KR101105453B1 - Ffc and pcb terminal connect structure - Google Patents

Ffc and pcb terminal connect structure Download PDF

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Publication number
KR101105453B1
KR101105453B1 KR1020100085210A KR20100085210A KR101105453B1 KR 101105453 B1 KR101105453 B1 KR 101105453B1 KR 1020100085210 A KR1020100085210 A KR 1020100085210A KR 20100085210 A KR20100085210 A KR 20100085210A KR 101105453 B1 KR101105453 B1 KR 101105453B1
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ffc
pcb
terminal
acf
connection
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KR1020100085210A
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Korean (ko)
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최용석
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최용석
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/771—Details

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PURPOSE: A PCB connecting part structure of an FFC is provided to directly connect an FFC on a PCB through an ACF and to prevent the generation of conductive failure. CONSTITUTION: An ACF(Anisotropic Conductive Film)(30) is attached to a connection part of a terminal part. A cover film is prepared in the end part of the FFC. The cover film prevents the exposure of the connection part of a connector. A groove part(22) of a bending shape is formed in the FFC.

Description

에프에프씨의 피씨비 연결부 구조{FFC AND PCB TERMINAL CONNECT STRUCTURE}FFC AND PCB TERMINAL CONNECT STRUCTURE}

본 발명은 FFC(플렉시블 케이블, Flexibe Flat Cable)에 관한 것으로서, 더욱 상세하게는 PCB와의 전극단자 연결부위에서 쇼트 등과 같은 연결 불량의 문제가 개선되어질 수 있도록 하기 위한 것이다.The present invention relates to a FFC (Flexible Flat Cable), and more particularly to improve the problem of a poor connection such as a short in the electrode terminal connection portion with the PCB.

일반적으로 모니터나 PC, 전화기 등을 비롯한 거의 모든 전자제품은 다양한 회로패턴이 형성된 PCB(인쇄회로기판,Printed Circuit Board)와, 상기 PCB간의 전기적 신호 연결 또는 상기 PCB와 부품간의 전기적 신호 연결을 위하여 얇은 판 형태의 FFC를 이용하여 상기 PCB와 PCB사이 또는 PCB와 주변부품을 전기적으로 연결한다In general, almost all electronic products such as monitors, PCs, telephones, and the like are thinner for printed circuit boards (PCBs) having various circuit patterns and electrical signals between the PCBs or electrical signals between the PCBs and components. Electrically connects the PCB and the PCB or between PCB and peripheral parts using a plate-shaped FFC

이때, 종래에는 FFC와 PCB를 전기적으로 연결하기 위해서 도 1에 도시한 바와 같이 PCB(10)의 단자부에 삽입식 소켓(11)을 형성하고, FFC(20)의 단자(21)를 상기 소켓(11)에 삽입함으로써 PCB(10)와 FFC(20)를 연결하였다.In this case, in order to electrically connect the FFC and the PCB, an insertable socket 11 is formed in the terminal portion of the PCB 10 as shown in FIG. 1, and the terminal 21 of the FFC 20 is connected to the socket ( 11) was connected to the PCB 10 and the FFC (20).

그러나, 상기와 같은 종래의 PCB(10)와 FFC(20)의 연결방법은 PCB(10) 상에 FFC(20)와 연결을 위한 소켓(11)을 별도로 설치하여야 하기 때문에 제작비가 많이 소요되고, 공정이 복잡해지며 특히, 상기 소켓(11)이 PCB(10)의 상부에 설치됨으로써 두께가 두꺼워져서 전자제품의 두께가 슬림화 되지 못하는 문제점이 있었다.However, the conventional method of connecting the PCB 10 and the FFC 20 as described above requires a lot of manufacturing costs because the socket 11 for connection with the FFC 20 must be separately installed on the PCB 10, The process becomes complicated, and in particular, the socket 11 is installed on top of the PCB 10, the thickness is thick, there is a problem that the thickness of the electronic product can not be slimmed.

또한, 갈수록 전자제품이 소형화, 슬림화 및 다기능화 되어 가는 추세에 따라 신호선의 증가에 의해 FFC(20)의 폭이 넓어지고, 전자제품의 소형화 추세에 따라 FFC(20)의 두께가 얇아지고 있는 상황에서 종래의 방법과 같이 소켓(11)을 이용하여 PCB(10)와 FFC(20)를 결합하는 데 한계가 있었다.In addition, as the trend of miniaturization, slimming, and multifunctional electronic products increases, the width of the FFC 20 is widened due to the increase in signal lines, and the thickness of the FFC 20 is thinned according to the trend of miniaturization of electronic products. In the conventional method, there is a limit in coupling the PCB 10 and the FFC 20 by using the socket 11.

