CN113811074A - Printed circuit board manufacturing method, golden finger protection method and protection structure - Google Patents
Printed circuit board manufacturing method, golden finger protection method and protection structure Download PDFInfo
- Publication number
- CN113811074A CN113811074A CN202110926516.9A CN202110926516A CN113811074A CN 113811074 A CN113811074 A CN 113811074A CN 202110926516 A CN202110926516 A CN 202110926516A CN 113811074 A CN113811074 A CN 113811074A
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- photosensitive film
- preset range
- golden
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Abstract
The invention relates to the field of printed circuit board production, aims to solve the problem that in the existing PCB manufacturing method, a gold finger is easy to scratch, so that the reject ratio is increased, and provides a printed circuit board manufacturing method, a gold finger protection method and a protection structure. The printed circuit board golden finger protection method is used after the step of golden finger dissolving, and the protection method comprises a step of film pressing, wherein a photosensitive film is pressed and attached to the printed circuit board on which the golden finger is formed; exposing the photosensitive film in a preset range on the printed circuit board to ensure that the photosensitive film in the preset range is exposed and cured; the preset range comprises a part of the range of the golden finger; and a developing step of removing the unexposed photosensitive film and reserving the exposed and cured photosensitive film within a preset range. The invention has the advantages that the gold finger can be prevented from being scratched or scratched in the subsequent operations such as forming, electrical measurement and the like, and the subsequent electrical measurement is not influenced.
Description
Technical Field
The invention relates to the field of printed circuit board production, in particular to a printed circuit board golden finger protection method, a printed circuit board golden finger protection structure and a printed circuit board manufacturing method.
Background
A gold finger of a Printed Circuit Board (PCB) is a conductive tab of the PCB for a conductive structure between the PCB and other structures.
The existing printed circuit board needs to be subjected to printed circuit board molding and electrical measurement processes after gold is dissolved to form gold fingers. However, in the forming and electrical testing processes after the gold melting process, the gold fingers are easily scratched, which increases the product defective rate and affects the product quality.
Disclosure of Invention
The invention aims to provide a printed circuit board golden finger protection method, a printed circuit board golden finger protection structure and a printed circuit board manufacturing method, and aims to solve the problem that in the existing PCB manufacturing method, a golden finger is easy to scratch, so that the reject ratio is increased.
The embodiment of the invention is realized by the following steps:
in a first aspect, an embodiment of the present application provides a method for protecting a gold finger of a printed circuit board, where after a gold plating step, the gold plating step is a gold plating process performed on the printed circuit board to form the gold finger on the printed circuit board, and the method includes:
laminating, namely laminating and attaching the photosensitive film on the printed circuit board with the golden fingers;
exposing the photosensitive film in a preset range on the printed circuit board to ensure that the photosensitive film in the preset range is exposed and cured; the preset range comprises a part of the range of the golden finger;
and a developing step of removing the unexposed photosensitive film and reserving the exposed and cured photosensitive film within a preset range.
According to the printed circuit board golden finger protection method, after the golden finger is formed through the gold melting process, the golden finger is conveniently coated and solidified with the photosensitive film as a protection layer through film pressing, exposure and development, and the golden finger can be prevented from being scratched or scratched in subsequent operations such as forming, electrical measurement and the like; meanwhile, the preset range only covers a part of the golden finger, and the left uncovered part can be used for subsequent electrical measurement.
In one possible implementation:
the golden finger comprises conducting strips which are sequentially arranged in parallel at intervals along a first direction, the conducting strips extend along a second direction, and the second direction is perpendicular to the first direction;
the preset range extends to pass through all the conductive strips in the first direction; the preset range covers 75% -85% of each conductive strip in the second direction, and the outer end of each conductive strip is located outside the preset range and is not covered by the photosensitive film.
In the scheme, the outer ends of the conductive strips of the golden finger are exposed, so that the subsequent electrical measurement step is facilitated.
In one possible implementation:
the predetermined range covers 80% of each of the conductive strips in a second direction.
In one possible implementation:
the exposure method in the exposure step comprises the following steps: irradiating the printed circuit board attached with the photosensitive film through the negative by adopting ultraviolet light; wherein, the negative plate is provided with a light transmission area corresponding to the preset range.
