board, wherein the bottom plate is provided with: the first pressing column is positioned on the bottom plate; the first spring is positioned on the first pressing column; the cover plate is provided with: the second pressing column is positioned on the cover plate; the second spring is positioned on the second pressing column, and the first spring and/or the second spring are/is deformed by locking the bottom plate and the cover plate; the deformed first spring and/or the deformed second spring provide a pressing force to the printed circuit board to press the printed circuit board. According to the utility model discloses a pressfitting tool for printed circuit board adopts the spring pressfitting, and the atress uniformity is better, and the pressfitting is even, and the gas tightness after the pressfitting is good, the precision is high, and the product yield is high.
Description
Technical Field
The utility model relates to a micro-electromechanical system makes technical field, in particular to a pressfitting tool for printed circuit board.
Background
Micro-Electro-Mechanical systems (MEMS), also called Micro-Electro-Mechanical systems, microsystems, micromachines, etc., refer to high-tech devices with dimensions of a few millimeters or even smaller. Products including microelectromechanical systems often involve the lamination of printed circuit boards during the manufacturing process.
In the prior art, stacked MEMS microphones having a multi-layer PCB (Printed Circuit Board) require the multi-layer PCB to be pressed together during the production process. In the existing pressing operation, a plurality of screws around the pressing jig serve as all pressure sources, and the PCB is pressed through the locking screws, so that the whole PCB is likely to be unclosed in a large area in an area without screw locking, the pressing effect is poor, and the yield is low. In addition, when current pressfitting tool used, the screw can only lock one by one usually, and the opposite side still did not receive the force when can lead to the one end of pressfitting tool to compress tightly, and PCB pressurized unbalance, the unable inseparable closure of different PCBs can appear pressfitting off normal, gas leakage scheduling problem.
Therefore, it is desirable to have a new pressing jig for printed circuit boards, which can overcome the above problems.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, an object of the utility model is to provide a pressfitting tool for printed circuit board to improve the gas tightness of pressfitting, promote the product yield.
According to an aspect of the present invention, a pressing fixture for a printed circuit board is provided, which comprises a bottom plate for placing the printed circuit board; and the cover plate is matched with the bottom plate and used for covering the printed circuit board, wherein the bottom plate is provided with: the first pressing column is positioned on the bottom plate; and a first spring located on the first compression post; the cover plate is provided with: the second pressing column is positioned on the cover plate; and a second spring on the second compression post, wherein the first spring and/or the second spring is deformed by locking the base plate and the cover plate; the deformed first spring and/or the deformed second spring provide a pressing force to the printed circuit board to press the printed circuit board.
Preferably, the first and/or second compression columns comprise: the pressing head is used for pressing the printed circuit board; a cylinder for mounting the first spring or the second spring; and the column head is used for limiting the first compression column or the second compression column.
Preferably, the press-fit jig further includes: and the cushion block is positioned at the bottom of the bottom plate and used for adjusting the height of the pressing jig.
Preferably, the press-fit jig further includes: the lock catch is positioned on the bottom plate and used for being connected with the cover plate.
Preferably, the base plate further comprises: and the first positioning pin is positioned on the bottom plate and used for positioning the printed circuit board.
Preferably, the cover plate further includes: and the second positioning pin is positioned on the cover plate, the first positioning pin is matched with the second positioning pin, and the first positioning pin and the second positioning pin are used for positioning the base plate and the cover plate when the base plate and the cover plate are connected.
Preferably, the bottom plate comprises a plurality of the first compression posts distributed in an array; the cover plate comprises a plurality of second pressing columns distributed in an array manner, wherein the first pressing columns are matched with the second pressing columns; when in pressing, the first pressing column and the second pressing column are coaxial.
Preferably, the printed circuit board comprises a sound hole location and a non-sound hole location; the first pressing column and the second pressing column are pressed at the position of the non-sound hole.
Preferably, the base plate further comprises: the first air holes are positioned on the bottom plate and used for ventilation; and/or the cover plate further comprises: and the second air hole is positioned on the cover plate and used for ventilation.
According to the utility model discloses a pressfitting tool for printed circuit board adopts the spring pressfitting, and the atress uniformity is better, and the pressfitting is even, has promoted the gas tightness and the pressfitting precision of pressfitting, has promoted the yield of product.
According to the utility model discloses a pressfitting tool for printed circuit board all is provided with a plurality of springs that are used for providing pressfitting power in printed circuit board's upper and lower both sides, and a plurality of springs are the array and distribute, have further improved the uniformity of atress, have strengthened the effect of pressfitting.
