CN203645914U - Release paster - Google Patents
Release paster Download PDFInfo
- Publication number
- CN203645914U CN203645914U CN201320839412.5U CN201320839412U CN203645914U CN 203645914 U CN203645914 U CN 203645914U CN 201320839412 U CN201320839412 U CN 201320839412U CN 203645914 U CN203645914 U CN 203645914U
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- CN
- China
- Prior art keywords
- bonding
- bonding strip
- release
- glue
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000004888 barrier function Effects 0.000 claims description 10
- 239000003292 glue Substances 0.000 abstract 7
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The utility model belongs to the technical field of flexible circuit board assembling, and especially relates to a release paster. The release paster comprises a plurality of bonding strips and a piece of release paper, wherein the plurality of bonding strips are used for bonding electronic elements, and the release paper is used for fixedly bonding the bonding strips. The bonding strips are arranged in a laminated, staggered and bonded manner and are bonded to the release paper. Each bonding strip comprises a base material, a first glue layer coated on the upper surface of the base material, a second glue layer coated on the lower surface of the base material, and an anti-sticking film covering the surface of the first glue layer. The bonding strip arranged on the lowest layer is bonded to the release paper through the second glue layer. Each bonding strip arranged above the bonding strip on the lowest layer is bonded to the anti-sticking film of the below bonding strip through one end of the second glue layer, and the other end of the glue layer is bonded to the release paper. According to the utility model, the bonding strips are arranged in a laminated and staggered manner, and a stripping opening is easily formed for one single bonding strip, so that the bonding strip can be quickly stripped from the release paper without tearing the glue layers, the stripping quality is ensured, and the bonding efficiency is improved.
Description
Technical field
The utility model belongs to the technical field of assembling flexible circuit board, relates in particular to a kind of release paster.
Background technology
At present, when factory makes flexible circuit board in a large number, conventionally need to use in batch less two-sided of size to there is the gummed paper of tack coat electronic component sticked.In actual use, gummed paper mostly is three-decker, middle one deck bonding paper, the upper and lower surface of the bonding paper release diaphragm of one deck that bonds respectively.
When use, first the release diaphragm of one deck of gummed paper one side surface is peeled off, expose the tack coat on gummed paper surface, be bonded in flexible circuit board, and then the lip-deep release diaphragm of the opposite side of described gummed paper is peeled off, expose another surperficial tack coat of gummed paper, for bonding electronic components, thereby electronic component is bonded on wiring board.
In real work, workman need to tear release diaphragm twice, and release diaphragm is difficult for peeling off with described gummed paper justify align conventionally, even if also easily will pull the tack coat on gummed paper even tack coat to be shut down while manually tearing release diaphragm, so, workman peels off an other gummed paper again again, increases the amount of doing over again, and gummed paper charge stripping efficiency is low; Meanwhile, because the gummed paper size of needs bonding is less, also need workman that rectangular gummed paper is cut into independently individual, so, complicated operation, bonding packaging efficiency is low.
Utility model content
The purpose of this utility model is to provide a kind of release paster, and be intended to solve paster in prior art and peel off inconvenience, and the low problem of bonding packaging efficiency.
The utility model is achieved in that a kind of release paster, comprise many bonding strip and the release liners that are arranged stacked, each described bonding strip includes base material, the upper surface of described base material is coated with the first glue-line of viscosity, the surface coverage of described the first glue-line has antiadhesion barrier, and the lower surface of described base material applies sticking the second glue-line; The bonding strip that is positioned at the bottom is bonded in described release liners by described the second glue-line, be positioned at each described bonding strip more than bottom bonding strip, its second glue-line be bonded in respectively described release liners and the antiadhesion barrier of the bonding strip that is adjacent on, and the end of multiple bonding strips is staggeredly arranged towards homonymy.
Particularly, multiple described bonding strips are straight arranged in strips.
Particularly, the specification of each described bonding strip is identical.
Particularly, the width of described release liners is greater than the width of described bonding strip.
Particularly, the width of described bonding strip is 5-25mm.
Particularly, the thickness of described bonding strip is 0.05-2mm.
Preferably, between described bonding strip, stagger arrange spacing equate.