In one possible implementation:
and the film pressing step is realized by adopting a film pressing machine.
In a second aspect, an embodiment of the present application further provides a method for manufacturing a printed circuit board, including:
providing a substrate;
forming a circuit on a substrate;
performing a gold melting step to form a gold finger on the substrate;
after the step of gold melting, the printed circuit board gold finger protection method is carried out to protect the formed gold finger;
a molding step, namely processing the printed circuit board to enable the printed circuit board to meet the requirements of design size and geometric shape;
an electrical testing step, wherein the printed circuit board is subjected to circuit testing;
a film removing step, namely removing the cured photosensitive film within a preset range after the electrical measurement step is finished;
and an appearance inspection step, wherein the appearance of the printed circuit board is detected.
According to the printed circuit board manufacturing method, due to the adoption of the printed circuit board golden finger protection method, the produced printed circuit board golden fingers are not easily scratched or scratched, so that the yield of products can be ensured.
In one possible implementation:
the electrical measuring step uses a portion of each conductive strip having an outer end outside a predetermined range and not covered by the photosensitive film.
In one possible implementation:
and a packaging step is carried out after the appearance inspection step, and the printed circuit board is packaged.
In a third aspect, an embodiment of the present application provides a printed circuit board protection structure, which is based on the foregoing printed circuit board golden finger protection method; the printed circuit board protection structure comprises a printed circuit board with a gold finger and a photosensitive film solidified in the preset range.
The printed circuit board protection structure can protect the golden fingers of the printed circuit board in the production process, prevent the golden fingers from being scratched and ensure the yield of final printed circuit board products.
In one possible implementation:
the two sides of the printed circuit board are provided with the golden fingers and the corresponding photosensitive films.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a flow chart of a method of fabricating a printed circuit board according to an embodiment of the present application;
FIG. 2 is a diagram illustrating a structure of a printed circuit board with a gold finger protected by a photosensitive film according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of an exposure step of a method of manufacturing a printed circuit board according to an embodiment of the present application;
fig. 4 is a schematic diagram of a film laminating step of the printed circuit board manufacturing method in the embodiment of the present application.
Description of the main element symbols:
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art of printed circuit board production of the present application. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.
Some embodiments of the present application are described in detail. In the following embodiments, features of the embodiments may be combined with each other without conflict.
Examples
Referring to fig. 1, an embodiment of the present application provides a method for manufacturing a printed circuit board, including the following steps:
s1, providing a substrate;
s2, transferring the inner layer circuit pattern to the substrate;
s3, pressing, bonding the circuits into a whole;
s4, drilling to form through holes between circuit board layers to connect the layers;
s5, electroplating, namely, metallizing the through hole to electrically communicate the layers;
s6, transferring the outer layer circuit pattern to the outer layer of the board;
s7, solder mask, which is to coat a layer of solder mask on the board surface by silk-screen printing or solder mask ink coating, but expose the solder pad and the hole;
s8, dissolving gold to form a gold finger 11 on the substrate;
s100, performing a printed circuit board golden finger protection method to protect the formed golden finger 11; the method specifically comprises the following steps: a lamination step S9, an exposure step S10, and a development step S11. The film pressing step is that the photosensitive film 12 is pressed and attached on the printed circuit board 10 with the golden finger 11; the exposure step is that the photosensitive film 12 in the preset range 15 on the printed circuit board 10 is exposed, so that the photosensitive film 12 in the preset range 15 is exposed and solidified; the preset range 15 comprises a part of the range of the golden finger 11; the developing step is to remove the unexposed photosensitive film 12 and to retain the exposed and cured photosensitive film 12 within the predetermined range 15; the structure of the printed circuit board 10 when the gold finger 11 is protected by the photosensitive film 12 is shown in fig. 2; according to the printed circuit board golden finger protection method, after the golden finger 11 is formed through a gold melting process, the golden finger 11 is conveniently coated and connected with the cured photosensitive film 12 as a protection layer through film pressing, exposure and development, and the golden finger 11 can be prevented from being scratched or scratched in subsequent operations such as forming, electrical measurement and the like; at the same time, the preset range 15 covers only a part of the gold finger 11, and the left uncovered part can be used for subsequent electrical measurements. Optionally, referring to fig. 3, the exposure method in the exposure step is: irradiating the printed circuit board 10 attached with the photosensitive film 12 through the negative 14 with ultraviolet light; wherein the bottom sheet 14 has a transparent region 16 corresponding to the predetermined range 15 (the shape of the transparent region 16 is only shown schematically), and ultraviolet light can be provided by the ultraviolet lamp 13; alternatively, referring to fig. 4, the film pressing step is implemented by using a film pressing machine 17;
s12, forming and processing the printed circuit board 10 to make it meet the requirements of design size and geometric shape;
s13, electrical measurement, wherein the circuit test is carried out on the printed circuit board 10;
s14, removing the film, and removing the cured photosensitive film 12 in the preset range 15 after the electrical measurement step is finished;
and S15, appearance inspection, wherein the appearance of the printed circuit board 10 is detected.
