WO2013125388A1 - Anisotropic conductive connection material, connection structure, manufacturing method and connection method for connection structure - Google Patents

Anisotropic conductive connection material, connection structure, manufacturing method and connection method for connection structure Download PDF

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Publication number
WO2013125388A1
WO2013125388A1 PCT/JP2013/053210 JP2013053210W WO2013125388A1 WO 2013125388 A1 WO2013125388 A1 WO 2013125388A1 JP 2013053210 W JP2013053210 W JP 2013053210W WO 2013125388 A1 WO2013125388 A1 WO 2013125388A1
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WIPO (PCT)
Prior art keywords
anisotropic conductive
flexible display
connection
electronic component
terminal
Prior art date
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PCT/JP2013/053210
Other languages
French (fr)
Japanese (ja)
Inventor
川津　雅巳
Original Assignee
デクセリアルズ株式会社
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Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to CN201380010151.9A priority Critical patent/CN104106182B/en
Priority to KR1020147016359A priority patent/KR101886909B1/en
Publication of WO2013125388A1 publication Critical patent/WO2013125388A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Definitions

  • the present invention relates to a flexible display and an electronic component using an anisotropic conductive connection layer and an anisotropic conductive connection layer used when mounting an electronic component such as a flexible printed wiring board and a semiconductor element on a flexible display.
  • the present invention relates to a connected connection structure, a connection method for connecting a flexible display and an electronic component using an anisotropic conductive connection layer, and a method for manufacturing a connection structure by this connection method.
  • a flip chip mounting method in which the electronic component is mounted on the substrate in a so-called face-down state is widely used.
  • an anisotropic conductive film is interposed between a terminal of an electronic component and a terminal provided on a substrate for the purpose of improving connection reliability and the like. And mechanical connections are made.
  • the anisotropic conductive film is obtained by dispersing conductive particles in an adhesive containing a resin or the like.
  • the conductive particles are, for example, particles obtained by applying nickel or gold plating to resin particles.
  • This mounting method is also used for liquid crystal displays and flexible displays.
  • the liquid crystal display has a Young's modulus as high as 72 GPa and is not easily deformed.
  • the liquid crystal display is easily damaged by external pressure or the like.
  • a flexible display using a flexible plastic as a base material is very thin and has flexibility, so that it can be bent and is not easily damaged, and can be used for electronic paper or a roll-up screen.
  • the transparent electrode (ITO etc.) in the display area extends and is connected to electronic parts such as IC chip and flexible printed wiring board at the end of the base material made of plastic etc. Terminals are provided.
  • the connection terminals are provided directly below or in the vicinity of the display area, and the terminals are miniaturized and the pitch is reduced in order to cope with high-density mounting.
  • the anisotropic conductive film is used for electrical connection between the terminals thus miniaturized and narrowed in pitch and terminals such as electronic parts and plexi- ble printed wiring boards (for example, Patent Document 2).
  • a flexible base material such as polyimide or polyethylene terephthalate
  • a general anisotropic conductive film used for connection with electronic components, and connected by pressure
  • Problems such as cracks in the terminals starting from the conductive particles, cracks in the base material, or destruction may occur.
  • the IC chip etc. are dotted with bumps serving as terminals, Since the pressure applied at the time of connection is also concentrated on the point, cracks are likely to occur.
  • the present invention has been proposed in view of such a conventional situation, and mechanically and electrically connects a terminal provided on a flexible display and a terminal of an electronic component with an anisotropic conductive connection material.
  • anisotropic conductive connection layer and anisotropic conductive connection layer that can suppress cracks in the terminals provided on the flexible display and cracks in the flexible display itself. It is an object of the present invention to provide a connection structure in which components are connected, a connection method in which a flexible display and an electronic component are connected using an anisotropic conductive connection layer, and a method of manufacturing a connection structure by this connection method.
  • the manufacturing method of the connection structure according to the present invention includes a flexible display and an electronic component in which an anisotropic conductive connection layer is interposed between a terminal provided on the flexible display and a terminal of the electronic component.
  • the electronic component is mounted on the flexible display so that the terminal of the electronic component faces the terminal provided on the flexible display through the anisotropic conductive connection layer.
  • Mounting step pressurizing the electronic component against the flexible display, connecting the terminal provided on the flexible display and the terminal of the electronic component with an anisotropic conductive connection layer, and conductive particles in the anisotropic conductive connection layer
  • the conductive particles have a compression hardness of 30 to 400 kgf / mm 2 at 30% compression deformation. It is characterized by that.
  • a connection method that achieves the above-described object is a connection method in which a terminal provided on a flexible display and a terminal of an electronic component are connected by an anisotropic conductive connection layer, through the anisotropic conductive connection layer.
  • Mounting the electronic component on the flexible display so that the terminal of the electronic component faces the terminal provided on the flexible display, and the terminal provided on the flexible display by pressing the electronic component against the flexible display And connecting the terminals of the electronic component with an anisotropic conductive connection layer and conducting the conductive particles through the conductive particles in the anisotropic conductive connection layer.
  • the conductive particles are 30% compressed and deformed.
  • the compression hardness is 150 to 400 kgf / mm 2 .
  • An anisotropic conductive connection material according to the present invention that achieves the above-described object is an anisotropic conductive connection material for connecting a terminal provided on a flexible display and a terminal of an electronic component, and 30% in an adhesive. It is characterized by containing conductive particles having a compression hardness at the time of compressive deformation of 150 to 400 kgf / mm 2 .
  • connection structure according to the present invention that achieves the above-described object connects the flexible display and the electronic component by interposing an anisotropic conductive connection layer between the terminal provided on the flexible display and the terminal of the electronic component.
  • the conductive particles in the anisotropic conductive layer are characterized in that the compression hardness at 30% compression deformation is 150 to 400 Kgf / mm 2 .
  • the conductive particles contained in the insulating adhesive of the anisotropic conductive connecting material have a compressive hardness at the time of 30% compression deformation of 150 to 400 Kgf / mm 2. Even when pressure is applied when connecting electronic components, the conductive particles are deformed, the contact area between the conductive particles and the terminals of the flexible display is increased, and cracks can be prevented from entering the terminals of the flexible display. The display itself can be prevented from cracking or being destroyed.
  • the anisotropic conductive connecting material is interposed between the terminal provided on the flexible display and the terminal of the electronic component, and connects the flexible display and the electronic component to make them conductive.
  • Examples of such an anisotropic conductive connection material include a film-like anisotropic conductive film or a paste-like anisotropic conductive connection paste.
  • the anisotropic conductive film or the anisotropic conductive connection paste is defined as “anisotropic conductive connection material”.
  • an anisotropic conductive film will be described as an example.
  • the film laminate 1 is generally a laminate of an anisotropic conductive film 3 serving as an anisotropic conductive connection layer on a release film 2 serving as a release substrate.
  • the release film 2 is formed by, for example, applying a release agent such as silicone to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene) or the like. .
  • a release agent such as silicone to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene) or the like.
  • the anisotropic conductive film 3 is obtained by dispersing conductive particles 5 in an insulating adhesive (binder) 4 containing a film-forming resin, a thermosetting resin, a curing agent, and the like.
  • the anisotropic conductive film 3 is formed on the release film 2 in a film shape.
  • the film forming resin is preferably a resin having an average molecular weight of about 10,000 to 80,000.
  • the film-forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is preferable from the viewpoint of film formation state, connection reliability, and the like. If the content of the film-forming resin is too small, a film will not be formed, and if it is too high, it will be difficult to eliminate the resin for electrical connection.
  • Part by mass preferably 40 to 70 parts by mass.
  • the curing component is not particularly limited as long as it has fluidity at room temperature, and examples thereof include commercially available epoxy resins and acrylic resins.
  • the epoxy resin is not particularly limited and may be appropriately selected depending on the purpose.
  • naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, Phenolmethane type epoxy resin, phenol aralkyl type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like can be mentioned. These may be used alone or in combination of two or more.
  • an acrylic resin there is no restriction
  • thermosetting resin it is preferable to use an epoxy resin or an acrylic resin as the thermosetting resin.
  • Examples of the latent curing agent include various curing agents such as a heat curing type and a UV curing type.
  • the latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction.
  • the activation method of the thermally activated latent curing agent includes a method of generating active species (cations and anions) by a dissociation reaction by heating, and the like. There are a method of dissolving and dissolving and starting a curing reaction, a method of starting a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, an elution and curing method using microcapsules, and the like.
