CN113861869A - Conductive adhesive film and preparation method thereof - Google Patents

Conductive adhesive film and preparation method thereof Download PDF

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Publication number
CN113861869A
CN113861869A CN202111152464.0A CN202111152464A CN113861869A CN 113861869 A CN113861869 A CN 113861869A CN 202111152464 A CN202111152464 A CN 202111152464A CN 113861869 A CN113861869 A CN 113861869A
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conductive
conductive adhesive
metal foil
layer
foil layer
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CN202111152464.0A
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Chinese (zh)
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雷成
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Individual
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a conductive adhesive film and a preparation method thereof, wherein the conductive adhesive film comprises a metal foil layer, two opposite side surfaces of the metal foil layer are respectively provided with a conductive adhesive layer, conductive particles are contained in the conductive adhesive layer, and the diameter of the conductive particles is not more than 500 nm; in the conductive adhesive layer, the closer to the metal foil layer, the greater the number of the conductive particles. In the conductive adhesive film of the embodiment, the conductive adhesive layer has a better conductive effect on the metal foil layer, which is equivalent to reducing the resistance of the conductive adhesive layer.

Description

Conductive adhesive film and preparation method thereof
Technical Field
The invention relates to the field of conductive materials, in particular to a conductive adhesive film.
Background
With the demand of light and thin electronic products, the market of Flexible Printed Circuit (FPC) with excellent flexibility is getting bigger and bigger, and the FPC will become one of the mainstream development directions in the future. At present, the FPC takes a PI film as a carrier base film, and procedures such as electronic component assembly, distribution control of conducting circuits, electromagnetic shielding treatment and the like are all carried out on the film.
Patent publication No. CN112391125A discloses a pressure-sensitive adhesive film, which can only be pressed on the surface of a material for conducting electricity, and when the thickness of the adhesive film is less than 50 μm, the adhesive film is liable to cause a large connection resistance after lamination.
The conductive adhesive film in the prior art has larger thickness and is easy to have larger resistance; in view of the above, it is desirable to design a conductive adhesive film and a method for manufacturing the same to increase the conductive capability of the conductive adhesive film.
Disclosure of Invention
The invention aims to provide a conductive adhesive film and a preparation method thereof, so as to increase the conductive capability of the conductive adhesive film.
In order to achieve the purpose, the invention adopts the following technical scheme:
a conductive adhesive film comprises a metal foil layer, wherein two opposite side surfaces of the metal foil layer are provided with conductive adhesive layers, conductive particles are contained in the conductive adhesive layers, and the diameter of each conductive particle is not more than 500 nm; in the conductive adhesive layer, the closer to the metal foil layer, the greater the number of the conductive particles.
Optionally, the conductive particles are nanoscale particles;
the conductive adhesive layer is prepared from the following components: modified thermosetting epoxy resin, polyurethane, a curing agent and the conductive particles.
The thickness range of the conductive adhesive layer is 10-50 mu m.
Optionally, the thickness of the metal foil layer ranges from 6 to 12 μm;
and a plurality of conductive bulges are arranged on the two opposite side surfaces of the metal foil layer at intervals.
Optionally, the conductive protrusion is cross-shaped, m-shaped, in-line, L-shaped or F-shaped; the conductive bumps are arranged in a linear array, and the bump height of each conductive bump is not more than 2 microns.
Optionally, the conductive adhesive film further comprises a release film, the release film is provided with two layers, and the release film is laminated with the conductive adhesive layer, the metal foil layer, the conductive adhesive layer and the release film in sequence.
Optionally, the mass fraction of the conductive particles in the conductive adhesive layer is 30-50%.
Optionally, the nanoscale conductive particles comprise one or more of silver nanopowder, copper nanopowder, nickel nanopowder and graphite nanopowder.
A preparation method of a conductive adhesive film comprises the following steps:
preparing a conductive glue solution, wherein conductive particles are mixed in the conductive glue solution, and the diameter of each conductive particle is not more than 500 nm;
coating the conductive glue solution on the upward first side surface of the metal foil layer by using an extrusion coating machine to form a first semi-finished product, and baking the first semi-finished product by using a tunnel type oven to form a conductive glue layer attached to the metal foil layer on the first side surface;
and coating the conductive glue solution on the upward second side surface of the metal foil layer by using an extrusion coating machine to form a second semi-finished product, and baking the second semi-finished product by using a tunnel type oven to form a conductive glue layer attached to the metal foil layer on the second side surface.
Optionally, the preparing of the conductive glue solution specifically includes: adding the modified thermosetting epoxy resin, polyurethane, a curing agent and conductive particles into a solvent, and uniformly stirring to obtain a conductive glue solution.
Optionally, after the tunnel oven bakes the second semi-finished product to form a conductive adhesive layer attached to the metal foil layer on the second side surface, the method further includes:
and the coating machine presses the release film on the conductive adhesive layer.
