CN112521873A - Method for manufacturing anisotropic conductive film - Google Patents
Method for manufacturing anisotropic conductive film Download PDFInfo
- Publication number
- CN112521873A CN112521873A CN202011386632.8A CN202011386632A CN112521873A CN 112521873 A CN112521873 A CN 112521873A CN 202011386632 A CN202011386632 A CN 202011386632A CN 112521873 A CN112521873 A CN 112521873A
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- China
- Prior art keywords
- coating
- conductive
- glue
- anisotropic conductive
- film
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- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 38
- 239000002313 adhesive film Substances 0.000 claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 239000003292 glue Substances 0.000 claims abstract description 28
- 239000002131 composite material Substances 0.000 claims abstract description 6
- 238000005553 drilling Methods 0.000 claims abstract description 6
- 239000012466 permeate Substances 0.000 claims abstract description 6
- 238000007790 scraping Methods 0.000 claims abstract description 6
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 239000004005 microsphere Substances 0.000 abstract description 7
- 239000002245 particle Substances 0.000 abstract description 7
- 238000002360 preparation method Methods 0.000 abstract description 6
- 238000004080 punching Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 12
- 239000003973 paint Substances 0.000 description 8
- 238000009413 insulation Methods 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000238367 Mya arenaria Species 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a method for manufacturing an anisotropic conductive adhesive film, which comprises the following steps: (1) coating glue on a piece of double-sided release film; (2) after coating, covering a layer of double-sided release film on the other side to form a sandwich structure with the release films on the two sides and the glue layer in the middle; (3) carrying out intensive laser drilling on the composite adhesive film with the sandwich structure; (4) coating a conductive coating on one surface of the punched hole, and ensuring that the conductive coating permeates into the opposite surface of the hole; (5) scraping the conductive coatings on the two surfaces by using a scraper; (6) and semi-curing in a baking oven to obtain the anisotropic conductive adhesive film. The preparation method of the anisotropic conductive adhesive film can be finished by coating, attaching, punching, grouting and semi-curing without conductive microspheres. The invention can arrange the conductive particles at any rule, thereby having higher reliability than the traditional mode.
Description
Technical Field
The invention relates to a method for manufacturing a directional conductive adhesive film, and belongs to the field of conductive material preparation.
Background
The anisotropic conductive film is a transparent high-molecular connecting material with three characteristics of adhesion, conductivity and insulation, is mainly applied to multiple fields of OLED, electronic books, touch screens and the like, and has the remarkable characteristics of vertical conduction and horizontal insulation, and can solve the problem of fine wire connection which cannot be processed by the conventional connector. Anisotropic Conductive Films (ACFs) have the property of being able to be continuously processed with very low material loss, and thus are currently the more commonly used product form.
The anisotropic conductive film is characterized in that the Z-axis electrical conduction direction and the resistance characteristics of the XY insulation plane have obvious difference. When the difference between the Z-axis conduction resistance value and the XY-plane insulation resistance value exceeds a certain ratio, it is called as good conduction anisotropy.
The anisotropic conductive film utilizes conductive particles to connect the electrodes between the IC chip and the substrate to make them conductive, and simultaneously can avoid the conduction short circuit between two adjacent electrodes, thereby achieving the purpose of conduction only in the Z-axis direction.
The anisotropic conductive adhesive mainly comprises a resin adhesive and conductive particles. The resin adhesive functions to fix the relative position of the electrodes between the IC chip and the substrate and provide a pressing force to maintain the contact area between the electrodes and the conductive particles, in addition to heat resistance and insulation.
Chinese patent CN111718444A provides a conductive microsphere for anisotropic conductive adhesive/film and a preparation method thereof, wherein the inner layer of the conductive microsphere is a highly crosslinked polymer hard core microsphere, the outer layer is a linear polymer soft shell, the surface layer of the outer layer is coated with copper, silver, nickel or gold as a conductive metal layer,
chinese patent CN1919900A provides a method for preparing an anisotropic conductive adhesive film, which comprises adding a thermoplastic elastomer and epoxy resin in insulating resin into a mixed solvent of toluene and ethyl acetate, heating and stirring; after dissolving, adding the conductive particles and uniformly stirring; after cooling, adding the latent curing agent, the antioxidant, the thixotropic agent and the silane coupling agent in the insulating resin, and uniformly stirring to prepare a glue solution. The prepared glue solution is coated on a stripping film made of polyethylene glycol terephthalate treated by a stripping agent, and the film is formed after drying.
