CN205880416U - Base plate stripping off device - Google Patents

Base plate stripping off device Download PDF

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Publication number
CN205880416U
CN205880416U CN201620671956.9U CN201620671956U CN205880416U CN 205880416 U CN205880416 U CN 205880416U CN 201620671956 U CN201620671956 U CN 201620671956U CN 205880416 U CN205880416 U CN 205880416U
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China
Prior art keywords
suction nozzle
substrate
absorption platform
laser head
ultra
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CN201620671956.9U
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Chinese (zh)
Inventor
洪瑞
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to CN201620671956.9U priority Critical patent/CN205880416U/en
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Abstract

The utility model provides a base plate stripping off device, it is including being used for placing and adsorbing bearing substrate's suction table bearing substrate's top is equipped with mobilizable laser head and suction head, the laser head is used for melting the tie coat between ultra -thin or flexible base plate and the bearing substrate, the suction head is used for adsorbing the adhesive linkage and melts the back ultra -thin or flexible base plate. The utility model discloses can effectively improve ultra -thin or flexible base plate and bearing substrate's the success rate of peeling off.

Description

A kind of strippable substrate device
Technical field
This utility model relates to Display Technique field, is specifically related to a kind of strippable substrate device.
Background technology
Existing display product is substantially and produces based on rigid substrates, such as common TFT-LCD display and OLED display.Along with the requirement of consumer is more and more higher, ultrathin display can meet, with Flexible Displays, the need that consumer is different Ask.Current ultrathin products (below gross thickness 1mm) major part is to have produced afterwards by the side of chemical reduction at display screen Formula realizes, as thinning with HF acid solution.Our environment can be posed a big pressure by this mode of production, and dangerous.
The supplier of glass substrate for display attempt produce can the thinning substrate that just can meet demand, due to At the production link of display, needing ceaselessly to transport substrate, the problem on deformation of ultra thin substrate hinders it and applies on a large scale. It is below ultra thin substrate, increase holding of a piece of thickness 0.4-1.0mm to solve the existing frequently-used method of the problem of substrate deformation Carried base board, the problem that thus can solve flexible base board deformation.
It is generally to make both bond, in order to ensure FEOL with special material between bearing substrate and ultra thin substrate Smoothly completing, it is desirable to jointing material has certain bonding force, bearing substrate completes to need afterwards to take off at display manufacturing, this It is extremely difficult technique.First have to during separation ensure that bearing substrate is injury-free, it is possible to recycling is to reduce cost, more It is important to ensure that ultra thin substrate will not be destroyed peeling off when.
Utility model content
For defect of the prior art, this utility model provides a kind of strippable substrate device, it is possible to be effectively improved ultra-thin Or the stripping success rate of flexible base board and bearing substrate.
This utility model provides a kind of strippable substrate device, and it includes putting down for placing and adsorb the absorption of bearing substrate Platform, is arranged over moveable laser head and suction nozzle at described bearing substrate, and described laser head is used for melting ultra-thin or flexible Tack coat between substrate and bearing substrate, described suction nozzle is for adsorbing the described ultra-thin or flexible base board after adhesive linkage melts.
Wherein, described laser head is arranged on the top of described bearing substrate by portal frame, and described portal frame is across described The both lateral sides of absorption platform, and can move along the length direction of described absorption platform, described laser head can be along described portal frame Vertical or transverse shifting.
Wherein, described absorption platform be arranged over multiple rows of support, multiple rows of described support is along the length of described absorption platform Direction be arranged in parallel, and described suction nozzle is spaced along the length direction of described support, and each described suction nozzle can be along described support Lower movement.
Wherein, described absorption platform connect have vacuum absorption device, each described suction nozzle the most respectively with described vac sorb Device is connected.
Wherein, described suction nozzle is connected with described support by connecting tube, described suction nozzle by described connecting tube and described very Suction adsorption device connects.
Further, universal joint articulated is passed through at the middle part of described connecting tube.
Wherein, also include that Destaticizing device, described Destaticizing device are located at the both sides of described absorption platform.
Further, described Destaticizing device is ion wind gun.
