CN115019677A - Display panel, preparation method thereof and preparation method of display device - Google Patents
Display panel, preparation method thereof and preparation method of display device Download PDFInfo
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- CN115019677A CN115019677A CN202210768489.1A CN202210768489A CN115019677A CN 115019677 A CN115019677 A CN 115019677A CN 202210768489 A CN202210768489 A CN 202210768489A CN 115019677 A CN115019677 A CN 115019677A
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Abstract
The embodiment of the application provides a display panel, a preparation method thereof and a preparation method of a display device, wherein the display panel comprises: a first substrate in which an electronic device is disposed; the connecting wires are arranged at intervals along a first direction, are electrically connected with the electronic device and are wound from the light emitting surface of the first substrate to the backlight surface of the first substrate, and the first direction is a direction parallel to the plane of the first substrate; and the conductive pad is positioned on one side where the backlight surface is positioned, is electrically connected with the connecting wire and is used for connecting the driving chip and/or the flexible circuit board. The embodiment of the application can effectively reduce the size of the lower frame of the display panel, saves the bending process and avoids yield loss caused by bending.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a display panel, a preparation method of the display panel and a preparation method of a display device.
Background
With the development of the full-screen technology, the proportion of the size of the mobile phone screen is higher and higher, and the size of the lower frame of the display panel is also higher and higher. Some methods for realizing a narrow frame of a lower frame of a display panel adopt a bound region Bending (Pad Bending) structure, and bend the bound region to the back of the display panel by designing a specific Bending region, so as to realize the narrow frame.
Disclosure of Invention
The embodiment of the application provides a display panel, a preparation method of the display panel and a preparation method of a display device, which can effectively reduce the size of a lower frame of the display panel.
In a first aspect, an embodiment of the present application provides a display panel, including: a first substrate in which an electronic device is disposed; the connecting wires are arranged at intervals along a first direction, are electrically connected with the electronic device and are wound from the light emitting surface of the first substrate to the backlight surface of the first substrate, and the first direction is a direction parallel to the plane of the first substrate; and the conductive pad is positioned on one side where the backlight surface is positioned, is electrically connected with the connecting wire and is used for connecting the driving chip and/or the flexible circuit board.
According to an embodiment of the first aspect of the present application, the first substrate further includes a plurality of conductive pads located on the backlight surface and arranged at intervals along the first direction, the plurality of conductive pads are electrically connected to the plurality of connection traces in a one-to-one correspondence, the conductive pads are located in an orthographic projection of the conductive pad on the first substrate, and the conductive pads are bound to the driving chip and/or the flexible circuit board through the conductive pad; the light emitting surface of the first substrate is provided with a packaging part, and the first substrate is connected with the cover plate through the packaging part; in the direction perpendicular to the plane of the first substrate, the orthographic projection of the conductive pad on the first substrate is at least partially overlapped with the orthographic projection of the packaging part on the first substrate.
Therefore, as the connection strength of the part of the first substrate connected with the packaging part is stronger, when the conductive bonding pad is arranged in the area at least partially overlapped with the orthographic projection of the packaging part on the first substrate, the screen body can be ensured to have a sufficient supporting function after the driving chip and/or the flexible circuit board are bound with the conductive bonding pad.
According to any one of the embodiments of the first aspect of the present application, the encapsulation portion is located in an edge region of the light emitting surface, the edge region including at least one of a left side edge, a right side edge, an upper side edge, and a lower side edge; in the direction perpendicular to the plane of the first substrate, the orthographic projection of the conductive pad on the first substrate at least partially overlaps with the orthographic projection of the packaging part on the left side edge, the right side edge, the upper side edge and/or the lower side edge on the first substrate.
Therefore, the position of the conductive bonding pad can be flexibly adjusted in the overlapped area of the packaging part, the screen body can be ensured to have sufficient supporting effect, the flexibility of the design of the display panel is improved, and the mechanism interference is avoided.
According to any of the embodiments of the first aspect of the present application, the conductive pads are made of a first material having conductive anisotropy, and the conductive pads are electrically connected to the plurality of connection traces simultaneously.
Therefore, the conductive pad is prepared from the first material with conductive anisotropy, so that the conductive pad can be integrally formed while short circuit of a plurality of connecting wires connected with the conductive pad is avoided, the production process of the display panel is simplified, and the production efficiency is improved.
According to any of the preceding embodiments of the first aspect of the present application, the first material comprises an anisotropic conductive film.
Therefore, the conductive pad is prepared through the anisotropic conductive adhesive film, so that the conductive pad can be integrally formed while short circuit of a plurality of connecting wires connected with the conductive pad is avoided, the production process of the display panel is simplified, and the production efficiency is improved.
