CN102595777A - Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board - Google Patents

Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board Download PDF

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Publication number
CN102595777A
CN102595777A CN2012100613105A CN201210061310A CN102595777A CN 102595777 A CN102595777 A CN 102595777A CN 2012100613105 A CN2012100613105 A CN 2012100613105A CN 201210061310 A CN201210061310 A CN 201210061310A CN 102595777 A CN102595777 A CN 102595777A
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CN
China
Prior art keywords
golden finger
circuit board
flexible circuit
glue
goldfinger
Prior art date
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Granted
Application number
CN2012100613105A
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Chinese (zh)
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CN102595777B (en
Inventor
杨术钊
陆申林
袁井刚
李稳
刘燕华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Yifuda Electronics Co Ltd
Kunshan Huhua Metal Products Co Ltd
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Kunshan Yifuda Electronics Co Ltd
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Application filed by Kunshan Yifuda Electronics Co Ltd filed Critical Kunshan Yifuda Electronics Co Ltd
Priority to CN201210061310.5A priority Critical patent/CN102595777B/en
Publication of CN102595777A publication Critical patent/CN102595777A/en
Application granted granted Critical
Publication of CN102595777B publication Critical patent/CN102595777B/en
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  • Adhesives Or Adhesive Processes (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses an adhesive adhering structure and an adhesive adhering method for a hollowed-out goldfinger of a flexible circuit board. Hollowed-out areas are formed among all terminal in a goldfinger area, and a cushion layer covers on the entire goldfinger area; and an adhesive layer covers the goldfinger area by being spaced by the cushion layer and is adhered onto the flexible circuit board or a part on which the adhesive layer can be adhered. According to the adhesive adhering structure and the adhesive adhering method for the hollowed-out goldfinger of the flexible circuit board, disclosed by the invention, adhesive adhering and adhesive stripping are more convenient and quicker and are free from the limitation from adhesiveness, the goldfinger cannot be pulled through stripping when the adhesiveness is high, a chemical liquid cannot permeate to influence an adherence part when the adhesiveness is low, and thus, the goldfinger is protected effectively.

Description

FPC hollow out golden finger rubberizing structure and sticking method
Technical field
The present invention relates to a kind of FPC hollow out golden finger rubberizing structure and sticking method, belong to electronic technology field.
Background technology
Golden finger mainly is intended for the externally outlet of communication of wiring board on the FPC, by the gold with superior electrical conductivity and non-oxidizability the golden finger place is carried out parcel plating or chemical turmeric, and the connection of golden finger is extremely important to FPC.In order not influence the characteristic of golden finger, in some processing steps, must apply protection to golden finger.Usually the method that adopts is to protect in golden finger surface rubberizing, still, it is torn glue bother very much; Especially for FPC, form Openworks shape between each golden finger line, if the viscosity of rubberizing is stronger with hollow out golden finger; When tearing glue; The golden finger line is easily by the viscosity of glue and distortion is pullled in adhesion, even broken string; If the viscosity of rubberizing a little less than, then paste imprecision, lose the protective effect of rubberizing.
Summary of the invention
Technical problem to be solved by this invention provides a kind of FPC hollow out golden finger rubberizing structure and sticking method, makes rubberizing, tears the glue more convenient and quicker, not limited by the viscosity of glue, does not pull golden finger when tearing glue, effectively the protective money finger.
For solving the problems of the technologies described above; The present invention provides a kind of hollow-out flexible circuit board gold finger plaster plastic structure, comprise FPC and on golden finger, it is characterized in that; Between each terminal of said golden finger zone is vacancy section, on the whole zone of said golden finger, covers a bed course; One glue-line covers said golden finger zone across said bed course, and is pasted on the FPC or the position of Pasting glue-line.
The area of said bed course is not less than said golden finger zone.
The area of said glue-line is greater than the area of said bed course.
Sticking method based on the described hollow-out flexible circuit board gold of claim 1 finger plaster plastic structure is characterized in that, comprises following steps:
(1) on the whole zone of golden finger, covers a bed course;
(2) said golden finger zone is covered across said bed course with a glue-line,
(3) and be pasted on the FPC said glue-line or the position of Pasting glue-line.
Preferably, the area of said bed course is not less than said golden finger zone.
Preferably, the area of said glue-line is greater than the area of said bed course.
Preferably, be vacancy section between regional each terminal of said golden finger.
The beneficial effect that the present invention reached:
FPC hollow out golden finger rubberizing structure of the present invention and sticking method; Make rubberizing, tear the glue more convenient and quicker, not limited by the viscosity of glue, tear glue when adhesivity is strong and can not pull golden finger; The liquid medicine seepage influence position of pasting can not take place in adhesivity when weak, effectively protected golden finger.
Description of drawings
Fig. 1 is a FPC hollow out golden finger sketch map of the present invention;
Fig. 2 is the rubberizing structural representation of Fig. 1;
Fig. 3 is the right view of Fig. 2 rubberizing structure.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.Following examples only are used for technical scheme of the present invention more clearly is described, and can not limit protection scope of the present invention with this.
As shown in Figure 1, be vacancy section 22 between golden finger zone 2 each terminal 21 on the FPC 1, this hollow out golden finger more is prone to pullled distortion.Therefore, like Fig. 2, shown in Figure 3, the sticking method of present technique scheme is at first covering a bed course 3 on golden finger zone 2, and bed course 3 is not with the common interlayer of glue, can be with golden finger zone 2 whole coverings.On bed course 3, paste a glue-line 4 again, glue-line 4 areas are greater than bed course 3, can be coated on it down with bed course 3 is whole, and be pasted on the FPC or other positions 5.Because of the isolation of bed course 3, glue-line 4 can not paste golden finger zone 2, thereby has avoided golden finger zone 2 each terminal 21.When tearing glue, glue-line 4 can not pullled golden finger zone 2 each terminal 21.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from know-why of the present invention; Can also make some improvement and distortion, these improvement and distortion also should be regarded as protection scope of the present invention.