Optionally, the tunnel oven is a 6-segment oven, and the baking temperature of each segment of oven from the inlet to the outlet of the tunnel oven is 80 ℃, 100 ℃, 120 ℃, 150 ℃ and 100 ℃ in sequence.
Compared with the prior art, the invention has the following beneficial effects:
conductive particles are distributed in the conductive adhesive layer, the more the conductive adhesive layer is close to the area of the metal foil layer, the more the conductive particles are, the more the conductive particles greatly enhance the conductivity of the conductive adhesive layer to the metal foil layer, so that the conductivity of the conductive adhesive layer is increased, and the resistance of the conductive adhesive layer is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
The structure, proportion, size and the like shown in the drawings are only used for matching with the content disclosed in the specification, so that the person skilled in the art can understand and read the description, and the description is not used for limiting the limit condition of the implementation of the invention, so the method has no technical essence, and any structural modification, proportion relation change or size adjustment still falls within the scope of the technical content disclosed by the invention without affecting the effect and the achievable purpose of the invention.
Fig. 1 is a schematic structural diagram of a conductive adhesive film according to an embodiment of the invention.
Illustration of the drawings: 1. a metal foil layer; 2. and the conductive adhesive layer.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. It should be noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
The embodiment of the invention provides a conductive adhesive film and a preparation method thereof, which are used for improving the conductive capability of the conductive adhesive film.
Example one
The conductive adhesive film comprises a metal foil layer 1, wherein two opposite side surfaces of the metal foil layer 1 are provided with conductive adhesive layers 2, the conductive adhesive layers 2 contain conductive particles, and the diameter of the conductive particles is not more than 500 nm; in the conductive adhesive layer 2, the closer to the metal foil layer 1, the larger the number of the conductive particles. It is worth noting that the existence of the conductive particles enhances the conductive capability of the conductive adhesive layer 2, and the nanometer conductive particles well enhance the conductive capability of the conductive adhesive film and the metal foil layer 1. The conductive effect between the metal foil layer 1 and the conductive adhesive layer 2 is better, and the thickness of the conductive adhesive film can be set to be thinner.
It is worth to be noted that the conductive adhesive film in the embodiment has a simple structure, good conductivity, a resistance smaller than 0.3 ohm, and a peel strength larger than 0.8kgf/cm, and greatly improves the defects of the existing conductive adhesive film. In addition, the conductive adhesive film in the embodiment can be stored at normal temperature, has long quality guarantee period, and is equivalent to cost saving.
Optionally, the conductive particles are nanoscale particles; the conductive adhesive layer 2 is prepared from the following components: modified thermosetting epoxy resin, polyurethane, a curing agent and the conductive particles; the thickness range of the conductive adhesive layer 2 is 10-50 μm. It is worth mentioning that the polyurethane may be replaced with a modified rubber. It is worth mentioning that the composition of the conductive adhesive layer 2 is dissolved in the solvent and stirred uniformly, and then coated on the metal foil layer 1 for forming.
Optionally, the thickness of the metal foil layer 1 ranges from 6 to 12 μm; and a plurality of conductive bulges are arranged on the two opposite side surfaces of the metal foil layer 1 at intervals. The conductive bulge is in a cross shape, a meter shape, a straight shape, an L shape or an F shape; the conductive bumps are arranged in a linear array, and the bump height of each conductive bump is not more than 2 microns. It is worth to be noted that the conductive protrusion increases the contact area with the conductive particles in the conductive adhesive film, which is equivalent to further reducing the resistance between the conductive adhesive film and the metal foil layer 1, so that the conductive effect of the conductive adhesive layer 2 on the metal foil layer 1 is better.
Optionally, the conductive adhesive film further comprises a release film, the release film is provided with two layers, and the release film is laminated with the conductive adhesive layer 2, the metal foil layer 1, the conductive adhesive layer 2 and the release film in sequence. It is worth mentioning that the presence of the release film constitutes a protective effect for the layer of conductive glue 2, so that the layer of conductive glue 2 better maintains its integrity.
Optionally, the mass fraction of the conductive particles in the conductive adhesive layer 2 is 30-50%. It is worth to say that the conductive particles account for 30-50% by mass, so that the conductive capacity of the conductive adhesive film can be effectively improved; when the mass fraction of the conductive particles is increased to be higher, the elasticity and the adhesive ability of the conductive adhesive layer 2 are significantly reduced.
Optionally, the nanoscale conductive particles comprise one or more of silver nanopowder, copper nanopowder, nickel nanopowder and graphite nanopowder.
Example two
The preparation method of the conductive adhesive film comprises the following steps:
preparing a conductive glue solution, wherein conductive particles are uniformly mixed in the conductive glue solution, and the diameter of each conductive particle is not more than 500 nm;
coating the conductive glue solution on the upward first side surface of the metal foil layer 1 by using an extrusion coating machine to form a first semi-finished product, and baking the first semi-finished product by using a tunnel type oven to form a conductive glue layer 2 attached to the metal foil layer 1 on the first side surface;
