CN110187580B - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN110187580B CN110187580B CN201910579037.7A CN201910579037A CN110187580B CN 110187580 B CN110187580 B CN 110187580B CN 201910579037 A CN201910579037 A CN 201910579037A CN 110187580 B CN110187580 B CN 110187580B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
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- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The invention discloses a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises a first substrate, the part of the first substrate corresponding to a non-display area comprises a first surface parallel to the display panel and a second surface vertical to the display panel, the second surface is positioned on one side of the first substrate far away from the display area, and the thickness of the part of the first substrate covered by the second surface is smaller than that of the part of the first substrate covered by the first surface; the first substrate further comprises a third surface connected with the first surface and the second surface, the display panel further comprises a plurality of connecting portions arranged on the second surface and a plurality of signal lines wired with the first surface through the third surface, and the connecting portions are electrically connected with the corresponding signal lines and transmit display signals through the corresponding signal lines. By the technical scheme, the realization of the narrow frame of the hard screen is facilitated, and the probability of disconnection of the signal line is reduced.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel, a manufacturing method of the display panel and a display device.
Background
With the development of the full-screen technology, the market demand for narrow-frame products is increasing, and reducing the frame size is an effective means for improving the screen occupation ratio of the display screen.
The COF (Chip On Flex) bending technology is to bend the COF to the back of the panel, but the lower frame of the display panel is still affected by the binding area, which is not favorable for realizing the narrow frame of the display panel.
Disclosure of Invention
The invention provides a display panel, a manufacturing method thereof and a display device, which are beneficial to realizing a narrow frame of a hard screen and reducing the probability of disconnection of a signal line.
In a first aspect, an embodiment of the present invention provides a display panel, including:
a display area and a non-display area located on at least one side of the display area;
the display panel further comprises a first substrate, wherein the part of the first substrate corresponding to the non-display area comprises a first surface parallel to the display panel and a second surface perpendicular to the display panel, the second surface is positioned on one side of the first substrate away from the display area, and the thickness of the part of the first substrate covered by the second surface is smaller than that of the part of the first substrate covered by the first surface;
the first substrate further comprises a third surface connected with the first surface and the second surface, the display panel further comprises a plurality of connecting portions arranged on the second surface and a plurality of signal lines routed through the third surface and the first surface, and the connecting portions are electrically connected with the corresponding signal lines and transmit display signals through the corresponding signal lines.
Further, the third surface forms an angle with the first surface and the second surface that is greater than 0 ° and less than 90 °;
preferably, the included angle between the third surface and the first surface and the included angle between the third surface and the second surface are greater than or equal to 30 ° and smaller than 60 °.
Further, the ratio of the thickness of the first substrate covered by the second surface to the thickness of the first substrate covered by the first surface is greater than or equal to 1:10 and smaller than 1: 1.
The difficulty of punching to form the third surface of the first substrate is reduced while facilitating the formation of the connection portion on the second surface.
Further, the display panel further includes:
the first part of the flexible circuit board is provided with a plurality of welding pads, the welding pads are correspondingly and electrically connected with the connecting parts, and the second part of the flexible circuit board is bent to the surface of the first substrate opposite to the first surface.
The width of the non-display area of the display panel along the direction in which the non-display area is arranged relative to the display area is further reduced, and the realization of the hard-screen narrow frame is facilitated.
In a second aspect, an embodiment of the present invention further provides a manufacturing method of a display panel, where the manufacturing method includes:
forming a first substrate; wherein the first substrate comprises a first surface and a second surface perpendicular to the first surface, and the thickness of the part of the first substrate covered by the second surface is smaller than that of the part of the first substrate covered by the first surface;
the first substrate forms the third surface via a punching process; wherein the third surface connects the first surface and the second surface, respectively;
forming a first patterned structure on a second surface of the first substrate; wherein the first patterned structure constitutes at least a connection portion; the second surface comprises a plurality of connecting parts and a plurality of signal wires which are routed with the first surface through the third surface.
Further, the forming the first substrate includes:
providing a second substrate; wherein the second substrate is a substrate corresponding to the plurality of display panels;
performing a punching process on a portion of the second substrate corresponding to each of the display panels to form the third surface;
cutting the second substrate in a direction perpendicular to the second substrate to form a plurality of first substrates; wherein the cutting location is at a junction of the second surface and the third surface.
