CN110767348A - Anisotropic conductive film and manufacturing method thereof - Google Patents
Anisotropic conductive film and manufacturing method thereof Download PDFInfo
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- CN110767348A CN110767348A CN201911099877.XA CN201911099877A CN110767348A CN 110767348 A CN110767348 A CN 110767348A CN 201911099877 A CN201911099877 A CN 201911099877A CN 110767348 A CN110767348 A CN 110767348A
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- anisotropic conductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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Abstract
An anisotropic conductive film includes a colloidal layer and a plurality of conductive particles. The colloid layer has a first surface and a normal perpendicular to the first surface. A plurality of conductive particles are disposed in the colloid layer, each conductive particle is rod-shaped and has a long axis substantially parallel to the normal. The anisotropic conductive film is used for reducing the risk of micro-cracks and reducing the chance of conductive particles gathering between adjacent electrodes.
Description
Technical Field
The present disclosure relates to conductive films, and more particularly to anisotropic conductive films.
Background
The Anisotropic Conductive Film (Anisotropic Conductive Film) is generally formed by mixing resin and spherical Conductive particles, and is mainly used for connecting two different substrates and circuits and simultaneously avoiding short circuit between two adjacent electrode leads.
However, when the anisotropic conductive film is used for bonding, there is a risk that conductive particles may be accumulated between two adjacent electrode leads and the conductive particles may be microcracked. Therefore, there is a need to provide an improved anisotropic conductive film to solve the problems of the prior art.
Disclosure of Invention
One embodiment of the present disclosure provides an anisotropic conductive film, which includes a colloid layer and a plurality of conductive particles. The colloid layer has a first surface and a normal perpendicular to the first surface. A plurality of conductive particles are disposed in the colloid layer, each conductive particle is rod-shaped and has a long axis substantially parallel to the normal.
In other embodiments of the present description, each conductive particle includes a titanium dioxide core, a conductive material layer, and a magnetic material layer. The conductive material layer coats the titanium dioxide core. The magnetic material layer coats the conductive material layer.
In other embodiments of the present description, the layer of conductive material comprises copper, silver, gold, platinum, or any combination thereof.
In other embodiments of the present description, the magnetic material layer comprises iron, cobalt, nickel, or any combination thereof.
In other embodiments of the present description, the anisotropic conductive film further includes a first insulating film on the first surface of the colloid layer.
In other embodiments of the present disclosure, the colloidal layer further includes a second surface opposite the first surface, and a second insulating film on the second surface.
In other embodiments of the present description, the rod shape of each conductive particle has an aspect ratio of 4 to 1.
In other embodiments of the present disclosure, a method of fabricating an anisotropic conductive film includes the following steps. A plurality of conductive particles are provided in the form of rods. Mixing the conductive particles with a binder to form a conductive paste. And molding the conductive adhesive into a film body. And polarizing the film body in a magnetic field to make the long axes of the conductive particles approximately parallel to the normal of the surface of the film body, and drying the film body.
In other embodiments of the present disclosure, the method further comprises applying an insulating film on the surface of the film body before drying the film body.
In summary, the conductive particles of the anisotropic conductive film of the present invention are rod-shaped and have long axes substantially parallel to the normal line of the film body, so that the conductive particles can be orderly arranged in the film body. The conductive particles comprise three layers of titanium dioxide cores, conductive material layers, magnetic material layers and the like, so that the risk of peeling or microcracks caused by pressing is avoided. The anisotropic conductive film is additionally provided with an insulating film, so that the possibility of short circuit caused by the accumulation of conductive particles between adjacent electrodes is reduced.
The above description will be described in detail by embodiments, and further explanation will be provided for the technical solution of the present invention.
Drawings
In order to make the aforementioned and other objects, features, advantages and embodiments of the invention more comprehensible, the following description is given:
FIG. 1 illustrates an anisotropic conductive film according to an embodiment of the present invention;
FIG. 2 shows an anisotropic conductive film according to another embodiment of the present invention;
FIG. 3 shows an anisotropic conductive film according to yet another embodiment of the present invention;
FIGS. 4A-4C are schematic diagrams illustrating an anisotropic conductive film application process according to another embodiment of the present invention;
FIGS. 5A-5C are schematic diagrams illustrating an anisotropic conductive film application process according to yet another embodiment of the present invention;
FIG. 6 is a cross-sectional view of a conductive particle according to an embodiment of the invention;
FIG. 7 is a schematic diagram illustrating the arrangement of conductive particles in an anisotropic conductive film according to an embodiment of the invention.