상기와 같은 문제점을 해결하기 위하여 근래에는 FFC(20)와 PCB(10)를 연결하기 위한 소켓(11)의 구성없이, FFC(20)의 단자(21)를 PCB(10)의 단자부에 직접 솔더링하여 결합하는 방법이 시도되고 있으나, 상기와 같이 FFC(20)의 단자(21)를 PCB(10)의 단자부에 직접 솔더링하기 위해서는 FFC(20)의 단부에 형성된 단자(21)를 PCB(10)의 단자부에 정확하게 위치시킨 상태에서 솔더링하여야 하는데, 작업자가 육안 또는 확대경을 이용하여 FFC(20)의 단자(21)를 PCB(10)의 단자부에 정렬시키는 방법은 그 정렬 상태가 정확하지 못할 뿐 아니라, 시간이 많이 소요되는 문제점이 있어 생산효율이 현저히 저하되고 불량이 많이 발생하는 문제점이 있었다.
In order to solve the above problems, in recent years, without the configuration of the socket 11 for connecting the FFC 20 and the PCB 10, soldering the terminal 21 of the FFC 20 directly to the terminal portion of the PCB (10) Although a method of coupling is being attempted, in order to solder the terminal 21 of the FFC 20 directly to the terminal of the PCB 10 as described above, the terminal 21 formed at the end of the FFC 20 is connected to the PCB 10. Soldering should be done in the correct position on the terminal part of the operator. The method of aligning the terminal 21 of the FFC 20 to the terminal part of the PCB 10 by the naked eye or using a magnifying glass is not only accurate. There is a problem that takes a lot of time, the production efficiency is significantly reduced and a lot of defects occur.

본 발명은 상기한 종래 FFC와 PCB 단자부간 연결에 있어서의 문제점을 개선하기 위해 제안된 것으로서, 별도의 커넥터나 솔더링방법을 사용하지 않고 단자부 상호간의 전기적인 직접연결이 보다 효과적으로 이루어질 수 있도록 하는데 목적이 있다.The present invention has been proposed to improve the problems in the conventional connection between the FFC and the PCB terminal portion, the object of the present invention is to enable more effective electrical direct connection between the terminal portion without using a separate connector or soldering method have.

상기 목적을 이루기 위한 본 발명의 기술적 특징은, PCB의 단자부와 FFC의 단자부를 상호 전기적으로 연결함에 있어, 각각의 단자부간 상호 연결부위에 ACF가 부착 구비됨을 특징으로 한다.Technical features of the present invention for achieving the above object, in the electrical connection between the terminal portion of the PCB and the terminal portion of the FFC, it characterized in that the ACF is attached to the interconnection portion between each terminal portion.

이러한 본 발명은, FFC를 PCB 상에 ACF을 사용하여 직접적으로 연결시킴으로써, 종래기술에서와 같은 연결커넥터가 필요하지 않게 되므로, 도통불량 발생을 방지함과 함께 공정비용 절감의 효과가 있다.The present invention, by directly connecting the FFC using the ACF on the PCB, since the connection connector as in the prior art is not necessary, there is an effect of reducing the process cost and prevent the occurrence of poor conduction.

또한, 자동화 공정으로 인해 공정시간이 단축되는 효과가 있다.In addition, the process time is shortened due to the automated process.

