CN204622704U - A kind of thermal conductive silicon gum cover - Google Patents
A kind of thermal conductive silicon gum cover Download PDFInfo
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- CN204622704U CN204622704U CN201520232144.XU CN201520232144U CN204622704U CN 204622704 U CN204622704 U CN 204622704U CN 201520232144 U CN201520232144 U CN 201520232144U CN 204622704 U CN204622704 U CN 204622704U
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- Prior art keywords
- thermal conductive
- gum cover
- conductive silicon
- silicon gum
- adhesive coating
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Abstract
The utility model discloses a kind of thermal conductive silicon gum cover, comprise thermal conductive silicon gum cover body, adhesive coating, silicone oil paper, it is characterized in that: described thermal conductive silicon gum cover is followed successively by silicone oil paper, adhesive coating and thermal conductive silicon gum cover body from the inside to surface, described adhesive coating is coated on the inner surface of thermal conductive silicon gum cover body uniformly, described adhesive coating surface coverage one deck silicone oil paper.Thermal conductive silicon gum cover of the present utility model, as long as tear silicone oil paper, is socketed in thermal conductive silicon gum cover after electronic component pinches reality with hand and can realizes its function.
Description
Technical field
The utility model relates to silica gel material field, especially relates to a kind of thermal conductive silicon gum cover.
Background technology
Thermal conductive silicon gum cover is widely used in the radiating treatment of electronic product, and thermal conductive silicon adhesive tape on the market does not all have bonding force at present, and other adhesives often will be coordinated during use could to realize its adhesion function, is bonded together inconvenient and bonding insecure like this.
Utility model content
The technical problems to be solved in the utility model is: thermal conductive silicon gum cover does not have bonding force, and other adhesives often will be coordinated during use could to realize its adhesion function, is bonded together inconvenient and bonding insecure like this.
Technical solution of the present utility model is: the utility model discloses a kind of thermal conductive silicon gum cover, described thermal conductive silicon gum cover, comprise thermal conductive silicon gum cover body 1, adhesive coating 2, silicone oil paper 3, it is characterized in that: described thermal conductive silicon gum cover is followed successively by silicone oil paper 3, adhesive coating 2 and thermal conductive silicon gum cover body 1 from the inside to surface, described adhesive coating 2 is coated on the inner surface of thermal conductive silicon gum cover body 1 uniformly, and described silicone oil paper 3 covers on the surface of adhesive coating 2.
Preferably, the thickness of described adhesive coating 2 is 0.01 ~ 0.5cm.
The utility model compared with prior art, has the following advantages:
The second layer of thermal conductive silicon gum cover of the present utility model is adhesive coating, can realize the bonding of thermal conductive silicon gum cover and electronic component very well.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Accompanying drawing illustrates:
1. thermal conductive silicon gum cover body
2. adhesive coating
3. silicone oil paper
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As Fig. 1, the utility model discloses a kind of thermal conductive silicon gum cover, described thermal conductive silicon gum cover, comprise thermal conductive silicon gum cover body 1, adhesive coating 2, silicone oil paper 3, it is characterized in that: described thermal conductive silicon gum cover is followed successively by silicone oil paper 3, adhesive coating 2 and thermal conductive silicon gum cover body 1 from the inside to surface, described adhesive coating 2 is coated on the inner surface of thermal conductive silicon gum cover body 1 uniformly, and described silicone oil paper 3 covers on the surface of adhesive coating 2.
Preferably, the thickness of described adhesive coating 2 is 0.01 ~ 0.5cm.
When using this thermal conductive silicon gum cover, tear the silicone oil paper 3 of innermost layer, thermal conductive silicon gum cover is enclosed within the surface of electronic component, clutching with hand, both can realize firmly bonding.
Embodiment one:
A kind of thermal conductive silicon gum cover, described thermal conductive silicon gum cover, comprise thermal conductive silicon gum cover body 1, adhesive coating 2, silicone oil paper 3, it is characterized in that: described thermal conductive silicon gum cover is followed successively by silicone oil paper 3, adhesive coating 2 and thermal conductive silicon gum cover body 1 from the inside to surface, described adhesive coating 2 is coated on the inner surface of thermal conductive silicon gum cover body 1 uniformly, described silicone oil paper 3 covers on the surface of adhesive coating 2, and the thickness of described adhesive coating 2 is 0.01cm.
