CN109679515A - Anisotropic conductive film and display panel - Google Patents
Anisotropic conductive film and display panel Download PDFInfo
- Publication number
- CN109679515A CN109679515A CN201811584302.2A CN201811584302A CN109679515A CN 109679515 A CN109679515 A CN 109679515A CN 201811584302 A CN201811584302 A CN 201811584302A CN 109679515 A CN109679515 A CN 109679515A
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- CN
- China
- Prior art keywords
- conductive film
- anisotropic conductive
- metalwork
- template
- oxidant layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The present invention provides a kind of anisotropic conductive film, including a template, through a plurality of metalworks of the template and the gluing oxidant layer of the covering metalwork.The anisotropic conductive film replaces traditional conducting particles by the ferromagnetism steel plate array controllable and excellent axial conductivity using distribution, improves the uncontrollable phenomenon of conductive materials distribution in anisotropic conductive film.
Description
Technical field
The present invention relates to technical field of display panel, in particular to a kind of anisotropic conductive film and application this respectively to different
The display panel of property conductive adhesive film.
Background technique
In recent years, with the continuous improvement of living standards, requirement of the people to display panel technology is constantly soaring improves.It is aobvious
Show panel in module group procedure, needs to bind IC chip and substrate.Current binding method is led using anisotropy
Electric glue film (Anisotropic Conductive Film, ACF) forms leading for Z-direction between the IC chip and substrate
It is logical.
Shown in FIG. 1 is the structural schematic diagram of current conventional anisotropic conductive film.As shown in Figure 1, it is described respectively to
Anisotropic conductive adhesive film 1 is made of resin 2 and the conducting particles 3 being scattered in the resin 2.It is as shown in Figure 1, this respectively to different
In property conductive adhesive film 1, easily there is local agglomeration in the conducting particles 3, so that the conducting particles 3 is in resin 2
Distribution situation is difficult to control, thus may will affect the electric conductivity of the anisotropic conductive film 1.
In addition, referring to Fig. 2, Fig. 2 is the structural schematic diagram of the conducting particles 3.As shown in Figure 2, the conductive particle
Son 3 is usually successively to coat nickel (Ni) 32, gold (Au) 33 and outer insulation 34 in 31 outer surface of polymer particles.This kind of structure
The conducting particles 3 structure is complicated, making step is cumbersome and cost is high.
It is then desired to a kind of new anisotropic conductive film, to solve the above technical problems.
Summary of the invention
The purpose of the present invention is to provide a kind of anisotropic conductive films, by controllably and axially being led using distribution
Electrically excellent ferromagnetism steel plate array replaces traditional conducting particles, to improve conductive materials in anisotropic conductive film
The uncontrollable phenomenon of distribution, and then improve the performance of anisotropic conductive film.
In order to achieve the above object, the present invention provides a kind of anisotropic conductive film, comprising: a template has opposite
A first surface and a second surface；A plurality of metalworks, each metalwork is through the template and has opposite
One first end and a second end, the first end and second end protrude from the first surface and second surface of the template respectively；
And gluing oxidant layer, it is respectively arranged in the first surface and second surface of the template, also, the gluing oxidant layer covers
The metalwork.
In an embodiment of the present invention, it is sharp to be formed as one for the first end and/or the second end of the metalwork
End.
In an embodiment of the present invention, metalwork array setting, such as, but not limited to rectangular array, diamond shape array,
Circular array.
In an embodiment of the present invention, the spacing between a metalwork and an adjacent metal part is 50~1000 μm.
In an embodiment of the present invention, the metalwork is column or rod-shaped.In one embodiment, section of the metalwork
Face can be any appropriate shape, such as, but not limited to circle, ellipse, rectangle, square, triangle, polygon etc..?
In one embodiment, the section of a plurality of metalworks can have different shapes.
In an embodiment of the present invention, the section maximum gauge of the metalwork can be any suitable size, such as
But it is not limited to 2~100 μm.
In an embodiment of the present invention, the metalwork has a central axis, and the central axis is in the template
First surface and/or second surface.
In an embodiment of the present invention, the surface area of the gluing oxidant layer is less than the first surface and/or described second
The surface area on surface.Preferably, the gluing oxidant layer being set on the first surface of the template covers the metalwork, but
The first surface is not covered；The gluing oxidant layer being set on the second surface of the template covers the metalwork, but
The second surface is not covered；Also, it the gluing oxidant layer being set on the first surface of the template and is set to described
Gluing oxidant layer on the second surface of template can have same or different surface area.
In an embodiment of the present invention, the thickness of the gluing oxidant layer is configured as: in the gluing oxidant layer because towards institute
State template active force deformation occurs and when thickness is become smaller, the first end of the metalwork for tip and/
Or the second end pierces through the gluing oxidant layer.The gluing oxidant layer insulation, and by epoxy resin, phenol-formaldehyde resin, acrylic acid tree
One or more of rouge is mixed.
The present invention also provides a kind of display panel, including array basal plate, the array substrate has at least one binding area
Above-mentioned anisotropic conductive film is arranged in domain in the binding region.