  • Thermally active latent curing agents include imidazole series, hydrazide series, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide, and modified products thereof.
  • the above mixture may be sufficient.
  • a microcapsule type imidazole-based latent curing agent is preferable.
  • the anisotropic conductive film 3 may contain a silane coupling agent. Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. By adding the silane coupling agent, connectivity at the interface between the organic material and the inorganic material can be improved.
  • the conductive particles 5 have a compression hardness (K value) at 30% compression deformation of 150 to 400 kgf / mm 2 (1.50 to 4.00 GPa), preferably 150 to 350 kgf / mm 2 (1. 50 to 3.50 GPa).
  • the index of hardness of the conductive particles 5 is calculated from the weight necessary for compressing and deforming 30% of the particle diameter in an unloaded state when one particle is weighted and deformed. Value.
  • the 30% compressive deformation is a state in which when the conductive particles 5 are compressed in one direction, the particle size 2R (mm) of the conductive particles is deformed so as to be 30% shorter than the original particle size. This is a deformation state in which the particle size 2R of the conductive particles is 70% of the original particle size. The smaller the K value, the softer the particles.
  • the compression hardness (K value) at the time of 30% compression deformation of the conductive particles 5 is calculated by the following equation (1).
  • K value is measured by the following measurement method, for example. Specifically, first, conductive particles are dispersed on a steel plate having a smooth surface at room temperature. Next, one conductive particle is selected from the dispersed conductive particles. Then, the conductive end face is pressed by pressing the smooth end face of a diamond cylinder of 50 ⁇ m diameter provided in a micro-compression tester (for example, PCT-200 type: manufactured by Shimadzu Corporation) against one selected conductive particle. Compress the sex particles. At this time, the compression load is electrically detected as an electromagnetic force, and the compression displacement is electrically detected as a displacement by the operating transformer.
  • a micro-compression tester for example, PCT-200 type: manufactured by Shimadzu Corporation
  • the “compression displacement” refers to a value (mm) obtained by subtracting the length of the short diameter of the conductive particles after deformation from the particle diameter of the conductive particles before deformation. Then, another electroconductive particle on a steel plate is selected, and a compressive load and a compressive displacement are measured also about the selected electroconductive particle. For example, compressive deformation is measured for 10 conductive particles with different compressive loads.
  • Compressive displacement-load relationship is expressed as shown in FIG. From the relationship shown in FIG. 2, the load value F (kgf) is calculated from the compression displacement S (mm) when the conductive particles are compressed by 30%. And the compression hardness K value at the time of 30% compression is calculated using Formula (1) from the load value F (kgf) and the compression displacement S (mm).
  • the compression hardness at the time of 30% compression deformation of the conductive particles 5 is 150 to 400 kgf / mm 2 , when the substantially spherical particles are pressed, they are deformed by a load, so that a flexible display as described later can be obtained.
  • the anisotropic conductive film 3 is interposed between the provided terminal and the terminal of the electronic component to connect and conduct the terminals, the terminal is deformed so that it is slightly crushed even if it is compressed. For this reason, the conductive particles 5 come into contact with the terminals of the flexible display without touching at points, reducing the pressure per unit area transmitted to the terminals and dispersing the local pressure applied to the terminals. It is possible to prevent the terminal from being cracked and the flexible display itself from being destroyed.
  • the conduction resistance value of the connecting portion becomes unstable, so that it is 150 Kgf / mm 2 or more.
  • it is possible to prevent the occurrence of cracks in the terminals and the cracks and breakage of the flexible display itself, and the conduction resistance value can be lowered.
  • the conductive particles 5 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, plastic, and the like.
  • the surface of the particles may be coated with a metal, or the surface of these particles may be further coated with an insulating thin film.
  • the resin particles include, for example, epoxy resin, phenol resin, acrylic resin, acrylonitrile / styrene (AS) resin, benzoguanamine resin, divinylbenzene resin, styrene resin, etc. Particles can be mentioned.
  • the electroconductive particle 5 consists of these materials, and satisfy
  • the average particle diameter of the conductive particles 5 is preferably 1 to 20 ⁇ m, more preferably 2 to 10 ⁇ m, from the viewpoint of connection reliability. By setting the average particle diameter of the conductive particles 5 in the range of 1 ⁇ m to 20 ⁇ m, electrical connection is possible even when compression deformation is caused by pressurization.
  • the film laminate 1 having such a structure is made of an anisotropic conductive composition in which the above-described insulating adhesive (binder) 4 is dissolved in a solvent such as toluene or ethyl acetate and the conductive particles 5 are dispersed.
  • a solvent such as toluene or ethyl acetate
  • the anisotropic conductive composition Produced by applying this anisotropic conductive composition on the release film 2 having peelability to a desired thickness, drying to remove the solvent, and forming the anisotropic conductive film 3 can do.
  • the film laminated body 1 is not limited to the structure which formed the anisotropic conductive film 3 on such a peeling film 2,
  • the insulating resin which consists only of the insulating adhesives 4 in the anisotropic conductive film 3, for example A layer (NCF: Non Conductive Film layer) may be laminated.
  • the film laminate 1 may have a configuration in which a release film is also provided on the surface opposite to the surface on which the release film 2 of the anisotropic conductive film 3 is laminated.
  • the anisotropic conductive film 3 of the film laminate 1 having the above-described configuration is pressurized when the compression hardness at the time of 30% compression deformation of the conductive particles 5 is 150 to 400 Kgf / mm 2.
  • the almost spherical particles are deformed by the load.
  • connection method for conducting and connecting terminals of a flexible display and terminals of an electronic component using the anisotropic conductive film 3, a connection structure manufactured thereby, and a method for manufacturing the connection structure will be described. .
  • connection structure 10 the flexible printed wiring board 13 is mechanically and electrically connected to the flexible display 11 so as to be electrically connected to the IC chip 12 and the outside as an electronic component for driving the flexible display 11.
  • the connection structure 10 includes a display unit 10a that displays an image and the like, and a mounting unit 10b on which the IC chip 12 and the flexible printed wiring board 13 are mechanically and electrically connected and mounted.
  • the flexible display 11 has two flexible films 14, a front plate and a back plate, and a display medium layer 15 such as a microcapsule layer or a liquid crystal layer is disposed between the two flexible films 14.
  • the periphery of the layer 15 is sealed with a sealing portion 16 made of a sealing material.
  • the flexible film 14 has a Young's modulus of 10 GPa or less, preferably 2 to 10 GPa, more preferably 3 to 5 GPa.
  • the Young's modulus is a constant specific to a substance calculated from a strain per unit (deformation rate) generated when a substance is deformed by applying stress. If this Young's modulus is large, it is difficult to deform against stress, and if it is small, it is likely to deform.
  • This flexible film 14 has a small Young's modulus and is easily deformed with respect to a load as compared with a glass substrate of about 72 GPa.
  • Examples of the flexible film 14 include polyimide or polyethylene terephthalate.
  • the terminals 14 a provided on the flexible film 14 on the back plate and the terminals 12 a of the IC chip 12 and the terminals 13 a of the flexible printed wiring board 13 are electrically connected by conductive particles 5 that are compressed and deformed. Has been.
  • connection structure 10 can be manufactured by using the following connection method.
  • a mounting step of mounting the IC chip 12 and the flexible printed wiring board 13 on the flexible film 14 is performed so that the terminals 12a and the terminals 13a of the flexible printed wiring board 13 face each other.
  • the IC chip 12 and the flexible printed wiring board 13 are pressed against the flexible film 14, and the terminals 14a provided on the flexible film 14 are different from the terminals 12a of the IC chip 12 and the terminals 13a of the flexible printed wiring board 13.
  • the connection process of conducting through the conductive particles 5 in the anisotropic conductive film 3 and the connection with the anisotropic conductive film 3 is performed.
  • connection structure 10 About the manufacturing method of the connection structure 10, the case where the film laminated body 1 provided with the anisotropic conductive film 3 which contained the electroconductive particle 5 in the insulating adhesive 4 which used the thermoplastic resin as a hardening component is used is demonstrated, for example.
  • the anisotropic conductive film 3 of the film laminate 1 is connected to the flexible film 14 at a position where the terminal 14 a of the flexible film 14 is connected to the terminal 12 a of the IC chip 12 and the terminal 13 a of the flexible printed wiring board 13.
  • the release film 2 is peeled off to make only the anisotropic conductive film 3, and then the anisotropic conductive film 3 is attached to the terminal 14a.
