CN106292111B - A kind of array substrate and liquid crystal display panel - Google Patents
A kind of array substrate and liquid crystal display panel Download PDFInfo
- Publication number
- CN106292111B CN106292111B CN201610915363.7A CN201610915363A CN106292111B CN 106292111 B CN106292111 B CN 106292111B CN 201610915363 A CN201610915363 A CN 201610915363A CN 106292111 B CN106292111 B CN 106292111B
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- array substrate
- array
- color membrane
- membrane substrates
- outer pin
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- 239000000758 substrate Substances 0.000 title claims abstract description 115
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 38
- 238000012360 testing method Methods 0.000 claims abstract description 51
- 238000003825 pressing Methods 0.000 claims abstract description 38
- 238000006243 chemical reaction Methods 0.000 claims description 55
- 239000012528 membrane Substances 0.000 claims description 50
- 239000000565 sealant Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 210000004027 cell Anatomy 0.000 description 3
- 210000002858 crystal cell Anatomy 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 210000004556 brain Anatomy 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136254—Checking; Testing
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
Abstract
The embodiment of the present invention provides a kind of array substrate, including wiring region outside array, first outer pin presses area and the second outer pin presses area, it continuously arranges with second outer pin pressing area along far from wiring region direction outside the array in the first outer pin pressing area, first outer pin pressing area is provided with multiple first testing weld pads, the multiple testing weld pad is connected on the cabling of the outer wiring region of the array, second outer pin pressing area is provided with multiple second testing weld pads, the multiple second testing weld pad connects one to one with the multiple first testing weld pad.Array substrate of the invention can match various sizes of liquid crystal display panel, to reduce cost of manufacture.
Description
Technical field
The present invention relates to technical field of liquid crystal display, more particularly, to a kind of array substrate and liquid crystal display panel.
Background technique
Referring to Fig. 1, array substrate specifically includes that (Gate On Array, is integrated in array by pixel display area 11, GOA
Row scanning on substrate) area 12, it is fanned out to area (Fanout) 13, the area 14, IC WOA (Wire On Array, array outside be routed)
(Driver Integrated Circuit, integrated circuit driving chip) area 15 and liquid crystal cell test the area (Cell Test)
16.Wherein pixel display area 11 is used for the display of pixel；The grid that the area GOA 12 is used to generate thin film transistor (TFT) in face (TFT) drives
Dynamic signal；Fanout area 13 is connect for the area IC 15 with the cabling of 12 data line of pixel display area (Dataline)；The area WOA 16 is used for
The connection of cabling around panel, to connect color membrane substrates signal；The area IC 17 is used for the binding (Bonding) of IC, is driven by IC
Circuit and TFT in face；After liquid crystal cell test section 19 is used for product at box (Cell), pass through liquid crystal cell testing weld pad (Cell
Test pad, hereinafter referred to as testing weld pad) conveying signal Display panel effect is tested.
In the prior art, for the liquid crystal display panel of different border widths, the setting position of testing weld pad and cabling
It arranges different, it is therefore desirable to which the face of two kinds of production different border width specifications could be corresponded to by designing two sets of different mask plates
Plate.Since the cost of mask plate is higher, cause the manufacturing cost of liquid crystal display panel high.
Summary of the invention
The purpose of the present invention is to provide a kind of array substrate, which can be according to the liquid crystal of different border widths
Panel is cut, to realize the mesh of the corresponding array substrate of same set of mask plate production different size liquid crystal display panel
, reduce the cost of manufacture of liquid crystal display panel.
Another object of the present invention is to provide a kind of liquid crystal display panels using above-mentioned array substrate.
To achieve the goals above, embodiment of the present invention provides the following technical solutions:
The present invention provides a kind of array substrate, wherein presses outside area and second including wiring region, the first outer pin outside array
Pin presses area, and the first outer pin pressing area and second outer pin pressing area are along far from wiring region side outside the array
To continuous arrangement, the first outer pin pressing area is provided with multiple first testing weld pads, and the multiple first testing weld pad connects
It is connected on the cabling of the outer wiring region of the array, the second outer pin pressing area is provided with multiple second testing weld pads, described
Multiple second testing weld pads connect one to one with the multiple first testing weld pad.