Anisotropic conductive film of the present invention replaces passing by using a plurality of metalworks through the template
The conducting particles of system, realize in anisotropic conductive film formed distribution can manual control, especially perpendicular to
The conductive materials being evenly distributed on the anisotropic conductive film surface direction (i.e. Z-direction), and then improve described each
The performance of anisotropy conductive adhesive film.In addition, anisotropic conductive film of the present invention is with metalwork made of known materials
Instead of traditional complicated conducting particles, production cost is significantly reduced.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the structural schematic diagram of an anisotropic conductive film in the prior art；
Fig. 2 is the structural schematic diagram of a conducting particles in the prior art；
Fig. 3 A to Fig. 3 C is the structural schematic diagram according to an anisotropic conductive film of one embodiment of the invention.
Fig. 4 A and Fig. 4 B are the template and the institute to form an anisotropic conductive film according to an embodiment of the invention
State the structural schematic diagram of metalwork；
Fig. 5 is the structural schematic diagram according to a display panel of one embodiment of the invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
A kind of anisotropic conductive film 10, the perspective view of the anisotropic conductive film 10 are provided in the present embodiment
Fig. 3 A is referred to, the sectional view of the anisotropic conductive film 10 refers to Fig. 3 B, the anisotropic conductive film 10
Top view refers to Fig. 3 C.
As shown in Fig. 3 A to Fig. 3 C, the anisotropic conductive film 10 includes a template 110, runs through the template 110
A plurality of metalworks 120, such as the first metalwork 121 and the second metalwork 122, and be respectively arranged at the template 110
First surface 111 and second surface 112 on gluing oxidant layer 130a and 130b.
As shown in Figure 3B, each metalwork 120 runs through the template 110.In the present embodiment, a plurality of gold
Belonging to part 120 has similar configuration, is hereinafter specifically described by taking the first metalwork 121 and/or the second metalwork 122 as an example.
As shown in Figure 3B, first metalwork 121 has an an opposite first end 121a and second end 121b, the first end
121a and second end 121b protrudes from the first surface 111 and second surface 112 of the template 110 respectively.
As shown in Figure 3B, the first end 121a and/or the second end 121b of first metalwork 121 are formed as
One sharp end.In the present invention, 120 array of the metalwork setting, it is described in detail below.As shown in Figure 3B, described first
Spacing between metalwork 121 and the second adjacent metalwork 122, which can be, meets any spacing that technique requires, such as 50~
1000μm.Also, as shown in Figure 3B, first metalwork 121 has a central axis C, and the central axis C is perpendicular to the mould
The first surface 111 and second surface 112 of plate 110.Anisotropic conductive film 10 described in the present embodiment is made to hang down in this way
Directly in the metalwork 120 of the distribution as conductive materials on the direction on the surface of the anisotropic conductive film 10.
The preparation process of the anisotropic conductive film 10 is described below in conjunction with Fig. 4 A and Fig. 4 B and Fig. 3 A to Fig. 3 C.
As shown in Figure 4 A, there is the template 110 of porous structure first with offer.The template 110 can be by
SiO2Film is made, and the thickness of the template 110 can be any appropriate thickness.It can be obtained by any known method
The SiO2Film such as, but not limited to prepares certain thickness SiO using physical vaporous deposition2Film.Then, in institute
State SiO2Plurality of holes 113 is formed on film, to form porous structure.It can be by any known method in the SiO2It is thin
Plurality of holes 113 is formed on film, such as, but not limited to, lithographic process, hydrofluoric acid orientation etching or electrochemical method.Certainly,
The template 110 with porous structure is also possible to commercially available porous anodic oxidation aluminium formwork.
Then, as shown in Figure 4 B, it is heavy to be such as, but not limited to physical vapor using the porous structure of the template 110
The methods of product, chemical vapor deposition or electrochemical deposition make the conductive metal of such as copper or silver in the hole of the template 110
It is deposited in 113 duct, to form the metalwork 120.
As shown in Figure 4 B, the metalwork 120 is arranged with matrix array.But in the present invention, the metalwork 120 is gone back
It can be to be such as, but not limited to diamond shape array, circular array arrangement.In Fig. 4 A and Fig. 4 B, the section shape of the metalwork 120
Shape, i.e., the shape in the hole 113 in the described template 110, is circular, but in the present invention, the cross sectional shape of the metalwork 120
It can be any appropriate shape, such as, but not limited to circle, ellipse, rectangle, square, triangle, polygon etc..When
So, the cross sectional shape of each metalwork can be same or different.In addition, the section maximum gauge of the metalwork 120
It can be any suitable size, such as, but not limited to 2~100 μm.