According to any of the embodiments of the first aspect of the present application, the conductive pads include a first conductive pad and a second conductive pad arranged at a distance, and the first conductive pad is electrically connected to the second conductive pad; the first conductive pad is used for connecting the driving chip, and the second conductive pad is used for connecting the flexible circuit board.
Therefore, the first conductive pad and the second conductive pad are arranged, the first conductive pad is used for connecting the driving Chip, the second conductive pad is used for connecting the flexible circuit board, and a Chip On Glass (Chip On Glass) design of the backlight surface can be realized.
In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel, where the display panel includes the display panel provided in the first aspect, and the method for manufacturing the display panel includes: depositing metal layers on the light emitting surface, the first side surface and the backlight surface of the first substrate; patterning the metal layer to obtain a plurality of connecting wires which are arranged at intervals along a first direction, wherein the connecting wires are wound from the light emitting surface to the backlight surface through the first side surface; and a conductive pad is formed on one side of the backlight surface and electrically connected with the connecting trace for connecting the driving chip and/or the flexible circuit board.
According to the embodiment of the second aspect of the present application, the light emitting surface of the first substrate is provided with the encapsulation portion, and the first substrate is connected with the cover plate through the encapsulation portion; forming a conductive pad on the side where the backlight surface is located, specifically comprising: in the direction perpendicular to the plane of the first substrate, a conductive bonding pad is arranged in the area where the backlight surface and the packaging part are at least partially overlapped; a conductive pad is formed on a side of the conductive pad facing away from the first substrate.
Therefore, as the connection strength of the part of the first substrate connected with the packaging part is stronger, when the conductive bonding pad is arranged in the area at least partially overlapped with the orthographic projection of the packaging part on the first substrate, the screen body can be ensured to have a sufficient supporting function after the driving chip and/or the flexible circuit board are bound with the conductive bonding pad.
In a third aspect, an embodiment of the present application provides a method for manufacturing a display device, where the method for manufacturing a display device includes: a method for producing a display panel as provided in the second aspect; and binding the driving chip and/or the flexible circuit board on the conductive pad.
According to the third aspect of the present application, the method for bonding a driver chip and/or a flexible circuit board to a conductive pad specifically includes: after the driving chip is bound on the flexible circuit board, binding the flexible circuit board with the conducting pad; or, the conductive pads include first conductive pads and second conductive pads arranged at intervals, the driving chip is bound with the first conductive pads, and the flexible circuit board is bound with the second conductive pads.
In this way, a COF (Chip On FPC) design or a COG (Chip On Glass) design of the backlight surface can be realized.
The display panel, the manufacturing method thereof and the manufacturing method of the display device provided by the embodiment of the application comprise the following steps: a first substrate in which an electronic device is disposed; the connecting wires are arranged at intervals along a first direction, are electrically connected with the electronic device and are wound from the light emitting surface of the first substrate to the backlight surface of the first substrate, and the first direction is a direction parallel to the plane of the first substrate; and the conductive pad is positioned on one side where the backlight surface is positioned, is electrically connected with the connecting wire and is used for connecting the driving chip and/or the flexible circuit board. The embodiment of the application is to walk the line around establishing the play plain noodles to first base plate with being connected of the electron device in the first base plate, perhaps says through connecting to walk the line and draw the shady face of first base plate with the pin of the electron device in the first base plate, then walk the line with being connected of drive chip and/or flexible circuit board and shady face and bind through the conducting pad, can effectively reduce display panel's lower frame size to and save the process of buckling, avoid buckling the yield loss that leads to.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a display panel bonded to a flexible circuit board;
fig. 2 is a schematic top view of a backlight surface of a display panel according to an embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure;
fig. 4 is another schematic cross-sectional view of a display panel according to an embodiment of the present disclosure;
fig. 5 is another schematic top view illustrating a backlight surface of a display panel according to an embodiment of the present disclosure;
fig. 6 is a schematic top view of a light emitting surface of a display panel according to an embodiment of the present disclosure;
fig. 7 is a schematic top view illustrating a backlight surface of a display panel according to an embodiment of the present disclosure;
fig. 8 is a schematic top view illustrating a backlight surface of a display panel according to an embodiment of the present disclosure;
fig. 9 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 10 is an operation schematic diagram of a manufacturing method of a display panel according to an embodiment of the present application;
fig. 11 is an operation diagram of a method for manufacturing a display device according to an embodiment of the present disclosure;
fig. 12 is another schematic operation diagram of a manufacturing method of a display device according to an embodiment of the present application;
fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present application.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are intended to be illustrative only and are not intended to be limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It should be understood that the term "and/or" as used herein is merely a relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B, may represent: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
In the embodiments of the present application, the term "electrically connected" may mean that two components are directly electrically connected, or may mean that two components are electrically connected to each other via one or more other components.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application cover the modifications and variations of this application provided they come within the scope of the corresponding claims (the claimed subject matter) and their equivalents. It should be noted that the embodiments provided in the embodiments of the present application can be combined with each other without contradiction.