Alternatively, the packaging step S16 is performed after the appearance inspection step to package the printed circuit board 10.
Because the printed circuit board manufacturing method adopts the printed circuit board golden finger protection method, the flying golden fingers 11 of the produced printed circuit board 10 are not easily scratched or scratched, and thus the yield of products can be ensured.
In this embodiment, optionally, the gold finger 11 includes conductive strips 19 sequentially arranged in parallel at intervals along a first direction 18, where the conductive strips 19 extend along a second direction 20, and the second direction 20 is perpendicular to the first direction 18; the predetermined range 15 extends in the first direction 18 to pass through all the conductive strips 19; the predetermined range 15 covers 75% -85% of each conductive strip 19 in the second direction 20, and the outer end 21 of each conductive strip 19 is located outside the predetermined range 15 and is not covered by the photosensitive film 12. Optionally, the predetermined range 15 covers 80% of each of the conductive strips 19 in the second direction 20. The electrical measurement step employs the portion of each conductive strip 19 that is outside the predetermined range 15 and not covered by the photosensitive film 12 at its outer end 21.
In this embodiment, the outer ends 21 of the conductive strips 19 of the golden finger 11 are exposed for the following electrical measurement steps. Covering nearly 80%, a large part of the gold finger 11 can be protected, while the remaining about 20% can be used for electrical measurements.
In this embodiment, the inner and outer layers form a multi-layer circuit on the substrate, and for some single layer circuit printed circuit boards 10, the inner layer circuit may not be formed.
With reference to fig. 2, an embodiment of the present application provides a printed circuit board protection structure, which is based on the foregoing printed circuit board golden finger protection method; the printed circuit board protection structure comprises a printed circuit board 10 with gold fingers 11 and a photosensitive film 12 solidified in the preset range 15.
The printed circuit board protection structure can protect the golden fingers 11 of the printed circuit board 10 in the production process, prevent the golden fingers 11 from being scratched, and ensure the yield of final printed circuit board 10 products.
For a printed circuit board 10 with double-sided gold fingers 11, the gold fingers 11 and the corresponding photosensitive films 12 are arranged on two sides of the printed circuit board 10.
Although the present application has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.
Claims (10)
1. A printed circuit board golden finger protection method is used after a golden step, the golden step is a golden process carried out on a printed circuit board so as to form golden fingers on the printed circuit board, and the protection method comprises the following steps:
laminating, namely laminating and attaching the photosensitive film on the printed circuit board with the golden fingers;
exposing the photosensitive film in a preset range on the printed circuit board to ensure that the photosensitive film in the preset range is exposed and cured; the preset range comprises a part of the range of the golden finger;
and a developing step of removing the unexposed photosensitive film and reserving the exposed and cured photosensitive film within a preset range.
2. The printed circuit board golden finger protection method of claim 1, characterized in that:
the golden finger comprises conducting strips which are sequentially arranged in parallel at intervals along a first direction, the conducting strips extend along a second direction, and the second direction is perpendicular to the first direction;
the preset range extends to pass through all the conductive strips in the first direction; the preset range covers 75% -85% of each conductive strip in the second direction, and the outer end of each conductive strip is located outside the preset range and is not covered by the photosensitive film.
