CN2720763Y - Gold finger protection device - Google Patents
Gold finger protection device Download PDFInfo
- Publication number
- CN2720763Y CN2720763Y CN 200420077113 CN200420077113U CN2720763Y CN 2720763 Y CN2720763 Y CN 2720763Y CN 200420077113 CN200420077113 CN 200420077113 CN 200420077113 U CN200420077113 U CN 200420077113U CN 2720763 Y CN2720763 Y CN 2720763Y
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- China
- Prior art keywords
- glue
- line
- protecting device
- gold finger
- protection glue
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- Expired - Fee Related
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The utility model relates to a gold finger protection device, which is applied to a circuit board with a plurality of gold fingers. The gold finger protection device comprises a protection paste layer which is made in the method of printing, wherein, the protection paste layer which is formed on the gold fingers on the circuit board comprises ultraviolet paste (UV paste) which is provided with silicon base and solidified by ultraviolet rays. The protection paste layer is coated on the gold fingers in the method of printing and has elastic and certain thickness; the paste layer can be solidified, removed by tearing and is not easy to brake; the gold fingers can not be polluted by the process of wave soldering and SMT hand soldering iron welding.
Description
Technical field
The utility model relates to a kind of circuit board with gold finger protecting device, particularly relates to a kind of gold finger protecting device that can form by mode of printing.
Background technology
(Printed circuit board PCB) can reserve the input circuit that is used for interlinking at boundary to known printed circuit board (PCB), generally is commonly called as the edge connector (edge connector) into " golden finger (Tab) ".This golden finger is formed by many exposed copper packings, or gold-plated thereon for adding stiff stability.When common two circuit boards are connected to each other, the golden finger of a slice circuit board wherein can be injected on the suitable slot of another sheet circuit board and (generally be called expansion slot Slot) to reach the purpose of electric connection; As display card, sound card or other similar interface card, all be to be connected with motherboard, so golden finger generally can make product supplier carry out every possible adjustment by this connected circuit by golden finger.
See also shown in Figure 1, be the known action schematic diagram that attaches circuit board 1 with high temperature gummed tape 2a, circuit board 1a electroplates or installs before the various spare parts of welding, for avoiding golden finger 11a contaminated, usually in artificial contraposition mode, sticking high temperature gummed tape 2a (generally is Kapton Tape (PolyimideTape), it has effect high temperature resistant and that insulation is covered), 11a coats fully with golden finger, avoid golden finger 11a immersed by electroplate liquid or the scolding tin pollution, and the stability that influence electrically connects reaches outward appearance to finish after the above-mentioned technology, removes this high temperature gummed tape 2a in the mode that removes again.
Yet, attach with manual type that adhesive tape is not only consuming time and take a lot of work (because of the careful contraposition of need to coat golden finger 11a), and in the process that pastes this high temperature gummed tape 2a, the greasy dirt of finger 3a is transferred on the golden finger 11a easily, forms another kind of the pollution.Therefore, the assembly of being badly in need of a kind of effective protective money finger can reach the function that coats golden finger simultaneously, take into account the manpower of saving time with the utility model of enhancing productivity again.
Summary of the invention
Main purpose of the present utility model is to provide a kind of gold finger protecting device, and it is applied to have the circuit board of a plurality of golden fingers, can save manpower and time, avoids finger to pollute and promote production efficiency.
In order to reach above-mentioned purpose, the utility model provides a kind of gold finger protecting device, and it is applied to have the circuit board of a plurality of golden fingers; This gold finger protecting device comprises the resilient protection glue-line made from mode of printing; this protection glue-line is formed on this golden finger of this circuit board; and comprise with ultraviolet curing and have UV cured glue (the ultraviolet paste of siliceous substrate (Silicon base) material; UV paste), and this protection glue-line have an elasticity and a predetermined thickness.
Above-mentioned gold finger protecting device, wherein this protection glue-line is for applying the UV cured glue that forms with steel plate or screen painting on this circuit board.
Above-mentioned gold finger protecting device, wherein should protection glue-line be can anti-at least 250 ℃ of high temperature UV cured glue.