So that the cut first substrate has a second surface perpendicular to the first substrate and a third surface connecting the first surface and the second surface.
Further, the perforating a portion of the second substrate corresponding to each of the display panels to form the third surface includes:
punching the second substrate to form the connection hole corresponding to each display panel, wherein one display panel comprises one connection hole, and the third surface of the first substrate of the corresponding display panel is exposed in the connection hole; wherein the signal line is routed through the connection hole.
Further, before cutting the second substrate in a direction perpendicular to the second substrate to form a plurality of first substrates, the fabrication method further includes:
forming a second patterned structure on the first surface of the second substrate corresponding to each of the display panel portions and forming a full-face structure in the connection hole; wherein the second patterned structure constitutes a part of the signal line on the first surface.
When a part of the signal line on the first surface is manufactured, the material constituting the signal line flows into the connection hole, and a whole surface structure having the same shape as the connection hole is formed in the connection hole.
Further, when the first patterned structure is formed on the second surface of the first substrate, a third patterned structure is formed on the third surface of the first substrate; wherein the third patterned structure constitutes a part of the signal line on the third surface;
the forming a third patterned structure on a third surface of the first substrate comprises:
forming a repair structure on at least a portion of the third surface of the first substrate;
etching the repairing structure on the third surface to form a repairing circuit, and etching the whole-surface-shaped structure on the third surface to form a fourth patterning structure; the repair circuit and the fourth patterned structure form the third patterned structure.
So that the third surface forms a complete signal line, the disconnection probability of the signal line electrically connected with the connecting part is greatly reduced, and the influence of the disconnection of the signal line on the display effect of the display panel is further reduced.
In a third aspect, an embodiment of the present invention further provides a display device, including the display panel according to the first aspect or the display panel manufactured by the manufacturing method of the display panel according to the second aspect.
The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises a first substrate, the part of the first substrate corresponding to a non-display area comprises a first surface parallel to the display panel and a second surface vertical to the display panel, the second surface is positioned at one side of the first substrate far away from the display area, the thickness of the part of the first substrate covered by the second surface is smaller than that of the part of the first substrate covered by the first surface, the first substrate also comprises a third surface connecting the first surface and the second surface, the display panel also comprises a plurality of connecting parts arranged on the second surface and a plurality of signal lines wired with the first surface through the third surface, the connecting parts are electrically connected with corresponding signal lines and transmit display signals to the display area through the corresponding signal lines, the width of the non-display area of the display panel is greatly shortened, and the realization of a narrow frame of a hard screen is facilitated, meanwhile, the probability of the disconnection of the signal line is reduced.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the present invention;
fig. 2 is a schematic top view of a display panel according to an embodiment of the present invention;
fig. 3 is a schematic side view of a display panel according to an embodiment of the invention;
fig. 4 is a schematic flowchart illustrating a manufacturing method of a display panel according to an embodiment of the present invention;
fig. 5 is a schematic flow chart of a method for manufacturing a first substrate according to an embodiment of the present invention;
fig. 6 to 8 are schematic cross-sectional views corresponding to steps of the manufacturing method shown in fig. 5;
fig. 9 is a manufacturing method of another display panel according to an embodiment of the invention;
fig. 10 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures. Throughout this specification, the same or similar reference numbers refer to the same or similar structures, elements, or processes. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The embodiment of the invention provides a display panel, which comprises a display area and a non-display area positioned on at least one side of the display area, wherein the display panel also comprises a first substrate, the part of the first substrate corresponding to the non-display area comprises a first surface parallel to the display panel and a second surface vertical to the display panel, the second surface is positioned on one side of the first substrate far away from the display area, and the thickness of the part of the first substrate covered by the second surface is smaller than that of the part of the first substrate covered by the first surface. The first substrate further comprises a third surface which is connected with the first surface and the second surface, the display panel further comprises a plurality of connecting parts which are arranged on the second surface and a plurality of signal wires which are wired with the first surface through the third surface, and the connecting parts are electrically connected with the corresponding signal wires and transmit display signals to the display area through the corresponding signal wires.
COF (Chip On Flex, cover the Chip film) technique of buckling is to the screen body back with COF buckle, in order to reduce the width of display panel lower frame, but display panel's lower frame still receives the influence of binding the district, make the width of lower frame can't shorten again, to flexible display panel, can buckle to the screen body back in order to shorten the width of display panel lower frame with binding the district, but hard screen is owing to receive the restriction of factors such as glass elastic modulus, can't use the district technique of buckling of binding in the flexible screen, lead to the lower frame width of hard screen great, be unfavorable for the realization of the narrow frame of display panel.