Reference numerals:
anisotropic conductive film 100a
100c. anisotropic conductive film 102
102a
102c
104a
104c
150
160
H
Detailed Description
Referring to fig. 1, an anisotropic conductive film according to an embodiment of the invention is shown. The anisotropic conductive film 100a includes an insulating colloid layer 102 and a plurality of rod-shaped conductive particles 104. After being polarized, the conductive particles 104 are vertically and horizontally arranged in the colloid layer 102. In other words, the long axis 104a of each rod-shaped conductive particle 104 is substantially parallel to the normal 102c of the surface 102a of the colloid layer 102.
In some embodiments of the present disclosure, the method for manufacturing the anisotropic conductive film 100a at least includes the following steps. A plurality of conductive particles 104 are provided in the form of rods. The conductive particles 104 are mixed with a binder (e.g., the colloidal layer 102) to form a conductive paste. And molding the conductive adhesive into a film body. The film is polarized by a magnetic field such that the long axes 104a of the conductive particles 104 are substantially parallel to the normal 102c of the film surface. And drying the film body.
In some embodiments of the present disclosure, the conductive particles are prepared by hydrolyzing titanium tetraisopropoxide with oleic acid to prepare rod-shaped titanium dioxide (TiO2), and then sequentially plating the conductive material layer and the magnetic material layer on the surface of the rod-shaped titanium dioxide particles by using an evaporation method.
In some embodiments of the present disclosure, the conductive particles and the adhesive are mixed to form a liquid conductive adhesive, and a magnetic field polarization machine is used to perform magnetic field polarization, so that the conductive particles 104 are disposed in the colloidal layer 102 as shown in fig. 1, and finally the conductive particles 104 are positioned in the colloidal layer after drying the colloidal layer. The colloidal layer 102 may be a material such as polycycloolefin (cycloolefin polymer), but is not limited thereto.
Referring to fig. 2, an anisotropic conductive film according to another embodiment of the invention is shown. The anisotropic conductive film 100b is different from the anisotropic conductive film 100a in that an insulating film 106a is additionally added on the surface 102a of the colloid layer 102. The insulating film 106a may be different from the material of the colloid layer 102, but not limited thereto. In the present embodiment, the thickness of the colloidal layer 102 ranges from about 3 to 7 microns, and the thickness of the insulating film 106a ranges from about 3 to 10 microns, but not limited thereto.
Referring to fig. 3, an anisotropic conductive film according to another embodiment of the invention is shown. The anisotropic conductive film 100c is different from the anisotropic conductive film 100a in that insulating films (106a, 106b) are additionally provided on the two opposite surfaces (102a, 102b) of the colloid layer 102, respectively. The insulating films (106a, 106b) may be different from the material of the colloid layer 102, but not limited thereto. In the present embodiment, the thickness of the colloidal layer 102 ranges from about 3 to 7 microns, and the thickness of the insulating films (106a, 106b) ranges from about 3 to 10 microns, but not limited thereto.
Referring to fig. 4A to 4C, schematic diagrams of an anisotropic conductive film 100b according to another embodiment of the invention are shown. The anisotropic conductive film 100b is used to electrically bond the corresponding electrodes (152, 162) of the objects (150, 160) to be bonded. When the thickness of the electrode 152 is larger (for example, greater than or equal to 35 μm), the conductive particles in the anisotropic conductive film are more easily squeezed between the adjacent electrodes 152 during the pressing. In the present embodiment, an insulating film 106a is added to the anisotropic conductive film 100b on the surface 102a. Referring to fig. 4B, the insulating film 106a is more easily pressed between the adjacent electrodes 152 during the pressing process, so as to reduce the chance of the conductive particles being pressed between the adjacent electrodes 152, thereby reducing the chance of the conductive particles gathering between the adjacent electrodes 152 to cause short circuit. Referring to fig. 4C, after the objects (150, 160) to be bonded are completely pressed, the corresponding electrodes (152, 162) are electrically connected through the conductive particles, and the rest of the conductive particles 104 are less likely to gather between the adjacent electrodes 152 to cause short circuit.