Above-mentioned gold finger protecting device, wherein this protection glue-line is for through the ultraviolet irradiation of about 345 nanometers of wavelength and produce the UV cured glue of curing molding.
Above-mentioned gold finger protecting device should the protection glue-line be through the about 1000mj/cm of irradiation gross energy wherein
2Ultraviolet irradiation and produce the UV cured glue of curing molding.
Above-mentioned gold finger protecting device should the protection glue-line be through the about 140mW/cm of exposure intensity wherein
2Ultraviolet irradiation and produce the UV cured glue of curing molding.
Above-mentioned gold finger protecting device, wherein this protection glue-line is for through about 5 seconds of ultraviolet irradiation and produce the UV cured glue of curing molding.
Above-mentioned gold finger protecting device, wherein this protection glue-line is the UV cured glue through ultraviolet irradiation and dry about 10 seconds curing moldings.
Above-mentioned gold finger protecting device should the protection glue-line be to shine the also UV cured glue of curing molding via ultraviolet LED wherein.
Above-mentioned gold finger protecting device should the protection glue-line be the UV cured glue of and curing molding fiber-optic illuminated via the ultraviolet LED collocation wherein.
Above-mentioned gold finger protecting device, wherein this predetermined thickness of this protection glue-line is 0.1～0.2 millimeter.
Above-mentioned gold finger protecting device, wherein offer can be corresponding to a plurality of micropores at this golden finger place for this protection glue-line.In order to enable further to understand feature of the present utility model and technology contents, see also followingly about detailed description of the present utility model and accompanying drawing, yet only providing, accompanying drawing consults and illustrates usefulness, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is pasted with the action schematic diagram of high temperature gummed tape for the known circuits plate;
Fig. 2 is the structural representation of the utility model gold finger protecting device; And
Fig. 3 is the structural representation of another embodiment of the utility model gold finger protecting device.
Wherein, description of reference numerals is as follows:
Known technology:
1a circuit board 11a golden finger
2a high temperature gummed tape 3a finger
The utility model gold finger protecting device:
1 circuit board, 11 golden fingers
12 protection glue-lines, 121 micropores
Embodiment
See also shown in Figure 2ly, this figure is a gold finger protecting device of the present utility model, and it is applied to have the circuit board 1 of a plurality of golden fingers 11; This gold finger protecting device comprises the protection glue-line made from mode of printing 12, this protection glue-line is formed on this golden finger 11 of this circuit board 1, and comprise with ultraviolet curing and have the UV cured glue (ultraviolet paste, UV paste) of siliceous substrate (Silicon base) material; Utilize this protection glue-line 12 to be coated on this golden finger 11, and have elasticity and a predetermined thickness and can solidify and remove not easy fracture, reach the effect of saving the manpower in man-hour with mode of printing.
This protection glue-line 12 is a kind of UV cured glue via curable after the ultraviolet irradiation (Curing) moulding; and can bear at least 250 ℃ process high-temperature and non-deterioration in reflow wave soldering technology; it can the mode with steel plate or screen painting be coated on this golden finger 11 in the technology that this circuit board 1 is made, and can avoid taking a lot of work with the consuming time of artificial attaching high temperature gummed tape at this point.This UV cured glue needs properly to preserve outside technology to avoid qualitative change to produce, and its suitable mode is to avoid the solar radiation place and be housed in the following preservation environment of room temperature 25 degree Celsius.This UV cured glue is on being coated on this golden finger 11 time, note that this predetermined thickness of control is in 0.1～0.2 millimeter (millimeter, mm), because of this blocked up UV cured glue is difficult for dry, crossing this thin UV cured glue then is that removing in the process behind drying and moulding ruptured easily, this UV cured glue can be suitable for reaching the characteristic that removes easily after the rapid drying at 0.1～0.2 millimeter thickness, and can satisfy the paste solder printing technology of follow-up SMT.This UV cured glue is through the about 1000mj/Cm of irradiation gross energy
2(millijoule/square centimeter), the about 140mW/cm of exposure intensity
2(milliwatt/square centimeter), about 345 nanometers of wavelength (nanometer, nm) etc. after about 5 seconds of ultraviolet irradiation (sec) under the condition, this step is called curing (Curing) moulding, and dry about 10 seconds (sec) can form this protection glue-line 12 of solid strip; This protection glue-line 12 has microviscosity matter and can be attached on this golden finger 11; and can be with removing again after the technologies such as this circuit board 1 process plating or reflow; therefore application of the present utility model is not only convenient but also save time, and can also exempt the problem that the greasy dirt that attaches the adhesive tape generation becomes the glass putty pollution golden finger 11 of SMT technology.