Before explaining the technical solutions provided by the embodiments of the present application, in order to facilitate understanding of the embodiments of the present application, the present application first specifically explains the problems existing in the related art:
at present, the technology of bonding a driver Chip On a Glass substrate (COG) is currently used in many display devices, but the direct bonding of the driver Chip (IC) On the Glass substrate of a display panel occupies a large area in the lower frame of the display panel, resulting in a large width (or size) of the lower frame of the display panel.
Fig. 1 is a schematic diagram of a display panel and a flexible circuit board. As shown in fig. 1, in order to reduce the width of the lower frame of the display panel, a design that the driver Chip is bound On a flexible circuit board (COF) may be adopted. That is, after the display panel 10 ' is bonded to a Flexible Printed Circuit (FPC) 20 ', the driver chip 30 ' is bent to the back surface of the display panel 10 ' through the FPC 20 '. Although the COF design can reduce the width of the lower frame of the display panel 10 ' to some extent, the width of the lower frame of the display panel 10 ' is still large due to various factors such as alignment accuracy, attachment tolerance, and bending radius of the flexible circuit board 20 '.
For example, if there is a deviation between the flexible circuit board 20 ' and the display panel 10 ' during alignment and attachment, the flexible circuit board 20 ' may be inclined. Therefore, a space is required to be reserved to prevent the flexible circuit board 20 'from being placed after the alignment deviation or the attachment deviation, which may result in an increase in the size of the lower frame of the display panel 10'. Meanwhile, under the influence of the bending radius of the flexible circuit board 20 ', the larger the bending space required for bending to the backlight surface of the display panel 10 ', which results in the larger width of the lower frame of the display panel 10 '.
In view of the above research by the inventors, embodiments of the present application provide a display panel, a manufacturing method thereof, and a manufacturing method of a display device, which can solve the technical problem of the related art that the width of the lower frame of the display panel is large.
The technical idea of the embodiment of the application is as follows: firstly, a connecting wire connected with an electronic device in the first substrate is wound to the backlight surface of the first substrate, or a pin of the electronic device in the first substrate is led to the backlight surface of the first substrate through the connecting wire, and then the driving chip and/or the flexible circuit board are bound with the connecting wire of the backlight surface through the conducting pad. Therefore, a larger space does not need to be reserved in the lower frame of the display panel to bind the driving chip and/or the flexible circuit board, and the size of the lower frame of the display panel is effectively reduced.
The following first describes a display panel provided in an embodiment of the present application.
Fig. 2 is a schematic top view of a backlight surface of a display panel according to an embodiment of the present disclosure. Fig. 3 is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure. As shown in fig. 2 and fig. 3, the display panel 20 provided in the embodiment of the present application includes: the first substrate 210, a plurality of connection traces 220 and conductive pads 230 are arranged at intervals along the first direction X. The first direction X is a direction parallel to a plane (such as the light emitting surface a or the backlight surface b) where the first substrate is located. In the embodiment of the present application, the first substrate 210 may include, for example, a substrate, a driving device layer, a light emitting layer, and an encapsulation layer, which are stacked. The substrate includes, but is not limited to, a hard substrate including, but not limited to, a glass substrate, a plastic substrate, a quartz substrate, or a sapphire substrate. Of course, in some examples, the first substrate 210 may further include a touch function layer, that is, the first substrate 210 may be a touch display substrate. It is easily understood that the electronic devices are disposed in the first substrate 210. The electronic device may comprise, for example, a transistor, a capacitor and/or a light emitting element, among others.
In the embodiment of the present application, the connection trace 220 may be electrically connected to an electronic device in the first substrate 210. Specifically, the first substrate 210 may have a scan signal line, a data signal line, a power supply voltage signal line, a reference voltage signal line, a detection signal line, and the like disposed therein. The plurality of connection traces 220 can be divided into a plurality of types. The first type of connection trace 220 may be electrically connected to a gate of a transistor in the first substrate 210 through a scan signal line, the second type of connection trace 220 may be electrically connected to a source or a drain of the transistor in the first substrate 210 through a data signal line, the third type of connection trace 220 may be electrically connected to a power supply voltage signal line in the first substrate 210 (i.e., may be understood as being indirectly connected to the transistor), the fourth type of connection trace 220 may be electrically connected to a reference voltage signal line in the first substrate 210 (i.e., may be understood as being indirectly connected to the transistor), the fifth type of connection trace 220 may be electrically connected to a detection signal line in the first substrate 210 (i.e., may be understood as being indirectly connected to the transistor), and so on.