Wherein, each first testing weld pad is respectively connected to the cabling of wiring region outside the array through a short-circuiting metal strip
On.
It wherein, further include the first conversion pad interconnected and the second conversion pad, the first conversion pad more described second
Conversion is padded close to the outer wiring region of the array, and the first conversion pad is connected on the cabling of the outer wiring region of the array, described
Sealant is covered in first conversion pad and the second conversion pad one of both.
Wherein, sealant is covered on the first conversion pad, the second outer pin pressing area includes being oppositely arranged
First edge line and second edge line, the second edge line, which is set to outside the first outer pin pressing area and described second, to be drawn
Foot press closes the intersection in area, and distance of the sealant apart from the second edge line is less than 500um.
Wherein, sealant is covered on the second conversion pad, the second outer pin pressing area includes being oppositely arranged
First edge line and second edge line, the second edge line, which is set to outside the first outer pin pressing area and described second, to be drawn
Foot press closes the intersection in area, and distance of the sealant apart from the first edge line is less than 500um.
Wherein, the first conversion pad is connected to outside the array on the cabling of wiring region through short-circuiting metal strip.
7. array substrate as claimed in claim 3, which is characterized in that the first conversion pad is arranged in the outer wiring
It area and is directly contacted with the cabling on the outer wiring region.
Wherein, the first conversion pad is connected with the second conversion pad through ITO.
The present invention also provides a kind of liquid crystal display panels, wherein array base described in color membrane substrates and above-mentioned any one
Plate, the color membrane substrates and the array substrate are oppositely arranged.
The present invention also provides a kind of liquid crystal display panels, wherein array base described in color membrane substrates and above-mentioned any one
Plate, the color membrane substrates and the array substrate are oppositely arranged, wherein throwing of the first conversion pad on the color membrane substrates
Shadow is contained in the color membrane substrates.
The embodiment of the present invention have the following advantages that or the utility model has the advantages that
Area and the second outer pin are pressed by the way that the first outer pin is arranged in array substrate in the present invention and presses area, outside first
The first testing weld pad and the second testing weld pad, the first test weldering are arranged in pin pressing area and the second outer pin pressing area
Disk is for testing small size liquid crystal display panel, and second testing weld pad is for testing large scale liquid crystal display panel, this hair
Bright array substrate can match various sizes of liquid crystal display panel, to reduce cost of manufacture.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is with prior art array base-plate structure schematic diagram.
Fig. 2 is the array base-plate structure schematic diagram of one embodiment of the present invention.
Fig. 3 is the array base-plate structure schematic diagram of another embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art are obtained all without making creative work
Other embodiments shall fall within the protection scope of the present invention.
In addition, the explanation of following embodiment is referred to the additional illustration, the spy that can be used to implement to illustrate the present invention
Determine embodiment.Direction terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner",
"outside", " side " etc. are only the directions with reference to annexed drawings, and therefore, the direction term used is to more preferably, more clearly say
The bright and understanding present invention, rather than indicate or imply signified device or element and must have a particular orientation, with specific square
Position construction and operation, therefore be not considered as limiting the invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, is also possible to detachably connected, or integrally connects
It connects；It can be mechanical connection；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The connection in portion.For the ordinary skill in the art, the tool of above-mentioned term in the present invention can be understood with concrete condition
Body meaning.
In addition, in the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or more.If this
Occur the term of " process " in specification, refers not only to independent process, when can not clearly be distinguished with other process, as long as
Effect desired by the process is able to achieve then to be also included in this term.In addition, the numerical value model indicated in this specification with "~"
Enclose the range for referring to that the numerical value for recording "~" front and back is included as minimum value and maximum value.In the accompanying drawings, structure
Similar or identical is indicated by the same numeral.