When using this thermal conductive silicon gum cover, tear the silicone oil paper 3 of innermost layer, thermal conductive silicon gum cover is enclosed within the surface of electronic component, clutching with hand, both can realize firmly bonding.
Embodiment two:
A kind of thermal conductive silicon gum cover, described thermal conductive silicon gum cover, comprise thermal conductive silicon gum cover body 1, adhesive coating 2, silicone oil paper 3, it is characterized in that: described thermal conductive silicon gum cover is followed successively by silicone oil paper 3, adhesive coating 2 and thermal conductive silicon gum cover body 1 from the inside to surface, described adhesive coating 2 is coated on the inner surface of thermal conductive silicon gum cover body 1 uniformly, described silicone oil paper 3 covers on the surface of adhesive coating 2, and the thickness of described adhesive coating 2 is 0.5cm.
When using this thermal conductive silicon gum cover, tear the silicone oil paper 3 of innermost layer, thermal conductive silicon gum cover is enclosed within the surface of electronic component, clutching with hand, both can realize firmly bonding.
Embodiment three:
A kind of thermal conductive silicon gum cover, described thermal conductive silicon gum cover, comprise thermal conductive silicon gum cover body 1, adhesive coating 2, silicone oil paper 3, it is characterized in that: described thermal conductive silicon gum cover is followed successively by silicone oil paper 3, adhesive coating 2 and thermal conductive silicon gum cover body 1 from the inside to surface, adhesive coating 2, silicone oil paper 3, on the inner surface that described adhesive coating 2 is coated on thermal conductive silicon gum cover body 1 uniformly and outer surface, described silicone oil paper 3 covers on the surface of adhesive coating 2, and the thickness of described adhesive coating 2 is 0.1cm.
When using this thermal conductive silicon gum cover, tear the silicone oil paper 3 of innermost layer, thermal conductive silicon gum cover is enclosed within the surface of electronic component, clutching with hand, both can realize firmly bonding.
Claims (2)
1. a thermal conductive silicon gum cover, comprise thermal conductive silicon gum cover body, adhesive coating, silicone oil paper, it is characterized in that: described thermal conductive silicon gum cover is followed successively by silicone oil paper, adhesive coating and thermal conductive silicon gum cover body from the inside to surface, described adhesive coating is coated on the inner surface of thermal conductive silicon gum cover body uniformly, and described silicone oil paper covers adhesive coating on the surface.
2. thermal conductive silicon gum cover according to claim 1, is characterized in that: the thickness of described adhesive coating is 0.01 ~ 0.5cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520232144.XU CN204622704U (en) | 2015-04-17 | 2015-04-17 | A kind of thermal conductive silicon gum cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520232144.XU CN204622704U (en) | 2015-04-17 | 2015-04-17 | A kind of thermal conductive silicon gum cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204622704U true CN204622704U (en) | 2015-09-09 |
Family
ID=54041763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520232144.XU Active CN204622704U (en) | 2015-04-17 | 2015-04-17 | A kind of thermal conductive silicon gum cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204622704U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105271663A (en) * | 2015-09-27 | 2016-01-27 | 孟红琳 | Glass sheet production line cooling apparatus |
-
2015
- 2015-04-17 CN CN201520232144.XU patent/CN204622704U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105271663A (en) * | 2015-09-27 | 2016-01-27 | 孟红琳 | Glass sheet production line cooling apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518106, Gongming office, Guangming District, Guangdong, Shenzhen, will be on the first floor, No. 15, Yau Ma Tei Industrial Park, Shek Wai community, Shek Wai Patentee after: Shenzhen Han Yuxin Polytron Technologies Inc Address before: 518106, Gongming office, Guangming District, Guangdong, Shenzhen, will be on the first floor, No. 15, Yau Ma Tei Industrial Park, Shek Wai community, Shek Wai Patentee before: SHENZHEN HANYUXIN ELECTRONICS TECHNOLOGY CO., LTD. |