It is noted that the connection trace 220 can be wound from the light-emitting surface a of the first substrate 210 to the backlight surface b of the first substrate 210. Specifically, for example, after the connection traces 220 are connected to the light-emitting surface a of the first substrate 210, the connection traces can be wound around the backlight surface b of the first substrate 210 along the side surface (referred to as the first side surface) of the lower frame of the first substrate 210.
The conductive pad 230 is located at a side of the first substrate 210 where the backlight surface b is located, and is electrically connected to the connection trace 220 for connecting the driving chip and/or the flexible circuit board.
The display panel of the embodiment of the application, the display panel includes: a first substrate in which an electronic device is disposed; the connecting wires are arranged at intervals along a first direction, are electrically connected with the electronic device and are wound from the light emitting surface of the first substrate to the backlight surface of the first substrate, and the first direction is a direction parallel to the plane of the first substrate; and the conductive pad is positioned on one side where the backlight surface is positioned, is electrically connected with the connecting wire and is used for connecting the driving chip and/or the flexible circuit board. According to the embodiment of the application, the connection wire connected with the electronic device in the first substrate is wound on the light emitting surface of the first substrate, or the pin of the electronic device in the first substrate is led to the backlight surface of the first substrate through the connection wire, and then the connection wire connecting the driving chip and/or the flexible circuit board with the backlight surface is bound through the conductive pad. Therefore, the driver chip and/or the flexible circuit board do not need to be bound by reserving a large space in the lower frame of the display panel, the size of the lower frame of the display panel can be effectively reduced, the bending process is saved, and yield loss caused by bending is avoided.
Fig. 4 is another schematic cross-sectional view of a display panel according to an embodiment of the present disclosure. Fig. 5 is another schematic top view of a backlight surface of a display panel according to an embodiment of the present disclosure. With reference to fig. 4 and 5, according to some embodiments of the present application, optionally, the first substrate 210 may further include a plurality of conductive pads 610 located on the backlight surface b and arranged at intervals along the first direction X, and the plurality of conductive pads 610 are electrically connected to the plurality of connection traces 220 in a one-to-one correspondence. The conductive pad 610 is located in an orthographic projection of the conductive pad 230 on the first substrate 210, and the conductive pad 610 may be bound with the driving chip and/or the flexible circuit board through the conductive pad 230. The light emitting surface a of the first substrate 210 may be provided with a sealing portion 410, and the first substrate 210 may be connected to the cover plate 420 through the sealing portion 410. Illustratively, the material of the sealing portion 410 may be frit (frit), which melts under the action of high temperature and then solidifies to form the sealing portion 410, so as to bond the first substrate 210 and the cover plate 420. The cover plate 420 includes, but is not limited to, a glass cover plate.
In a direction Z perpendicular to a plane of the first substrate, an orthogonal projection of the conductive pad 610 on the first substrate 210 at least partially overlaps an orthogonal projection of the package 410 on the first substrate 210. In some specific examples, for example, an orthogonal projection of the conductive pad 610 on the first substrate 210 and an orthogonal projection of the encapsulation part 410 on the first substrate 210 may partially overlap. In other specific examples, for example, the orthographic projection of the conductive pad 610 on the first substrate 210 may also be completely located in the orthographic projection of the encapsulation portion 410 on the first substrate 210.
Therefore, as the connection strength of the part of the first substrate connected with the packaging part is stronger, when the conductive bonding pad is arranged in the area which is at least partially overlapped with the orthographic projection of the packaging part on the first substrate, the screen body can be ensured to have a sufficient supporting function after the driving chip and/or the flexible circuit board are bound with the conductive bonding pad.
Fig. 6 is a schematic top view of a light emitting surface of a display panel according to an embodiment of the present disclosure. As shown in fig. 6, according to some embodiments of the present disclosure, optionally, the encapsulation part 410 may be located at an edge region B of the light emitting surface a of the first substrate 210, where the edge region B includes at least one of a left side edge 510, a right side edge 520, an upper side edge 530 and a lower side edge 540. In the embodiment shown in fig. 5, the edge region B may include, for example, a left side edge 510, a right side edge 520, an upper side edge 530, and a lower side edge 540 at the same time.