Particularly, between described bonding strip, stagger arrange spacing be 25mm.
The beneficial effects of the utility model: by stacked each bonding strip setting that is staggered is bonded in a release liners, so, whole release paster has only used a release liners, reduce the use amount of release liners, due to the setting of staggering between each bonding strip, the direction of tearing along bonding strip, between the bonding strip of each layer, form layer poor, in the time tearing release paster, be easy to single bonding strip to form peel-open, be convenient to peel off bonding strip, make it to peel off and can not tear glue-line from release paster fast, after release paster is bonded in flexible circuit board, only need peel off the antiadhesion barrier that is covered in bonding strip upper surface, just can bonding electronic components, whole operating process, operation is simple, bonding efficiency is high.
Accompanying drawing explanation
Fig. 1 is the schematic top plan view of release paster in the utility model embodiment;
Fig. 2 is the schematic side view of release paster in the utility model embodiment;
Fig. 3 is the schematic cross-section of bonding strip in Fig. 2.
Description of symbols:
100 release pasters
1 release liners 23 base materials
2 bonding strip 24 second glue-lines
21 antiadhesion barrier D spacing
22 first glue-line W bonding strip width
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Below in conjunction with concrete accompanying drawing, realization of the present utility model is described in detail.
Refer to shown in Fig. 1 and Fig. 2, the release paster 100 of one that the utility model embodiment provides, it comprises bonding strip 2 and a release liners 1 of many stacked settings, above-mentioned many bonding strips 2 all bond and are fixed in this release liners 1; Refer again to shown in Fig. 3, each bonding strip 2 has included a base material 23, the upper surface of described base material 23 and lower surface are coated with respectively the first glue-line 22 and the second glue-line 24, wherein the surface coverage of the first glue-line 22 has antiadhesion barrier 21, in actual use, bonding strip 2 is bonded in flexible circuit board by the second glue-line 24, then the antiadhesion barrier 21 its upper surface being covered is torn, again electronic devices and components are attached on the first glue-line 22 of bonding strip 2 upper surfaces, thereby electronic devices and components bonding is fixed in flexible circuit board.Again as shown in Figure 2, the bonding strip 2 that is positioned at the bottom is bonded on release paster 100 by the second glue-line 24, other bonding strip 2 is bonded in release liners 1 by second glue-line 24 one end, the other end is bonded in or is positioned at below it and on the antiadhesion barrier 21 of the bonding strip 2 being adjacent, that is to say, the lower surface of the bonding strip 2 of the bottom is attached on release paster 100 completely, the part that other the more than bottom bonding strips 2 are only lower surfaces is bonded in release liners 1, wherein, be positioned at the bonding strip 2 more than bottom, while being bonded on the bonding strip 2 that is positioned at its below, mutually stagger and have a space D in the end of its end bonding strip 2 adjacent with this, also be the unjustified setting in end of each bonding strip 2.In actual use, the end of multiple bonding strips 2 is staggeredly arranged towards homonymy.Understandably, the extension of staggering in the same direction bonds between each bonding strip that " homonymy is staggeredly arranged " at this place refers to.Like this, by stacked each bonding strip 2 setting that is staggered is bonded in a release liners 1, only use a release liners 1, reduce the use amount of release liners 1, simultaneously, due to the setting of staggering between each bonding strip 2, the direction of tearing along bonding strip 2, between the bonding strip 2 of each layer, form layer poor, in the time tearing release paster 100, be easy to single bonding strip 2 to form peel-open, be convenient to peel off bonding strip 2, make it to peel off and can not tear glue-line from release paster 100 fast, after release paster 100 is bonded in flexible circuit board, only need peel off the antiadhesion barrier 21 that is covered in bonding strip 2 upper surfaces, just can bonding electronic components, whole operating process, operation is simple, bonding efficiency is high.
Preferably, multiple described bonding strips 2 are straight arranged in strips.Namely, the track that each bonding strip 2 bonds in line.
Certainly, in actual use, according to concrete operating mode, the quantity of bonding strip 2 can be rationally set, be also feasible.