  • This pasting is performed by heating at a temperature at which the thermosetting resin component contained in the anisotropic conductive film 3 is not cured, for example, while slightly pressing. Thereby, the anisotropic conductive film 3 is positioned and fixed on the terminal 14 a of the flexible film 14.
  • the IC chip 12 and the flexible printed wiring board 13 are mounted on the anisotropic conductive film 3.
  • the alignment state of the anisotropic conductive film 3 is confirmed, and if there is no misalignment or the like, the terminal 14a of the flexible film 14, the terminal 12a of the IC chip 12, and the flexible printed wiring board 13 are mounted.
  • the IC chip 12 and the flexible printed wiring board 13 are mounted on the flexible film 14 via the anisotropic conductive film 3 so that the terminals 13a face each other.
  • connection process of mechanically and electrically connecting the flexible film 14 of the flexible display 11 to the IC chip 12 and the flexible printed wiring board 13 is performed using a pressing head that can be heated and pressurized with the IC chip 12 and the flexible print.
  • the IC chip 12 and the flexible printed wiring board 13 are heated and pressed against the flexible film 14 from the upper surface of the wiring board 13 to cure the anisotropic conductive film 3, and the terminals 14a of the flexible film 14 and the terminals of the IC chip 12 are cured.
  • 12a and the terminal 13a of the flexible printed wiring board 13 are electrically connected through the conductive particles 5, and the flexible film 14, the IC chip 12 and the flexible printed wiring board 13 are mechanically connected by the insulating adhesive 4.
  • the connection structure 10 IC chip 12 and the flexible printed circuit board 13 is connected to the play 11.
  • the condition of this connection process is that the heating temperature is a temperature equal to or higher than the curing temperature of the thermosetting resin contained in the anisotropic conductive film 3, and the anisotropic conductive film thermally melted from between the terminal 14a and the terminals 12a and 13a. 3 is excluded, and pressurization is performed at a pressure that can sandwich the conductive particles 5.
  • the flexible film 14, the IC chip 12, and the flexible printed wiring board 13 are electrically connected by the conductive particles 5 and mechanically connected by the insulating adhesive (binder) 4.
  • Specific conditions for temperature and pressurization are a temperature of about 120 ° C. to 150 ° C. and a pressure of about 1 MPa to 5 MPa.
  • the IC chip 12 and the flexible printed wiring board 13 are pressed by the pressing head toward the flexible film 14, whereby the conductive particles 5 interposed therebetween are compressed and deformed, and the flexible film
  • the 14 terminals 14a do not come into contact with each other but come into contact with each other, and the contact area with the terminal 14a increases.
  • the pressure per unit area transmitted from the conductive particles 5 to the terminal 14a can be reduced, the local pressure applied to the terminal 14a can be dispersed, and cracks can be prevented from occurring in the terminal 14a.
  • the flexible film 14 can be prevented from cracking or being destroyed.
  • connection structure 10 As described above is applied to the anisotropic conductive film 3 interposed between the terminal 14a of the flexible film 14, the terminal 12a of the IC chip 12, and the terminal 13a of the flexible printed wiring board 13.
  • the conductive particles 5 contained have a compression hardness of 30 to 400 kgf / mm 2 at 30% compression deformation, terminals are particularly scattered when connecting the flexible film 14 and the electronic component.
  • the manufacturing method of the connection structure 10 is such that the mounting portion 10b is narrow when the mounting area for the electronic component exists near the display portion 10a having the display medium layer 15 of the flexible display 11 or immediately below the display portion 10a. Even if it is a simple mounting region, no cracks are generated in the terminals 14a of the flexible film 14, and no cracks are generated or broken in the flexible film 14 itself. Thus, it is possible to prevent the display medium layer 15 from affecting the display of an image or the like.
  • connection structure 10 described above has a configuration in which one IC chip 12 and a flexible printed wiring board 13 are mechanically and electrically connected to the flexible display 11, but the present invention is not limited to this, and as shown in FIG.
  • the connection structure 20 may be sufficient.
  • the connection structure 20 has a configuration in which two IC chips 12 and a flexible printed wiring board 13 are mechanically and electrically connected to the flexible film 14 of the flexible display 11 by the anisotropic conductive film 3.
  • the connection structure 20 includes a display unit 20a that displays an image or the like using a display medium layer (not shown), and a mounting unit 20b that is mounted by mechanically and electrically connecting the IC chip 12 and the flexible printed wiring board 13 to each other. Have. In such a connection structure 20 as well, as in the connection structure 10 described above, the terminal 14a of the flexible film 14 is not cracked, and the flexible film 14 itself is not broken.
  • connection structures 10 and 20 described above do not require reinforcing treatment for preventing cracks on the terminals 14a of the flexible display 11, and the manufacturing cost is the same as the manufacturing process of the conventional flexible display 11. Can be prevented.
  • connection structures 10 and 20 are not limited to the flexible display described above, and may be ones in which an electronic component such as an IC chip 12 or a flexible printed wiring board 13 is connected to a flexible base material such as a flexible film. Good.
  • the electronic component is not limited to the IC chip 12 and the flexible printed wiring board 13, but may be other electronic components.
  • Examples include semiconductor chips other than IC chips such as LSI (Large Scale Integration) chips, semiconductor elements such as chip capacitors, and semiconductor mounting materials (COF: Chip On Film) for driving liquid crystals.
  • LSI Large Scale Integration
  • COF Chip On Film
  • Two or more electronic components may be mounted on the flexible display 11, and the mounting positions of the electronic components are not limited to those shown in FIGS. 4 and 5, and may be mounted directly below the display units 10a and 20a.
  • Example 1 to Example 5 ⁇ Production of anisotropic conductive film> (Example 1 to Example 5)
  • a phenoxy resin (YP50, manufactured by Nippon Steel Chemical Co., Ltd.)
  • imidazole System latent curing agent Novacure 3941HP, manufactured by Asahi Kasei E-Materials
  • 2 parts by mass of silane coupling agent A-187, manufactured by Momentive Performance Materials
  • 10 parts by mass of conductive particles having a predetermined hardness Toluene was added to a solid content of 50% to prepare an anisotropic conductive composition.
  • the anisotropic conductive composition was applied onto a release substrate using a bar coater, and toluene was dried using an oven to prepare an anisotropic conductive film having a thickness of 20 ⁇ m.
  • the conductive particles were produced by forming the core part with resin and applying nickel (Ni) plating or nickel gold (NiAu) plating to the core part.
  • the resin particles in the core part are heated with uniform stirring at high speed by adding benzoisoperoxide as a polymerization initiator to a solution in which the mixing ratio of divinylbenzene, styrene, and butyl methacrylate is adjusted,
  • a fine particle dispersion was obtained by carrying out a polymerization reaction.
  • the fine particle dispersion was filtered and dried under reduced pressure to obtain a block body that was an aggregate of fine particles.
  • this block was pulverized to obtain divinylbenzene resin particles having various hardnesses and an average particle diameter of 3.0 ⁇ m.
  • the divinylbenzene resin particles obtained as described above were subjected to Ni plating or NiAu plating to produce conductive particles obtained by applying Ni plating or NiAu plating to the divinylbenzene resin particles.
  • Conductive particles obtained by applying Ni plating to divinylbenzene resin particles were obtained by supporting palladium catalyst on 5 g of 3 ⁇ m divinylbenzene resin particles by an immersion method.
  • an electroless nickel plating solution prepared from nickel sulfate hexahydrate, sodium hypophosphite, sodium citrate, triethanolamine and thallium nitrate pH 12, plating solution temperature 50 ° C.
  • Electroless nickel plating was performed using nickel, and nickel-coated resin particles having nickel plating layers (metal layers) having various phosphorus contents formed on the surfaces were obtained as conductive particles (resin core Ni plating particles).
  • the average particle diameter of the obtained conductive particles was in the range of 3 to 4 ⁇ m.
  • Conductive particles obtained by applying NiAu plating to divinylbenzene resin particles were prepared by mixing 12 g of divinylbenzene resin particles with a solution of 10 g of sodium chloroaurate dissolved in 1000 mL of ion exchange water to prepare an aqueous suspension. .
  • a gold plating bath was prepared by adding 15 g of ammonium thiosulfate, 80 g of ammonium sulfite, and 40 g of ammonium hydrogen phosphate to the obtained aqueous suspension. After 4 g of hydroxylamine was added to the gold plating bath obtained, the pH of the gold plating bath was adjusted to 9 using ammonia, and the bath temperature was maintained at 60 ° C. for about 15 to 20 minutes. Layer) was obtained as nickel-coated resin particles (resin core NiAu plating particles) formed on the surface. The average particle diameter of the obtained conductive particles was in the range of 3 to 4 ⁇ m.