In the embodiment of the invention, a side binding technology is adopted, namely, the connecting part is arranged on the second surface of the first substrate, so that the width of a non-display area of the display panel is greatly shortened (namely the length in the non-display area along the extending direction of the display area to the non-display area), the realization of a narrow frame of a hard screen is facilitated, in addition, the third surface is arranged, the third surface is connected with the first surface and the second surface, a signal wire electrically connected with the connecting part is wired through the inclined third surface which is connected with the first surface and the second surface, the signal wire on the third surface formed when the signal wire on the first surface is manufactured is probably incomplete, and the third surface is the inclined surface, so that the signal wire on the third surface can be repaired to form a complete structure when the connecting part on the second surface is manufactured, and the probability of the wire breakage of the signal wire on the third surface is reduced, and then the probability of the disconnection of the signal wire is reduced, so that the radian of the transition from the second surface of the first substrate to the first surface is optimized by the punched third surface, and the disconnection probability of the signal wire is further reduced. The above is the core idea of the present invention, and the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Fig. 1 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the present invention, fig. 2 is a schematic top-view structure diagram of a display panel according to an embodiment of the present invention, and fig. 3 is a schematic side-view structure diagram of a display panel according to an embodiment of the present invention. Referring to fig. 1 to 3, the display panel includes a display area AA and a non-display area NAA located at least one side of the display area AA, where only the non-display area NAA located at one side of the display area AA is shown, and the non-display area NAA may correspond to a lower frame of the display panel.
The display panel further comprises a first substrate 1, a portion of the first substrate 1 corresponding to the non-display area NAA comprises a first surface a parallel to the display panel, i.e. an upper surface of the first substrate 1, and a second surface B perpendicular to the display panel, i.e. a side surface of the first substrate 1, the second surface B is located on a side of the first substrate 1 away from the display area AA, i.e. along a setting direction XX' of the non-display area NAA relative to the display area AA, a thickness of a portion of the first substrate 1 covered by the second surface B is smaller than a thickness of a portion of the first substrate 1 covered by the first surface a, i.e. a thickness of the first substrate 1 corresponding to the second surface B is smaller than a thickness of the first substrate 1 corresponding to the first surface a, i.e. along a direction perpendicular to the first substrate 1, a thickness of the first substrate 1 corresponding to the second surface B is smaller than a thickness of the first substrate 1 corresponding to the first surface a.
The first substrate 1 further includes a third surface C, the third surface C connects the first surface a and the second surface B, it should be noted that the display panel does not include the portion 12 in fig. 1 after being manufactured, the portion 12 shown in fig. 1 is only one implementation manner for embodying the third surface C, that is, the display panel is formed by a punching process, because the second surface B is located on a side of the first substrate 1 away from the display area AA and the thickness of the portion of the first substrate 1 covered by the second surface B is smaller than the thickness of the portion of the first substrate 1 covered by the first surface a, the third surface C forms an inclined plane as shown in fig. 1, the display panel further includes a plurality of connection portions 2 disposed on the second surface B and a plurality of signal lines 3 routed through the third surface C and the first surface a, and the connection portions 2 are electrically connected with the corresponding signal lines 3 and transmit display signals through the corresponding signal lines 3.
For example, referring to fig. 1 to fig. 3, the first substrate 1 may be a glass substrate, taking the display panel as an organic light emitting display panel as an example, the first substrate 1 disposed corresponding to the display area AA is provided with a structure of an organic light emitting display device 10, a thin film encapsulation layer 11, and the like, the second surface B of the first substrate 1 is provided with a plurality of connection portions 2, and a driving chip (not shown in the figure) transmits display signals through the plurality of connection portions 2 and signal lines 3 disposed in one-to-one correspondence with the connection portions 2, for example, may transmit data signals to the display area AA of the display panel or transmit clock signals to the non-display area NAA of the display panel.