As shown in fig. 3, 5 and 6, in a direction Z perpendicular to a plane of the first substrate, an orthogonal projection of the conductive pad 610 on the first substrate 210 may at least partially overlap an orthogonal projection of the package 410 on the left side edge 510, the right side edge 520, the upper side edge 530 and/or the lower side edge 540 on the first substrate 210. That is, the conductive pad 610 may be disposed not only at the lower side edge 540 but also at the left side edge 510, the right side edge 520, and/or the upper side edge 530, to which the embodiment of the present application is not limited.
Therefore, the position of the conductive pad can be flexibly adjusted in the overlapping area of the conductive pad and the packaging part, so that the screen body can be ensured to have a sufficient supporting function, the design flexibility of the display panel is improved, and the mechanism interference is avoided.
According to some embodiments of the present disclosure, optionally, the conductive pad 230 may be made of a first material having conductive anisotropy, and the conductive pad 230 may be electrically connected to the plurality of connection traces 220 at the same time. Wherein the conductive anisotropy means that the first material is conductive in the Z-direction and non-conductive in the X-and Y-directions. The Z direction of the first material may be a pressing direction of the first material, and the X and Y directions may be directions perpendicular to the pressing direction. That is, the conductive pads 230 can be integrally formed, and the conductive pads 230 can be electrically connected to the plurality of connection traces 220 as a whole. The conductive pad 230 is conductive along a bonding direction (e.g., a direction Z perpendicular to a plane of the first substrate), and the conductive pad 230 is non-conductive along a transverse direction (e.g., the first direction X) and a longitudinal direction Y.
Since the conductive pads 230 are not laterally conductive, even if the conductive pads 230 are electrically connected to the connection traces 220 at the same time, short circuits between the connection traces 220 will not occur.
Therefore, the conductive pad is prepared from the first material with conductive anisotropy, so that the conductive pad can be integrally formed while short circuit of a plurality of connecting wires connected with the conductive pad is avoided, the production process of the display panel is simplified, and the production efficiency is improved.
In some specific embodiments, optionally, the first material includes, but is not limited to, Anisotropic Conductive Film (ACF).
Therefore, the conductive pad is prepared through the anisotropic conductive adhesive film, so that the conductive pad can be integrally formed while short circuit of a plurality of connecting wires connected with the conductive pad is avoided, the production process of the display panel is simplified, and the production efficiency is improved.
Fig. 7 is a schematic top view illustrating a backlight surface of a display panel according to an embodiment of the present disclosure. As shown in fig. 6 and 7, according to some embodiments of the present application, the display panel 20 may optionally include one conductive pad 230, and the conductive pad 230 may be disposed at the lower side edge 540, the left side edge 510, the right side edge 520, or the upper side edge 530. An orthogonal projection of the conductive pad 230 on the first substrate 210 at least partially overlaps an orthogonal projection of the package portion 410 on the first substrate 210. In practical applications, the conductive pads 230 may be bound to the flexible circuit board 30, and the driver chip 40 is bound to the flexible circuit board 30, so as to implement a COF design on the backlight surface of the first substrate 210.
Fig. 8 is a schematic top view illustrating a backlight surface of a display panel according to an embodiment of the present disclosure. In conjunction with fig. 6 and 8, according to other embodiments of the present application, optionally, unlike the embodiment shown in fig. 7, the conductive pads may include a first conductive pad (not shown) and a second conductive pad (not shown) which are arranged at intervals, the conductive pad 230 may include a first conductive pad 810 and a second conductive pad 820 which are arranged at intervals, the first conductive pad is located in an orthographic projection of the first conductive pad 810 on the first substrate, the second conductive pad is located in an orthographic projection of the second conductive pad 820 on the first substrate, and the first conductive pad 810 is electrically connected to the second conductive pad 820. The first conductive pad and the first conductive pad 810 may be disposed at the lower side edge 540, and may be disposed at the left side edge 510, the right side edge 520, or the upper side edge 530. Similarly, the second conductive pad and the second conductive pad 820 may be disposed at the lower side edge 540, and may also be disposed at the left side edge 510, the right side edge 520, or the upper side edge 530. The first conductive pad 810 may be used for connecting the driving chip 40, i.e., binding with the driving chip 40. The second conductive pad 820 may be used to connect the flexible circuit board 30, i.e., to be bound with the flexible circuit board 30.
In this way, the first conductive pad and the second conductive pad are disposed, the first conductive pad is used for connecting the driving chip, and the second conductive pad is used for connecting the flexible circuit board, so that the COG design of the backlight surface of the first substrate 210 can be realized.
It should be noted that the display panel 20 provided in the embodiment of the present application includes, but is not limited to, an OLED display panel.
Based on the display panel 20 provided in the above embodiment, correspondingly, the embodiment of the present application further provides a manufacturing method of the display panel. The manufacturing method of the display panel is, for example, used for manufacturing the display panel 20 provided in the above embodiment. Please see the examples below.