According to the utility model discloses a pressfitting tool for printed circuit board carries out the pressfitting to printed circuit board through the pressfitting post, and the spring setting is in order to provide pressfitting power on the pressfitting post, and the application of pressfitting power is more stable, is difficult for causing the pressfitting off normal, and the pressfitting effect is better.
According to the utility model discloses a pressfitting tool for printed circuit board is provided with the locating pin and fixes a position printed circuit board to and fix a position the apron and the bottom plate of pressfitting tool when the pressfitting, the precision of pressfitting is higher, the effect of pressfitting is better.
According to the utility model discloses a pressfitting tool for printed circuit board adopts stainless steel, has better heat conductivity, is convenient for debug the backward flow curve.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
fig. 1 shows a schematic front view of a press fixture according to an embodiment of the present invention;
fig. 2 shows a schematic bottom view of a press fixture according to an embodiment of the present invention;
fig. 3 shows a schematic perspective view of a pressing jig according to an embodiment of the present invention;
fig. 4 shows a schematic front view of a base plate according to an embodiment of the invention;
fig. 5 shows a schematic bottom view of a base plate according to an embodiment of the invention;
fig. 6 shows a schematic front view of a cover plate according to an embodiment of the invention;
fig. 7 shows a schematic bottom view of a cover plate according to an embodiment of the invention;
fig. 8 shows a schematic front view of a printed circuit board according to an embodiment of the invention.
Detailed Description
Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. Moreover, certain well-known elements may not be shown in the figures.
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. Numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of components, are set forth in the following description in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
Fig. 1 shows a schematic front view of a pressing fixture according to an embodiment of the present invention. Fig. 2 shows a schematic bottom view of a pressing fixture according to an embodiment of the present invention. Fig. 3 shows a schematic perspective view of a pressing fixture according to an embodiment of the present invention. As shown in fig. 1 to 3, the pressing jig according to the embodiment of the present invention includes a bottom plate 10 and a cover plate 20. According to the utility model discloses pressfitting tool is used for printed circuit board 30's pressfitting.
Specifically, the chassis base 10 is used to place the printed circuit board 30. Optionally, the base plate 10 is provided with a spacer 101, a first spring 102, a latch 103, a first positioning pin 104 and a first press-fit column 105.
The cushion block 101 is located at the bottom of the bottom plate 10 and used for adjusting the height of the pressing jig. Optionally, the height of the pad 101 is adjustable. Optionally, the height of the pressing jig is adjusted (increased) by the pad 101 to increase the movable space of the first pressing column 105. When the pressing jig is pressed, the first pressing column 105 is not limited by the ground (where the pressing jig is placed).
The latch 103 is located on the base plate 10 for connection with the cover plate 20. Optionally, a latch 103 is located on the side of the base plate 10 for securing the cover plate 20. Optionally, the latch 103 locks the base plate 10 and the cover plate 20 after connecting the base plate 10 and the cover plate 20.
The first positioning pin 104 is located on the base plate 10 for positioning the printed circuit board 30. Optionally, the first positioning pin 104 is also used to secure the printed circuit board 30.
The first press-fit post 105 is located on the base plate 10 for press-fitting the printed circuit board 30. The first spring 102 is located on the first press-fit post 105 for providing a (first) press-fit force to (the lower surface of) the printed circuit board 30. Optionally, the first press post 105 is press fit in a non-acoustic hole location of the printed circuit board 30.
The cover plate 20 is mated with the base plate 10 for covering the printed circuit board 30. Optionally, the cover plate 20 is provided with a second spring 202, a second positioning pin 204 and a second press column 205.
The second spring 202 is disposed on the cover plate 20 for pressing the printed circuit board 30.
A second alignment pin 204 is located on the cover plate 20 for alignment of the printed circuit board 30. Optionally, the second positioning pin 204 is also used to fix the printed circuit board 30.
The second pressing column 205 is located on the cover plate 20 for pressing the printed circuit board 30. The second spring 202 is located on the second press stud 205 for providing a (second) pressing force to (the upper surface of) the printed circuit board 30. Optionally, the second press stud 205 is press fit in a non-acoustic hole location of the printed circuit board 30.
By locking the base plate 10 and the cover plate 20 to deform the first spring 102 and/or the second spring 202; the deformed first spring 102 and/or the deformed second spring 202 provide a pressing force to the printed circuit board 30 to press the printed circuit board 30. Alternatively, as shown in fig. 1, after placing the printed circuit board 30 and locking the base plate 10 and the cover plate 20, the first spring 102 and the second spring 202 are compressed; the compressed first spring 102 and the compressed second spring 202 provide a pressing force (elastic force) to the printed circuit board 30 to press the printed circuit board.