With reference to fig. 1 to 3, by providing the connecting portions 2 for bonding with the driving chip on the second surface B of the first substrate 1, and the connecting portions 2 transmit the display signals through the plurality of signal lines 3 routed through the third surface C and the first surface a, while the connecting portions 2 are electrically connected to transmit the display signals, the width of the non-display area NAA of the display panel along the setting direction XX' of the non-display area NAA with respect to the display area AA is greatly reduced by using the side-bonding technique, that is, the size of d1 in fig. 1 is greatly reduced, which is beneficial for realizing the narrow bezel of the hard screen, in addition, the first substrate 1 is provided to include the third surface C, which connects the first surface a and the second surface B, that is, the first substrate 1 is provided to include the third surface C, the signal lines 3 electrically connected with the connecting portions 2 are routed through the third surface C, and the signal lines 3 formed on the third surface C when the signal lines 3 on the first surface a are manufactured may be incomplete, because the third surface C is an inclined surface, it is beneficial to repair the signal line 3 on the third surface C when the connecting portion 2 on the second surface B is manufactured, so that the probability of the disconnection of the signal line 3 on the third surface C is greatly reduced, and further, the probability of the disconnection of the signal line 3 is reduced.
Optionally, an included angle between the third surface C and the first surface a and the second surface B is greater than 0 ° and smaller than 90 °, so that the radian of the transition from the second surface B of the first substrate 1 to the first surface a is optimized by the punched third surface C, and the disconnection probability of the signal line 3 is further reduced. Preferably, an included angle between the third surface C and the first surface a and the second surface B is greater than or equal to 30 ° and less than 60 °, specifically, the plurality of connecting portions 2 are disposed on the second surface B of the first substrate 1, and the signal line 3 electrically connected to the connecting portions 2 and used for transmitting the display signal is routed through the third surface C, so that the radian of the transition from the second surface B of the first substrate 1 to the first surface a is further optimized, the bending angle of the first substrate 1 from the second surface B to the third surface C and from the third surface C to the first surface a is uniformly changed, a sudden change of the bending angle of the first substrate 1 from the second surface B to the third surface C and from the third surface C to the first surface a is avoided, the probability of the disconnection of the signal line 3 is further reduced, and further, the influence of the disconnection of the signal line 3 on the display effect of the display panel is reduced. Alternatively, with reference to fig. 1 to 3, the ratio of the thickness of the portion of the first substrate 1 covered by the second surface B to the thickness of the portion of the first substrate 1 covered by the first surface a may be set to be greater than or equal to 1:10 and less than 1: 1. Specifically, with reference to fig. 1 to 3, too small a thickness of a portion of the first substrate 1 covered by the second surface B is not favorable for forming the connection portion 2 on the second surface B, too large a thickness of a portion of the first substrate 1 covered by the second surface B makes a portion 12 smaller, which increases the difficulty of the process of forming the third surface C of the first substrate 1 by punching, and setting the ratio of the thickness of the portion of the first substrate 1 covered by the second surface B to the thickness of the portion of the first substrate 1 covered by the first surface a to be greater than or equal to 1:10 and less than 1:1 reduces the difficulty of punching to form the third surface C of the first substrate 1 while facilitating formation of the connection portion 2 on the second surface B.
Optionally, with reference to fig. 1 to fig. 3, the display panel may further include a flexible circuit board 4, the first portion 41 of the flexible circuit board 4 is provided with a plurality of pads (not shown in the figure), the pads are electrically connected to the connection portions 2 on the second surface B of the first substrate 1, and the second portion 42 of the flexible circuit board 4 is bent to a surface of the first substrate 1 opposite to the first surface a. Specifically, a driving chip may be disposed on the flexible circuit board 4, and the driving chip transmits the display signal to the connecting portion 2 disposed on the second surface B of the first substrate 1 through the flexible circuit board 4 and the plurality of pads on the first portion 41 of the flexible circuit board 4, so as to transmit the display signal to the display panel. The driving chip may be disposed on the second portion 42 of the flexible circuit board 4, and the second portion 42 of the flexible circuit board 4 is bent to a surface of the first substrate 1 opposite to the first surface a, so that the driving chip is also bent to a surface of the first substrate 1 opposite to the first surface a, that is, a lower surface of the first substrate 1, and a width of the non-display area NAA of the display panel (that is, a length in the non-display area NAA in a direction along which the display area AA extends to the non-display area NAA) is further reduced, which is beneficial to implementing a narrow bezel of a hard screen. In addition, the display panel may further include a first flexible circuit board 40, and the flexible circuit board 4 may be electrically connected to the first flexible circuit board 40, and the first flexible circuit board is fixed to the lower surface of the first substrate 1 by a fixing structure 400.