Chinese patent CN108102562A provides an anisotropic conductive adhesive film, one side or both sides surface at whole membrane body sets up groove structure, in the components and parts laminating processing procedure, anisotropic conductive adhesive film melts into mobile colloid by hot pressing, its groove structure can accumulate mobile colloid to a certain extent, reduce the discharge amount of colloid, prevent that the excessive gluey phenomenon from appearing in anisotropic conductive adhesive film, glass substrate and PI base plate separation difficulty's when having solved laser scanning problem, can reduce the terminal zone width of panel simultaneously, promote the screen face and account for and compare and the big face number of getting.
At present, the ACF used for the integrated circuit is monopolized by several Japanese companies, the technical difficulty is the manufacture of the conductive microspheres plated with gold of 6 mu m, and the invention is completed by coating, attaching, punching, grouting and semi-curing without the help of the conductive microspheres. The invention can arrange the conductive particles at any rule, thereby having higher reliability than the traditional mode.
Disclosure of Invention
Accordingly, the present invention is directed to a method for manufacturing an anisotropic conductive film, comprising the steps of:
(1) coating an epoxy resin adhesive on a piece of double-sided release film;
(2) after coating, covering a layer of double-sided release film on the other side to form a sandwich structure with the release films on the two sides and the glue layer in the middle;
(3) carrying out intensive laser drilling on the composite adhesive film with the sandwich structure;
(4) coating a conductive coating on one surface of the punched hole, and ensuring that the conductive coating permeates into the opposite surface of the hole;
(5) scraping the conductive coatings on the two surfaces by using a scraper;
(6) and semi-curing in a baking oven to obtain the anisotropic conductive adhesive film.
Preferably, the glue in the step (1) is polyamide glue, acrylic glue or epoxy resin glue.
Preferably, the glue in the step (1) is an epoxy resin glue.
Preferably, the thickness of the double-sided release film in the step (1) is 8-12 μm, and the thickness of the epoxy resin glue coating is 8-12 μm.
Preferably, the thickness of the double-sided release film in the step (2) is 8-12 μm.
Preferably, the diameter of the holes punched in the step (3) is 5-7 μm, and the pitch of the holes punched is 8-12 μm.
Preferably, the conductive paint in step (4) is a conductive nickel powder paint.
The other purpose of the invention is to provide an anisotropic conductive adhesive film and a using method thereof, wherein the release films on the two surfaces are removed during use for connecting a circuit.
The invention uses laser to punch, because of the high heat of the laser, the glue on the hole wall is solidified, and the glue is prevented from flowing and permeating into the hole. The conductive coatings on the two surfaces are scraped by using a scraper, the conductive colloid is easy to scrape due to the characteristic of the release film, and the conductive coatings are left only in the holes due to the fact that the inner parts of the holes can not be scraped.
When the anisotropic conductive adhesive film is used for circuit connection, only the release films on two surfaces need to be removed, the solidified conductive slurry in the release film holes protrudes out of the surface of the adhesive film after the release films are removed, and the extension of the end surface is formed by pressurization when a circuit is bonded, so that the conductive contact area is increased, the vertical resistance is greatly reduced, and the reliability is increased. The anisotropic conductive adhesive film is prepared without conductive microspheres, is prepared by coating, attaching, punching, grouting and semi-curing, and can be randomly and regularly distributed with conductive particles, so that the anisotropic conductive adhesive film is more reliable than the conventional method.
Detailed Description
Example 1
A preparation method and a use method of an anisotropic conductive adhesive film comprise the following steps:
(1) coating 10 mu m epoxy resin glue on a piece of 10 mu m double-sided release film;
(2) after coating, covering a layer of 10-micron double-sided release film on the other side to form a sandwich structure with release films on both sides and a glue layer in the middle;
(3) carrying out intensive laser drilling on the composite adhesive film with the sandwich structure, wherein the diameter of the drilled holes is 6 microns, and the spacing of the drilled holes is 10 microns;
(4) coating conductive nickel powder paint on one surface of the punched hole, and ensuring that the conductive paint permeates to the opposite surface of the hole;
(5) scraping the conductive coatings on the two surfaces by using a scraper;
(6) and semi-curing in a baking oven to obtain the anisotropic conductive adhesive film.
And removing the release films on the two surfaces of the anisotropic conductive adhesive film to be used for circuit connection.
Example 2
A preparation method and a use method of an anisotropic conductive adhesive film comprise the following steps:
(1) coating 8 mu m epoxy resin glue on a piece of 8 mu m double-sided release film;
(2) after coating, covering a layer of double-sided release film with the thickness of 8 mu m on the other side to form a sandwich structure with the release films on both sides and the glue layer in the middle;
(3) carrying out intensive laser drilling on the composite adhesive film with the sandwich structure, wherein the diameter of the drilled holes is 5 microns, and the spacing between the drilled holes is 8 microns;
(4) coating conductive nickel powder paint on one surface of the punched hole, and ensuring that the conductive paint permeates to the opposite surface of the hole;
(5) scraping the conductive coatings on the two surfaces by using a scraper;
(6) and semi-curing in a baking oven to obtain the anisotropic conductive adhesive film.
