CN204625535U - A kind of comprehensive silicon adhesive tape - Google Patents

A kind of comprehensive silicon adhesive tape Download PDF

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Publication number
CN204625535U
CN204625535U CN201520232143.5U CN201520232143U CN204625535U CN 204625535 U CN204625535 U CN 204625535U CN 201520232143 U CN201520232143 U CN 201520232143U CN 204625535 U CN204625535 U CN 204625535U
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CN
China
Prior art keywords
high temperature
silica gel
tape
temperature gummed
band body
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Application number
CN201520232143.5U
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Chinese (zh)
Inventor
南海成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Han Yuxin Polytron Technologies Inc
Original Assignee
SHENZHEN HANYUXIN ELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN201520232143.5U priority Critical patent/CN204625535U/en
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  • Adhesives Or Adhesive Processes (AREA)

Abstract

The utility model discloses a kind of comprehensive silicon adhesive tape, comprise compound silica gel band body, high temperature gummed tape, pressure-sensitive adhesive coating, silicone oil paper, it is characterized in that: described pressure-sensitive adhesive coating is coated on a surface of compound silica gel band body uniformly, described silicone oil paper is pasted onto in pressure sensitive coatings, described high temperature gummed tape covers the another one surface of compound silica gel band body, and described high temperature gummed tape fusing point is 580 DEG C.

Description

A kind of comprehensive silicon adhesive tape
Technical field
The utility model relates to silicone band field, especially relates to a kind of comprehensive silicon adhesive tape.
Background technology
Comprehensive silicon adhesive tape is widely used in the radiating treatment of electronic product, and comprehensive silicon adhesive tape on the market does not all have bonding force at present, and other adhesives often will be coordinated during use could to realize its adhesion function, is bonded together inconvenient and bonding insecure like this.
Utility model content
The technical problems to be solved in the utility model is: comprehensive silicon adhesive tape does not have bonding force, and other adhesives often will be coordinated during use could to realize its adhesion function, is bonded together inconvenient and bonding insecure like this.
Technical solution of the present utility model is: design a kind of comprehensive silicon adhesive tape, comprise compound silica gel band body 1, high temperature gummed tape 2, pressure-sensitive adhesive coating 3, silicone oil paper 4, it is characterized in that: described pressure-sensitive adhesive coating 3 is coated on one of them surface of compound silica gel band body 1 uniformly, and described silicone oil paper 4 is pasted onto in pressure sensitive coatings 3; Described high temperature gummed tape 2 covers the another one of compound silica gel band body 1 on the surface, and the fusing point of described high temperature gummed tape 2 is 580 DEG C.
Preferably, described compound silica gel tape wrapping is on plastic ring.
Preferably, the thickness of described high temperature gummed tape 2 is 0.01 ~ 0.02cm.
The utility model compared with prior art, has the following advantages:
A face of 1, comprehensive silicon adhesive tape of the present utility model scribbles pressure-sensitive adhesive coating, and the silicone oil paper tearing pressure-sensitive adhesive coating surface both can be bonded on the element that will use, convenient, fast, and convenient operation.
2, comprehensive silicon adhesive tape of the present utility model is on plastic ring or be pressed into strip, is convenient to transport and deposits.
3, described high temperature gummed tape can tolerate higher temperature, can damage silicone band body when temperature is too high, can avoid the generation of this phenomenon, protecting electronic component further when using high temperature gummed tape.
Accompanying drawing explanation
Fig. 1 is the sectional view of the comprehensive silicon adhesive tape of tool binding function.
Accompanying drawing illustrates:
1. compound silica gel band body
2. high temperature gummed tape
3. pressure-sensitive adhesive coating
4. silicone oil paper
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in Figure 1, a kind of comprehensive silicon adhesive tape, comprise compound silica gel band body 1, high temperature gummed tape 2, pressure-sensitive adhesive coating 3, silicone oil paper 4, it is characterized in that: described pressure-sensitive adhesive coating 3 is coated on one of them surface of compound silica gel band body 1 uniformly, and described silicone oil paper 4 is pasted onto in pressure sensitive coatings 3; Described high temperature gummed tape 2 covers the another one of compound silica gel band body 1 on the surface, and the fusing point of described high temperature gummed tape 2 is 580 DEG C.
Preferably, described compound silica gel tape wrapping is on plastic ring.
Preferably, the thickness of described high temperature gummed tape 2 is 0.01 ~ 0.02cm.
In Fig. 1, the upper and lower surface of compound silica gel band body 1 all scribbles one deck pressure-sensitive adhesive coating 3, has one deck silicone oil paper 4 in pressure-sensitive adhesive coating 3 surface coverage, during use, tears silicone oil paper 4 and both comprehensive silicon adhesive tape can be bonded in the place needing to use, convenient, fast; The effect of described high temperature gummed tape is that high-temperature device contacts with high temperature gummed tape when high-temperature operation; to burn the electronic devices and components will protected after compound silica gel band body through compound silica gel band body to prevent device; the thickness of high temperature silicon adhesive tape can not be too thick; if the too thick heat conduction being just unfavorable for the electronic devices and components that comprehensive silicon adhesive tape will be protected of the thickness of high temperature silicon adhesive tape; experiment proves, the thickness of described high temperature gummed tape 2 is 0.01 ~ 0.02cm.
Embodiment one:
A kind of comprehensive silicon adhesive tape, described comprehensive silicon adhesive tape comprises leads compound adhesive tape body 1, high temperature gummed tape 2, pressure-sensitive adhesive coating 3, silicone oil paper 4, it is characterized in that: described pressure-sensitive adhesive coating 3 is coated on a surface of compound silica gel band body 1 uniformly, and described silicone oil paper 4 covers in pressure sensitive coatings 3; Described high temperature gummed tape 2 covers the another one of compound silica gel band body 1 on the surface, and described compound silica gel tape wrapping is on plastic ring, and the thickness of described high temperature gummed tape 2 is 0.01cm.
Embodiment two:
A kind of comprehensive silicon adhesive tape, described comprehensive silicon adhesive tape comprises leads compound adhesive tape body 1, high temperature gummed tape 2, pressure-sensitive adhesive coating 3, silicone oil paper 4, it is characterized in that: described pressure-sensitive adhesive coating 3 is coated on the surface of compound silica gel band body 1 uniformly, described silicone oil paper 4 covers in pressure sensitive coatings 3; Described high temperature gummed tape 2 covers the another one of compound silica gel band body 1 on the surface, and described compound silica gel tape wrapping is on plastic ring, and the thickness of described high temperature gummed tape 2 is 0.02cm.