Fig. 4 is a schematic flow chart of a manufacturing method of a display panel according to an embodiment of the present invention, the manufacturing method is used for manufacturing the display panel according to the above embodiment, and as shown in fig. 4, the manufacturing method of the display panel includes:
s10, forming a first substrate; wherein the first substrate forms the third surface via a punching process.
With reference to fig. 1 to fig. 3, a first substrate 1 is formed, a hole punching process may be performed on the first substrate 1 to form a third surface C, a hole is punched to form a connection hole 13, and the third surface C of the first substrate 1 is exposed in the connection hole 13, optionally, fig. 5 is a schematic flow chart of a method for manufacturing the first substrate according to an embodiment of the present invention, and as shown in fig. 5, the forming the first substrate includes:
s101, providing a second substrate, wherein the second substrate corresponds to a plurality of display panels.
Specifically, as shown in fig. 6, a second substrate 5 is provided, the second substrate 5 being a substrate corresponding to a plurality of display panels, and a portion between two broken lines in fig. 6 corresponds to one display panel.
And S102, perforating a part of the second substrate corresponding to each display panel to form a third surface.
Specifically, as shown in fig. 7, a punching process is performed on a portion of the second substrate 5 corresponding to each display panel to form the third surface C, and then the display panel may be used as a processing unit to punch holes at corresponding positions of the second substrate 5 to form the punched hole shape in fig. 7, where a slope formed by punching is the third surface C corresponding to the first substrate 1.
Optionally, with reference to fig. 1 to 7, performing a punching process on a portion of the second substrate 5 corresponding to each display panel to form the third surface C includes punching the second substrate 5 to form a connection hole 13 corresponding to each display panel, where one display panel includes one connection hole 13, the third surface C of the first substrate 1 of the corresponding display panel is exposed in the connection hole 13, and the signal lines 3 are routed through the connection hole 13.
S103, cutting the second substrate along a direction vertical to the second substrate to form a plurality of first substrates; wherein the cutting location is located at a junction of the second surface and the third surface.
Specifically, as shown in fig. 8, the second substrate 5 is cut in a direction perpendicular to the second substrate 5 to form a plurality of first substrates 1, the cutting position is located at a junction of the second surface B and the third surface C, the second substrate 5 is cut along a dotted line position in fig. 7 to form a plurality of first substrates 1 shown in fig. 8, and the cut first substrates 1 have a second surface B perpendicular to the first substrates 1 and a third surface C connecting the first surface a and the second surface B.
It can be known that the thickness of the part of the first substrate 1 covered by the second surface B of the display panel is smaller than the thickness of the part of the first substrate 1 covered by the first surface a, the thickness of the second surface B corresponding to the first substrate 1 is smaller than the thickness of the first substrate 1 corresponding to the first surface a, and the inclined hole 13 of the connection hole formed by punching penetrates through the upper right corner of the first substrate 1, so that the part 12 of the first substrate 1 is removed after the first substrate 1 is cut and formed, and the third surface C of the first substrate 1 is exposed to facilitate the manufacture of the signal line 3 on the third surface C.
Alternatively, before cutting the second substrate in a direction perpendicular to the second substrate to form the plurality of first substrates, the manufacturing method may further include forming a second patterned structure on the first surface of the second substrate corresponding to each display panel portion and forming a full-face structure in the connection hole, the second patterned structure constituting a portion of the signal line on the first surface.
Specifically, referring to fig. 1, 2 and 7, before the second substrate 5 is cut in a direction perpendicular to the second substrate 5 to form a plurality of first substrates 1, a punching process has been performed on a portion of the second substrate 5 corresponding to each display panel to form a third surface C of the first substrate 1, a second patterned structure 62 may be formed on the first surface a of the second substrate 5 corresponding to each display panel portion and a full-face structure may be formed in the connection hole 13, the second patterned structure 62 constitutes a portion of the signal line 3 on the first surface a, the connection hole 13 corresponding to a portion of the second substrate 5 corresponding to each display panel is a through hole, when a portion of the signal line 3 on the first surface a is manufactured, a material constituting the signal line 3 flows into the connection hole 13, a full-face structure having the same shape as the connection hole 13 is formed in the connection hole 13, the second patterned structure 62 and the full-face structure are manufactured before the second substrate 5 is cut to form the first substrates 1.