3. The printed circuit board golden finger protection method of claim 2, characterized in that:
the predetermined range covers 80% of each of the conductive strips in a second direction.
4. The printed circuit board golden finger protection method of claim 1, characterized in that:
the exposure method in the exposure step comprises the following steps: irradiating the printed circuit board attached with the photosensitive film through the negative by adopting ultraviolet light; wherein, the negative plate is provided with a light transmission area corresponding to the preset range.
5. The printed circuit board golden finger protection method of claim 1, characterized in that:
and the film pressing step is realized by adopting a film pressing machine.
6. A method for manufacturing a printed circuit board is characterized by comprising the following steps:
providing a substrate;
forming a circuit on a substrate;
performing a gold melting step to form a gold finger on the substrate;
after the gold melting step, carrying out the printed circuit board gold finger protection method of any one of claims 1-5 to protect the formed gold finger;
a molding step, namely processing the printed circuit board to enable the printed circuit board to meet the requirements of design size and geometric shape;
an electrical testing step, wherein the printed circuit board is subjected to circuit testing;
a film removing step, namely removing the cured photosensitive film within a preset range after the electrical measurement step is finished;
and an appearance inspection step, wherein the appearance of the printed circuit board is detected.
7. The printed circuit board manufacturing method according to claim 6, wherein:
the electrical measuring step uses a portion of each conductive strip having an outer end outside a predetermined range and not covered by the photosensitive film.
8. The printed circuit board manufacturing method according to claim 6, wherein:
and a packaging step is carried out after the appearance inspection step, and the printed circuit board is packaged.
9. A printed circuit board golden finger protection structure, which is based on the printed circuit board golden finger protection method of any one of claims 1 to 5; the printed circuit board protection structure includes:
the printed circuit board with the golden fingers and the photosensitive film solidified in the preset range.
10. A printed circuit board gold finger protection structure according to claim 9 wherein:
the two sides of the printed circuit board are provided with the golden fingers and the corresponding photosensitive films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110926516.9A CN113811074A (en) | 2021-08-12 | 2021-08-12 | Printed circuit board manufacturing method, golden finger protection method and protection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110926516.9A CN113811074A (en) | 2021-08-12 | 2021-08-12 | Printed circuit board manufacturing method, golden finger protection method and protection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113811074A true CN113811074A (en) | 2021-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110926516.9A Pending CN113811074A (en) | 2021-08-12 | 2021-08-12 | Printed circuit board manufacturing method, golden finger protection method and protection structure |
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| CN (1) | CN113811074A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268984A (en) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Works Ltd | Manufacture of printed wiring board |
| CN2720763Y (en) * | 2004-07-21 | 2005-08-24 | 昶驎科技股份有限公司 | Gold finger protection device |
| CN103118449A (en) * | 2013-01-31 | 2013-05-22 | 景旺电子（深圳）有限公司 | PCB (printed circuit board) board production method utilizing solder mask dry film and PCB board |
| CN105407653A (en) * | 2015-12-02 | 2016-03-16 | 日彩电子科技(深圳)有限公司 | Manufacturing method of circuit board |
| CN108391387A (en) * | 2018-04-03 | 2018-08-10 | 广德今腾电子科技有限公司 | A kind of processing technology of printed circuit board electroplating finger |
-
2021
- 2021-08-12 CN CN202110926516.9A patent/CN113811074A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268984A (en) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Works Ltd | Manufacture of printed wiring board |
| CN2720763Y (en) * | 2004-07-21 | 2005-08-24 | 昶驎科技股份有限公司 | Gold finger protection device |
| CN103118449A (en) * | 2013-01-31 | 2013-05-22 | 景旺电子（深圳）有限公司 | PCB (printed circuit board) board production method utilizing solder mask dry film and PCB board |
| CN105407653A (en) * | 2015-12-02 | 2016-03-16 | 日彩电子科技(深圳)有限公司 | Manufacturing method of circuit board |
| CN108391387A (en) * | 2018-04-03 | 2018-08-10 | 广德今腾电子科技有限公司 | A kind of processing technology of printed circuit board electroplating finger |
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