CN113257127A - Display device - Google Patents
Display device Download PDFInfo
- Publication number
- CN113257127A CN113257127A CN202110510785.7A CN202110510785A CN113257127A CN 113257127 A CN113257127 A CN 113257127A CN 202110510785 A CN202110510785 A CN 202110510785A CN 113257127 A CN113257127 A CN 113257127A
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- CN
- China
- Prior art keywords
- display panel
- conductive
- display device
- circuit board
- external circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Abstract
A display device comprises a display panel, a conductive pad, an external circuit board and an adhesive layer. The display panel includes inner pins exposed at the side edges. The conductive pads are arranged on the side edge of the display panel and connected with the inner pins. The external circuit board is arranged at the side edge of the display panel and comprises an outer pin, wherein a conductive protruding structure is arranged on the outer pin and at least contacts the conductive pad, so that the external circuit board is electrically connected to the display panel. The adhesive layer is arranged between the external circuit board and the display panel.
Description
Technical Field
The present invention relates to a display device, and more particularly, to a display device having a side bonding (side bonding) external circuit board.
Background
In the side bonding process of the current display device, conductive paste is mostly used to connect the outer leads of the external circuit board to the inner leads of the display panel, so that the external circuit board is electrically connected to the inner leads of the display panel through the conductive pads serving as the side electrodes by the conductive particles in the conductive paste.
However, since the external circuit board is attached to the side of the display panel by side bonding, the distribution and bonding of the conductive particles in the conductive adhesive cannot be observed from the side of the display panel, and thus the minimum contact area between the external circuit board and the display panel when the external circuit board is electrically connected to the display panel cannot be accurately calculated. In addition, the external circuit board and the display panel are bonded by the conductive adhesive, which must undergo a high temperature process. As a result, the elements in the display device are easily damaged by the high temperature process.
Disclosure of Invention
The invention provides a display device, which electrically connects an external circuit board and a display panel through a conductive protrusion structure on an external pin of the external circuit board.
The display device comprises a display panel, a conductive connecting pad, an external circuit board and an adhesive layer. The display panel includes inner pins exposed at the side edges. The conductive pads are arranged on the side edge of the display panel and connected with the inner pins. The external circuit board is arranged at the side edge of the display panel and comprises an outer pin, wherein a conductive protruding structure is arranged on the outer pin and at least contacts the conductive pad, so that the external circuit board is electrically connected to the display panel. The adhesive layer is arranged between the external circuit board and the display panel.
Based on the above, in the display device of the invention, the conductive protrusion structure is disposed on the outer pin of the external connection board, and the conductive protrusion structure contacts the conductive pad on the side of the display panel (even penetrates into the conductive pad), so that the external connection board is electrically connected to the display panel. Therefore, the minimum contact area when the external circuit board is electrically connected with the display panel can be easily calculated, and the external circuit board and the display panel can be combined without conductive adhesive and without high-temperature process.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic side view of a display panel according to an embodiment of the invention.
Fig. 2A is a schematic cross-sectional view of a part of an external connection board according to an embodiment of the invention.
Fig. 2B is a top view of the outer lead in fig. 2A.
Fig. 3A is a schematic cross-sectional view of an outer lead according to another embodiment of the invention.
Fig. 3B is a schematic cross-sectional view of an outer lead according to another embodiment of the invention.
Fig. 3C is a schematic cross-sectional view of an outer lead according to another embodiment of the invention.
Fig. 3D is a top view of an outer lead according to another embodiment of the invention.
Fig. 3E is a top view of an outer lead according to another embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a display device according to an embodiment of the invention.
Fig. 5 is a schematic cross-sectional view of a display device according to another embodiment of the invention.
Description of reference numerals:
10: display panel
20: external connection circuit board
40. 50: display device
100 a: front side
100 b: back side of the panel
102: first substrate
102 a: inner pin
104: second substrate
104 a: electrode pattern
105: frame glue
106a, 106 b: polarizing plate
108: conductive pad
200: substrate
202: outer pin
204. 204a, 204b, 204c, 204d, 204e, 204 f: conductive bump structure
402: adhesive layer
204f _ 1: main body part
204f _ 2: extension part
Detailed Description
The following examples are described in detail with reference to the accompanying drawings, but the examples are not provided to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only and are not drawn to scale. For ease of understanding, like elements will be described with like reference numerals in the following description.
All references to "including," comprising, "" having, "and the like, herein are to be interpreted as open-ended terms, that is, to mean" including, but not limited to.
Furthermore, directional phrases such as "up," "down," "left," "right," and the like may be used with reference to the drawings in the following detailed description, and are not intended to limit the invention.