S11, forming a first patterned structure on the second surface of the first substrate; wherein the first patterned structure at least constitutes the connecting portion.
Specifically, with reference to fig. 1 and 3 and fig. 8, after the second substrate 5 is cut to form the first substrate 1, the second surface B of the first substrate 1 is exposed, the first patterned structure 61 is formed on the second surface B of the first substrate 1, the first patterned structure 61 at least constitutes the connection portion 2, and at least a portion of the signal line 3 electrically connected to the connection portion 2 may also be formed on the second surface B, so that the first patterned structure 61 constitutes the connection portion 2 and the portion of the signal line 3.
Alternatively, with reference to fig. 1 to 3 and fig. 7 and 8, when forming the first patterned structure 61 on the second surface B of the first substrate 1, a third patterned structure 63 may be formed on the third surface C of the first substrate 1, the third patterned structure 63 constituting a part of the signal line 3 on the third surface C, and the forming the third patterned structure 63 on the third surface C of the first substrate 1 includes:
forming a repair structure on at least a part of the third surface C of the first substrate 1, etching the repair structure on the third surface C to form a repair line, and etching the full-face structure on the third surface C to form a fourth patterned structure, wherein the repair line and the fourth patterned structure form a third patterned structure 63.
Specifically, before the second substrate 5 is cut to form the first substrate 1, a full-face structure is formed in the third surface C of each display panel portion corresponding to the second substrate 5, that is, in the connection hole 13, there may be a case that the formed full-face structure cannot completely fill the connection hole 13, and when the full-face structure is etched to form the signal line 3 on the third surface C, the full-face structure cannot form the full signal line 3 as shown in fig. 2, so that the signal line 3 electrically connected to the connection portion 2 is disconnected, which affects the normal display effect of the display panel.
After the plurality of first substrates 1 are cut and formed on the second substrate 5, the second surface B of the first substrate 1 is exposed, and the arrangement of the third surface C formed by punching enables the incomplete signal line 3 on the third surface C to be repaired when the first patterned structure 61 of the second surface B is fabricated, for example, a repairing structure is formed at a position where the third surface C of the first substrate 1 is not covered by the full-face structure, or the repairing structure may be a full-face repairing structure, and then the full-face structure formed before cutting the second substrate 5 and the full-face repairing structure formed before cutting the second substrate 5 may be arranged to cover the third surface C, and the full-face structure formed before cutting the second substrate 5 and the full-face repairing structure formed before etching respectively form a fourth patterned structure and a repairing line to form a part of the signal line 3 on the third surface C, that is, namely, a third patterned structure 63, so that the third surface C forms a complete signal line 3 as shown in fig. 2, thereby greatly reducing the disconnection probability of the signal line 3 electrically connected with the connecting part 2, and further reducing the influence of the disconnection of the signal line 3 on the display effect of the display panel.
Fig. 9 is a schematic diagram illustrating another method for manufacturing a display panel according to an embodiment of the present invention, which is based on the method for manufacturing a display panel shown in fig. 4, and after forming a first patterned structure on a second surface of a first substrate, the method for manufacturing a display panel further includes attaching a first portion of a flexible circuit board to the second surface of the first substrate; the bonding pad arranged on the first part of the flexible circuit board is electrically connected with the connecting part correspondingly; bending the second portion of the flexible circuit board to a surface of the first substrate opposite to the first surface, as shown in fig. 9, the manufacturing method includes:
s20, forming a first substrate; wherein the first substrate forms the third surface via a punching process.
S21, forming a first patterned structure on the second surface of the first substrate; wherein the first patterned structure at least constitutes the connecting portion.
S22, attaching the first part of the flexible circuit board to the second surface of the first substrate; the bonding pad arranged on the first part of the flexible circuit board is electrically connected with the connecting part correspondingly.
Specifically, with reference to fig. 1 to 3, the display panel may further include a flexible circuit board 4, a first portion 41 of the flexible circuit board 4 is provided with a plurality of pads, the first portion 41 of the flexible circuit board 4 is attached to the second surface B of the first substrate 1, that is, the pads of the first portion 41 of the flexible circuit board 4 are correspondingly electrically connected to the connecting portion 2, a driving chip may be disposed on the flexible circuit board 4, and the driving chip transmits a display signal to the connecting portion 2 disposed on the second surface B of the first substrate 1 through the flexible circuit board 4 and the plurality of pads of the first portion 41 of the flexible circuit board 4, so as to transmit the display signal to the display panel.