  • Table 1 shows the compression hardness at the time of 30% compression deformation of the conductive particles.
  • the compressive hardness at 30% compressive deformation of the conductive particles is that the conductive particles are dispersed on a steel plate having a smooth surface at room temperature, and one of the dispersed conductive particles is electrically conductive. Particles were selected. Then, the conductive end face is pressed by pressing the smooth end face of a diamond cylinder of 50 ⁇ m diameter provided in a micro-compression tester (for example, PCT-200 type: manufactured by Shimadzu Corporation) against one selected conductive particle. Sex particles were compressed. And the load value F (kgf) was computed from the compression displacement S (mm) at the time of 30% compression of electroconductive particle from the relationship shown in FIG. Then, the compression hardness K value at the time of 30% compression was calculated using Formula (1) from the calculated load value F (kgf) and compression displacement S (mm).
  • Comparative Examples 1 to 3 were the same as the Examples except that conductive particles were prepared so that the compression hardness at 30% compression of the resin core Ni plated particles was as shown in Table 1. An anisotropic conductive film was produced.
  • PET polyethylene terephthalate
  • the anisotropic conductive film produced is placed on the flexible film on which the wiring is formed, and the IC chip is placed on the anisotropic conductive film so that the terminals of the IC chip and the wiring face each other through the anisotropic conductive film. Arranged above. And it connected by heating and pressurizing on the conditions of temperature 200 degreeC and pressure 600kgf / cm ⁇ 2 > with the press head from the upper surface of the IC chip, and produced the connection structure.
  • the occurrence of wiring cracks was confirmed visually.
  • the rate of occurrence of cracks indicates the ratio of occurrence of cracks in 100 wirings.
  • Table 1 and Table 2 show the crack occurrence rates.
  • ⁇ Test of conduction resistance> In the test of the conduction resistance value, a flexible film and a flexible wiring board were connected as in the crack generation test, a connection structure was produced, and the conduction resistance was measured.
  • the conduction resistance value after being allowed to stand for 125 hours in an 85 ° C./85% RH environment (after aging) was evaluated.
  • the conduction resistance value was measured using a digital multimeter (trade name: Digital Multimeter 7561, manufactured by Yokogawa Electric Corporation) when a current of 1 mA was passed by the four-terminal method. When the conduction resistance value after aging is 10 ⁇ or less, the resistance is low. Tables 1 and 2 show the measurement results of the conduction resistance values.
  • Example 1 the conduction resistance value was lower than that in Comparative Example 1, and the conduction resistance was lowered. Accordingly, from Examples 1 to 5, by causing the compression hardness at the time of 30% compression deformation of the conductive particles in the anisotropic conductive film to be in the range of 150 to 400 Kgf / mm 2 , the generation of wiring cracks It can be seen that the conduction resistance value can be lowered. Among the examples, in Example 2, no cracks were generated in the wiring, and the conduction resistance value was low.
  • Comparative Example 1 has a compressive hardness at 30% compressive deformation of the conductive particles of 100 kgf / mm 2 , and since the hardness is low, cracks in the wiring did not occur. Insufficient encroachment of the conductive particles into the surface occurred, and a low conduction resistance value could not be obtained.
  • Comparative Examples 2 and 3 since the compression hardness at the time of 30% compression deformation of the conductive particles is 500 kgf / mm 2 and 720 kgf / mm 2 , the hardness is high and the conduction resistance is low, but the wiring crack There has occurred. Since Comparative Example 3 was harder than Comparative Example 2, wiring cracks were more likely to occur.

Abstract

Provided is a manufacturing method for a connection structure in which an anisotropic conductive connection layer is interposed between a terminal provided to a flexible display and a terminal of an electronic component, and the flexible display and the electronic component are connected and conductive to each other. The method includes the following: a mounting step for mounting the electronic component on the flexible display, via the anisotropic conductive connection layer, so that the terminal of the electronic component faces the terminal provided to the flexible display; and a connection step in which the electronic component is pressed against the flexible display, and the terminal provided to the flexible display and the terminal of the electronic component are connected by the anisotropic conductive connection layer and made to be conductive to each other via conductive particles in the anisotropic conductive connection layer. The compression hardness of the conductive particles is 150-400 Kgf/mm2 when compression deformation is 30%.

Description

異方性導電接続材料、接続構造体、接続構造体の製造方法及び接続方法Anisotropic conductive connection material, connection structure, manufacturing method of connection structure, and connection method
　本発明は、フレキシブルディスプレイに、例えばフレキシブルプリント配線板や半導体素子等の電子部品を実装する際に使用する異方性導電接続材料、異方性導電接続層を用いてフレキシブルディスプレイと電子部品とを接続した接続構造体、異方性導電接続層を用いてフレキシブルディスプレイと電子部品とを接続する接続方法及びこの接続方法による接続構造体の製造方法に関するものである。 The present invention relates to a flexible display and an electronic component using an anisotropic conductive connection layer and an anisotropic conductive connection layer used when mounting an electronic component such as a flexible printed wiring board and a semiconductor element on a flexible display. The present invention relates to a connected connection structure, a connection method for connecting a flexible display and an electronic component using an anisotropic conductive connection layer, and a method for manufacturing a connection structure by this connection method.
　半導体素子等の電子部品を基板に実装する技術として、例えば電子部品をいわゆるフェースダウン状態で基板上に実装するフリップチップ実装法が広く用いられている。フリップチップ実装法においては、接続信頼性を高めること等を目的に、電子部品の端子と基板に設けられた端子との間に異方性導電フィルムを介在させ、異方性導電フィルムによる電気的及び機械的な接続が行われている。異方性導電フィルムは、樹脂等を含有する接着剤に導電性粒子を分散させたものである。導電性粒子は、例えば樹脂粒子にニッケル、金めっきを施した粒子等である。 As a technique for mounting an electronic component such as a semiconductor element on a substrate, for example, a flip chip mounting method in which the electronic component is mounted on the substrate in a so-called face-down state is widely used. In the flip chip mounting method, an anisotropic conductive film is interposed between a terminal of an electronic component and a terminal provided on a substrate for the purpose of improving connection reliability and the like. And mechanical connections are made. The anisotropic conductive film is obtained by dispersing conductive particles in an adhesive containing a resin or the like. The conductive particles are, for example, particles obtained by applying nickel or gold plating to resin particles.
　このような実装方法において、例えば、特許文献１では、電子部品の端子又は配線基板の端子の表面を平坦な面とし、導電性粒子を均一に潰すことにより、電子部品の端子と配線基板に設けられた端子との電気的接続を良好にしている。 In such a mounting method, for example, in Patent Document 1, the surface of the terminal of the electronic component or the terminal of the wiring board is made flat, and the conductive particles are uniformly crushed to provide the terminals of the electronic component and the wiring board. The electrical connection with the connected terminal is made good.
　また、この実装方法は、液晶ディスプレイやフレキシブルディスプレイにも使用されている。液晶ディスプレイは、ヤング率が７２ＧＰａと高く変形しにくいガラス基材が用いられており、外部からの押圧等によって破損しやすいものである。一方、柔軟なプラスチックを基材に用いたフレキシブルディスプレイは、非常に薄く、可撓性を有するため曲げることができ、破損しづらく、電子ペーパやロールアップスクリーンに用いることができる。 This mounting method is also used for liquid crystal displays and flexible displays. The liquid crystal display has a Young's modulus as high as 72 GPa and is not easily deformed. The liquid crystal display is easily damaged by external pressure or the like. On the other hand, a flexible display using a flexible plastic as a base material is very thin and has flexibility, so that it can be bent and is not easily damaged, and can be used for electronic paper or a roll-up screen.
　フレキシブルディスプレイでは、表示領域の透明電極（ＩＴＯ等）が延在してプラスチック等からなる基材の端部に、ＩＣチップやプレキシブルプリント配線板等の電子部品と電気的に接続される接続用の端子が設けられている。フレキシブルディスプレイでは、この接続用の端子が表示領域の直下又は近傍に設けられ、高密度実装等に対応するため、端子の微細化、狭ピッチ化がなされている。このように微細化、狭ピッチ化がなされた端子と、電子部品やプレキシブルプリント配線板等の端子との電気的な接続には、上述のように異方性導電フィルムが使用される（例えば特許文献２参照）。 In a flexible display, the transparent electrode (ITO etc.) in the display area extends and is connected to electronic parts such as IC chip and flexible printed wiring board at the end of the base material made of plastic etc. Terminals are provided. In the flexible display, the connection terminals are provided directly below or in the vicinity of the display area, and the terminals are miniaturized and the pitch is reduced in order to cope with high-density mounting. As described above, the anisotropic conductive film is used for electrical connection between the terminals thus miniaturized and narrowed in pitch and terminals such as electronic parts and plexi- ble printed wiring boards (for example, Patent Document 2).