Finally, being respectively coated the gluing of insulation on the first surface 111 and second surface 112 of the template 110
Agent is simultaneously formed in the gluing oxidant layer 130a and gluing oxidant layer 130b.As shown in Fig. 3 A to Fig. 3 C, the gluing oxidant layer 130a and
The surface area of gluing oxidant layer 130b is less than the first surface 111 and second surface 112.Also, as shown in Figure 3A and Figure 3B, institute
State the gluing oxidant layer 130a being formed on the first surface 111 and the glue being formed on the second surface 112
Adhesive layer 130b is covered each by the metalwork 120.That is, first gold medal for example shown in Fig. 3 B, as demonstration example
The first end 121a and second end 121b for belonging to part 121 are located in the gluing oxidant layer 130a and gluing oxidant layer 130b.It is described
Adhesive can be any appropriate adhesive known in the art, such as, but not limited to epoxy resin, phenolic resin, acrylic acid
Resin.
As shown in figure 5, the display panel 20 also provided in the present embodiment, the array substrate 21 of the display panel 20
Binding region in be equipped with for such as flip chip (COF) or flexible circuit board (FPC) conductive connection metal routing
211, the anisotropic conductive film 10 is set on metal routing 211.When COF or FPC 22 are attached to the array
When in the binding region of substrate 21, the COF or FPC 22 contact the anisotropic conductive film 10, and towards the mould
Apply active force to the anisotropic conductive film 10 on the direction of plate 110, so that the gluing oxidant layer 130a and adhesive
Layer 130b deformation occurs and thickness becomes smaller.
Since the surface area of the gluing oxidant layer 130a and gluing oxidant layer 130b are less than the surface area of the template 110, make
It obtains as shown in Figure 5, after deformation occurs, the template 110 is completely covered in the gluing oxidant layer 130a and gluing oxidant layer 130b.
Also, the first end 121a and the second end 121b shape due to the described first metalwork 121 as demonstration example
As a sharp end, so that the first end 121a and the second end 121b of first metalwork 121 pierce through the glue
Adhesive layer, so that the COF or FPC 22 be connected with the metal routing 211 to complete to bind.
Therefore, anisotropic conductive film of the present invention is by using a plurality of metalwork generations for running through the template
For traditional conducting particles, realize in anisotropic conductive film formed distribution can manual control, especially hang down
Directly in the conductive materials being evenly distributed on the anisotropic conductive film surface direction (i.e. Z-direction), and then improve institute
State the performance of anisotropic conductive film.In addition, anisotropic conductive film of the present invention is with gold made of known materials
Belong to part and replace traditional complicated conducting particles, significantly reduces production cost.
The present invention is described by above-mentioned related embodiment, however above-described embodiment is only to implement example of the invention.
It must be noted that, it has been disclosed that embodiment be not limiting as the scope of the present invention.On the contrary, being contained in the spirit of claims
And range modification and impartial setting be included in the scope of the present invention.
Claims (10)
1. a kind of anisotropic conductive film, which is characterized in that the anisotropic conductive film includes:
One template has opposite a first surface and a second surface；
A plurality of metalworks, each metalwork is through the template and has opposite a first end and a second end, institute
State the first surface and second surface that first end and second end protrudes from the template respectively；And
Gluing oxidant layer is respectively arranged in the first surface and second surface of the template, also, the gluing oxidant layer covers institute
State metalwork.
2. anisotropic conductive film as described in claim 1, which is characterized in that the first end of the metalwork and/
Or the second end is formed as a sharp end.
3. anisotropic conductive film as described in claim 1, which is characterized in that the metalwork array setting.
4. anisotropic conductive film as described in claim 1, which is characterized in that between a metalwork and an adjacent metal part
Spacing be 50~1000 μm.
5. anisotropic conductive film as described in claim 1, which is characterized in that the metalwork is column or rod-shaped.
6. anisotropic conductive film as claimed in claim 5, which is characterized in that the metalwork has a central axis, institute
Central axis is stated in the first surface and/or second surface of the template.
7. anisotropic conductive film as described in claim 1, which is characterized in that the surface area of the gluing oxidant layer is less than institute
State the surface area of first surface and/or the second surface.
8. anisotropic conductive film as claimed in claim 2, which is characterized in that the thickness of the gluing oxidant layer is configured
Are as follows: the gluing oxidant layer because towards the active force of the template, deformation occurs thickness is become smaller when, it is described for tip
The first end of the metalwork and/or the second end pierce through the gluing oxidant layer.
9. anisotropic conductive film as described in claim 1, which is characterized in that the gluing oxidant layer insulation, by asphalt mixtures modified by epoxy resin
One or more of rouge, phenol-formaldehyde resin, acrylic resin are mixed.
10. a kind of display panel, which is characterized in that the display panel includes array basal plate, and the array substrate has extremely
A few binding region, is arranged anisotropic conductive film as described in claim 1 in the binding region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811584302.2A CN109679515B (en) | 2018-12-24 | 2018-12-24 | Anisotropic conductive adhesive film and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811584302.2A CN109679515B (en) | 2018-12-24 | 2018-12-24 | Anisotropic conductive adhesive film and display panel |
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| Publication Number | Publication Date |
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| CN109679515A true CN109679515A (en) | 2019-04-26 |
| CN109679515B CN109679515B (en) | 2021-08-24 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110767348A (en) * | 2019-11-12 | 2020-02-07 | 业成科技（成都）有限公司 | Anisotropic conductive film and manufacturing method thereof |
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| CN109679515B (en) | 2021-08-24 |
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