And S23, bending the second part of the flexible circuit board to the surface of the first substrate opposite to the first surface.
Specifically, with reference to fig. 1 to 3, the driving chip may be disposed on the second portion 42 of the flexible circuit board 4, and the second portion 42 of the flexible circuit board 4 is bent to a surface of the first substrate 1 opposite to the first surface a, so that the driving chip is also bent to a surface of the first substrate 1 opposite to the first surface a, that is, a lower surface of the first substrate 1, thereby further reducing a width of the non-display area NAA of the display panel along the non-display area NAA in the setting direction XX' relative to the display area AA, and facilitating implementation of a hard-screen narrow bezel.
The manufacturing method of the display panel provided by the embodiment of the invention enables the display panel to realize the side binding technology, greatly shortens the width of the non-display area NAA of the display panel along the setting direction XX' of the non-display area NAA relative to the display area AA, is favorable for realizing a hard-screen narrow frame, and is favorable for repairing the signal line 3 on the third surface C when the connecting part 2 on the second surface B is manufactured by the punched third surface C, thereby reducing the probability of the disconnection of the signal line 3.
An embodiment of the present invention further provides a display device, and fig. 10 is a schematic structural diagram of the display device provided in the embodiment of the present invention. As shown in fig. 10, the display device 20 includes the display panel 19 according to the above embodiment, so that the display device 20 according to the embodiment of the present invention also has the beneficial effects described in the above embodiment, and further description is omitted here. For example, the display device 20 may be an organic light emitting display device, or may be a liquid crystal display device, the display device 20 may be a mobile phone, or may be an electronic device such as a computer or a wearable device, and the specific form of the display device is not limited in the embodiment of the present invention.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments illustrated herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (11)
1. A display panel, comprising:
a display area and a non-display area located on at least one side of the display area;
the display panel further comprises a first substrate, the part of the first substrate corresponding to the non-display area comprises a first surface parallel to the display panel and a second surface perpendicular to the display panel, the second surface is positioned on one side of the first substrate away from the display area, and the thickness of the part of the first substrate covered by the second surface is smaller than that of the part of the first substrate covered by the first surface; forming a second patterned structure on the first surface of the display panel part; wherein the second patterned structure constitutes a portion of a signal line on the first surface;
the first substrate further comprises a third surface connecting the first surface and the second surface, the display panel further comprises a plurality of connecting parts arranged on the second surface and a plurality of signal lines routed with the first surface through the third surface, and the connecting parts are electrically connected with the corresponding signal lines and transmit display signals through the corresponding signal lines;
at least part of the third surface of the first substrate is provided with a repairing structure, the repairing structure forms a repairing circuit, and the repairing circuit forms part of the signal lines on the third surface.
2. The display panel according to claim 1, wherein the third surface is at an angle greater than 0 ° and less than 90 ° with respect to the first surface and the second surface.
3. The display panel according to claim 1, wherein an angle between the third surface and the first surface and an angle between the third surface and the second surface are greater than or equal to 30 ° and less than 60 °.
4. The display panel according to claim 1, wherein a ratio of a thickness of the portion of the first substrate covered with the second surface to a thickness of the portion of the first substrate covered with the first surface is 1:10 or more and less than 1: 1.
5. The display panel according to any one of claims 1 to 4, further comprising:
the first part of the flexible circuit board is provided with a plurality of welding pads, the welding pads are correspondingly and electrically connected with the connecting parts, and the second part of the flexible circuit board is bent to the surface of the first substrate opposite to the first surface.
6. A method for manufacturing a display panel is characterized by comprising the following steps:
forming a first substrate; the first substrate comprises a first surface and a second surface perpendicular to the first surface, and the thickness of the part of the first substrate covered by the second surface is smaller than that of the part of the first substrate covered by the first surface; forming a second patterned structure on the first surface of the display panel part; wherein the second patterned structure constitutes a portion of a signal line on the first surface;
the first substrate forms a third surface through a punching process; wherein the third surface connects the first surface and the second surface, respectively;
forming a first patterned structure on a second surface of the first substrate; wherein the first patterned structure constitutes at least a connection portion; the second surface comprises a plurality of connecting parts and a plurality of signal wires which are routed with the first surface through the third surface;
forming a repairing structure on at least part of the third surface of the first substrate and etching the repairing structure to form a repairing circuit; wherein the repair line constitutes a part of the signal line of the third surface.