In an alternative embodiment of the present invention, the first locating pin 104 and the second locating pin 204 are mated. The first positioning pin 104 and the second positioning pin 204 are used together for positioning the base plate 10 and the cover plate 20 when they are connected (fixedly mounted). Optionally, the first compression post 105 on the base plate 10 and the second compression post 205 on the cover plate 20 are matched, i.e. when compressed, the first compression post 105 is coaxial with the second compression post 205.
In an alternative embodiment of the present invention, the first positioning pin 104 and/or the second positioning pin 204 are used to fix the printed circuit board 30. The first and/or second press- fit posts 105, 205 are used to press-fit the non-acoustic hole locations of the printed circuit board 30. The cover plate 20 is used for press-fitting the printed circuit board 30. The latch 103 is used to secure the cover plate 20. The cushion block 101 is used for increasing the height of the pressing jig. The first spring 102 and the second spring 202 are used to press-fit the printed circuit board 30. The pressing jig according to the embodiment of the utility model is applied to the pressing of the printed circuit board (three-layer structure) of the MEMS microphone, adopts the spring pressing mode, has better stress consistency and uniform pressing, and can better solve the problems of air leakage and deviation caused by the pressing of the multi-layer (three-layer) structure of the printed circuit board, thereby improving the product yield; the press fit jig is made of stainless steel, so that the press fit jig is better in importing performance relative to synthetic stone materials and convenient to debug a backflow curve.
The press fitting jig according to the embodiment comprises the base plate 10 and the cover plate 20 which are matched with each other, the first spring 102 and the second spring 202 which are used for press fitting the printed circuit board 30 are respectively arranged on the base plate 10 and the cover plate 20, the stress consistency of the spring press fitting mode is better, the press fitting is uniform, the problems of air leakage, deviation and the like caused by press fitting of the printed circuit board can be solved, and the product yield is improved.
The utility model discloses an optional embodiment, bottom plate 10 and apron 20 adopt stainless steel, have better leading-in nature for other materials (synthetic stone material etc.), are convenient for debug the backward flow curve.
Fig. 4 shows a schematic front view of a base plate according to an embodiment of the invention. Fig. 5 shows a schematic bottom view of a base plate according to an embodiment of the invention. As shown in fig. 4 and 5, the bottom plate 10 according to the embodiment of the present invention includes a pad 101, a first spring 102, a latch 103, a first positioning pin 104, a first press-fit column 105, and a first vent hole 106.
Specifically, the pad 101 is located at the bottom of the base plate 10. The spacers 101 are, for example, strip-shaped and are respectively located on two sides of the bottom plate 10. Optionally, the pad 101 is hollowed or perforated.
The first pressing columns 105 are located on the bottom plate 10, and the plurality of first pressing columns 105 are distributed in an array. The first compression post 105 is provided with a first spring 102. The first press post 105 and the first spring 102 are used to press the printed circuit board 30.
The latch 103 is located on the base plate 10 for fixed connection with the cover plate. Optionally, the latch 103 is coupled to or decoupled from at least a portion of the cover plate to enable coupling or decoupling of the base plate 10 to the cover plate. The structure of the latch 103 is not limited to the illustrated structure, and may be any type of latch structure or connection structure.
The first positioning pin 104 is located on the base plate 10 for fixing the printed circuit board 30. Optionally, the first positioning pin 104 is used for positioning of the printed circuit board 30. Optionally, a first locating pin 104 is used for locating between the base plate 10 and the top cover. Optionally, the first locating pin 104 is a fixed locating pin and/or a movable locating pin. The first alignment pin 104 may be designed according to actual requirements.
The first airing hole 106 is formed on the base plate 10 to ventilate. Optionally, the first vent hole 106 is a through hole penetrating the bottom plate 10. Optionally, the first vents 106 are distributed in an array.
In an alternative embodiment of the present invention, a plurality of through holes are provided on the bottom plate 10. A part of the through holes are used as first air holes 106; a portion of the through-hole is used to mount the first compression post 105.
Fig. 6 shows a schematic front view of a cover plate according to an embodiment of the invention. Fig. 7 shows a schematic bottom view of a cover plate according to an embodiment of the invention. As shown in fig. 6 and 7, the cover plate 20 according to an embodiment of the present invention includes a second spring 202, a second positioning pin 204, a second press-fit column 205, and a second vent 206.