When elements are described in terms of "first," "second," etc., these elements are merely used to distinguish one element from another, and the order or importance of these elements is not limited. Thus, in some cases, a first element can also be referred to as a second element, and a second element can also be referred to as a first element, without departing from the scope of the claims.
The display device comprises a display panel, conductive pads (serving as side electrodes) arranged on the side edge of the display panel, an external circuit board arranged on the side edge of the display panel and an adhesion layer arranged between the external circuit board and the display panel. These components will be described in detail below.
Fig. 1 is a schematic side view of a display panel according to an embodiment of the invention. In the present invention, the kind of the display panel will not be limited. For example, in the embodiment, the display panel includes two substrates disposed oppositely, but the invention is not limited thereto. In other embodiments, the display panel may include only one substrate. In addition, for convenience of describing the present invention, fig. 1 simply illustrates a thin film transistor substrate, a color filter substrate and a sealant for bonding the thin film transistor substrate and the color filter substrate, which constitute the display panel, but the present invention is not limited thereto, and these members are well known to those skilled in the art and will not be described herein. The structure of the display panel in the present embodiment can be modified by those skilled in the art according to actual needs.
Referring to fig. 1, in the present embodiment, a display panel 10 includes a first substrate 102 and a second substrate 104 disposed opposite to each other, and a sealant 105 for bonding the first substrate 102 and the second substrate 104. The first substrate 102 is, for example, a thin film transistor substrate, and may have active devices, circuit patterns, pins, etc., wherein the pins extend from the inside of the first substrate 102 to the side and are exposed at the side for connecting with external devices. In the present embodiment, the leads extending from the inside of the first substrate 102 to the side and exposed at the side are referred to as inner leads 102 a. In the present embodiment, the number of the inner leads 102a is shown for example purposes only, and the present invention is not limited thereto. In addition, the second substrate 104 is, for example, a color filter substrate, and may have components such as a color filter, an electrode pattern, and the like, wherein the electrode pattern is disposed on the second substrate 104. In the present embodiment, the electrode pattern 104a is disposed on the second substrate 104 and does not extend to the side of the second substrate 104 and is exposed at the side, i.e., the edge of the electrode pattern 104a is spaced apart from the edge of the second substrate 104.
The sealant 105 is disposed between the first substrate 102 and the second substrate 104 for bonding the first substrate 102 and the second substrate 104. In the embodiment, the sealant 105 is disposed adjacent to the edge of the display panel 10, and defines a space for accommodating liquid crystal in the central area of the display panel 10.
In addition, in the present embodiment, a polarizing plate 106a is disposed on the front surface 100a of the display panel 10, and a polarizing plate 106b is disposed on the rear surface 100b of the display panel 10.
The conductive pads 108 are disposed on the side of the display panel 10 and connected to the inner leads. In the present embodiment, the conductive pads 108 are disposed on the side of the display panel 10, and each of the conductive pads 108 is connected to a corresponding inner lead 102 a. As a result, the external device can be electrically connected to the display panel 10 through the conductive pads 108. In the present invention, the arrangement of the conductive pads 108 is not limited, and those skilled in the art can modify the arrangement according to actual requirements. In the present embodiment, the conductive pads 108 may be silver pads, for example.
Fig. 2A is a schematic cross-sectional view of a part of an external connection board according to an embodiment of the invention. Fig. 2B is a top view of the outer lead in fig. 2A. The external circuit board mainly comprises a substrate, a circuit pattern arranged on the substrate, an external pin used for being connected with an external element and a chip arranged on the circuit pattern. In addition, for convenience of describing the present invention, fig. 2 is only a simplified illustration of a partial external circuit board, which includes a substrate and external leads disposed on the substrate, and other components in other areas are well known to those skilled in the art and will not be further described herein.
Referring to fig. 2A and fig. 2B, in the present embodiment, the external circuit board 20 is, for example, a Chip On Film (COF) circuit board. The external connection board 20 includes a substrate 200, an outer lead 202 and a circuit pattern disposed on the substrate 200, and a chip disposed on the circuit pattern, wherein the circuit pattern and the chip are not shown for clarity and convenience of illustration. The outer leads 202 are disposed on the substrate 200 for connecting with an external device (e.g., the display panel 10 in fig. 1), so that the external circuit board 20 can be electrically connected to the external device. In the present embodiment, the number, width, thickness, length and number of film layers of the outer leads 202 are not limited, and those skilled in the art can adjust the number, width, thickness, length and number of film layers according to actual requirements. In this embodiment, the outer lead 202 is provided with a conductive bump structure 204. These conductive bump structures 204 are distributed on the surface of the outer lead 202 without contacting each other. In the present embodiment, the conductive bump structures 204 are disposed on the surface of the outer leads 202 in an array manner and located at the ends of the outer leads 202, but the invention is not limited thereto. In addition, in the present embodiment, the conductive protrusion 204 is a cone-shaped structure. In the embodiment, the conductive protrusion 204 is a quadrangular pyramid structure, but the invention is not limited thereto. In other embodiments, the conductive protrusion structure may be a cone structure or other form of three-dimensional structure.