　フレキシブルディスプレイでは、ポリイミドやポリエチレンテレフタラート等の柔軟な基材を用いているため、電子部品との接続に用いられている一般的な異方性導電フィルムを使用し、加圧により接続した場合、導電性粒子を起点として端子にクラックが入ったり、基材にもクラックが入ったり又は破壊されてしまう等の不具合が生じることがある。例えば、フレキシブルディスプレイの基材上にＩＣチップ等の電子部品を直接接続する場合、配線幅で接続するフレキシブルプリント配線板の場合と異なり、ＩＣチップ等は端子となるバンプが点在しており、接続時に加わる圧力も点に集中して加わるため、クラックが入りやすくなる。 In a flexible display, since a flexible base material such as polyimide or polyethylene terephthalate is used, when using a general anisotropic conductive film used for connection with electronic components, and connected by pressure, Problems such as cracks in the terminals starting from the conductive particles, cracks in the base material, or destruction may occur. For example, when directly connecting an electronic component such as an IC chip on the substrate of the flexible display, unlike the case of the flexible printed wiring board connected by the wiring width, the IC chip etc. are dotted with bumps serving as terminals, Since the pressure applied at the time of connection is also concentrated on the point, cracks are likely to occur.
　フレキシブルディスプレイでは、表示部の直下又は近傍に電子部品の実装領域が存在することから、上述した特許文献１のような単に配線基板に設けられた端子に電子部品を実装する場合に比べて、狭額の実装領域においてクラックが発生しないように、クラックの発生を特に抑制する必要がある。フレキシブルディスプレイでは、電子部品を接続する際に端子にクラックが入ったり、フレキシブルな基材が破壊されてしまうと、表示部までクラックや破壊等が生じてしまう場合があるため、表示部への影響が大きく、電子部品の接続によるクラックの発生や基材の破壊を抑制することが求められている。 In the flexible display, since a mounting area for electronic components exists directly below or in the vicinity of the display unit, it is narrower than a case where electronic components are simply mounted on terminals provided on the wiring board as described in Patent Document 1 described above. It is necessary to particularly suppress the occurrence of cracks so that cracks do not occur in the forehead mounting region. In a flexible display, if an electronic component is connected, if the terminal is cracked or the flexible substrate is destroyed, the display may be cracked or destroyed. Therefore, it is required to suppress the generation of cracks due to the connection of electronic components and the destruction of the base material.
特開２００９－１１１０４３号公報JP 2009-111043 A 特開２００９－２４２５０８号公報JP 2009-242508 A
　本発明は、このような従来の実情に鑑みて提案されたものであり、フレキシブルディスプレイに設けられた端子と、電子部品の端子とを異方性導電接続材料で機械的及び電気的に接続する際に、フレキシブルディスプレイに設けられた端子にクラックやフレキシブルディスプレイ自体にもクラックが入ったり、破壊が生じることを抑制できる異方性導電接続材料、異方性導電接続層を用いてフレキシブルディスプレイと電子部品とを接続した接続構造体、異方性導電接続層を用いてフレキシブルディスプレイと電子部品とを接続する接続方法及びこの接続方法による接続構造体の製造方法を提供することを目的とする。 The present invention has been proposed in view of such a conventional situation, and mechanically and electrically connects a terminal provided on a flexible display and a terminal of an electronic component with an anisotropic conductive connection material. When using the anisotropic conductive connection layer and anisotropic conductive connection layer that can suppress cracks in the terminals provided on the flexible display and cracks in the flexible display itself, It is an object of the present invention to provide a connection structure in which components are connected, a connection method in which a flexible display and an electronic component are connected using an anisotropic conductive connection layer, and a method of manufacturing a connection structure by this connection method.
　上述した目的を達成する本発明に係る接続構造体の製造方法は、フレキシブルディスプレイに設けられた端子と電子部品の端子との間に異方性導電接続層を介在させて、フレキシブルディスプレイと電子部品とを接続及び導通した接続構造体の製造方法であり、異方性導電接続層を介して、電子部品の端子がフレキシブルディスプレイに設けられた端子と対向するように電子部品をフレキシブルディスプレイ上に搭載する搭載工程と、電子部品をフレキシブルディスプレイに対して加圧し、フレキシブルディスプレイに設けられた端子と電子部品の端子とを異方性導電接続層で接続及び異方性導電接続層中の導電性粒子を介して導通する接続工程とを有し、導電性粒子は、３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２であることを特徴とする。 The manufacturing method of the connection structure according to the present invention that achieves the above-described object includes a flexible display and an electronic component in which an anisotropic conductive connection layer is interposed between a terminal provided on the flexible display and a terminal of the electronic component. The electronic component is mounted on the flexible display so that the terminal of the electronic component faces the terminal provided on the flexible display through the anisotropic conductive connection layer. Mounting step, pressurizing the electronic component against the flexible display, connecting the terminal provided on the flexible display and the terminal of the electronic component with an anisotropic conductive connection layer, and conductive particles in the anisotropic conductive connection layer The conductive particles have a compression hardness of 30 to 400 kgf / mm 2 at 30% compression deformation. It is characterized by that.
　上述した目的を達成する本発明に係る接続方法は、フレキシブルディスプレイに設けられた端子と電子部品の端子とを異方性導電接続層により接続する接続方法であり、異方性導電接続層を介して、電子部品の端子がフレキシブルディスプレイに設けられた端子と対向するように電子部品をフレキシブルディスプレイ上に搭載する搭載工程と、電子部品をフレキシブルディスプレイに対して加圧し、フレキシブルディスプレイに設けられた端子と電子部品の端子とを異方性導電接続層で接続及び異方性導電接続層中の導電性粒子を介して導通する接続工程とを有し、導電性粒子は、３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２であることを特徴とする。 A connection method according to the present invention that achieves the above-described object is a connection method in which a terminal provided on a flexible display and a terminal of an electronic component are connected by an anisotropic conductive connection layer, through the anisotropic conductive connection layer. Mounting the electronic component on the flexible display so that the terminal of the electronic component faces the terminal provided on the flexible display, and the terminal provided on the flexible display by pressing the electronic component against the flexible display And connecting the terminals of the electronic component with an anisotropic conductive connection layer and conducting the conductive particles through the conductive particles in the anisotropic conductive connection layer. The conductive particles are 30% compressed and deformed. The compression hardness is 150 to 400 kgf / mm 2 .
　上述した目的を達成する本発明に係る異方性導電接続材料は、フレキシブルディスプレイに設けられた端子と電子部品の端子とを接続する異方性導電接続材料であり、接着剤中に、３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２である導電性粒子を含有することを特徴とする。 An anisotropic conductive connection material according to the present invention that achieves the above-described object is an anisotropic conductive connection material for connecting a terminal provided on a flexible display and a terminal of an electronic component, and 30% in an adhesive. It is characterized by containing conductive particles having a compression hardness at the time of compressive deformation of 150 to 400 kgf / mm 2 .
　上述した目的を達成する本発明に係る接続構造体は、フレキシブルディスプレイに設けられた端子と電子部品の端子との間に異方性導電接続層を介在させて、フレキシブルディスプレイと電子部品とを接続及び導通した接続構造体であり、異方性導電性層中の導電性粒子は、３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２であることを特徴とする。 The connection structure according to the present invention that achieves the above-described object connects the flexible display and the electronic component by interposing an anisotropic conductive connection layer between the terminal provided on the flexible display and the terminal of the electronic component. The conductive particles in the anisotropic conductive layer are characterized in that the compression hardness at 30% compression deformation is 150 to 400 Kgf / mm 2 .