Fig. 9 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure. As shown in fig. 9, the method for manufacturing a display panel provided in the embodiment of the present application may include the following steps S101 to S103.
S101, depositing metal layers on the light emitting surface, the first side surface and the backlight surface of the first substrate.
Fig. 10 is an operation schematic diagram of a method for manufacturing a display panel according to an embodiment of the present application. As shown in fig. 10, in S101, the metal layer 100 may be first deposited on the partial area of the light emitting surface a, the partial area of the first side surface c and the partial area of the backlight surface b of the first substrate 210. The material of the metal layer is not limited in the embodiment of the application, and can be flexibly adjusted according to actual conditions. The first side c may be a side of a lower frame of the first substrate 210, which is referred to as a lower side.
S102, patterning the metal layer to obtain a plurality of connecting wires which are arranged at intervals along the first direction, wherein the connecting wires are wound from the light emitting surface to the backlight surface through the first side surface.
As shown in fig. 10, in S102, the metal layer 100 may be patterned, for example, by a laser etching process, so as to obtain a plurality of connection traces 220 arranged at intervals along the first direction X. The connection trace 220 is wound from the light-emitting surface a to the backlight surface b through the first side surface c.
And S103, forming a conductive pad on the side where the backlight surface is located, wherein the conductive pad is electrically connected with the connecting trace and is used for connecting the driving chip and/or the flexible circuit board.
As shown in fig. 10, in S103, a conductive pad 230 may be formed at a side where the backlight surface b is located. Taking the conductive pad 230 as an ACF, for example, the conductive pad 230 can be formed on the side of the backlight surface b by a coating process. The conductive pad 230 may be electrically connected with the connection trace 220, and the conductive pad 230 may be used for connecting a driving chip and/or a flexible circuit board.
According to the preparation method of the display panel, the connection wires connected with the electronic device in the first substrate are wound on the light emitting surface of the first substrate, or the pins of the electronic device in the first substrate are led to the backlight surface of the first substrate through the connection wires, then the connection wires of the driving chip and/or the flexible circuit board and the backlight surface are bound through the conducting pads, the size of the lower frame of the display panel can be effectively reduced, the screen occupation ratio is increased, the bending process is saved, and yield loss caused by bending is avoided.
As shown in fig. 4, according to some embodiments of the present disclosure, optionally, the light emitting surface a of the first substrate 210 may be provided with a packaging portion 410, and the first substrate 210 may be connected to the cover plate 420 through the packaging portion 410.
Correspondingly, in step S103, forming a conductive pad on the side where the backlight surface is located, the method may specifically include the following steps: in the direction perpendicular to the plane of the first substrate, a conductive bonding pad is arranged in the area where the backlight surface and the packaging part are at least partially overlapped; a conductive pad is formed on a side of the conductive pad facing away from the first substrate.
Specifically, as shown in fig. 5, in a direction Z perpendicular to the plane of the first substrate, the conductive pad 610 may be disposed in a region where the backlight surface b of the first substrate 210 and the encapsulation portion 410 at least partially overlap. The conductive pad 230 is then formed on the conductive pad 610, for example, by a coating process. In some specific examples, for example, an orthogonal projection of the conductive pad 610 on the first substrate 210 and an orthogonal projection of the encapsulation part 410 on the first substrate 210 may partially overlap. In other specific examples, for example, the orthographic projection of the conductive pad 610 on the first substrate 210 may also be completely located in the orthographic projection of the encapsulation portion 410 on the first substrate 210.
Therefore, as the connection strength of the part of the first substrate connected with the packaging part is stronger, when the conductive bonding pad is arranged in the area at least partially overlapped with the orthographic projection of the packaging part on the first substrate, the screen body can be ensured to have a sufficient supporting function after the driving chip and/or the flexible circuit board are bound with the conductive bonding pad.
As shown in fig. 3, 5 and 6, in some specific embodiments, optionally, the encapsulation portion 410 may be located in an edge region B of the light emitting surface a of the first substrate 210, where the edge region B includes at least one of a left side edge 510, a right side edge 520, an upper side edge 530 and a lower side edge 540. In a direction Z perpendicular to a plane of the first substrate, an orthographic projection of the conductive pad 610 on the first substrate 210 may at least partially overlap with an orthographic projection of the package 410 on the first substrate 210 at the left side edge 510, the right side edge 520, the upper side edge 530, and/or the lower side edge 540. That is, the conductive pad 610 may be disposed not only at the lower side edge 540 but also at the left side edge 510, the right side edge 520, and/or the upper side edge 530, to which the embodiment of the present application is not limited.
