CN204311008U - A kind of High temperature-resistanadhesive adhesive tape - Google Patents
A kind of High temperature-resistanadhesive adhesive tape Download PDFInfo
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- CN204311008U CN204311008U CN201420784243.4U CN201420784243U CN204311008U CN 204311008 U CN204311008 U CN 204311008U CN 201420784243 U CN201420784243 U CN 201420784243U CN 204311008 U CN204311008 U CN 204311008U
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- high temperature
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- sensitive adhesive
- substrate layer
- adhesive tape
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Abstract
The utility model discloses a kind of High temperature-resistanadhesive adhesive tape, comprising: substrate layer, enhancing belt and pressure-sensitive adhesive layer, and described enhancing belt is coated in a side surface of described substrate layer, and described pressure-sensitive adhesive layer is coated in the opposite side surface of described substrate layer; Described substrate layer is polyimide film layer; Described enhancing belt is high temperature resistant wrinkle beautifying paper tape; Described pressure-sensitive adhesive layer is silicone glue-line.High temperature-resistanadhesive adhesive tape described in the utility model, has desirable resistance to elevated temperatures, does not shrink, indeformable when at high temperature using, and soft docile, tearability good.
Description
Technical field
The utility model relates to adhered protection film field, is specially a kind of High temperature-resistanadhesive adhesive tape.
Background technology
At present; in high temperature process flow process; need the protection using various adhesive tape as covering; existing high temperature gummed tape forms by base film layer applying varistor layer, and the adhesive band base of this structure is single layer structure, uses this kind of tape adhesion on the aperture of printed circuit board (PCB) as covering protection; and when printed circuit board (PCB) being sent into tin stove wave soldering; easy appearance is shunk and obscission, the aperture on printed circuit board (PCB) can be caused exposed, thus cause scrapping of printed circuit board (PCB).
Utility model content
For above-mentioned technical problem, the utility model discloses a kind of High temperature-resistanadhesive adhesive tape, comprise: substrate layer, enhancing belt and pressure-sensitive adhesive layer, described enhancing belt is coated in a side surface of described substrate layer, and described pressure-sensitive adhesive layer is coated in the opposite side surface of described substrate layer; Described substrate layer is polyimide film layer; Described enhancing belt is high temperature resistant wrinkle beautifying paper tape; Described pressure-sensitive adhesive layer is silicone glue-line.
Preferably, the thickness of described pressure-sensitive adhesive layer is 0.04-0.0.06mm.
The beneficial effects of the utility model are described High temperature-resistanadhesive adhesive tape, have desirable resistance to elevated temperatures, do not shrink, indeformable when at high temperature using, and soft docile, tearability good.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view from peeling off High temperature-resistanadhesive adhesive tape described in the utility model.
In figure, 1-substrate layer; 2-strengthens belt; 3-pressure-sensitive adhesive layer.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail, can implements according to this with reference to specification sheets word to make those skilled in the art.
As shown in the figure, the utility model discloses a kind of High temperature-resistanadhesive adhesive tape, comprise: substrate layer 1, enhancing belt 2 and pressure-sensitive adhesive layer 3, described enhancing belt 2 is coated in a side surface of described substrate layer 1, and described pressure-sensitive adhesive layer 3 is coated in the opposite side surface of described substrate layer 1; Described substrate layer 1 is polyimide film layer; Described enhancing belt 2 is high temperature resistant wrinkle beautifying paper tape; Described pressure-sensitive adhesive layer 3 is silicone glue-line.The thickness of described pressure-sensitive adhesive layer 3 is 0.04-0.0.06mm.Described High temperature-resistanadhesive adhesive tape, has desirable resistance to elevated temperatures, does not shrink, indeformable when at high temperature using, and soft docile, tearability good.
Although embodiment of the present utility model is open as above, but it is not restricted to listed in specification sheets and embodiment utilization, it can be applied to various applicable field of the present utility model completely, for those skilled in the art, can easily realize other amendment, therefore do not deviating under the universal that claim and equivalency range limit, the utility model is not limited to specific details and illustrates here and the legend described.
Claims (2)
1. a High temperature-resistanadhesive adhesive tape, is characterized in that, comprising: substrate layer, enhancing belt and pressure-sensitive adhesive layer, and described enhancing belt is coated in a side surface of described substrate layer, and described pressure-sensitive adhesive layer is coated in the opposite side surface of described substrate layer; Described substrate layer is polyimide film layer; Described enhancing belt is high temperature resistant wrinkle beautifying paper tape; Described pressure-sensitive adhesive layer is silicone glue-line.
2. High temperature-resistanadhesive adhesive tape according to claim 1, is characterized in that: the thickness of described pressure-sensitive adhesive layer is 0.04-0.0.06mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420784243.4U CN204311008U (en) | 2014-12-15 | 2014-12-15 | A kind of High temperature-resistanadhesive adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420784243.4U CN204311008U (en) | 2014-12-15 | 2014-12-15 | A kind of High temperature-resistanadhesive adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204311008U true CN204311008U (en) | 2015-05-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420784243.4U Active CN204311008U (en) | 2014-12-15 | 2014-12-15 | A kind of High temperature-resistanadhesive adhesive tape |
Country Status (1)
| Country | Link |
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| CN (1) | CN204311008U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
-
2014
- 2014-12-15 CN CN201420784243.4U patent/CN204311008U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ANHUI MINGXUN NEW MATERIAL CO., LTD. Free format text: FORMER OWNER: SUZHOU BANLID NEW MATERIAL CO., LTD. Effective date: 20150602 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 215000 SUZHOU, JIANGSU PROVINCE TO: 242200 XUANCHENG, ANHUI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150602 Address after: 242200 Guangde Economic Development Zone (north area), Xuancheng, Anhui Patentee after: ANHUI MINGXUN NEW MATERIAL TECHNOLOGY CO., LTD. Address before: Suzhou City, Jiangsu province 215000 Wuzhong District town of Lotus Village Du Village Patentee before: SUZHOU BANLID NEW MATERIAL CO., LTD. |