7. The method according to claim 6, wherein the forming the first substrate comprises:
providing a second substrate; wherein the second substrate is a substrate corresponding to the plurality of display panels;
performing a punching process on a portion of the second substrate corresponding to each of the display panels to form the third surface;
cutting the second substrate in a direction perpendicular to the second substrate to form a plurality of first substrates; wherein the cutting location is at a junction of the second surface and the third surface.
8. The method according to claim 7, wherein the perforating the portion of the second substrate corresponding to each of the display panels to form the third surface comprises:
punching the second substrate to form a connecting hole corresponding to each display panel, wherein one display panel comprises one connecting hole, and a third surface of the first substrate of the corresponding display panel is exposed in the connecting hole; wherein the signal line is routed through the connection hole.
9. The manufacturing method of a display panel according to claim 8, wherein before the second substrate is cut in a direction perpendicular to the second substrate to form a plurality of first substrates, the manufacturing method further comprises:
forming a second patterned structure on the first surface of the second substrate corresponding to each of the display panel portions and forming a full-face structure in the connection hole; wherein the second patterned structure constitutes a part of the signal line on the first surface.
10. The method for manufacturing a display panel according to claim 9, wherein a third patterned structure is formed on a third surface of the first substrate when the first patterned structure is formed on the second surface of the first substrate; wherein the third patterned structure constitutes a part of the signal line on the third surface;
the forming a third patterned structure on a third surface of the first substrate comprises:
etching the whole surface structure on the third surface to form a fourth patterning structure; the repair circuit and the fourth patterned structure form the third patterned structure.
11. A display device comprising the display panel according to any one of claims 1 to 5 or the display panel manufactured by the method for manufacturing a display panel according to any one of claims 6 to 10.
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| CN201910579037.7A CN110187580B (en) | 2019-06-28 | 2019-06-28 | Display panel, manufacturing method thereof and display device |
| PCT/CN2019/130732 WO2020258823A1 (en) | 2019-06-28 | 2019-12-31 | Display panel, fabrication method therefor and display device |
| US17/376,417 US20210343758A1 (en) | 2019-06-28 | 2021-07-15 | Display panel and manufacturing method thereof |
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| CN110596962B (en) * | 2019-09-03 | 2020-12-08 | 深圳市华星光电技术有限公司 | Display module and display device |
| WO2020258823A1 (en) * | 2019-06-28 | 2020-12-30 | 云谷（固安）科技有限公司 | Display panel, fabrication method therefor and display device |
| CN114594624A (en) * | 2022-01-27 | 2022-06-07 | 业成科技（成都）有限公司 | Display module, manufacturing method thereof, touch display module, display and electronic equipment |
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| JP2005242248A (en) * | 2004-02-27 | 2005-09-08 | Optrex Corp | Optical display device |
| CN106558600A (en) * | 2016-11-02 | 2017-04-05 | 友达光电（昆山）有限公司 | Display device |
| CN109001943A (en) * | 2018-07-26 | 2018-12-14 | 武汉华星光电技术有限公司 | A kind of display module and preparation method thereof and electronic device |
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| KR100759413B1 (en) * | 2006-08-03 | 2007-09-20 | 삼성에스디아이 주식회사 | Light emitting device and liquid crystal display with the light emitting device as backlight unit |
| KR101073563B1 (en) * | 2010-02-08 | 2011-10-14 | 삼성모바일디스플레이주식회사 | Display device and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005242248A (en) * | 2004-02-27 | 2005-09-08 | Optrex Corp | Optical display device |
| CN106558600A (en) * | 2016-11-02 | 2017-04-05 | 友达光电（昆山）有限公司 | Display device |
| CN109001943A (en) * | 2018-07-26 | 2018-12-14 | 武汉华星光电技术有限公司 | A kind of display module and preparation method thereof and electronic device |
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Denomination of invention: Display panel and its production method, display device Effective date of registration: 20230616 Granted publication date: 20210827 Pledgee: China Construction Bank Co.,Ltd. Gu'an Sub branch Pledgor: YUNGU (GU'AN) TECHNOLOGY Co.,Ltd. Registration number: Y2023980044410 |