　本発明によれば、異方性導電接続材料の絶縁性接着剤に含有されている導電性粒子の３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２とすることによって、フレキシブルディスプレイと電子部品とを接続する際に加圧しても、導電性粒子が変形し、導電性粒子とフレキシブルディスプレイの端子との接触面積が広くなり、フレキシブルディスプレイの端子にクラックが入ることを防止でき、フレキシブルディスプレイ自体にもクラックが入ったり、破壊されることを抑制できる。 According to the present invention, the conductive particles contained in the insulating adhesive of the anisotropic conductive connecting material have a compressive hardness at the time of 30% compression deformation of 150 to 400 Kgf / mm 2. Even when pressure is applied when connecting electronic components, the conductive particles are deformed, the contact area between the conductive particles and the terminals of the flexible display is increased, and cracks can be prevented from entering the terminals of the flexible display. The display itself can be prevented from cracking or being destroyed.
本発明を適用したフィルム積層体の断面図である。It is sectional drawing of the film laminated body to which this invention is applied. 導電性粒子の３０％圧縮変形時の圧縮硬さの算出における圧縮変位－荷重の関係を示す図である。It is a figure which shows the relationship of the compression displacement-load in calculation of the compression hardness at the time of 30% compressive deformation of electroconductive particle. フレキシブルディスプレイと電子部品とを異方性導電フィルムで接続した接続構造体を示す図であり、（Ａ）は接続構造体の上面図であり、（Ｂ）は接続構造体の断面図である。It is a figure which shows the connection structure which connected the flexible display and the electronic component with the anisotropic conductive film, (A) is a top view of a connection structure, (B) is sectional drawing of a connection structure. フレキシブルフィルムの端子と、電子部品の端子との接続部分を示す断面図である。It is sectional drawing which shows the connection part of the terminal of a flexible film, and the terminal of an electronic component. フレキシブルディスプレイに、２つのＩＣチップ及びフレキシブルプリント配線基板を異方性導電フィルムで接続した接続構造体の上面図である。It is a top view of the connection structure which connected two IC chips and the flexible printed wiring board to the flexible display with the anisotropic conductive film.
　以下、本発明が適用された異方性導電接続材料、接続構造体、接続構造体の製造方法及び接続方法について、図面を参照して詳細に説明する。なお、本発明は、特に限定がない限り、以下の詳細な説明に限定されるものではない。本発明に係る実施の形態の説明は、以下の順序で行う。
１．異方性導電接続材料
２．接続構造体・接続構造体の接続方法・接続方法 Hereinafter, an anisotropic conductive connection material to which the present invention is applied, a connection structure, a method for manufacturing the connection structure, and a connection method will be described in detail with reference to the drawings. Note that the present invention is not limited to the following detailed description unless otherwise specified. The embodiment according to the present invention will be described in the following order.
1. 1. Anisotropic conductive connecting material Connection structure / Connection structure connection method / Connection method
　＜異方性導電接続材料＞
　異方性導電接続材料は、フレキシブルディスプレイに設けられた端子と電子部品の端子との間に介在し、フレキシブルディスプレイと電子部品とを接続して導通させるものである。このような異方性導電接続材料としては、フィルム状の異方性導電フィルム又はペースト状の異方性導電接続ペーストを挙げることができる。本願では、異方性導電フィルム又は異方性導電接続ペーストを「異方性導電接続材料」と定義する。以下では、異方性導電フィルムを例に挙げて説明する。 <Anisotropic conductive connection material>
The anisotropic conductive connecting material is interposed between the terminal provided on the flexible display and the terminal of the electronic component, and connects the flexible display and the electronic component to make them conductive. Examples of such an anisotropic conductive connection material include a film-like anisotropic conductive film or a paste-like anisotropic conductive connection paste. In the present application, the anisotropic conductive film or the anisotropic conductive connection paste is defined as “anisotropic conductive connection material”. Hereinafter, an anisotropic conductive film will be described as an example.
　フィルム積層体１は、図１に示すように、通常、剥離基材となる剥離フィルム２上に異方性導電接続層となる異方性導電フィルム３が積層されたものである。 As shown in FIG. 1, the film laminate 1 is generally a laminate of an anisotropic conductive film 3 serving as an anisotropic conductive connection layer on a release film 2 serving as a release substrate.
　剥離フィルム２は、例えば、ＰＥＴ（Poly Ethylene Terephthalate）、ＯＰＰ（Oriented Polypropylene）、ＰＭＰ（Poly-4-methlpentene－1）、ＰＴＦＥ（Polytetrafluoroethylene）等にシリコーン等の剥離剤を塗布してなるものである。 The release film 2 is formed by, for example, applying a release agent such as silicone to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene) or the like. .
　異方性導電フィルム３は、膜形成樹脂、熱硬化性樹脂及び硬化剤等を含有する絶縁性接着剤（バインダ）４に導電性粒子５が分散されたものである。この異方性導電フィルム３は、剥離フィルム２上にフィルム状に形成されている。 The anisotropic conductive film 3 is obtained by dispersing conductive particles 5 in an insulating adhesive (binder) 4 containing a film-forming resin, a thermosetting resin, a curing agent, and the like. The anisotropic conductive film 3 is formed on the release film 2 in a film shape.
　膜形成樹脂としては、平均分子量が１００００～８００００程度の樹脂が好ましい。膜形成樹脂としては、特にエポキシ樹脂、変形エポキシ樹脂、ウレタン樹脂、フェノキシ樹脂等の各種の樹脂が挙げられる。中でも、膜形成状態、接続信頼性等の観点からフェノキシ樹脂が好ましい。膜形成樹脂の含有量は、少なすぎるとフィルムを形成せず、多すぎると電気接続のための樹脂の排除がしにくくなるので、１００質量部の絶縁性接着剤４に対して、２０～８０質量部、好ましくは４０～７０質量部である。 The film forming resin is preferably a resin having an average molecular weight of about 10,000 to 80,000. Examples of the film-forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is preferable from the viewpoint of film formation state, connection reliability, and the like. If the content of the film-forming resin is too small, a film will not be formed, and if it is too high, it will be difficult to eliminate the resin for electrical connection. Part by mass, preferably 40 to 70 parts by mass.
　硬化成分としては、常温で流動性を有していれば特に限定されず、市販のエポキシ樹脂、アクリル樹脂が挙げられる。 The curing component is not particularly limited as long as it has fluidity at room temperature, and examples thereof include commercially available epoxy resins and acrylic resins.
　エポキシ樹脂としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビスフェノール型エポキシ樹脂、スチルベン型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、ナフトール型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂等が挙げられる。これらは単独でも、２種以上の組み合わせであってもよい。 The epoxy resin is not particularly limited and may be appropriately selected depending on the purpose. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, Phenolmethane type epoxy resin, phenol aralkyl type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like can be mentioned. These may be used alone or in combination of two or more.
　アクリル樹脂としては、特に制限はなく、目的に応じて適宜選択することができ、例えばアクリル化合物、液状アクリレート等が挙げられる。具体的には、メチルアクリレート、エチルアクリレート、イソプロピルアクリレート、イソブチルアクリレート、エポキシアクリレート、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、ジメチロールトリシクロデカンジアクリレート、テトラメチレングリコールテトラアクリレート、２－ヒドロキシ－１，３－ジアクリロキシプロパン、２，２－ビス［４－（アクリロキシメトキシ）フェニル］プロパン、２，２－ビス［４－（アクリロキシエトキシ）フェニル］プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、トリス（アクリロキシエチル）イソシアヌレート、ウレタンアクリレート、エポキシアクリレート等が挙げられる。これらは単独でも、２種以上の組み合わせであってもよい。 There is no restriction | limiting in particular as an acrylic resin, According to the objective, it can select suitably, For example, an acrylic compound, liquid acrylate, etc. are mentioned. Specifically, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2 -Hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate , Tricyclodecanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, epoxy acrylate and the like. These may be used alone or in combination of two or more.
　熱硬化性樹脂としては、エポキシ樹脂又はアクリル樹脂を用いることが好ましい。 It is preferable to use an epoxy resin or an acrylic resin as the thermosetting resin.