Liquid crystal display panel includes the color membrane substrates being oppositely arranged and array substrate, and the size of usually color membrane substrates is small
In the size of array substrate, the array substrate is more than that the region of the color membrane substrates can be used to connect outer lead, commonly referred to as
OLB (Outer Lead Bonding, outer lead pressing) area.Testing weld pad also is located at the area OLB, for liquid crystal display panel
It is tested.For various sizes of liquid crystal display panel, the area array substrate Shang OLB size is not also identical.In order to reduce
Manufacturing cost can lead to the corresponding array substrate of various sizes of liquid crystal display panel during manufacturing array substrate
Same way production is crossed, then the area OLB of array substrate is cut, to adapt to various sizes of liquid crystal display panel.
Referring to Fig. 2, Fig. 2 is the array base-plate structure schematic diagram of one embodiment of the present invention.Array substrate 200 is main
Area is pressed including wiring region 23, the first outer pin pressing area 24 and the second outer pin outside pixel display area 21, the area GOA 22, array
25.The first outer pin pressing area 24 and second outer pin pressing area 25 connect along far from wiring region direction outside the array
Continuous arrangement.Specifically, the first outer pin pressing area 24 includes first edge line 241 and second edge line 242.Described second
Edge line 242 is set between the first outer pin pressing area 24 and second outer pin pressing area 25.Outside described first
Multiple first testing weld pads 26 are provided in pin pressing area 24, the multiple first testing weld pad is connected to the outer cloth of the array
On the cabling in line area 23, second outer pin presses and is provided with multiple second testing weld pads 27 in area 25, and the multiple second
Testing weld pad 27 connects one to one with the multiple first pad 26.
Specifically, in the present embodiment, array substrate 200 can correspond to the first color membrane substrates (not shown go out) and the second coloured silk film
Substrate (not shown go out).Wherein, the first color membrane substrates size is less than the second color membrane substrates size.Work as array substrate
200 and first color membrane substrates at box after the completion of, projecting edge of first color membrane substrates in array substrate and first edge line 241
It is overlapped.At this point, second outer pin can be pressed area 25 and multiple second testing weld pads thereon for array substrate 200
27 cut off along second edge line 242.The first testing weld pad 26 in area 24, which is pressed, by first outer pin carries out liquid crystal
Show the test of panel.
After the completion of array substrate 200 and the second color membrane substrates are at box, throwing of second color membrane substrates in array substrate
Shadow and second edge line 242 and coincident.At this point, the first outer pin pressing area 24 is covered by color membrane substrates, it is described
Second outer pin presses area 25 and second color membrane substrates leak outside.Therefore, area 25 can be pressed by second outer pin
On the second testing weld pad 27 carry out liquid crystal display panel test process.
Area and the second outer pin are pressed by the way that the first outer pin is arranged in array substrate in the present invention and presses area, outside first
The first testing weld pad and the second testing weld pad, the first test weldering are arranged in pin pressing area and the second outer pin pressing area
Disk is for testing small size liquid crystal display panel, and second testing weld pad is for testing large scale liquid crystal display panel, this hair
Bright array substrate can match various sizes of liquid crystal display panel, to reduce cost of manufacture.
Optionally, the array substrate 200 further includes short-circuiting metal strip (Shorting Bar) 28.Each described first surveys
Test weld disk 26 is respectively connected to outside the array on the cabling of wiring region 23 through a short-circuiting metal strip 28.It is understood that institute
Stating short-circuiting metal strip 28 can be removed after test by way of edging or laser.
Further, the array substrate 200 further includes the first conversion pad (Transfer Pad) 31 Hes interconnected
Second conversion pad 32.Wherein, the first conversion pad 31 more described second converts the wiring region 23 outside the array of pad 32.It can
With understanding, the gate metal layer that the cabling on the outer wiring region 23 of array refers to, gate metal layer top is covered with insulating layer GI
And passivation layer.Therefore the signal in gate metal layer is needed to convert pad 32 as medium through the first conversion pad 31/ second and is connected to
On first color membrane substrates/second color membrane substrates.Pad 32 is converted for the first conversion pad 31/ second, generally includes gold goal (Au
Ball it) is directly contacted with ITO, gold goal with the gate metal layer, the ITO covers gold goal.Grid signal is padded through the first conversion
31/ second conversion pad 32 is conducted to color membrane substrates.Specifically, the first conversion pad 31 and the second conversion pad 32 pass through
ITO connection.