Claims (7)

1. hollow-out flexible circuit board gold finger plaster plastic structure, comprise FPC and on golden finger, it is characterized in that, be vacancy section between each terminal of said golden finger zone, covering one bed course on the whole zone of said golden finger; One glue-line covers said golden finger zone across said bed course, and is pasted on the FPC or the position of Pasting glue-line.
2. hollow-out flexible circuit board gold finger plaster plastic structure according to claim 1 is characterized in that, the area of said bed course is not less than said golden finger zone.
3. hollow-out flexible circuit board gold finger plaster plastic structure according to claim 1 is characterized in that the area of said glue-line is greater than the area of said bed course.
4. based on the sticking method of the described hollow-out flexible circuit board gold of claim 1 finger plaster plastic structure, it is characterized in that, comprise following steps:
(1) on the whole zone of golden finger, covers a bed course;
(2) said golden finger zone is covered across said bed course with a glue-line;
(3) and be pasted on the FPC said glue-line or the position of Pasting glue-line.
5. hollow-out flexible circuit board gold finger plaster gluing method according to claim 4 is characterized in that, the area of said bed course is not less than said golden finger zone.
6. hollow-out flexible circuit board gold finger plaster plastic structure according to claim 4 is characterized in that the area of said glue-line is greater than the area of said bed course.
7. hollow-out flexible circuit board gold finger plaster plastic structure according to claim 4 is characterized in that, is vacancy section between each terminal of said golden finger zone.
CN201210061310.5A 2012-03-09 2012-03-09 Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board Active CN102595777B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210061310.5A CN102595777B (en) 2012-03-09 2012-03-09 Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210061310.5A CN102595777B (en) 2012-03-09 2012-03-09 Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board

Publications (2)

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CN102595777A true CN102595777A (en) 2012-07-18
CN102595777B CN102595777B (en) 2014-06-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107645845A (en) * 2017-10-20 2018-01-30 深圳市芬能自动化设备有限公司 A kind of circuit board automatic film applicator
CN107787127A (en) * 2017-11-23 2018-03-09 贵州维讯光电科技有限公司 A kind of FPC camera head protectings plate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2720763Y (en) * 2004-07-21 2005-08-24 昶驎科技股份有限公司 Gold finger protection device
CN201388341Y (en) * 2009-03-05 2010-01-20 中兴通讯股份有限公司 Flexible printed circuit board
CN201557322U (en) * 2009-11-20 2010-08-18 Tcl集团股份有限公司 Flexible circuit board
CN202005058U (en) * 2011-01-28 2011-10-05 瀚斯宝丽显示科技(南京)有限公司 Structure of printed circuit board bonded with adhesive layer of liquid crystal display panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2720763Y (en) * 2004-07-21 2005-08-24 昶驎科技股份有限公司 Gold finger protection device
CN201388341Y (en) * 2009-03-05 2010-01-20 中兴通讯股份有限公司 Flexible printed circuit board
CN201557322U (en) * 2009-11-20 2010-08-18 Tcl集团股份有限公司 Flexible circuit board
CN202005058U (en) * 2011-01-28 2011-10-05 瀚斯宝丽显示科技(南京)有限公司 Structure of printed circuit board bonded with adhesive layer of liquid crystal display panel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107645845A (en) * 2017-10-20 2018-01-30 深圳市芬能自动化设备有限公司 A kind of circuit board automatic film applicator
CN107645845B (en) * 2017-10-20 2023-08-29 深圳市芬能自动化设备有限公司 Automatic film sticking machine for circuit board
CN107787127A (en) * 2017-11-23 2018-03-09 贵州维讯光电科技有限公司 A kind of FPC camera head protectings plate
CN107787127B (en) * 2017-11-23 2024-04-30 贵州维讯光电科技有限公司 FPC camera protection device
CN107787127B8 (en) * 2017-11-23 2024-05-21 陕西维讯创展半导体科技有限公司 FPC camera protection device

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