Referring to fig. 5A to 5C, schematic diagrams of an anisotropic conductive film 100C according to another embodiment of the invention are shown. The anisotropic conductive film 100c is used to electrically bond the corresponding electrodes (152, 162) of the objects (150, 160) to be bonded. When the thickness of the electrodes 152 and 162 is larger (e.g., greater than or equal to 35 μm), the conductive particles in the anisotropic conductive film are more easily squeezed between the adjacent electrodes 152 or 162 during the pressing process. In the present embodiment, the anisotropic conductive film 100c is further provided with insulating films (106a, 106b) on the surfaces (102a, 102b), respectively. Referring to fig. 5B, when pressing, the insulating film 106a is more easily pressed between the adjacent electrodes 152, and the insulating film 106B is more easily pressed between the adjacent electrodes 162, so as to reduce the chance of the conductive particles being pressed between the adjacent electrodes 162, thereby reducing the chance of the conductive particles gathering between the adjacent electrodes 152 or the adjacent electrodes 162 to cause short circuit. Referring to fig. 5C, after the objects (150, 160) to be bonded are completely pressed, the corresponding electrodes (152, 162) are electrically connected through the conductive particles, and the rest of the conductive particles 104 are less likely to gather between the adjacent electrodes 152 or the adjacent electrodes 162 to cause short circuit.
Referring to fig. 6, a cross-sectional view of a conductive particle according to an embodiment of the invention is shown. The conductive particles 104 include a titanium dioxide core 104b, a conductive material layer 104c, and a magnetic material layer 104d. In the present embodiment, the conductive particles 104 are prepared by hydrolyzing titanium tetraisopropoxide with oleic acid to form rod-shaped titanium dioxide cores 104b, such that the titanium dioxide cores 104b have a long axis 104a. The conductive material layer 104c and the magnetic material layer 104d are sequentially plated on the surface of the rod-shaped titanium dioxide particles by evaporation, i.e., the conductive material layer 104c covers the titanium dioxide core 104b, and the magnetic material layer 104d covers the conductive material layer 104c.
In the embodiment, the rod-shaped conductive particles 104 have an aspect ratio (height H/width W) of 4 to 1, the height H of the conductive particles 104 is about 3 to 7 μm, the conductive material layer 104c includes copper, silver, gold, platinum or any combination thereof, and the magnetic material layer 104d includes iron, cobalt, nickel or any combination thereof, but not limited thereto. The magnetic material layer 104d is used to make the rod-shaped conductive particles 104 easily adjust to the in-gel layer orientation (i.e. the long axis of the conductive particles is substantially parallel to the normal of the film surface) through the magnetic field when polarized by the magnetic field. The titanium dioxide core 104b is better bonded with the conductive material layer 104c, and is not easy to peel off or crack due to pressing. The outer magnetic material layer 104d is less ductile than the inner conductive material layer 104c, and may be crushed during the pressing process, so that the conductive material layer 104c is exposed to contact with the electrode. The rod-shaped conductive particles 104 can effectively control the particle arrangement by magnetic field polarization, and the surface area of the rod-shaped conductive particles is larger than that of the sphere, so that the possibility of short circuit can be reduced.
Fig. 7 is a schematic diagram illustrating the arrangement of conductive particles in the anisotropic conductive film according to an embodiment of the invention. In the present embodiment, the long axis 104a of each rod-shaped conductive particle 104 is substantially parallel to the normal line 102c of the surface 102a of the colloid layer 102, i.e., the included angle θ between the long axis 104a and the normal line 102c is smaller than 15 degrees.
In summary, the conductive particles of the anisotropic conductive film of the present invention are rod-shaped and have long axes substantially parallel to the normal line of the film body, so that the conductive particles can be orderly arranged in the film body. The conductive particles comprise three layers of titanium dioxide cores, conductive material layers, magnetic material layers and the like, so that the risk of peeling or microcracks caused by pressing is avoided. The anisotropic conductive film is additionally provided with an insulating film, so that the possibility of short circuit caused by the accumulation of conductive particles between adjacent electrodes is reduced.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes and modifications can be made without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An anisotropic conductive film, comprising:
a colloid layer having a first surface and a normal perpendicular to the first surface; and
a plurality of conductive particles disposed in the colloid layer, each conductive particle being rod-shaped and having a long axis substantially parallel to the normal.
2. The anisotropic conductive film of claim 1, wherein each of the conductive particles comprises:
a titanium dioxide core;
a conductive material layer coating the titanium dioxide core; and
and the magnetic material layer coats the conductive material layer.
3. The anisotropic conductive film of claim 1, wherein the conductive material layer comprises copper, silver, gold, platinum, or any combination thereof.
4. The anisotropic conductive film of claim 1, wherein the magnetic material layer comprises iron, cobalt, nickel, or any combination thereof.
5. The anisotropic conductive film of claim 1, further comprising a first insulating film on the first surface of the colloidal layer.
6. The anisotropic conductive film of claim 1, wherein the colloidal layer further comprises a second surface opposite the first surface, and further comprising a second insulating film on the second surface.