Wherein, also including controlling device and lifting device, described control device is connected with described lifting device, described lifting Device is connected respectively with multiple described suction nozzles.
As shown from the above technical solution, this utility model uses absorption platform, laser head and suction nozzle to cooperate, and first passes through Absorption platform, by fixing for bearing substrate absorption, then send laser by laser head and reduces ultra-thin or flexible base board and carrying base Peel off the adhesion of position between plate, by suction nozzle absorption, ultra-thin or flexible base board and bearing substrate separated the most again, it is possible to Ensureing that ultra-thin or flexible base board is not destroyed when peeling off, bearing substrate is injury-free;Thus improve ultra-thin or flexible base board Stripping success rate with bearing substrate.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment Or the required accompanying drawing work one used simply is introduced in description of the prior art, it should be apparent that, the accompanying drawing in describing below is Embodiments more of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, Other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic perspective view of this utility model a kind of strippable substrate device;
Fig. 2 is the side view of this utility model a kind of strippable substrate device;
In figure: 1: absorption platform;2: bearing substrate;3: tack coat;4: ultra-thin or flexible base board;5: portal frame;6: laser Head;7: support;8: suction nozzle;9: connecting tube;10: universal joint.
Detailed description of the invention
For making the purpose of this utility model embodiment, technical scheme and advantage clearer, new below in conjunction with this practicality Accompanying drawing in type embodiment, is clearly and completely described the technical scheme in this utility model embodiment, it is clear that retouched The embodiment stated is a part of embodiment of this utility model rather than whole embodiments.Based on the enforcement in this utility model Example, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into The scope of this utility model protection.
As depicted in figs. 1 and 2, a kind of strippable substrate device provided for this utility model, it includes for placing and inhaling The absorption platform 1 of attached bearing substrate 2, makes bearing substrate 2 be fixed on absorption platform 1, being arranged over of described bearing substrate 2 Movably laser head 6 and suction nozzle 8, described laser head 6 is viscous for melt between ultra-thin or flexible base board 4 and bearing substrate 2 Knot layer 3, thus reduce ultra-thin or flexible base board 4 and bearing substrate 2 by laser and peel off the adhesion of position, described suction nozzle 8 For adsorbing the described ultra-thin or flexible base board 4 after adhesive linkage melts, by absorption by ultra-thin or flexible base board 4 and bearing substrate 2 separately, to promote ultra-thin or flexible base board 4 and the stripping success rate of bearing substrate 2.
As it is shown in figure 1, described laser head 6 is arranged on the top of described bearing substrate 2, described portal frame 5 by portal frame 5 Across the both lateral sides of described absorption platform 1, and can move along the length direction of described absorption platform 1, described laser head 6 can edge Described portal frame 5 is vertical or transverse shifting;To ensure that laser head 6 can move freely at the three of space moving direction, thus Ensure that laser head 6 can move to different positions as required.The quantity of laser head 6 can be one or more;Laser head 6 Optical maser wavelength select the wave band that is suitable for melting the binding material between bearing substrate 2 and ultra-thin or flexible base board 4.
During strippable substrate, the operation continuous lateral probe movement of laser head 6 is to melt tack coat 3 material, simultaneously along with stripping Off normal put change laser head 6 position change the most therewith.
Fix suction nozzle 8 for convenience, described absorption platform 1 be arranged over multiple rows of support 7 such as two rows, three rows etc., as Shown in Fig. 1, support 7 is two rows, can unrestricted choice as required;Multiple rows of described support 7 is along the length side of described absorption platform 1 To be arrangeding in parallel, described suction nozzle 8 is spaced along the length direction of described support 7, and interval can be carried out according to the size of substrate Regulation, each described suction nozzle 8 can move up and down along described support 7 so that each suction nozzle 8 can individually control rise height and Movement time.
Thering is provided pull of vacuum for absorption platform 1 and suction nozzle 8 for convenience, described absorption platform 1 connects vac sorb Device, each described suction nozzle 8 is connected with described vacuum absorption device the most respectively, the suction of absorption platform 1 the right and left same position 8 need guarantee to be synchronized with the movement, to ensure peeling force uniformity suffered by the ultra-thin or both sides of flexible base board 4.
Specifically, as in figure 2 it is shown, described suction nozzle 8 is connected with described support 7 by connecting tube 9, described suction nozzle 8 passes through institute State connecting tube 9 to be connected with described vacuum absorption device, conveniently provide pull of vacuum for described suction nozzle 8.