The ultraviolet light that shines this protection glue-line 12 can provide via uviol lamp, ultraviolet LED (UVLED) or in conjunction with ultraviolet LED and the optical fiber light-emitting device for illumination (Distributive Lighting).
The protection glue-line 12 that is somebody's turn to do of the present utility model is different with general thermoset plastics, because general thermoset plastics can't be flexible strip shape body in the back combination of being heated, and easily produces broken state in stressed back; The UV cured glue that this protection glue-line 12 of the present utility model comprises siliceous substrate (Silicon base) material then forms the solid shape of elasticity by glue after curing, and can make the user remove easily not having cracked and remain in doubt on this golden finger 11.
See also shown in 3 figure; another embodiment for the utility model gold finger protecting device; wherein can select to remove and to offer can be corresponding to a plurality of micropores 121 at these golden finger 11 places for this protection glue-line 12; thereby make this circuit board 1 can directly apply to electric connection, do not need manpower to tear the effect of this diaphragm and reach when testing.
Gold finger protecting device of the present utility model has following advantage:
1, utilizes this protection glue-line to be coated on this golden finger, reach the effect of saving the manpower in man-hour with mode of printing;
2, utilize this protection glue-line to have a predetermined thickness and can suitably reach the characteristic that removes easily after the rapid drying;
3, utilize this protection glue-line to be coated on this golden finger, exempt the problem of the oil pollution golden finger that attaches the adhesive tape generation with mode of printing;
4, the application of this protection glue-line of the present utility model was not only convenient but also save time, and not only can reach the function that coats golden finger simultaneously, but also can enhance productivity; And
5, this diaphragm can improve the surcharge of this golden finger product for " brand-new product " if can be torn in person by the user to the user place again.
Above-mentioned disclosed technological means only is a preferred embodiment of the present utility model, and any modification and variation of doing according to spirit of the present utility model, feature all should be contained in the claim of the present invention.
Claims (12)
1, a kind of gold finger protecting device is located on the circuit board with a plurality of golden fingers, it is characterized in that comprising:
With the protection glue-line that mode of printing is made, be formed on this golden finger of this circuit board, this protection glue-line comprises with ultraviolet curing and has the UV cured glue of siliceous base material, and this protection glue-line has an elasticity and a predetermined thickness.
2, gold finger protecting device as claimed in claim 1 is characterized in that this protection glue-line is for applying the UV cured glue that forms with steel plate or screen painting on this circuit board.
3, gold finger protecting device as claimed in claim 2 is characterized in that this protection glue-line is UV cured glue that can anti-at least 250 ℃ of high temperature.
4, gold finger protecting device as claimed in claim 1 is characterized in that this protection glue-line is for through the ultraviolet irradiation of about 345 nanometers of wavelength and produce the UV cured glue of curing molding.
5, gold finger protecting device as claimed in claim 1 is characterized in that this protection glue-line is through irradiation gross energy 1000mj/cm
2Ultraviolet irradiation and produce the UV cured glue of curing molding.
6, gold finger protecting device as claimed in claim 1 is characterized in that this protection glue-line is through exposure intensity 140mW/cm
2Ultraviolet irradiation and produce the UV cured glue of curing molding.
7, gold finger protecting device as claimed in claim 1 is characterized in that this protection glue-line is for through 5 seconds of ultraviolet irradiation and produce the UV cured glue of curing molding.
8, gold finger protecting device as claimed in claim 1 is characterized in that this protection glue-line is the UV cured glue through ultraviolet irradiation and dry 10 seconds curing moldings.