Particularly, above-mentioned release liners 1 is made up of the paper that scribbles preventing viscosity substance, so, it has good anti-stick, meanwhile, and when above-mentioned release paster 100 does not use, adhere on the second glue-line 24 on bonding strip 2 by this release paster 100, like this, neither can make the second glue-line 24 residue in release liners 1, can guarantee that again the second glue-line 24 on bonding strip 2 is not contaminated.
Preferably, in the present embodiment, the specification of each bonding strip 2 is set to identical, and this is located said specification and includes but not limited to length, width, and thickness, caking property etc., certainly, " specification is identical " at this place allows to deposit the acceptable margin of tolerance aborning.Particularly, in the present embodiment, the width of bonding strip 2 is arranged between 5-25mm, and thickness is arranged between 0.05-2mm.So, be beneficial to batch production and make, meanwhile, make cohesive force between bonding strip 2 identical and can not involve the first glue-line 22 or the second glue-line 24.The width of bonding strip 2 or thickness are arranged on can be by each in this numerical value interval simultaneously
Preferably, consult shown in Fig. 1, the width of release liners 1 is greater than bonding strip 2 width W.So, guarantee that the lower surface of bonding strip 2 is attached in release liners 1 completely on the one hand, further guarantee that the second glue-line 24 applying on bonding strip 2 lower surfaces is not contaminated; On the other hand, so setting can form a staggered floor between bonding strip 2 and release liners 1, namely the surface of the upper surface of bonding strip 2, end face and release liners 1 forms a step-like structure, so, be convenient to slip into from the staggered floor between bonding strip 2 and release liners 1, the end face of supporting bonding strip 2 makes to turn on bonding strip 2, forms and tears mouth, thereby bonding strip 2 is peeled off fast in release liners 1, be bonded in flexible circuit board.
Certainly, for better effective and rapid rate peel off bonding strip 2, as depicted in figs. 1 and 2, the space D staggering between each bonding strip 2 is arranged to equal form.So, be easy to be convenient to workman and form the timing of peeling off, thereby improve peeling rate.Particularly, shown in goodbye Fig. 1 and Fig. 2, in the present embodiment, the space D staggering between bonding strip 2 is set to 25mm.So, guarantee when various model fingers are peeled off bonding strip 2 to there is a suitable operating space, certainly, according to different finger models, can reasonably adjust the space D staggering between bonding strip 2, also belong to protection range of the present utility model.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (8)
1. a release paster, it is characterized in that, comprise many bonding strip and the release liners that are arranged stacked, each described bonding strip includes base material, the upper surface of described base material is coated with the first glue-line of viscosity, the surface coverage of described the first glue-line has antiadhesion barrier, and the lower surface of described base material applies sticking the second glue-line; The bonding strip that is positioned at the bottom is bonded in described release liners by described the second glue-line, be positioned at each described bonding strip more than bottom bonding strip, its second glue-line be bonded in respectively described release liners and the antiadhesion barrier of the bonding strip that is adjacent on, and the end of multiple bonding strips is staggeredly arranged towards homonymy.
2. the release paster of one according to claim 1, is characterized in that: multiple described bonding strips are straight arranged in strips.
3. the release paster of one according to claim 1, is characterized in that: the specification of each described bonding strip is identical.
4. the release paster of one according to claim 1 and 2, is characterized in that: the width of described release liners is greater than the width of described bonding strip.
5. the release paster of one according to claim 3, is characterized in that: the width of described bonding strip is 5-25mm.
6. the release paster of one according to claim 2, is characterized in that: the thickness of described bonding strip is 0.05-2mm.
7. the release paster of one according to claim 1, is characterized in that: the spacing staggering between the end of described adjacent bonding strip equates.
8. the release paster of one according to claim 7, is characterized in that: described spacing is 25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320839412.5U CN203645914U (en) | 2013-12-18 | 2013-12-18 | Release paster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320839412.5U CN203645914U (en) | 2013-12-18 | 2013-12-18 | Release paster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203645914U true CN203645914U (en) | 2014-06-11 |
Family
ID=50877128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320839412.5U Expired - Lifetime CN203645914U (en) | 2013-12-18 | 2013-12-18 | Release paster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203645914U (en) |
-
2013
- 2013-12-18 CN CN201320839412.5U patent/CN203645914U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140611 |
|
| CX01 | Expiry of patent term |