　潜在性硬化剤としては、加熱硬化型、ＵＶ硬化型等の各種硬化剤が挙げられる。潜在性硬化剤は、通常では反応せず、熱、光、加圧等の用途に応じて選択される各種のトリガにより活性化し、反応を開始する。熱活性型潜在性硬化剤の活性化方法には、加熱による解離反応などで活性種（カチオンやアニオン）を生成する方法、室温付近ではエポキシ樹脂中に安定に分散しており高温でエポキシ樹脂と相溶・溶解し、硬化反応を開始する方法、モレキュラーシーブ封入タイプの硬化剤を高温で溶出して硬化反応を開始する方法、マイクロカプセルによる溶出・硬化方法等が存在する。熱活性型潜在性硬化剤としては、イミダゾール系、ヒドラジド系、三フッ化ホウ素－アミン錯体、スルホニウム塩、アミンイミド、ポリアミン塩、ジシアンジアミド等や、これらの変性物があり、これらは単独でも、２種以上の混合体であってもよい。中でも、マイクロカプセル型イミダゾール系潜在性硬化剤が好適である。 Examples of the latent curing agent include various curing agents such as a heat curing type and a UV curing type. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The activation method of the thermally activated latent curing agent includes a method of generating active species (cations and anions) by a dissociation reaction by heating, and the like. There are a method of dissolving and dissolving and starting a curing reaction, a method of starting a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, an elution and curing method using microcapsules, and the like. Thermally active latent curing agents include imidazole series, hydrazide series, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide, and modified products thereof. The above mixture may be sufficient. Among these, a microcapsule type imidazole-based latent curing agent is preferable.
　なお、異方性導電フィルム３には、シランカップリング剤を含有させてもよい。シランカップリング剤としては、特に限定されないが、例えば、エポキシ系、アミノ系、メルカプト・スルフィド系、ウレイド系等を挙げることができる。シランカップリング剤を添加することにより、有機材料と無機材料との界面における接続性を向上させることができる。 The anisotropic conductive film 3 may contain a silane coupling agent. Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. By adding the silane coupling agent, connectivity at the interface between the organic material and the inorganic material can be improved.
　導電性粒子５としては、３０％圧縮変形時の圧縮硬さ（Ｋ値）が１５０～４００Ｋｇｆ／ｍｍ２（１．５０～４．００ＧＰａ）であり、好ましくは１５０～３５０Ｋｇｆ／ｍｍ２（１．５０～３．５０ＧＰａ）である。この導電性粒子５の硬さの指標は、１つの粒子に加重をかけて粒子を変形させる際に、無負荷状態の粒子径に対して３０％圧縮変形させるために必要な加重から算出したＫ値である。３０％圧縮変形とは、導電性粒子５を一方向に圧縮した際に、導電性粒子の粒径２Ｒ（ｍｍ）が元の粒径に比べて３０％短くなるように変形する状態、すなわち導電性粒子の粒径２Ｒが元の粒径の７０％となる変形状態をいう。Ｋ値が小さいほど軟らかい粒子となる。 The conductive particles 5 have a compression hardness (K value) at 30% compression deformation of 150 to 400 kgf / mm 2 (1.50 to 4.00 GPa), preferably 150 to 350 kgf / mm 2 (1. 50 to 3.50 GPa). The index of hardness of the conductive particles 5 is calculated from the weight necessary for compressing and deforming 30% of the particle diameter in an unloaded state when one particle is weighted and deformed. Value. The 30% compressive deformation is a state in which when the conductive particles 5 are compressed in one direction, the particle size 2R (mm) of the conductive particles is deformed so as to be 30% shorter than the original particle size. This is a deformation state in which the particle size 2R of the conductive particles is 70% of the original particle size. The smaller the K value, the softer the particles.
　この導電性粒子５の３０％圧縮変形時の圧縮硬さ（Ｋ値）は、下記の式（１）によって算出される。 The compression hardness (K value) at the time of 30% compression deformation of the conductive particles 5 is calculated by the following equation (1).
Figure JPOXMLDOC01-appb-I000001
Figure JPOXMLDOC01-appb-I000001
　Ｋ値は、例えば以下の測定方法によって測定される。具体的には、先ず、室温において平滑表面を有する鋼板の上に導電性粒子を散布する。次に、散布した導電性粒子の中から１個の導電性粒子を選択する。そして、微小圧縮試験機（例えば、ＰＣＴ－２００型：株式会社島津製作所製）が備えるダイアモンド製の直径５０μｍの円柱の平滑な端面を、選択した１個の導電性粒子に押し当てることによりこの導電性粒子を圧縮する。この際、圧縮荷重は、電磁力として電気的に検出され、圧縮変位は、作動トランスによる変位として電気的に検出される。ここで、「圧縮変位」とは、変形前の導電性粒子の粒径から変形後の導電性粒子の短径の長さを引いた値（ｍｍ）をいう。その後、鋼板上の別の導電性粒子を選択し、選択した導電性粒子についても圧縮荷重及び圧縮変位を測定する。例えば１０個の導電性粒子について、異なる圧縮荷重に対する圧縮変形の測定を行う。 K value is measured by the following measurement method, for example. Specifically, first, conductive particles are dispersed on a steel plate having a smooth surface at room temperature. Next, one conductive particle is selected from the dispersed conductive particles. Then, the conductive end face is pressed by pressing the smooth end face of a diamond cylinder of 50 μm diameter provided in a micro-compression tester (for example, PCT-200 type: manufactured by Shimadzu Corporation) against one selected conductive particle. Compress the sex particles. At this time, the compression load is electrically detected as an electromagnetic force, and the compression displacement is electrically detected as a displacement by the operating transformer. Here, the “compression displacement” refers to a value (mm) obtained by subtracting the length of the short diameter of the conductive particles after deformation from the particle diameter of the conductive particles before deformation. Then, another electroconductive particle on a steel plate is selected, and a compressive load and a compressive displacement are measured also about the selected electroconductive particle. For example, compressive deformation is measured for 10 conductive particles with different compressive loads.
　圧縮変位－荷重の関係は、図２のように表わされる。この図２に示す関係から、導電性粒子の３０％圧縮時における圧縮変位Ｓ（ｍｍ）から荷重値Ｆ（ｋｇｆ）を算出する。そして、荷重値Ｆ（ｋｇｆ）及び圧縮変位Ｓ（ｍｍ）により、式（１）を用いて３０％圧縮時の圧縮硬さＫ値を算出する。 Compressive displacement-load relationship is expressed as shown in FIG. From the relationship shown in FIG. 2, the load value F (kgf) is calculated from the compression displacement S (mm) when the conductive particles are compressed by 30%. And the compression hardness K value at the time of 30% compression is calculated using Formula (1) from the load value F (kgf) and the compression displacement S (mm).
　導電性粒子５の３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２であることによって、ほぼ球状の粒子が加圧されると荷重により変形することによって、後述するようなフレキシブルディスプレイに設けられた端子と、電子部品の端子との間に異方性導電フィルム３を介在させて端子同士を接続及び導通させる際に、圧縮されても少し潰れるように変形する。このため、導電性粒子５は、フレキシブルディスプレイの端子に対して点で接触せず面で接触するようになり、端子に伝わる単位面積あたりの圧力が軽減し、端子にかかる局所的な圧力を分散でき、端子にクラックが入ったり、フレキシブルディスプレイ自体が破壊されることを防止できる。導電性粒子５のＫ値が小さく、柔らか過ぎると、接続部の導通抵抗値が不安定になるため、１５０Ｋｇｆ／ｍｍ２以上とする。１５０～４００Ｋｇｆ／ｍｍ２とすることによって、端子のクラック発生及びフレキシブルディスプレイ自体へのクラック発生や破壊を防止できると共に、導通抵抗値も低くすることができる。 Since the compression hardness at the time of 30% compression deformation of the conductive particles 5 is 150 to 400 kgf / mm 2 , when the substantially spherical particles are pressed, they are deformed by a load, so that a flexible display as described later can be obtained. When the anisotropic conductive film 3 is interposed between the provided terminal and the terminal of the electronic component to connect and conduct the terminals, the terminal is deformed so that it is slightly crushed even if it is compressed. For this reason, the conductive particles 5 come into contact with the terminals of the flexible display without touching at points, reducing the pressure per unit area transmitted to the terminals and dispersing the local pressure applied to the terminals. It is possible to prevent the terminal from being cracked and the flexible display itself from being destroyed. If the K value of the conductive particles 5 is small and too soft, the conduction resistance value of the connecting portion becomes unstable, so that it is 150 Kgf / mm 2 or more. By setting it to 150 to 400 Kgf / mm 2 , it is possible to prevent the occurrence of cracks in the terminals and the cracks and breakage of the flexible display itself, and the conduction resistance value can be lowered.