And removing the release films on the two surfaces of the anisotropic conductive adhesive film to be used for circuit connection.
Example 3
A preparation method and a use method of an anisotropic conductive adhesive film comprise the following steps:
(1) coating 12 mu m of acrylic glue on a piece of 12 mu m double-sided release film;
(2) after coating, covering a layer of 12-micron double-sided release film on the other side to form a sandwich structure with release films on both sides and a glue layer in the middle;
(3) carrying out intensive laser drilling on the composite adhesive film with the sandwich structure, wherein the diameter of the drilled holes is 7 microns, and the spacing of the drilled holes is 12 microns;
(4) coating conductive nickel powder paint on one surface of the punched hole, and ensuring that the conductive paint permeates to the opposite surface of the hole;
(5) scraping the conductive coatings on the two surfaces by using a scraper;
(6) and semi-curing in a baking oven to obtain the anisotropic conductive adhesive film.
And removing the release films on the two surfaces of the anisotropic conductive adhesive film to be used for circuit connection.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements can be made to the technical solution of the present invention by those skilled in the art without departing from the spirit of the present invention, and the technical solution of the present invention is defined by the claims.
Claims (9)
1. A method for manufacturing an anisotropic conductive film comprises the following steps:
(1) coating glue on a piece of double-sided release film;
(2) after coating, covering a layer of double-sided release film on the other side to form a sandwich structure with the release films on the two sides and the glue layer in the middle;
(3) carrying out intensive laser drilling on the composite adhesive film with the sandwich structure;
(4) coating a conductive coating on one surface of the punched hole, and ensuring that the conductive coating permeates into the opposite surface of the hole;
(5) scraping the conductive coatings on the two surfaces by using a scraper;
(6) and semi-curing in a baking oven to obtain the anisotropic conductive adhesive film.
2. The method as claimed in claim 1, wherein the glue in step (1) is polyamide glue, acrylic glue or epoxy resin glue.
3. The method as claimed in claim 2, wherein the glue in step (1) is epoxy resin glue.
4. The method for manufacturing the anisotropic conductive film of claim 1, wherein the thickness of the double-sided release film in the step (1) is 8 to 12 μm, and the thickness of the epoxy resin adhesive is 8 to 12 μm.
5. The method as claimed in claim 1, wherein the thickness of the double-sided release film in the step (2) is 8-12 μm.
6. The method as claimed in claim 1, wherein the holes in step (3) have a diameter of 5-7 μm and a pitch of 8-12 μm.
7. The method for manufacturing the anisotropic conductive film according to claim 1, wherein the conductive coating in step (4) is conductive nickel powder coating.
8. An anisotropic conductive film, characterized in that it is prepared by the method of any one of claims 1 to 5.
9. The method of claim 8, wherein the release films on both sides are removed for connection to an electrical circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011386632.8A CN112521873A (en) | 2020-12-01 | 2020-12-01 | Method for manufacturing anisotropic conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011386632.8A CN112521873A (en) | 2020-12-01 | 2020-12-01 | Method for manufacturing anisotropic conductive film |
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| Publication Number | Publication Date |
|---|---|
| CN112521873A true CN112521873A (en) | 2021-03-19 |
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ID=74996003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011386632.8A Pending CN112521873A (en) | 2020-12-01 | 2020-12-01 | Method for manufacturing anisotropic conductive film |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08273441A (en) * | 1995-03-22 | 1996-10-18 | Whitaker Corp:The | Anisotropic electric conduction film and its preparation |
| US20050118845A1 (en) * | 2001-11-28 | 2005-06-02 | Akihiko Kobayashi | Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices |
| CN103050170A (en) * | 2011-10-17 | 2013-04-17 | 财团法人工业技术研究院 | Anisotropic conductive film and manufacturing method thereof |
| CN105969237A (en) * | 2016-06-29 | 2016-09-28 | 深圳市华星光电技术有限公司 | Method for preparing differential conductive adhesive films |
-
2020
- 2020-12-01 CN CN202011386632.8A patent/CN112521873A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08273441A (en) * | 1995-03-22 | 1996-10-18 | Whitaker Corp:The | Anisotropic electric conduction film and its preparation |
| US20050118845A1 (en) * | 2001-11-28 | 2005-06-02 | Akihiko Kobayashi | Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices |
| CN103050170A (en) * | 2011-10-17 | 2013-04-17 | 财团法人工业技术研究院 | Anisotropic conductive film and manufacturing method thereof |
| CN105969237A (en) * | 2016-06-29 | 2016-09-28 | 深圳市华星光电技术有限公司 | Method for preparing differential conductive adhesive films |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210319 |