It is understood that the first conversion pad 31 and the second projection of the conversion pad 32 on color membrane substrates are contained in the
One color membrane substrates/the second color membrane substrates.
Specifically, realizing array by the second conversion pad 32 when array substrate 200 and the second color membrane substrates are at box
The signal conduction of substrate 200 and the second color membrane substrates.Therefore, it is necessary to be sealed glue encapsulation process to the second conversion pad 32.This
When, the signal of gate metal layer is connect after the first conversion pad 31 and the second conversion pad 32 with the color membrane substrates.
Preferably, in order to improve array substrate production yield, it should ensure that sealant and first outer pin press area 24
Second edge line 242 distance be less than 500um.That is, should ensure that sealant at a distance from the second edge line 242
Less than 500um.It is understood that avoiding array substrate through first turn by setting the second conversion pad 32 in present embodiment
When changing pad 31 and directly connecting with color membrane substrates, since the setting of sealant 38 is on the first conversion pad 31, sealant 38 and the are caused
The distance of two edge lines 242 is excessive, causes the too low phenomenon of yield.
It please refers to Fig. 3 (the second outer pin pressing area is omitted in the figure), in second of embodiment of the invention.Work as array
When substrate 200 ' and the first color membrane substrates are at box, array substrate 200 ' and color membrane substrates are realized by the first conversion pad 31
Signal conduction.Therefore, it is necessary to be sealed 38 encapsulation process of glue to the first conversion pad 31, (the second conversion pad 32 is not acted as at this time
With).
In addition, should ensure that the sealant being covered on the first conversion pad 31 to improve array substrate production yield
38 are less than 500um at a distance from the first edge 241 in first outer pin pressing area 24.That is, should ensure that sealant
38 are less than 500um at a distance from the first edge 241.
In present embodiment, the first conversion pad 31 and the second conversion pad 32 are set in array substrate 200 ', with right respectively
Should in the connection of the first color membrane substrates and the second color membrane substrates, and by setting first conversion pad 31/ second convert pad 32 away from
It is greater than 500um, with a distance from 242/ first edge line 241 of second edge line to improve array substrate production yield.
Please continue to refer to Fig. 3, in present embodiment, the first conversion pad 31 and can also be passed through with short-circuiting metal strip 28
The cabling being connected to after short-circuiting metal strip 28 on the outer wiring region 23 of array.The purpose done so is, the first conversion pad 31 and the
ITO between two conversion pads 32 can not have to reduce the electrostatic interference as caused by " cross-line " across short-circuiting metal strip 28.
The present invention also provides a kind of liquid crystal display panels, including the color membrane substrates being oppositely arranged and array substrate.The battle array
Column substrate is the array substrate in any one of the above embodiment.
Further, in liquid crystal display panel of the invention, projection of the first conversion pad on the color membrane substrates
It is contained in the color membrane substrates.
It is understood that liquid crystal display panel of the invention can be applied to including but not limited to as mobile phone, plate electricity
Any electronic equipment having a display function such as brain, television set, display, laptop, Digital Frame, navigator.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means particular features, structures, materials, or characteristics described in conjunction with this embodiment or example
It is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are different
Surely identical embodiment or example is referred to.Moreover, the particular features, structures, materials, or characteristics of description can be any one
It can be combined in any suitable manner in a or multiple embodiment or examples.
Embodiments described above does not constitute the restriction to the technical solution protection scope.It is any in above-mentioned implementation
Made modifications, equivalent substitutions and improvements etc., should be included in the protection model of the technical solution within the spirit and principle of mode
Within enclosing.