Further, the middle part of described connecting tube 9 is hinged by universal joint 10, facilitates described suction nozzle 8 can shell with substrate From direction free bend, to ensure good adsorption during substrate deformation.
The electrostatic produced during removing strippable substrate for convenience, is additionally provided with Destaticizing device, described Destaticizing device It is preferably disposed to the both sides of described absorption platform 1.Specifically, described Destaticizing device is preferably ion wind gun, to facilitate by blowing Sweep off and destatic.
It addition, also include controlling device and lifting device, described control device is connected with described lifting device, described lifting Device is connected respectively with multiple described suction nozzles, for control lifting speed, hoisting depth and the hoist-hole of suction nozzle every.
Below by a specific embodiment work process of the present utility model is described:
The glass substrate having made OLED is placed on absorption platform;Prepare upper strata with the ultra-thin base of device Plate is peeled off;
Adjust the spacing of suction nozzle, spacing is set as 10cm, and set carrying of speed and each suction nozzle in a program Rising distance, the lifting speed of suction nozzle is 30mm/min, and range of lift is 8cm, and the time interval that each suction nozzle promotes is set to 40- 60s;
Strippable substrate when, the bending stress of stretching can be produced, in order to not to the circuit on ultra thin substrate or other The performance of device produces impact, needs to ensure that disbondment radius, more than 4cm, can produce substantial amounts of quiet at stripping time due to stripping Electricity, these electrostatic are harmful for peeling off, and therefore need to open ion wind gun, to go to destatic in stripping process;
To be stripped complete after bearing substrate peeled off take out, and be carried out, to reuse reduction cost;
Ultra thin substrate can carry out follow-up cutting and module group procedure.
In description of the present utility model it should be noted that term " on ", the orientation of the instruction such as D score or position relationship For based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description rather than refer to Show or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not manage Solve as to restriction of the present utility model.Unless otherwise clearly defined and limited, term " is installed ", " being connected ", " connection " should do Broadly understood, connect for example, it may be fixing, it is also possible to be to removably connect, or be integrally connected;Can be to be mechanically connected, It can also be electrical connection;Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two element internals Connection.For the ordinary skill in the art, can understand that above-mentioned term is in this utility model as the case may be Concrete meaning.
In description of the present utility model, illustrate a large amount of detail.It is to be appreciated, however, that reality of the present utility model Execute example to put into practice in the case of there is no these details.In some instances, it is not shown specifically known method, knot Structure and technology, in order to do not obscure the understanding of this description.
Similarly, it will be appreciated that disclose to simplify this utility model and help to understand in each utility model aspect One or more, in description to exemplary embodiment of the present utility model above, each feature of the present utility model is sometimes It is grouped together in single embodiment, figure or descriptions thereof.But, the method for the disclosure should not explained in instead Reflect following intention: this utility model the most required for protection requires that the feature than being expressly recited in each claim is more Feature.More precisely, as the following claims reflect, utility model aspect is single less than disclosed above All features of embodiment.Therefore, it then follows claims of detailed description of the invention are thus expressly incorporated in this specific embodiment party Formula, the most each claim itself is as independent embodiment of the present utility model.
It should be noted that this utility model is illustrated rather than by above-described embodiment this utility model is limited, And those skilled in the art can design alternative embodiment without departing from the scope of the appended claims.In right In requirement, any reference marks that should not will be located between bracket is configured to limitations on claims.
Last it is noted that various embodiments above is only in order to illustrate the technical solution of the utility model, rather than it is limited System;Although being described in detail this utility model with reference to foregoing embodiments, those of ordinary skill in the art should Understand: the technical scheme described in foregoing embodiments still can be modified by it, or to the most some or all of Technical characteristic carries out equivalent;And these amendments or replacement, do not make the essence of appropriate technical solution depart from this practicality new The scope of type each embodiment technical scheme, it all should be contained in the middle of the scope of claim of the present utility model and description.