Therefore, the position of the conductive pad can be flexibly adjusted in the overlapping area of the conductive pad and the packaging part, so that the screen body can be ensured to have a sufficient supporting function, the design flexibility of the display panel is improved, and the mechanism interference is avoided.
According to some embodiments of the present disclosure, optionally, the step S103 of forming a conductive pad on the side where the backlight surface is located may specifically include the following steps: and a first conductive pad and a second conductive pad which are arranged at intervals are formed on one side of the backlight surface. Specifically, as shown in fig. 5 and 8, a first conductive pad 810 and a second conductive pad 820 may be formed at a side of the backlight surface of the first substrate, and the first conductive pad 810 and the second conductive pad 820 may be electrically connected. The first conductive pad 810 may be disposed on the lower side edge 540, the left side edge 510, the right side edge 520, or the upper side edge 530. Similarly, the second conductive pad 820 may be disposed at the lower edge 540, the left edge 510, the right edge 520, or the upper edge 530. The first conductive pad 810 may be used for connecting the driving chip 40, i.e., binding with the driving chip 40. The second conductive pad 820 may be used to connect the flexible circuit board 30, i.e., to be bound with the flexible circuit board 30.
In this way, the first conductive pads and the second conductive pads are disposed, the first conductive pads are used for connecting the driving chip, and the second conductive pads are used for connecting the flexible circuit board, so that the COG design of the backlight surface of the first substrate 210 can be implemented.
Based on the preparation method of the display panel provided by the embodiment, correspondingly, the embodiment of the application further provides a preparation method of the display device. The preparation method of the display device comprises the following steps: the display panel is formed according to the method for manufacturing a display panel provided in the above embodiment, that is, S101 to S103; and S104, binding a driving chip and/or a flexible circuit board on the conductive pad of the display panel.
Fig. 11 is an operation diagram of a method for manufacturing a display device according to an embodiment of the present disclosure. As shown in fig. 11, according to some embodiments of the present application, optionally, the step S104 of binding the driving chip and/or the flexible circuit board on the conductive pad of the display panel may specifically include the following steps: after the driving chip is bound on the flexible circuit board, the flexible circuit board is bound with the conductive pad. Specifically, the driver chip 40 may be bonded to the flexible circuit board 30, and then the flexible circuit board 30 is bonded only to the conductive pads 230, thereby implementing a COF design of the backlight surface of the first substrate 210.
Fig. 12 is another operation diagram of a method for manufacturing a display device according to an embodiment of the present disclosure. As shown in fig. 12, according to another embodiment of the present application, optionally, unlike the embodiment shown in fig. 11, the step S104 of binding the driving chip and/or the flexible circuit board on the conductive pad may specifically include the following steps: the conductive pads comprise a first conductive pad and a second conductive pad which are arranged at intervals, the driving chip is bound with the first conductive pad, and the flexible circuit board is bound with the second conductive pad. Specifically, the conductive pad 230 may include a first conductive pad 810 and a second conductive pad 820 spaced apart from each other, and the first conductive pad 810 is electrically connected to the second conductive pad 820. The driver chip 40 may be bonded to the first conductive pad 810, and the flexible circuit board 30 may be bonded to the second conductive pad 820, so as to implement a COG design for the backlight surface of the first substrate 210.
Based on the display panel 20 provided by the above embodiment, correspondingly, the present application further provides a display device, which includes the display panel provided by the present application. Referring to fig. 13, fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present application. Fig. 13 provides a display device 1000 including the display panel 20 according to any of the above embodiments of the present application. The display device 1000 is described in the embodiment of fig. 13, for example, taking a mobile phone as an example, it is understood that the display device provided in the embodiment of the present application may be other display devices having a display function, such as a wearable product, a computer, a television, and a vehicle-mounted display device, and the present application is not limited thereto. The display device provided in the embodiment of the present application has the beneficial effects of the display panel 20 provided in the embodiment of the present application, and specific reference may be specifically made to the specific description of the display panel 20 in each of the above embodiments, which is not repeated herein.
In some embodiments, the display device 1000 may further include a flexible circuit board and a driving chip, and the flexible circuit board and the driving chip may be attached to the back of the display panel in the COF design or the COG design described above.
In some embodiments, the display device 1000 may further include the above-mentioned packaging portion 410 and the cover plate 420, and the display panel 20 may be connected to the cover plate 420 through the packaging portion 410, where the specific connection relationship is described in detail above and is not described herein again.
In accordance with the embodiments of the present application as described above, these embodiments are not exhaustive and do not limit the application to the specific embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and its practical application, to thereby enable others skilled in the art to best utilize the application and its various modifications as are suited to the particular use contemplated. The application is limited only by the claims and their full scope and equivalents.