Claims (3)

1. a comprehensive silicon adhesive tape, comprise compound silica gel band body, high temperature gummed tape, pressure-sensitive adhesive coating, silicone oil paper, it is characterized in that: described pressure-sensitive adhesive coating is coated on one of them surface of compound silica gel band body uniformly, and described silicone oil paper is pasted onto in pressure sensitive coatings; Described high temperature gummed tape covers the another one of compound silica gel band body on the surface, and the fusing point of described high temperature gummed tape is 580 DEG C.
2. a kind of comprehensive silicon adhesive tape according to claim 1, is characterized in that: described compound silica gel tape wrapping is on plastic ring.
3. a kind of comprehensive silicon adhesive tape according to claim 1, is characterized in that: the thickness of described high temperature gummed tape is 0.01 ~ 0.02cm.
CN201520232143.5U 2015-04-17 2015-04-17 A kind of comprehensive silicon adhesive tape Active CN204625535U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520232143.5U CN204625535U (en) 2015-04-17 2015-04-17 A kind of comprehensive silicon adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520232143.5U CN204625535U (en) 2015-04-17 2015-04-17 A kind of comprehensive silicon adhesive tape

Publications (1)

Publication Number Publication Date
CN204625535U true CN204625535U (en) 2015-09-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520232143.5U Active CN204625535U (en) 2015-04-17 2015-04-17 A kind of comprehensive silicon adhesive tape

Country Status (1)

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CN (1) CN204625535U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10618254B2 (en) 2018-03-05 2020-04-14 Starj Llc Reusable surface cover having silicon and one or more couplers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10618254B2 (en) 2018-03-05 2020-04-14 Starj Llc Reusable surface cover having silicon and one or more couplers
US11511518B2 (en) 2018-03-05 2022-11-29 Starj Llc Wearable surface cover and method of manufacture

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GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 518106, Gongming office, Guangming District, Guangdong, Shenzhen, will be on the first floor, No. 15, Yau Ma Tei Industrial Park, Shek Wai community, Shek Wai

Patentee after: Shenzhen Han Yuxin Polytron Technologies Inc

Address before: 518106, Gongming office, Guangming District, Guangdong, Shenzhen, will be on the first floor, No. 15, Yau Ma Tei Industrial Park, Shek Wai community, Shek Wai

Patentee before: SHENZHEN HANYUXIN ELECTRONICS TECHNOLOGY CO., LTD.