The second positioning pin 204 is located on the cover plate 20 for fixing the printed circuit board 30. Optionally, a second locating pin 204 is used for locating the printed circuit board 30. Optionally, a second locating pin 204 is used for locating between the cover plate 20 and the base plate. Optionally, the second locating pin 204 is a fixed locating pin and/or a movable locating pin. The second positioning pin 204 can be designed according to actual requirements.
The second pressing columns 205 are located on the cover plate 20, and a plurality of the second pressing columns 205 are distributed in an array. The second compression post 205 is provided with a second spring 202. The second press post 205 and the second spring 202 are used to press the printed circuit board 30. Optionally, the second press stud 205 is press fit in a non-acoustic hole location of the printed circuit board 30.
The second airing hole 206 is formed on the cover plate 20 to ventilate. Optionally, the second vent 206 is a through hole penetrating the cover plate 20. Optionally, the second vents 206 are distributed in an array. In an alternative embodiment of the present invention, a plurality of through holes are provided on the cover plate 20. A part of the through holes are used as second ventilation holes 206; a portion of the through-hole is used to mount the second compression post 205.
In an alternative embodiment of the present invention, the second crimp post 205 includes a crimp head 2051, a post 2052, and a post head 2053.
The press head 2051 is used for press-fitting the printed circuit board 30. Alternatively, the bonding head 2051 may be in direct contact with the printed circuit board 30 during bonding.
The post 2052 is used to mount the second spring 202. The second spring 202 is, for example, fitted over the cylinder 2052. The post 2052 also serves as a stop for the second compression post 205 during compression.
The post head 2053 is used for limiting the second crimping post 205. The post head 2053 is also used for mounting of the second compression post 205.
The cover plate 20 is provided with a through hole for mounting the second press column 205. One end of the cylinder 2052 is connected to the press head 2051 and the other end is connected to the cylinder head 2053. The post head 2052 has a size larger than that of the through hole. As shown in fig. 6, one end of the second spring 202 is connected to the bonding head 2051, and the other end is connected to the cover plate 20. The second snap post 205 is secured to the cover plate 20 by the cooperation of the second spring 202 and the post head 2053. During the crimping process, the second crimp post 205 is displaced and the second spring 202 is compressed. The printed circuit board 30 is pressed by the second spring 202 and the second pressing column 205. Similarly, the design principle of the first spring 102 and the first press column 105 on the bottom plate 10 is the same as that of the second spring 202 and the second press column 205.
It should be noted that the above is only one embodiment of the present invention, and the connection relationship between the second spring 202, the second press column 205 and the cover plate 20 is not limited thereto. The second spring 202 is used to provide a pressing force for pressing the printed circuit board 30. The second snap post 205 is used for mounting the second spring 202. The cover plate 20 is used for mounting the second compression post 205. Optionally, the second spring 202 is located on one side of the post head 2053. During the crimping process, the second crimp post 205 is displaced and the second spring 202 is stretched. The printed circuit board 30 is pressed by the second spring 202 and the second pressing column 205.
Fig. 8 shows a schematic front view of a printed circuit board according to an embodiment of the invention. As shown in fig. 8, the printed circuit board 30 according to the embodiment of the present invention is, for example, a three-layer board structure (the present invention is not limited to a three-layer board, and may be a multilayer board), and includes a first printed circuit board 301, a second printed circuit board 302, and a third printed circuit board 303.
Specifically, the printed circuit boards 30 (the first printed circuit board 301, the second printed circuit board 302, and the third printed circuit board) to be laminated are placed on the chassis base 10. Alternatively, the printed circuit board 30 to be press-fitted is placed on the first press-fitting post 105. Optionally, the first positioning pin 104 positions the printed circuit board 30 to be bonded.
The cover plate 20 is placed on the base plate 10. Optionally, the first positioning pin 104 and the second positioning pin 204 position the cover plate 20 and the base plate 10.
And the locking buckle 103 is fixedly connected with the cover plate 20 and the bottom plate 10.
Optionally, each layer of printed circuit board (e.g., the first printed circuit board 301, the second printed circuit board 302, and the third printed circuit board 303) is surface printed with solder paste. After the printed circuit board 30 to be laminated is loaded into the lamination jig and locked by the lock 103, the solder paste is melted, combined and solidified by reflow soldering (e.g., at a high temperature of 260 ℃), so that the printed circuit boards of the respective layers are connected with each other and laminated into a whole.