As shown in fig. 3A, the conductive bump structure 204a disposed on the surface of the outer lead 202 may be a pillar structure with a top width smaller than a bottom width. As shown in fig. 3B, the conductive bump structure 204B disposed on the surface of the outer lead 202 may be a pillar structure with a top width equal to a bottom width. As shown in fig. 3C, the conductive bump structure 204C disposed on the surface of the outer lead 202 may be a ball structure.
In addition, the conductive bump structures may be disposed on the surface of the outer lead 202 in a strip-like manner parallel to each other, besides being disposed on the surface of the outer lead 202 in an array manner. As shown in fig. 3D, the conductive bump structure 204D disposed on the surface of the outer lead 202 is a bar structure, and the extending direction of the conductive bump structure 204D is parallel to the extending direction of the outer lead 202. As shown in fig. 3E, the conductive bump structures 204E disposed on the surface of the outer leads 202 are strip-shaped structures, and the extending directions of the conductive bump structures 204E are staggered with the extending directions of the outer leads 202. In addition, in the case where the conductive protrusion structures are stripe structures, the shape of a cross section of each conductive protrusion structure perpendicular to the extending direction thereof may also be a triangle, a rectangle, or a sphere.
The display device of the present invention is formed by bonding the external connection board 20 and the display panel 10, which will be described in detail below.
Fig. 4 is a schematic cross-sectional view of a display device according to an embodiment of the invention. In the present embodiment, for clarity of illustration, only the inner pins inside the display panel 10 are shown and other internal components are not shown.
Referring to fig. 1, fig. 2A, fig. 2B and fig. 4, the display device 40 includes a display panel 10, a conductive pad 108, an external connection board 20 disposed at a side edge of the display panel 10, and an adhesive layer 402 disposed between the external connection board 20 and the display panel 10. When the external connection board 20 is connected to the display panel 10, an external pin 202 of the external connection board 20 is aligned with and contacts a conductive pad 108 on a side of the display panel 10, and the conductive protrusion 204 on the surface of the external pin 202 penetrates into the conductive pad 108, so that the external connection board 20 can be electrically connected to the display panel 10. In another embodiment, the conductive bump structure 204 may only contact the conductive pad 108 without penetrating into the conductive pad 108.
In the present embodiment, the height of the conductive bump structure 204 is smaller than the thickness of the conductive pad 108, so as to prevent the inner lead 102a from being damaged when the conductive bump structure 204 penetrates into the conductive pad 108. In another embodiment, the height of the conductive bump structure 204 may be equal to the thickness of the conductive pad 108, i.e., the conductive bump structure 204 only contacts the surface of the inner lead 102a when penetrating into the conductive pad 108 without excessively damaging the inner lead 102 a. In addition, in the embodiment, the height of each conductive bump structure 204 is equal, but the invention is not limited thereto. In other embodiments, the conductive bump structures 204 may have different heights depending on the thickness of the conductive pad 108. For example, when the thickness of the central portion of the conductive pad 108 is greater than the thickness of the peripheral portion, the height of the conductive bump structure 204 on the surface of the outer lead 202 corresponding to the peripheral portion of the conductive pad 108 may be greater than the height of the conductive bump structure 204 corresponding to the central portion of the conductive pad 108, so that all of the conductive bump structures 204 can penetrate into the conductive pad 108.
In addition, in another embodiment, as shown in fig. 5, before the external wiring board 20 is bonded to the display panel 10, the height of the conductive bump structure is greater than the thickness of the conductive pad 108, so that after the external wiring board 20 is bonded to the display panel 10, the conductive bump structure penetrates into the conductive pad 108 and contacts the inner lead 102a, and is further bent. In detail, in the display device 50 of the embodiment, the conductive bump structure contacts the inner lead 102a in the conductive pad 108 and is bent under the condition that the inner lead 102a is not damaged or the inner lead 102a is not damaged excessively, so as to form the conductive bump structure 204f with a bent shape. At this time, the conductive bump structure 204f includes a main body portion 204f _1 and an extension portion 204f _ 2. The main body 204f _1 is disposed on the outer lead 202, and the extension 204f _2 extends from the main body 204f _1 to the surface of the inner lead 102a, and as the case may be, the extension 204f _2 may be further disposed on the side surfaces of the first substrate 102 and the second substrate 104. In addition, in the external wiring board 20, the extensions 204f _2 on the adjacent outer pins 202 do not contact each other to avoid the occurrence of the short circuit problem. In this way, the conductive bump structure 204f can be more firmly attached to the conductive pad 108 due to the increased contact area with the conductive pad 108, thereby improving the bonding strength between the external circuit board 20 and the display panel 10.
Returning to fig. 1, fig. 2A, fig. 2B and fig. 4, the adhesive layer 402 is disposed between the external circuit board 20 and the display panel 10 to provide adhesion between the external circuit board 20 and the display panel 10. The material of the adhesive layer 402 is, for example, resin, but the invention is not limited thereto. Furthermore, since the external circuit board 20 and the display panel 10 are electrically connected to each other through the conductive bump structures 204 and the conductive pads 108, the adhesive layer 402 only needs to provide adhesion between the external circuit board 20 and the display panel 10, and does not need to provide additional conductive paths. In other words, in the present embodiment, the conductive paste is not required to be used as the material of the adhesive layer 402. Therefore, the external circuit board 20 and the display panel 10 are bonded without a high temperature process, so as to prevent the elements in the display device from being damaged. In addition, the adhesive layer 402 can also provide a good buffer force between the external circuit board 20 and the display panel 10, and prevent external moisture from entering the display device 40 to damage the conductive pads 108.
In addition, in the embodiment, the external connection board 20 and the display panel 10 are electrically connected to each other through the conductive bump structure and the conductive pad 108. Therefore, the minimum contact area required for the electrical connection between the external circuit board 20 and the display panel 10 can be accurately calculated by the preset conductive bump structure, and the accurate calculation cannot be realized because the distribution and lamination situation of the conductive particles in the conductive adhesive cannot be observed.
In addition, when the conductive bump structure is a strip structure and the extending direction of the conductive bump structure is staggered with the extending direction of the outer lead (for example, the conductive bump structure 204e), the bonding accuracy between the external circuit board 20 and the display panel 10 can be further improved. In detail, in the bonding process between the external wiring circuit board 20 and the display panel 10, since the extending direction of the conductive bump structure 204e with a stripe structure is staggered with the extending direction of the outer pin 202, when aligning the outer pin 202 with the conductive pad 108, even if there is an alignment deviation between the outer pin 202 and the conductive pad 108, the conductive bump structure 204e can still accurately penetrate into the conductive pad 108 to avoid the electrical problem caused by the reduction of the contact area between the conductive pad 108 and the conductive bump structure 204 e.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (9)
1. A display device, comprising:
a display panel including inner pins exposed at a side;
the conductive connecting pad is arranged on the side edge of the display panel and is connected with the inner pin;
the external circuit board is arranged at the side edge of the display panel and comprises an outer pin, wherein a conductive protruding structure is arranged on the outer pin and at least contacts the conductive pad, so that the external circuit board is electrically connected to the display panel; and
and the adhesive layer is arranged between the external circuit board and the display panel.
2. The display device according to claim 1, wherein the conductive protrusion structure is a cone-shaped structure, a pillar-shaped structure, a sphere-shaped structure, or a stripe-shaped structure.
3. The display device according to claim 2, wherein the extending direction of the stripe structure is parallel to the extending direction of the outer lead.
4. The display device according to claim 2, wherein the extending direction of the stripe structure is staggered with the extending direction of the outer leads.
5. The display device of claim 1, wherein the conductive bump structures have a height that does not exceed a thickness of the conductive pads.
6. The display device according to claim 1, wherein the conductive bump structure comprises a main body portion disposed on the outer lead and an extension portion extending from the main body portion on a surface of the inner lead.
7. The display device according to claim 1, wherein a material of the adhesive layer comprises a resin.
8. The display device according to claim 1, further comprising polarizing plates disposed on the front and back surfaces of the display panel.
9. The display device of claim 1, wherein the conductive bump structures penetrate into the conductive pads.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063065641P | 2020-08-14 | 2020-08-14 | |
| US63/065,641 | 2020-08-14 | ||
| TW109141519 | 2020-11-26 | ||
| TW109141519A TWI741885B (en) | 2020-08-14 | 2020-11-26 | Display device |
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| Publication Number | Publication Date |
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| CN113257127A true CN113257127A (en) | 2021-08-13 |
| CN113257127B CN113257127B (en) | 2023-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110510785.7A Active CN113257127B (en) | 2020-08-14 | 2021-05-11 | Display device |
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| CN (1) | CN113257127B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210143247A1 (en) * | 2019-11-13 | 2021-05-13 | Hefei Xinsheng Optoelectronics Technology Co., Ltd. | Display panel, method of manufacturing display panel, and display apparatus |
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| Publication number | Publication date |
|---|---|
| CN113257127B (en) | 2023-03-14 |
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