Claims (9)

1. a strippable substrate device, it is characterised in that include the absorption platform for placing and adsorb bearing substrate, described Bearing substrate be arranged over moveable laser head and suction nozzle, described laser head is used for melting ultra-thin or flexible base board and carrying Tack coat between substrate, described suction nozzle is for adsorbing the described ultra-thin or flexible base board after adhesive linkage melts.
Strippable substrate device the most according to claim 1, it is characterised in that described laser head is arranged on institute by portal frame Stating the top of bearing substrate, described portal frame, and can be along the length of described absorption platform across the both lateral sides of described absorption platform Degree direction is moved, described laser head can along described portal frame vertical or transverse shifting.
Strippable substrate device the most according to claim 1, it is characterised in that described absorption platform be arranged over multiple rows of Frame, multiple rows of described support be arranged in parallel along the length direction of described absorption platform, and described suction nozzle is along the length direction of described support Being spaced, each described suction nozzle can move up and down along described support.
Strippable substrate device the most according to claim 3, it is characterised in that described absorption platform connects has vac sorb to fill Putting, each described suction nozzle is connected with described vacuum absorption device the most respectively.
Strippable substrate device the most according to claim 4, it is characterised in that described suction nozzle is by connecting tube and described support Connecting, described suction nozzle is connected with described vacuum absorption device by described connecting tube.
Strippable substrate device the most according to claim 5, it is characterised in that the middle part of described connecting tube is cut with scissors by universal joint Connect.
Strippable substrate device the most according to claim 1, it is characterised in that also include Destaticizing device, described in destatic Device is located at the both sides of described absorption platform.
Strippable substrate device the most according to claim 7, it is characterised in that described Destaticizing device is ion wind gun.
Strippable substrate device the most according to claim 3, it is characterised in that also include controlling device and lifting device, institute Stating control device to be connected with described lifting device, described lifting device is connected respectively with multiple described suction nozzles.
CN201620671956.9U 2016-06-29 2016-06-29 Base plate stripping off device Active CN205880416U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019061719A1 (en) * 2017-09-29 2019-04-04 武汉华星光电半导体显示技术有限公司 Method for separating flexible oled display and flexible oled display
WO2019200611A1 (en) * 2018-04-20 2019-10-24 深圳市柔宇科技有限公司 Display panel laser lift-off method and laser lift-off apparatus
CN111085770A (en) * 2019-11-01 2020-05-01 深圳市华星光电半导体显示技术有限公司 Laser separation device and method for laser separation of thin film
CN113838778A (en) * 2021-09-03 2021-12-24 北京中科镭特电子有限公司 Laser bonding device that separates

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019061719A1 (en) * 2017-09-29 2019-04-04 武汉华星光电半导体显示技术有限公司 Method for separating flexible oled display and flexible oled display
WO2019200611A1 (en) * 2018-04-20 2019-10-24 深圳市柔宇科技有限公司 Display panel laser lift-off method and laser lift-off apparatus
CN111085770A (en) * 2019-11-01 2020-05-01 深圳市华星光电半导体显示技术有限公司 Laser separation device and method for laser separation of thin film
CN113838778A (en) * 2021-09-03 2021-12-24 北京中科镭特电子有限公司 Laser bonding device that separates
CN113838778B (en) * 2021-09-03 2023-12-05 北京中科镭特电子有限公司 Laser bonding device that breaks

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