The utility model discloses an in the optional embodiment, according to the utility model discloses a pressfitting tool is when using, including following step:
the method comprises the following steps: placing a printed circuit board to be pressed on a bottom plate;
and placing the printed circuit board to be pressed on the bottom plate. The printed circuit board to be laminated is, for example, a three-layer structure including three layers of printed circuit boards. And stacking the three layers of printed circuit boards according to the pressing requirement and placing the three layers of printed circuit boards on the bottom plate.
Step two: placing a cover plate on the printed circuit board to be pressed;
and placing a cover plate on the printed circuit board to be pressed. Optionally, the placing position of the cover plate is positioned by positioning columns arranged on the bottom plate and/or the cover plate.
Step three: fixedly connecting the bottom plate and the cover plate and locking.
Fixedly connecting the bottom plate and the cover plate and locking the bottom plate and the cover plate. The springs on the bottom plate and the cover plate provide pressure required by pressing for the printed circuit board to be pressed.
In an alternative embodiment of the present invention, the pressure required for pressing is applied to the non-acoustic hole position of the printed circuit board to be pressed.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. The present invention is limited only by the claims and their full scope and equivalents.
Claims (9)
1. The utility model provides a pressfitting tool for printed circuit board which characterized in that includes:
a base plate for placing the printed circuit board; and
a cover plate matched with the bottom plate and used for covering the printed circuit board,
wherein, be provided with on the bottom plate:
the first pressing column is positioned on the bottom plate; and
the first spring is positioned on the first pressing column;
the cover plate is provided with:
the second pressing column is positioned on the cover plate; and
a second spring on the second compression post,
wherein the first spring and/or the second spring is deformed by locking the base plate and the cover plate; the deformed first spring and/or the deformed second spring provide a pressing force to the printed circuit board to press the printed circuit board.
2. The lamination jig according to claim 1, wherein the first lamination column and/or the second lamination column comprises:
the pressing head is used for pressing the printed circuit board;
a cylinder for mounting the first spring or the second spring; and
and the column head is used for limiting the first compression column or the second compression column.
3. The lamination jig according to claim 1, further comprising:
and the cushion block is positioned at the bottom of the bottom plate and used for adjusting the height of the pressing jig.
4. The lamination jig according to claim 1, further comprising:
the lock catch is positioned on the bottom plate and used for being connected with the cover plate.
5. The press-fit jig according to claim 1, wherein the base plate further comprises:
and the first positioning pin is positioned on the bottom plate and used for positioning the printed circuit board.
6. The pressing jig according to claim 5, wherein the cover plate further comprises:
a second positioning pin located on the cover plate,
the first positioning pin and the second positioning pin are matched and used for positioning the bottom plate and the cover plate when the bottom plate and the cover plate are connected.
7. The pressing jig according to claim 1, wherein the base plate includes a plurality of the first pressing posts distributed in an array;
the cover plate comprises a plurality of second pressing columns distributed in an array,
the first pressing column is matched with the second pressing column; when in pressing, the first pressing column and the second pressing column are coaxial.
8. The lamination jig according to claim 1, wherein the printed circuit board includes a sound hole position and a non-sound hole position;
the first pressing column and the second pressing column are pressed at the position of the non-sound hole.
9. The press-fit jig according to claim 1, wherein the base plate further comprises:
the first air holes are positioned on the bottom plate and used for ventilation;
and/or
The cover plate further includes:
and the second air hole is positioned on the cover plate and used for ventilation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021741745.0U CN212393058U (en) | 2020-08-19 | 2020-08-19 | Pressing jig for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021741745.0U CN212393058U (en) | 2020-08-19 | 2020-08-19 | Pressing jig for printed circuit board |
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| Publication Number | Publication Date |
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| CN212393058U true CN212393058U (en) | 2021-01-22 |
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| CN202021741745.0U Active CN212393058U (en) | 2020-08-19 | 2020-08-19 | Pressing jig for printed circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113068329A (en) * | 2021-02-27 | 2021-07-02 | 深圳市磐锋精密技术有限公司 | Microphone pressure maintaining jig for Internet of things equipment and using method thereof |
| CN114080120A (en) * | 2020-08-19 | 2022-02-22 | 东莞市瑞勤电子有限公司 | Pressing jig and pressing method for printed circuit board |
-
2020
- 2020-08-19 CN CN202021741745.0U patent/CN212393058U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114080120A (en) * | 2020-08-19 | 2022-02-22 | 东莞市瑞勤电子有限公司 | Pressing jig and pressing method for printed circuit board |
| CN113068329A (en) * | 2021-02-27 | 2021-07-02 | 深圳市磐锋精密技术有限公司 | Microphone pressure maintaining jig for Internet of things equipment and using method thereof |
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