7. The anisotropic conductive film of claim 1, wherein the rods of each of the conductive particles have an aspect ratio of 4 to 1.
8. A method for manufacturing an anisotropic conductive film, comprising:
providing a plurality of conductive particles in a rod shape;
mixing the conductive particles with a binder to form a conductive adhesive;
molding the conductive adhesive into a film body, wherein the film body is provided with a surface;
polarizing the film body by a magnetic field so that the long axes of the conductive particles are approximately parallel to the normal of the surface; and
the film body is dried.
9. The method of claim 8, wherein each of the conductive particles comprises:
a titanium dioxide core;
a conductive material layer coating the titanium dioxide core; and
and the magnetic material layer coats the conductive material layer.
10. The method of claim 8, further comprising: before drying the film body, an insulating film is coated on the surface of the film body.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911099877.XA CN110767348A (en) | 2019-11-12 | 2019-11-12 | Anisotropic conductive film and manufacturing method thereof |
| TW108141832A TWI704582B (en) | 2019-11-12 | 2019-11-18 | Anisotropic conductive film and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911099877.XA CN110767348A (en) | 2019-11-12 | 2019-11-12 | Anisotropic conductive film and manufacturing method thereof |
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| CN110767348A true CN110767348A (en) | 2020-02-07 |
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| CN201911099877.XA Pending CN110767348A (en) | 2019-11-12 | 2019-11-12 | Anisotropic conductive film and manufacturing method thereof |
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| TW (1) | TWI704582B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114882790A (en) * | 2022-04-24 | 2022-08-09 | 绵阳惠科光电科技有限公司 | Anisotropic conductive adhesive and display device |
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| CN1349101A (en) * | 2000-09-25 | 2002-05-15 | Jsr株式会社 | Aeolotropism conductive sheet, its mfg. process and products using same |
| CN1414570A (en) * | 2002-05-09 | 2003-04-30 | 上海大学 | Manufacturing method of pulse resistant surge voltage insulating material |
| CN1496597A (en) * | 2001-02-09 | 2004-05-12 | Jsr��ʽ���� | Anisotropic conductive connector, its mfg. method and probe member |
| CN1780729A (en) * | 2003-02-25 | 2006-05-31 | 曼弗雷德·R·库赫奈利 | Encapsulated nanoparticles for the absorption of electromagnetic energy |
| CN1918756A (en) * | 2004-02-06 | 2007-02-21 | Jsr株式会社 | Process for producing anisotropic conductive sheet |
| CN101400608A (en) * | 2006-03-07 | 2009-04-01 | 石原产业株式会社 | Titanium oxide, conductive titanium oxide, and processes for producing these |
| US20170359904A1 (en) * | 2015-01-13 | 2017-12-14 | Dexerials Corporation | Anisotropic conductive film, manufacturing method thereof, and connection structure |
| CN109679515A (en) * | 2018-12-24 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | Anisotropic conductive film and display panel |
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2019
- 2019-11-12 CN CN201911099877.XA patent/CN110767348A/en active Pending
- 2019-11-18 TW TW108141832A patent/TWI704582B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1349101A (en) * | 2000-09-25 | 2002-05-15 | Jsr株式会社 | Aeolotropism conductive sheet, its mfg. process and products using same |
| CN1496597A (en) * | 2001-02-09 | 2004-05-12 | Jsr��ʽ���� | Anisotropic conductive connector, its mfg. method and probe member |
| CN1414570A (en) * | 2002-05-09 | 2003-04-30 | 上海大学 | Manufacturing method of pulse resistant surge voltage insulating material |
| CN1780729A (en) * | 2003-02-25 | 2006-05-31 | 曼弗雷德·R·库赫奈利 | Encapsulated nanoparticles for the absorption of electromagnetic energy |
| CN1918756A (en) * | 2004-02-06 | 2007-02-21 | Jsr株式会社 | Process for producing anisotropic conductive sheet |
| CN101400608A (en) * | 2006-03-07 | 2009-04-01 | 石原产业株式会社 | Titanium oxide, conductive titanium oxide, and processes for producing these |
| US20170359904A1 (en) * | 2015-01-13 | 2017-12-14 | Dexerials Corporation | Anisotropic conductive film, manufacturing method thereof, and connection structure |
| CN109679515A (en) * | 2018-12-24 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | Anisotropic conductive film and display panel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114882790A (en) * | 2022-04-24 | 2022-08-09 | 绵阳惠科光电科技有限公司 | Anisotropic conductive adhesive and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI704582B (en) | 2020-09-11 |
| TW202119437A (en) | 2021-05-16 |
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