CN109920821B - Flexible display device - Google Patents
Flexible display device Download PDFInfo
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- CN109920821B CN109920821B CN201910149364.9A CN201910149364A CN109920821B CN 109920821 B CN109920821 B CN 109920821B CN 201910149364 A CN201910149364 A CN 201910149364A CN 109920821 B CN109920821 B CN 109920821B
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- conductive film
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Abstract
The present disclosure provides a flexible display device. The flexible display device includes a flexible panel, a flexible bonding pad, an anisotropic conductive film, and an integrated circuit. The flexible bonding pad is disposed on the flexible panel. Non-circuit areas are defined on two sides of the flexible combination pad, and grooves are formed in the non-circuit areas. The anisotropic conductive film is attached to the flexible bonding pad and is arranged in the groove of the non-circuit area. The integrated circuit is attached to the anisotropic conductive film. The anisotropic conductive film and the flexible bonding pad have good adhesive force, so that the separation problem between the anisotropic conductive film and the flexible bonding pad is improved.
Description
[ technical field ] A method for producing a semiconductor device
The present disclosure relates to the field of display technologies, and in particular, to a flexible display device.
[ background of the invention ]
With the development of industrial technology, flexible display devices, such as flexible Organic Light Emitting Diode (OLED) display devices, are receiving more and more attention. The flexible OLED display device is easy to cause the separation problem between the anisotropic conductive film and the flexible bonding pad in the bending process.
Therefore, there is a need to provide a flexible display device to solve the problems of the prior art.
[ summary of the invention ]
In order to solve the above-mentioned problems, an object of the present disclosure is to provide a flexible display device, which can have good adhesion between an anisotropic conductive film and a flexible bonding pad, thereby improving the separation between the anisotropic conductive film and the flexible bonding pad.
To achieve the above objective, the present disclosure provides a flexible display device. The flexible display device includes a flexible panel, a flexible bonding pad, an anisotropic conductive film, and an integrated circuit. The flexible bonding pad is disposed on the flexible panel. Non-circuit areas are defined on two sides of the flexible combination pad, and grooves are formed in the non-circuit areas. The anisotropic conductive film is attached to the flexible bonding pad and is arranged in the groove of the non-circuit area. The integrated circuit is attached to the anisotropic conductive film.
In one embodiment of the present disclosure, the anisotropic conductive film covers the groove of the non-circuit region.
In one embodiment of the present disclosure, the width of the groove ranges between 1mm and 2 mm.
In one embodiment of the present disclosure, the anisotropic conductive film has a substantially U-shape in side view.
In one embodiment of the present disclosure, the anisotropic conductive film is a colloid having conductive particles.
In one embodiment of the present disclosure, the anisotropic conductive film has a plurality of contact surfaces contacting the flexible bonding pads, and the contact surfaces of the anisotropic conductive film include a plane and a vertical surface perpendicular to each other.
In one embodiment of the present disclosure, the planar surface of the anisotropic conductive film contacts an upper surface of the flexible bonding pad, and the vertical surface of the anisotropic conductive film contacts a side surface of the flexible bonding pad.
In one embodiment of the present disclosure, the flexible panel includes a flexible film and an array film, and the array film is provided with the groove in the non-wiring region.
In one embodiment of the present disclosure, the flexible film is provided with the groove in the non-wiring region.
In one embodiment of the present disclosure, the material of the flexible film includes polyimide.
In the flexible display device according to the embodiment of the disclosure, the non-circuit area is defined on two sides of the flexible bonding pad and the non-circuit area is provided with the groove, and the anisotropic conductive film is attached to the flexible bonding pad and is arranged in the groove of the non-circuit area, so that the anisotropic conductive film and the flexible bonding pad have good adhesion, and the separation problem between the anisotropic conductive film and the flexible bonding pad is improved.
In order to make the aforementioned and other aspects of the present disclosure more comprehensible, preferred embodiments accompanied with figures are described in detail below:
[ description of the drawings ]
FIG. 1 is a schematic side view of a flexible display device according to an embodiment of the present disclosure;
FIG. 2 is a schematic top view of a flexible display device according to an embodiment of the present disclosure;
FIG. 3 is a schematic view of a flexible display device according to an embodiment of the present disclosure;
FIG. 4 is a schematic view of a flexible display device according to an embodiment of the present disclosure; and
FIG. 5 shows a schematic diagram of a flexible display device according to an embodiment of the present disclosure.
[ detailed description ] embodiments
In order to make the aforementioned and other objects, features and advantages of the present disclosure comprehensible, preferred embodiments accompanied with figures are described in detail below. Furthermore, directional phrases used in this disclosure, such as, for example, upper, lower, top, bottom, front, rear, left, right, inner, outer, lateral, peripheral, central, horizontal, lateral, vertical, longitudinal, axial, radial, uppermost or lowermost, etc., refer only to the orientation of the attached drawings. Accordingly, the directional terms used are used for the purpose of illustration and understanding of the present disclosure, and are not used to limit the present disclosure.
In the drawings, elements having similar structures are denoted by the same reference numerals.
Referring to fig. 1 and 2, a flexible display device 100 according to an embodiment of the present disclosure includes a flexible panel 110, a flexible bonding pad (bonding pad)120, an Anisotropic Conductive Film (ACF) 130, and an Integrated Circuit (IC) 140. The flexible bonding pad 120 is disposed on the flexible panel 110. Non-circuit regions 150 are defined on both sides of the flexible bonding pad 120 and the non-circuit regions 150 are provided with grooves 160. The anisotropic conductive film 130 is attached to the flexible bonding pad 120 and disposed in the groove 160 of the non-wiring region 150. The integrated circuit 140 is attached to the anisotropic conductive film 130. The embodiments of the present disclosure can provide good adhesion between the anisotropic conductive film 130 and the flexible bonding pad 120, thereby improving the separation (peeling) problem between the anisotropic conductive film 130 and the flexible bonding pad 120.
Specifically, the grooves 160 are dug on two sides of the flexible bonding pads 120 (i.e., the non-circuit regions 150), and then when the anisotropic conductive film 130 is attached to the flexible bonding pads 120 by pressing, the anisotropic conductive film 130 flows to the grooves 160 and is cured in the grooves 160, so as to increase the adhesion between the anisotropic conductive film 130 and the flexible bonding pads 120, thereby improving the separation between the anisotropic conductive film 130 and the flexible bonding pads 120, i.e., improving the separation of the integrated circuits 140, and better completing the bending of the flexible display device 100.
The flexible display device 100 is, for example, an Organic Light Emitting Diode (OLED) display device. The embodiments of the present disclosure can be applied to cop (chip on plastic) processes, in which the integrated circuit 140 and a portion of the bus cable are mounted on a flexible circuit board, and the bus cable chip area is folded to the back of the screen to realize a narrow frame. In the embodiment of the disclosure, the anisotropic conductive film 130 is attached to the flexible bonding pad 120 and disposed in the groove 160 of the non-circuit region 150, so that the anisotropic conductive film 130 and the flexible bonding pad 120 have good adhesion, thereby improving the problem that the flexible OLED display device is prone to COP process failure during the bending process, i.e., improving the separation problem of the integrated circuit 140, and better completing the bending of the flexible OLED display device.
In one embodiment of the present disclosure, the anisotropic conductive film 130 covers the groove 160 of the non-circuit region 150. In particular, the width of the groove 160 ranges between 1mm and 2 mm. The anisotropic conductive film 130 has a substantially U-shape in side view.
In one embodiment of the present disclosure, the anisotropic conductive film 130 has a plurality of contact surfaces contacting the flexible bonding pads 120, and the contact surfaces of the anisotropic conductive film 130 include a plane 132 and a vertical surface 134 perpendicular to each other. The flat surface 132 of the acf 130 contacts the upper surface 122 of the flexible bonding pad 120, and the vertical surface 134 of the acf 130 contacts the side surface 124 of the flexible bonding pad 120. Embodiments of the present disclosure increase adhesion by changing the way the anisotropic conductive film 130 contacts the flexible bonding pad 120 (plane changes to plane and vertical plane).
Referring to fig. 3, in an embodiment of the present disclosure, the flexible panel 110 includes a flexible film 112 and an array film 114, and the array film 114 is provided with the groove 160 in the non-circuit area 150.
Referring to fig. 4, in an embodiment of the present disclosure, the flexible film 112 is provided with the groove 160 in the non-wiring region 150. Specifically, the material of the flexible film 112 includes polyimide.
Referring to fig. 5, in an embodiment of the present disclosure, the anisotropic conductive film 130 is a colloid 138 having conductive particles 136. After the glue 138 is cured in the groove 160, the adhesion between the acf 130 and the flexible bonding pad 120 can be greatly increased.
Referring to fig. 3 to 5, in an embodiment of the present disclosure, the array film 114 includes a buffer layer 1141, a semiconductor layer 1142, a first gate insulating layer 1143, a first gate 1144, a second gate insulating layer 1145, a second gate 1146, an interlayer dielectric layer 1147, and a planarization layer 1148 sequentially disposed. The buffer layer 1141, the first gate insulating layer 1143, the second gate insulating layer 1145, the interlayer dielectric layer 1147, and the planarization layer 1148 are provided with the groove 160 in the non-line region 150.
In the flexible display device according to the embodiment of the disclosure, the non-circuit area is defined on two sides of the flexible bonding pad and the non-circuit area is provided with the groove, and the anisotropic conductive film is attached to the flexible bonding pad and is arranged in the groove of the non-circuit area, so that the anisotropic conductive film and the flexible bonding pad have good adhesion, the separation problem between the anisotropic conductive film and the flexible bonding pad is improved, and the bending of the flexible display device is better completed.
Although the disclosure has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art based upon a reading and understanding of this specification and the annexed drawings. The present disclosure includes all such modifications and alterations, and is limited only by the scope of the appended claims. In particular regard to the various functions performed by the above described components, the terms used to describe such components are intended to correspond, unless otherwise indicated, to any component which performs the specified function of the described component (e.g., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary implementations of the specification. In addition, while a particular feature of the specification may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for a given or particular application. Furthermore, to the extent that the terms "includes," has, "" contains, "or variants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term" comprising.
The foregoing is merely a preferred embodiment of the present disclosure, and it should be noted that modifications and refinements may be made by those skilled in the art without departing from the principle of the present disclosure, and these modifications and refinements should also be construed as the protection scope of the present disclosure.
Claims (5)
1. A flexible display device, comprising:
a flexible panel;
the flexible combination pad is arranged on the flexible panel, wherein non-circuit areas are defined on two sides of the flexible combination pad, and grooves are formed in the non-circuit areas;
the anisotropic conductive film is attached to the flexible bonding pad and arranged in the groove of the non-circuit area, and the anisotropic conductive film is colloid with conductive particles; and
an integrated circuit attached to the anisotropic conductive film; wherein the width of the groove ranges between 1mm and 2 mm; the flexible panel comprises a flexible film and an array film, and the array film is provided with the groove in the non-circuit area; the flexible film is provided with the groove in the non-circuit area; the array film comprises a buffer layer, a semiconductor layer, a first grid insulating layer, a first grid, a second grid insulating layer, a second grid, an interlayer dielectric layer and a flat layer which are sequentially arranged, wherein the buffer layer, the first grid insulating layer, the second grid insulating layer, the interlayer dielectric layer and the flat layer are arranged in a non-line area, grooves are formed in the non-line area, and the anisotropic conductive film covers the grooves in the non-line area.
2. The flexible display device according to claim 1, wherein the anisotropic conductive film has a substantially U-shape in side view.
3. The flexible display device according to claim 1, wherein the anisotropic conductive film has a plurality of contact surfaces contacting the flexible bonding pads, and the contact surfaces of the anisotropic conductive film include a plane and a vertical plane perpendicular to each other.
4. The flexible display device according to claim 3, wherein the flat surface of the anisotropic conductive film contacts an upper surface of the flexible bonding pad, and the vertical surface of the anisotropic conductive film contacts a side surface of the flexible bonding pad.
5. The flexible display device of claim 1, wherein the material of the flexible film comprises polyimide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910149364.9A CN109920821B (en) | 2019-02-28 | 2019-02-28 | Flexible display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910149364.9A CN109920821B (en) | 2019-02-28 | 2019-02-28 | Flexible display device |
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| Publication Number | Publication Date |
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| CN109920821A CN109920821A (en) | 2019-06-21 |
| CN109920821B true CN109920821B (en) | 2022-02-01 |
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| CN201910149364.9A Active CN109920821B (en) | 2019-02-28 | 2019-02-28 | Flexible display device |
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Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20140074740A (en) * | 2012-12-10 | 2014-06-18 | 삼성디스플레이 주식회사 | Display devcie and manufacturing method of the same |
| CN108877501A (en) * | 2018-07-02 | 2018-11-23 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof, display device |
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