and coating the conductive glue solution on the upward second side surface of the metal foil layer 1 by using an extrusion coating machine to form a second semi-finished product, and baking the second semi-finished product by using a tunnel type oven to form a conductive glue layer 2 attached to the metal foil layer 1 on the second side surface.
It is worth saying that, in the coating process of the extrusion coater, the conductive particles in the conductive adhesive solution can generate a settling effect, so that more conductive particles are in contact with the metal foil layer 1, that is, the distribution of the conductive particles on the formed conductive adhesive layer 2 is not uniform, but more conductive particles can exist on the side of the conductive adhesive layer 2 close to the metal foil layer 1, so as to increase the conduction effect of the conductive adhesive layer 2 on the metal foil layer 1.
Optionally, after the tunnel oven bakes the second semi-finished product to form the conductive adhesive layer 2 attached to the metal foil layer 1 on the second side, the method further includes:
the coating machine presses the release film on the conductive adhesive layer 2.
Optionally, preparing a conductive glue solution specifically comprises: adding the modified thermosetting epoxy resin, polyurethane, a curing agent and conductive particles into a solvent, and uniformly stirring to obtain a conductive glue solution.
In addition, it is worth mentioning that a release film is laminated on the side of each conductive adhesive layer 2 away from the metal foil layer 1.
Optionally, the tunnel oven is a 6-segment oven, and the baking temperature of each segment of oven from the inlet to the outlet of the tunnel oven is 80 ℃, 100 ℃, 120 ℃, 150 ℃ and 100 ℃ in sequence. Generally, the baking time is determined according to the content of the solvent in the conductive adhesive solution, and the baking time in each section of oven does not exceed 5 minutes.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. The conductive adhesive film is characterized by comprising a metal foil layer, wherein two opposite side surfaces of the metal foil layer are provided with conductive adhesive layers, each conductive adhesive layer contains conductive particles, and the diameter of each conductive particle is not more than 500 nm; in the conductive adhesive layer, the closer to the metal foil layer, the greater the number of the conductive particles.
2. The conductive adhesive film according to claim 1, wherein the conductive particles are nanoscale particles;
the conductive adhesive layer is prepared from the following components: modified thermosetting epoxy resin, polyurethane, a curing agent and the conductive particles;
the thickness range of the conductive adhesive layer is 10-50 mu m.
3. The conductive adhesive film according to claim 1, wherein the metal foil layer has a thickness ranging from 6 to 12 μm;
and a plurality of conductive bulges are arranged on the two opposite side surfaces of the metal foil layer at intervals.
4. The conductive adhesive film according to claim 3, wherein the conductive protrusions have a cross shape, a meter shape, a straight shape, an L shape or an F shape; the conductive bumps are arranged in a linear array, and the bump height of each conductive bump is not more than 2 microns.
5. The conductive adhesive film according to claim 1, further comprising a release film, wherein the release film has two layers, and the release film, the conductive adhesive layer, the metal foil layer, the conductive adhesive layer and the release film are sequentially stacked.
6. The conductive adhesive film according to claim 1, wherein the mass fraction of the conductive particles in the conductive adhesive layer is 30-50%.
7. The conductive adhesive film according to claim 2, wherein the nano-scale conductive particles comprise one or more of nano silver powder, nano copper powder, nano nickel powder and nano graphite powder.
8. The preparation method of the conductive adhesive film is characterized by comprising the following steps:
preparing a conductive glue solution, wherein conductive particles are mixed in the conductive glue solution, and the diameter of each conductive particle is not more than 500 nm;
coating the conductive glue solution on the upward first side surface of the metal foil layer by using an extrusion coating machine to form a first semi-finished product, and baking the first semi-finished product by using a tunnel type oven to form a conductive glue layer attached to the metal foil layer on the first side surface;
and coating the conductive glue solution on the upward second side surface of the metal foil layer by using an extrusion coating machine to form a second semi-finished product, and baking the second semi-finished product by using a tunnel type oven to form a conductive glue layer attached to the metal foil layer on the second side surface.
9. The method for preparing a conductive adhesive film according to claim 8, wherein the preparing of the conductive adhesive solution specifically comprises: adding the modified thermosetting epoxy resin, polyurethane, a curing agent and conductive particles into a solvent, and uniformly stirring to obtain a conductive glue solution.
10. The method for preparing the conductive adhesive film according to claim 8, wherein after the tunnel oven bakes the second semi-finished product to form a conductive adhesive layer attached to the metal foil layer on the second side surface, the method further comprises:
and the coating machine presses the release film on the conductive adhesive layer.
CN202111152464.0A 2021-09-29 2021-09-29 Conductive adhesive film and preparation method thereof Withdrawn CN113861869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111152464.0A CN113861869A (en) 2021-09-29 2021-09-29 Conductive adhesive film and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111152464.0A CN113861869A (en) 2021-09-29 2021-09-29 Conductive adhesive film and preparation method thereof

Publications (1)

Publication Number Publication Date
CN113861869A true CN113861869A (en) 2021-12-31

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Country Status (1)

Country Link
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