It is to be understood that the present application is not limited to the particular arrangements and instrumentalities described above and shown in the attached drawings. A detailed description of known methods is omitted herein for the sake of brevity. In the above embodiments, several specific steps are described and shown as examples. However, the method processes of the present application are not limited to the specific steps described and illustrated, and those skilled in the art can make various changes, modifications, and additions or change the order between the steps after comprehending the spirit of the present application.
It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed simultaneously.
Aspects of the present application are described above with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions/acts specified in the flowchart and/or block diagram block or blocks. Such a processor may be, but is not limited to, a general purpose processor, a special purpose processor, an application specific processor, or a field programmable logic circuit. It will also be understood that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based computer instructions which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
As described above, only the specific embodiments of the present application are provided, and it can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the system, the module and the unit described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application.
Claims (10)
1. A display panel, comprising:
the electronic device comprises a first substrate, a second substrate and a third substrate, wherein an electronic device is arranged in the first substrate;
the connecting wires are arranged at intervals along a first direction, are electrically connected with the electronic device and are wound from the light emitting surface of the first substrate to the backlight surface of the first substrate, and the first direction is a direction parallel to the plane of the first substrate;
and the conductive pad is positioned on one side of the backlight surface, is electrically connected with the connecting wire and is used for connecting a driving chip and/or a flexible circuit board.
2. The display panel according to claim 1, wherein the first substrate further includes a plurality of conductive pads located on the backlight surface and arranged at intervals along the first direction, the plurality of conductive pads are electrically connected to the plurality of connection traces in a one-to-one correspondence, the conductive pads are located in an orthographic projection of the conductive pads on the first substrate, and the conductive pads are bound to the driving chip and/or the flexible circuit board through the conductive pads;
the light emitting surface of the first substrate is provided with a packaging part, and the first substrate is connected with the cover plate through the packaging part;
in the direction perpendicular to the plane of the first substrate, the orthographic projection of the conductive pad on the first substrate is at least partially overlapped with the orthographic projection of the packaging part on the first substrate.
3. The display panel according to claim 2, wherein the encapsulation portion is located at an edge region of the light emitting surface, the edge region including at least one of a left side edge, a right side edge, an upper side edge, and a lower side edge;
in a direction perpendicular to a plane where the first substrate is located, an orthographic projection of the conductive pad on the first substrate is at least partially overlapped with an orthographic projection of the packaging part on the left side edge, the right side edge, the upper side edge and/or the lower side edge on the first substrate.
4. The display panel of claim 1, wherein the conductive pads are made of a first material having conductive anisotropy, and the conductive pads are electrically connected to the plurality of connection traces simultaneously.
5. The display panel of claim 1, wherein the first material comprises an anisotropic conductive film.
6. The display panel of claim 1, wherein the conductive pads comprise a first conductive pad and a second conductive pad arranged at a distance, and the first conductive pad is electrically connected to the second conductive pad;
the first conductive pad is used for connecting the driving chip, and the second conductive pad is used for connecting the flexible circuit board.
7. A method for manufacturing a display panel, wherein the display panel comprises the display panel according to any one of claims 1 to 6, the method comprising:
depositing metal layers on the light emitting surface, the first side surface and the backlight surface of the first substrate;
patterning the metal layer to obtain a plurality of connecting wires which are arranged at intervals along a first direction, wherein the connecting wires are wound from the light emitting surface to the backlight surface through the first side surface;
and forming the conductive pad on the side where the backlight surface is located, wherein the conductive pad is electrically connected with the connecting trace and is used for connecting a driving chip and/or a flexible circuit board.
8. The method according to claim 7, wherein a package portion is disposed on the light emitting surface of the first substrate, and the first substrate is connected to the cover plate through the package portion;
the forming of the conductive pad on the side where the backlight surface is located specifically includes:
arranging the conductive bonding pad in a region where the backlight surface and the packaging part are at least partially overlapped in a direction perpendicular to a plane where the first substrate is located;
the conductive pad is formed on a side of the conductive pad facing away from the first substrate.
9. A method of manufacturing a display device, the method comprising:
forming the display panel according to the method of claim 7 or claim 8;
and binding the driving chip and/or the flexible circuit board on the conductive pad of the display panel.
10. The method according to claim 9, wherein the bonding the driver chip and/or the flexible circuit board on the conductive pad specifically comprises:
binding the flexible circuit board with the conductive pad after the driver chip is bound on the flexible circuit board; or,
the conductive pads comprise first conductive pads and second conductive pads which are arranged at intervals, the driving chip is bound with the first conductive pads, and the flexible circuit board is bound with the second conductive pads.
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