9, gold finger protecting device as claimed in claim 1 is characterized in that this protection glue-line is the UV cured glue via ultraviolet LED irradiation and curing molding.
10, gold finger protecting device as claimed in claim 9 is characterized in that the UV cured glue of this protection glue-line for and curing molding fiber-optic illuminated via the ultraviolet LED collocation.
11, gold finger protecting device as claimed in claim 1, this predetermined thickness that it is characterized in that this protection glue-line is 0.1～0.2 millimeter.
12, gold finger protecting device as claimed in claim 1, it is characterized in that this protection glue-line offers can be corresponding to a plurality of micropore at this golden finger place.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420077113 CN2720763Y (en) | 2004-07-21 | 2004-07-21 | Gold finger protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420077113 CN2720763Y (en) | 2004-07-21 | 2004-07-21 | Gold finger protection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2720763Y true CN2720763Y (en) | 2005-08-24 |
Family
ID=35009710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420077113 Expired - Fee Related CN2720763Y (en) | 2004-07-21 | 2004-07-21 | Gold finger protection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2720763Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595777A (en) * | 2012-03-09 | 2012-07-18 | 昆山亿富达电子有限公司 | Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board |
| CN107635357A (en) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | A kind of pcb board golden finger guard method of easy to clean |
| CN107690249A (en) * | 2016-08-04 | 2018-02-13 | 苏政纬 | The high-voltage assembly waterproof method of portable electron device |
| CN109237363A (en) * | 2018-10-26 | 2019-01-18 | 珠海格力电器股份有限公司 | Lamp panel assembly and water purifier with same |
| CN112353077A (en) * | 2020-10-20 | 2021-02-12 | 浙江月立电器有限公司 | Surface treatment method and mini hair straightener |
| CN113811074A (en) * | 2021-08-12 | 2021-12-17 | 宏华胜精密电子(烟台)有限公司 | Printed circuit board manufacturing method, golden finger protection method and protection structure |
| CN114916157A (en) * | 2022-06-01 | 2022-08-16 | 东莞森玛仕格里菲电路有限公司 | Method for protecting fingers or PAD (PAD application program) in soft area of rigid-flex board |
| CN118076007A (en) * | 2024-04-18 | 2024-05-24 | 苏州维信电子有限公司 | Golden finger protective film coil stock, soft board based on protective film and manufacturing method thereof |
-
2004
- 2004-07-21 CN CN 200420077113 patent/CN2720763Y/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595777A (en) * | 2012-03-09 | 2012-07-18 | 昆山亿富达电子有限公司 | Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board |
| CN102595777B (en) * | 2012-03-09 | 2014-06-04 | 昆山亿富达电子有限公司 | Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board |
| CN107690249A (en) * | 2016-08-04 | 2018-02-13 | 苏政纬 | The high-voltage assembly waterproof method of portable electron device |
| CN107635357A (en) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | A kind of pcb board golden finger guard method of easy to clean |
| CN109237363A (en) * | 2018-10-26 | 2019-01-18 | 珠海格力电器股份有限公司 | Lamp panel assembly and water purifier with same |
| CN112353077A (en) * | 2020-10-20 | 2021-02-12 | 浙江月立电器有限公司 | Surface treatment method and mini hair straightener |
| CN113811074A (en) * | 2021-08-12 | 2021-12-17 | 宏华胜精密电子(烟台)有限公司 | Printed circuit board manufacturing method, golden finger protection method and protection structure |
| CN114916157A (en) * | 2022-06-01 | 2022-08-16 | 东莞森玛仕格里菲电路有限公司 | Method for protecting fingers or PAD (PAD application program) in soft area of rigid-flex board |
| CN114916157B (en) * | 2022-06-01 | 2024-04-12 | 东莞森玛仕格里菲电路有限公司 | Soft region finger or PAD protection method for soft and hard combined plate |
| CN118076007A (en) * | 2024-04-18 | 2024-05-24 | 苏州维信电子有限公司 | Golden finger protective film coil stock, soft board based on protective film and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |