CN204625535U - A kind of comprehensive silicon adhesive tape - Google Patents
A kind of comprehensive silicon adhesive tape Download PDFInfo
- Publication number
- CN204625535U CN204625535U CN201520232143.5U CN201520232143U CN204625535U CN 204625535 U CN204625535 U CN 204625535U CN 201520232143 U CN201520232143 U CN 201520232143U CN 204625535 U CN204625535 U CN 204625535U
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- Prior art keywords
- high temperature
- silica gel
- tape
- temperature gummed
- band body
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Abstract
The utility model discloses a kind of comprehensive silicon adhesive tape, comprise compound silica gel band body, high temperature gummed tape, pressure-sensitive adhesive coating, silicone oil paper, it is characterized in that: described pressure-sensitive adhesive coating is coated on a surface of compound silica gel band body uniformly, described silicone oil paper is pasted onto in pressure sensitive coatings, described high temperature gummed tape covers the another one surface of compound silica gel band body, and described high temperature gummed tape fusing point is 580 DEG C.
Description
Technical field
The utility model relates to silicone band field, especially relates to a kind of comprehensive silicon adhesive tape.
Background technology
Comprehensive silicon adhesive tape is widely used in the radiating treatment of electronic product, and comprehensive silicon adhesive tape on the market does not all have bonding force at present, and other adhesives often will be coordinated during use could to realize its adhesion function, is bonded together inconvenient and bonding insecure like this.
Utility model content
The technical problems to be solved in the utility model is: comprehensive silicon adhesive tape does not have bonding force, and other adhesives often will be coordinated during use could to realize its adhesion function, is bonded together inconvenient and bonding insecure like this.
Technical solution of the present utility model is: design a kind of comprehensive silicon adhesive tape, comprise compound silica gel band body 1, high temperature gummed tape 2, pressure-sensitive adhesive coating 3, silicone oil paper 4, it is characterized in that: described pressure-sensitive adhesive coating 3 is coated on one of them surface of compound silica gel band body 1 uniformly, and described silicone oil paper 4 is pasted onto in pressure sensitive coatings 3; Described high temperature gummed tape 2 covers the another one of compound silica gel band body 1 on the surface, and the fusing point of described high temperature gummed tape 2 is 580 DEG C.
Preferably, described compound silica gel tape wrapping is on plastic ring.
Preferably, the thickness of described high temperature gummed tape 2 is 0.01 ~ 0.02cm.
The utility model compared with prior art, has the following advantages:
A face of 1, comprehensive silicon adhesive tape of the present utility model scribbles pressure-sensitive adhesive coating, and the silicone oil paper tearing pressure-sensitive adhesive coating surface both can be bonded on the element that will use, convenient, fast, and convenient operation.
2, comprehensive silicon adhesive tape of the present utility model is on plastic ring or be pressed into strip, is convenient to transport and deposits.
3, described high temperature gummed tape can tolerate higher temperature, can damage silicone band body when temperature is too high, can avoid the generation of this phenomenon, protecting electronic component further when using high temperature gummed tape.
Accompanying drawing explanation
Fig. 1 is the sectional view of the comprehensive silicon adhesive tape of tool binding function.
Accompanying drawing illustrates:
1. compound silica gel band body
2. high temperature gummed tape
3. pressure-sensitive adhesive coating
4. silicone oil paper
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in Figure 1, a kind of comprehensive silicon adhesive tape, comprise compound silica gel band body 1, high temperature gummed tape 2, pressure-sensitive adhesive coating 3, silicone oil paper 4, it is characterized in that: described pressure-sensitive adhesive coating 3 is coated on one of them surface of compound silica gel band body 1 uniformly, and described silicone oil paper 4 is pasted onto in pressure sensitive coatings 3; Described high temperature gummed tape 2 covers the another one of compound silica gel band body 1 on the surface, and the fusing point of described high temperature gummed tape 2 is 580 DEG C.
Preferably, described compound silica gel tape wrapping is on plastic ring.
Preferably, the thickness of described high temperature gummed tape 2 is 0.01 ~ 0.02cm.
In Fig. 1, the upper and lower surface of compound silica gel band body 1 all scribbles one deck pressure-sensitive adhesive coating 3, has one deck silicone oil paper 4 in pressure-sensitive adhesive coating 3 surface coverage, during use, tears silicone oil paper 4 and both comprehensive silicon adhesive tape can be bonded in the place needing to use, convenient, fast; The effect of described high temperature gummed tape is that high-temperature device contacts with high temperature gummed tape when high-temperature operation; to burn the electronic devices and components will protected after compound silica gel band body through compound silica gel band body to prevent device; the thickness of high temperature silicon adhesive tape can not be too thick; if the too thick heat conduction being just unfavorable for the electronic devices and components that comprehensive silicon adhesive tape will be protected of the thickness of high temperature silicon adhesive tape; experiment proves, the thickness of described high temperature gummed tape 2 is 0.01 ~ 0.02cm.
Embodiment one:
A kind of comprehensive silicon adhesive tape, described comprehensive silicon adhesive tape comprises leads compound adhesive tape body 1, high temperature gummed tape 2, pressure-sensitive adhesive coating 3, silicone oil paper 4, it is characterized in that: described pressure-sensitive adhesive coating 3 is coated on a surface of compound silica gel band body 1 uniformly, and described silicone oil paper 4 covers in pressure sensitive coatings 3; Described high temperature gummed tape 2 covers the another one of compound silica gel band body 1 on the surface, and described compound silica gel tape wrapping is on plastic ring, and the thickness of described high temperature gummed tape 2 is 0.01cm.
Embodiment two:
A kind of comprehensive silicon adhesive tape, described comprehensive silicon adhesive tape comprises leads compound adhesive tape body 1, high temperature gummed tape 2, pressure-sensitive adhesive coating 3, silicone oil paper 4, it is characterized in that: described pressure-sensitive adhesive coating 3 is coated on the surface of compound silica gel band body 1 uniformly, described silicone oil paper 4 covers in pressure sensitive coatings 3; Described high temperature gummed tape 2 covers the another one of compound silica gel band body 1 on the surface, and described compound silica gel tape wrapping is on plastic ring, and the thickness of described high temperature gummed tape 2 is 0.02cm.
Claims (3)
1. a comprehensive silicon adhesive tape, comprise compound silica gel band body, high temperature gummed tape, pressure-sensitive adhesive coating, silicone oil paper, it is characterized in that: described pressure-sensitive adhesive coating is coated on one of them surface of compound silica gel band body uniformly, and described silicone oil paper is pasted onto in pressure sensitive coatings; Described high temperature gummed tape covers the another one of compound silica gel band body on the surface, and the fusing point of described high temperature gummed tape is 580 DEG C.
2. a kind of comprehensive silicon adhesive tape according to claim 1, is characterized in that: described compound silica gel tape wrapping is on plastic ring.
3. a kind of comprehensive silicon adhesive tape according to claim 1, is characterized in that: the thickness of described high temperature gummed tape is 0.01 ~ 0.02cm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520232143.5U CN204625535U (en) | 2015-04-17 | 2015-04-17 | A kind of comprehensive silicon adhesive tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520232143.5U CN204625535U (en) | 2015-04-17 | 2015-04-17 | A kind of comprehensive silicon adhesive tape |
Publications (1)
Publication Number | Publication Date |
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CN204625535U true CN204625535U (en) | 2015-09-09 |
Family
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Family Applications (1)
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CN201520232143.5U Active CN204625535U (en) | 2015-04-17 | 2015-04-17 | A kind of comprehensive silicon adhesive tape |
Country Status (1)
Country | Link |
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CN (1) | CN204625535U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10618254B2 (en) | 2018-03-05 | 2020-04-14 | Starj Llc | Reusable surface cover having silicon and one or more couplers |
-
2015
- 2015-04-17 CN CN201520232143.5U patent/CN204625535U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10618254B2 (en) | 2018-03-05 | 2020-04-14 | Starj Llc | Reusable surface cover having silicon and one or more couplers |
US11511518B2 (en) | 2018-03-05 | 2022-11-29 | Starj Llc | Wearable surface cover and method of manufacture |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518106, Gongming office, Guangming District, Guangdong, Shenzhen, will be on the first floor, No. 15, Yau Ma Tei Industrial Park, Shek Wai community, Shek Wai Patentee after: Shenzhen Han Yuxin Polytron Technologies Inc Address before: 518106, Gongming office, Guangming District, Guangdong, Shenzhen, will be on the first floor, No. 15, Yau Ma Tei Industrial Park, Shek Wai community, Shek Wai Patentee before: SHENZHEN HANYUXIN ELECTRONICS TECHNOLOGY CO., LTD. |