도 1은 종래 커넥터를 이용한 FFC의 PCB 연결상태 구조도.
도 2는 본 발명의 제1 실시예에 따른 FFC와 PCB 결합과정을 개략 단면도로 나타낸 것으로서,
2a는 PCB 배치 상태도.
2b는 PCB와 ACF 분리 상태도.
2c는 PCB와 ACF, FFC 분리 상태도.
2d는 단자부 결합시 상태도.
도 3은 본 발명의 제1 실시예에 따른 결합과정을 사시도로 나타낸 것으로서,
3a는 분리시 상태도.
3b는 결합시 상태도.
도 4는 본 발명의 제1 실시예에 따른 결합과정을 측면도로 나타낸 것으로서,
4a는 분리시 상태도.
4b는 결합시 상태도.
도 5는 본 발명의 제2 실시예에 따른 커버필름 부착시 상태를 나타낸 것으로서,
5a는 FFC 단면 상세도.
5b는 단자부간 결합시 상태도.
도 6은 본 발명의 제3 실시예에 따른 홈부 형성시 상태를 나타낸 것으로서,
6a는 분리시 상태도.
6b는 결합시 상태도.
도 7은 본 발명 제3 실시예에서의 요부 확대도.1 is a schematic view of a PCB connection state of the FFC using a conventional connector.
2 is a schematic cross-sectional view showing a process of coupling the FFC and the PCB according to the first embodiment of the present invention,
2a is a PCB layout.
2b shows the PCB and ACF separation.
2c shows the PCB, ACF and FFC separated.
2d is a state diagram when the terminal part is combined.
3 is a perspective view showing a coupling process according to a first embodiment of the present invention,
3a is a state diagram when disconnected.
3b is a state diagram when combined.
4 is a side view showing a bonding process according to the first embodiment of the present invention,
4a is a state diagram when disconnected.
4b is a state diagram when combined.
5 shows a state when the cover film is attached according to the second embodiment of the present invention,
5a is a detailed view of the FFC cross section.
5b is a state diagram when coupling between terminals.
6 is a view illustrating a state when forming a groove according to a third embodiment of the present invention.
6a is a state diagram when disconnected.
6b is a state diagram when combined.
7 is an enlarged view of main parts in the third embodiment of the present invention;

이하, 본 발명의 구체적인 실시 예를 첨부된 도 2 내지 도 6을 참조하여 상세히 살펴보기로 한다.Hereinafter, specific embodiments of the present invention will be described in detail with reference to FIGS. 2 to 6.

먼저, 본 발명의 제1실시예에 따른 케이블 연결구조를 도 2 내지 도 4를 통해 살펴보면, PCB(10)의 단자부(11)와 FFC(20)의 단자부(21)간 사이에 이방성 도전필름인 ACF(30,Anisotropic conductive film)가 구비되는것이다.First, referring to the cable connection structure according to the first embodiment of the present invention through FIGS. 2 to 4, an anisotropic conductive film is formed between the terminal portion 11 of the PCB 10 and the terminal portion 21 of the FFC 20. ACF (30, Anisotropic conductive film) is provided.

이러한 ACF(30)는, 이방성도전접착제가 보호용 필름위에 부착된 것으로, 도전볼이 접착성수지에 산포된 구조로 되어 있다. 상기 도전볼은 얇은 절연막으로 둘러싸인 도전성 구체로서 압력에 의해 절연막이 깨어지게 되어 있어, 소정의 단자전극 사이를 전기적으로 접속시키고자 할 경우 ACF(30)을 상기 접속시키고자 하는 단자부(11)와 단자부(21) 사이에 끼워 압력을 가한다.The ACF 30 has an anisotropic conductive adhesive attached on a protective film, and has a structure in which conductive balls are dispersed in an adhesive resin. The conductive ball is a conductive sphere surrounded by a thin insulating film, and the insulating film is broken by pressure. When the conductive ball is to be electrically connected between a predetermined terminal electrode, the terminal part 11 and the terminal part to which the ACF 30 is to be connected are connected. It is sandwiched between 21 and pressurized.

그러면, 압력에 의해 도전볼 표면의 절연막이 파괴되어 도전성 구체가 상기 전극 사이에 접촉됨으로서 상기 단자부(11,21) 사이가 전기적으로 연결되게 되는 것이다.Then, the insulating film on the surface of the conductive ball is destroyed by the pressure, and the conductive spheres are contacted between the electrodes so that the terminals 11 and 21 are electrically connected to each other.

따라서, 별도의 연결용 커넥터 없이도 쇼트나 접촉불량 등이 발생하지 않고 양측 단자부(11,21) 상호간에 안정적인 통전상태가 유지되어질 수 있게 됨을 알 수 있다.
Accordingly, it can be seen that a short energization state can be maintained between the terminal portions 11 and 21 without shorting or poor contact without a separate connector for connection.

한편, 도 5는 본 발명의 제2실시예에 따른 커버필름(40)이 FFC(20) 일단부에 구비된 상태를 나타낸 것으로서, 도시된 바와 같이 FFC(20) 일단부에 커버필름(40)을 부착 구성시킨 것이다.Meanwhile, FIG. 5 illustrates a state in which the cover film 40 according to the second embodiment of the present invention is provided at one end of the FFC 20, and the cover film 40 at one end of the FFC 20 as shown. It is configured to attach.