Claims (10)
1. a kind of array substrate, which is characterized in that for forming liquid crystal at box with the first color membrane substrates or the second color membrane substrates
Display panel, wherein size of the size of first color membrane substrates less than the second color membrane substrates；
The array substrate includes the outer wiring region of array, the first outer pin pressing area and the second outer pin pressing area, and described first
Outer pin presses area and continuously arranges with second outer pin pressing area along far from wiring region direction outside the array, and described first
Outer pin pressing area is provided with multiple first testing weld pads, and the multiple first testing weld pad is connected to the outer wiring region of the array
Cabling on, second outer pin pressing area is provided with multiple second testing weld pads, the multiple second testing weld pad and institute
Multiple first testing weld pads are stated to connect one to one；
First outer pin pressing area includes the first edge line and second edge line being oppositely arranged, and the second edge line is set
It is placed in the intersection in the first outer pin pressing area and second outer pin pressing area；
The liquid crystal that first outer pin pressing area is used to test the array substrate and first color membrane substrates are formed at box
Display panel；Wherein, projecting edge of first color membrane substrates in the array substrate is overlapped with the first edge line,
When the array substrate and first color membrane substrates form liquid crystal display panel at box, the second outer pin pressing area and
Multiple second testing weld pads thereon are removed along the second edge line；
The liquid crystal that second outer pin pressing area is used to test the array substrate and second color membrane substrates are formed at box
Display panel；Wherein projecting edge of second color membrane substrates in the array substrate is overlapped with the second edge line.
2. array substrate as described in claim 1, which is characterized in that each first testing weld pad is respectively through a short circuit metallic
Item is connected on the cabling of the outer wiring region of the array.
3. array substrate as described in claim 1, which is characterized in that further include the first conversion pad interconnected and second turn
Pad is changed, the first conversion pad second conversion is padded close to the outer wiring region of the array, and the first conversion pad is connected to
On the cabling of the outer wiring region of the array, sealing is covered in the first conversion pad and the second conversion pad one of both
Glue.
4. array substrate as claimed in claim 3, which is characterized in that it is covered with sealant on the first conversion pad, it is described
Distance of the sealant apart from the second edge line is less than 500um.
5. array substrate as claimed in claim 3, which is characterized in that it is covered with sealant on the second conversion pad, it is described
Distance of the sealant apart from the first edge line is less than 500um.
6. array substrate as claimed in claim 3, which is characterized in that the first conversion pad is connected to institute through short-circuiting metal strip
On the cabling for stating the outer wiring region of array.
7. array substrate as claimed in claim 3, which is characterized in that the first conversion pad setting in the outer wiring region and
It is directly contacted with the cabling on the outer wiring region.
8. array substrate as claimed in claim 3, which is characterized in that the first conversion pad and the second conversion pad connect through ITO
It connects.
9. a kind of liquid crystal display panel, which is characterized in that color membrane substrates and the array base as described in claim 1-8 any one
Plate, the color membrane substrates and the array substrate are oppositely arranged.
10. a kind of liquid crystal display panel, which is characterized in that color membrane substrates and array substrate as claimed in claim 3, the coloured silk
Ilm substrate and the array substrate are oppositely arranged, wherein projection of the first conversion pad on the color membrane substrates is contained in
The color membrane substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610915363.7A CN106292111B (en) | 2016-10-20 | 2016-10-20 | A kind of array substrate and liquid crystal display panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610915363.7A CN106292111B (en) | 2016-10-20 | 2016-10-20 | A kind of array substrate and liquid crystal display panel |
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| CN106292111A CN106292111A (en) | 2017-01-04 |
| CN106292111B true CN106292111B (en) | 2019-08-20 |
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| CN201610915363.7A Active CN106292111B (en) | 2016-10-20 | 2016-10-20 | A kind of array substrate and liquid crystal display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109523943B (en) * | 2018-12-28 | 2023-06-20 | 厦门天马微电子有限公司 | Display panel and display device |
| CN109491154A (en) * | 2018-12-29 | 2019-03-19 | 厦门天马微电子有限公司 | Display panel, display device and its manufacturing method |
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