특히, 커버필름(40)의 저면에 접착층(41)을 형성시킴으로서 도 5b에서와 같이 ACF(30)를 이용한 FFC(20)와 PCB(10)의 양측 단자부(11,21)간 결합시 커버필름(40)이 단자부(11,21)를 감싸는 형태로 덮어주게 됨으로 외부노출이 방지되어 외부로 부터의 이물질 유입에 따른 불량 발생이 방지되어질 수 있게 된다.
In particular, by forming the adhesive layer 41 on the bottom surface of the cover film 40, as shown in Figure 5b when the cover film when bonding between the FFC 20 using the ACF (30) and the terminal portion (11, 21) of the PCB 10 Since the 40 covers the terminal portions 11 and 21 so as to surround the terminal portions 11 and 21, the external exposure is prevented, thereby preventing the occurrence of a defect due to the inflow of foreign substances from the outside.

또한, 도 6 및 도 7은 본 발명의 제3실시예에 따른 FFC(20) 구조를 나타낸 것이다.6 and 7 show the structure of the FFC 20 according to the third embodiment of the present invention.

즉, 도시된 바와같이 FFC(20)의 단자부(21) 사이에 일정 깊이의 홈부(22)를 형성시킨 것으로, 이와 같이 홈부(22)가 형성됨으로서 PCB(10)와의 거리가 상대적으로 증대되어지도록 한 것이다.That is, as shown, the groove portion 22 having a predetermined depth is formed between the terminal portions 21 of the FFC 20. As the groove portion 22 is formed in this way, the distance from the PCB 10 is relatively increased. It is.

따라서, FFC(20)와 PCB(10)의 결합을 위한 가압시 홈부(22) 형성부위에서는 ACF(20)에 가해지는 압력이 감소되어짐으로서 ACF(30)에 포함되어 있는 도전볼 표면의 절연막 파괴현상이 감소되어 도통불량발생을 방지할 수 있게 된다.Therefore, the pressure exerted on the ACF 20 is reduced at the site of forming the groove 22 when the FFC 20 and the PCB 10 are pressed together, thereby destroying the insulating film on the surface of the conductive ball included in the ACF 30. The phenomenon is reduced to prevent the occurrence of poor conduction.

특히, 도 7에서 나타내어진 바와 같이 충격을 흡수할 수 있는 고무 재질의 탄성층(23)을 형성시킴으로서 단자부(11,21)가 형성되지 않은 부위에서의 도통에 따른 쇼트현상 발생이 방지되어질 수 있게 됨을 알 수 있다.
In particular, as shown in FIG. 7, by forming an elastic layer 23 made of a rubber material capable of absorbing shock, the occurrence of a short phenomenon due to conduction in a portion where the terminal portions 11 and 21 are not formed can be prevented. It can be seen that.

10 : PCB 11,21 : 단자부
20 : FFC 22 : 홈부
30 : ACF 40 : 커버필름
41 ; 접착층10: PCB 11,21: terminal part
20: FFC 22: groove
30: ACF 40: cover film
41; Adhesive layer

Claims (5)

PCB(10)의 단자부(11)와 FFC(20)의 단자부(21)를 상호 전기적으로 연결함에 있어, 각각의 단자부(11,21)간 상호 연결부위에 ACF(30)가 부착 구비되는FFC의 PCB연결부 구조에 있어서,
상기 FFC(20)의 단부에는 단자부(11,21) 연결부위의 노출을 방지하기 위한 커버필름(40)이 구비되고;
상기 FFC(20)는 단자부(21)간 사이에 만곡된 형상의 홈부(22)가 형성되며;
상기 홈부(22)에는 탄성층(23)이 박막으로 형성된 것을 특징으로 하는 FFC의 PCB연결부 구조.
In electrically connecting the terminal portion 11 of the PCB 10 and the terminal portion 21 of the FFC 20 to each other, the FFC of which the ACF 30 is attached to the interconnection portion between the respective terminal portions 11 and 21 is provided. PCB structure,
A cover film 40 is provided at an end of the FFC 20 to prevent exposure of the connection portions of the terminal portions 11 and 21;
The FFC 20 is formed with a curved groove portion 22 between the terminal portions 21;
The groove part 22, the structure of the PCB connection portion of the FFC, characterized in that the elastic layer 23 is formed of a thin film.
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KR1020100085210A 2010-09-01 2010-09-01 Ffc and pcb terminal connect structure KR101105453B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990025710U (en) * 1997-12-17 1999-07-05 김영환 Flexible connector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990025710U (en) * 1997-12-17 1999-07-05 김영환 Flexible connector

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