　導電性粒子５としては、ニッケル、鉄、銅、アルミニウム、錫、鉛、クロム、コバルト、銀、金等の各種金属や金属合金の粒子、金属酸化物、カーボン、グラファイト、ガラス、セラミック、プラスチック等の粒子の表面に金属をコートしたもの、或いはこれらの粒子の表面に更に絶縁薄膜をコートしたもの等を使用することができる。樹脂粒子の表面に金属をコートしたものを用いる場合、樹脂粒子としては、例えばエポキシ樹脂、フェノール樹脂、アクリル樹脂、アクリロニトリル・スチレン（ＡＳ）樹脂、ベンゾグアナミン樹脂、ジビニルベンゼン系樹脂、スチレン系樹脂等の粒子を挙げることができる。導電性粒子５は、これらの材料からなり上記Ｋ値を満たすものである。 Examples of the conductive particles 5 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, plastic, and the like. The surface of the particles may be coated with a metal, or the surface of these particles may be further coated with an insulating thin film. When using a resin particle surface coated with metal, the resin particles include, for example, epoxy resin, phenol resin, acrylic resin, acrylonitrile / styrene (AS) resin, benzoguanamine resin, divinylbenzene resin, styrene resin, etc. Particles can be mentioned. The electroconductive particle 5 consists of these materials, and satisfy | fills the said K value.
　導電性粒子５の平均粒径は、接続信頼性の観点から、好ましくは１～２０μｍ、より好ましくは２～１０μｍである。導電性粒子５の平均粒径を１μｍ～２０μｍの範囲とすることによって、加圧により圧縮変形しても電気的接続が可能である。 The average particle diameter of the conductive particles 5 is preferably 1 to 20 μm, more preferably 2 to 10 μm, from the viewpoint of connection reliability. By setting the average particle diameter of the conductive particles 5 in the range of 1 μm to 20 μm, electrical connection is possible even when compression deformation is caused by pressurization.
　また、絶縁性接着剤４中の導電性粒子５の平均粒子密度は、接続信頼性及び絶縁信頼性の観点から、好ましくは１０００～５００００個／ｍｍ２、より好ましくは３０００～３００００個／ｍｍ２である。 The average particle density of the conductive particles 5 in 4 insulating adhesive, the connection in terms of reliability and insulation reliability, preferably 1000 to 50000 / mm 2, more preferably from 3,000 to 30,000 pieces / mm 2 It is.
　このような構成からなるフィルム積層体１は、トルエンや酢酸エチル等の溶媒に、上述した絶縁性接着剤（バインダー）４を溶解させ、導電性粒子５を分散させた異方性導電組成物を作製し、この異方性導電組成物を剥離性を有する剥離フィルム２上に所望の厚さとなるように塗布し、乾燥して溶媒を除去し、異方性導電フィルム３を形成することによって製造することができる。 The film laminate 1 having such a structure is made of an anisotropic conductive composition in which the above-described insulating adhesive (binder) 4 is dissolved in a solvent such as toluene or ethyl acetate and the conductive particles 5 are dispersed. Produced by applying this anisotropic conductive composition on the release film 2 having peelability to a desired thickness, drying to remove the solvent, and forming the anisotropic conductive film 3 can do.
　なお、フィルム積層体１は、このような剥離フィルム２上に異方性導電フィルム３を形成した構成に限定されず、異方性導電フィルム３に例えば絶縁性接着剤４のみからなる絶縁性樹脂層（ＮＣＦ：Non Conductive Film層）を積層するようにしてもよい。 In addition, the film laminated body 1 is not limited to the structure which formed the anisotropic conductive film 3 on such a peeling film 2, The insulating resin which consists only of the insulating adhesives 4 in the anisotropic conductive film 3, for example A layer (NCF: Non Conductive Film layer) may be laminated.
　また、フィルム積層体１は、異方性導電フィルム３の剥離フィルム２が積層された面とは反対の面側にも剥離フィルムを設ける構成としてもよい。 Further, the film laminate 1 may have a configuration in which a release film is also provided on the surface opposite to the surface on which the release film 2 of the anisotropic conductive film 3 is laminated.
　以上のような構成からなるフィルム積層体１の異方性導電フィルム３は、導電性粒子５の３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２であることによって、加圧されるとほぼ球状の粒子が荷重により変形することになる。このため、この異方性導電フィルム３では、可撓性のフレキシブルディスプレイに設けられた端子と、電子部品の端子との間を接続及び導通させる際に、圧縮されてやや潰れるように変形するため、フレキシブルディスプレイの端子に対して点ではなく面で接触するようになり、接触面積が増えるため、端子にかかる圧力が分散され、端子にクラックが入ったり、フレキシブルディスプレイ自体へのクラック発生や破壊を抑制できる。 The anisotropic conductive film 3 of the film laminate 1 having the above-described configuration is pressurized when the compression hardness at the time of 30% compression deformation of the conductive particles 5 is 150 to 400 Kgf / mm 2. The almost spherical particles are deformed by the load. For this reason, in this anisotropic conductive film 3, when it connects between the terminal provided in the flexible flexible display, and the terminal of an electronic component, and it connects, it deform | transforms so that it may be compressed and may be a little crushed. Because it comes in contact with the terminals of the flexible display by points instead of points, the contact area increases, so the pressure applied to the terminals is dispersed, cracks occur in the terminals, and cracks and damage to the flexible display itself Can be suppressed.
　＜接続構造体・接続構造体の製造方法・接続方法＞
　次に、この異方性導電フィルム３を用いてフレキシブルディスプレイの端子と電子部品の端子とを導通して接続する接続方法及びこれにより製造される接続構造体、接続構造体の製造方法について説明する。 <Connecting structure / manufacturing method / connecting method of connecting structure>
Next, a connection method for conducting and connecting terminals of a flexible display and terminals of an electronic component using the anisotropic conductive film 3, a connection structure manufactured thereby, and a method for manufacturing the connection structure will be described. .
　図３に示す接続構造体１０は、フレキシブルディスプレイ１１に、このフレキシブルディスプレイ１１を駆動させるための電子部品としてＩＣチップ１２や外部と電気的に接続するためにフレキシブルプリント配線板１３が機械的及び電気的に接続固定されているものである。接続構造体１０は、画像等を表示する表示部１０ａと、ＩＣチップ１２やフレキシブルプリント配線板１３が機械的及び電気的に接続され実装される実装部１０ｂとを有する。 In the connection structure 10 shown in FIG. 3, the flexible printed wiring board 13 is mechanically and electrically connected to the flexible display 11 so as to be electrically connected to the IC chip 12 and the outside as an electronic component for driving the flexible display 11. Are fixedly connected. The connection structure 10 includes a display unit 10a that displays an image and the like, and a mounting unit 10b on which the IC chip 12 and the flexible printed wiring board 13 are mechanically and electrically connected and mounted.
　フレキシブルディスプレイ１１は、前面板と背面板の２枚のフレキシブルフィルム１４を有し、この２枚のフレキシブルフィルム１４の間にマイクロカプセル層又は液晶層等の表示媒体層１５を配置し、この表示媒体層１５の周囲が封止材による封止部１６で封止されている。フレキシブルフィルム１４は、ヤング率が１０ＧＰａ以下であり、２～１０ＧＰａが好ましく、３～５ＧＰａが更に好ましい。ヤング率は、物質に応力を印加して変形させた場合に発生する単位あたりの歪み（変形率）から算出する物質固有に定数である。
このヤング率が大きいと応力に対して変形しにくく、ヤング率が小さいと変形しやすい。
このフレキシブルフィルム１４は、ヤング率が小さく、７２ＧＰａ程度のガラス基材に比べて荷重に対して変形しやすいものである。このフレキシブルフィルム１４は、例えばポリイミド又はポリエチレンテレフタラートが挙げられる。図４に示すように、背面板のフレキシブルフィルム１４に設けられた端子１４ａと、ＩＣチップ１２の端子１２ａやフレキシブルプリント配線板１３の端子１３ａとが圧縮変形した導電性粒子５によって電気的に接続されている。 The flexible display 11 has two flexible films 14, a front plate and a back plate, and a display medium layer 15 such as a microcapsule layer or a liquid crystal layer is disposed between the two flexible films 14. The periphery of the layer 15 is sealed with a sealing portion 16 made of a sealing material. The flexible film 14 has a Young's modulus of 10 GPa or less, preferably 2 to 10 GPa, more preferably 3 to 5 GPa. The Young's modulus is a constant specific to a substance calculated from a strain per unit (deformation rate) generated when a substance is deformed by applying stress.
If this Young's modulus is large, it is difficult to deform against stress, and if it is small, it is likely to deform.
This flexible film 14 has a small Young's modulus and is easily deformed with respect to a load as compared with a glass substrate of about 72 GPa. Examples of the flexible film 14 include polyimide or polyethylene terephthalate. As shown in FIG. 4, the terminals 14 a provided on the flexible film 14 on the back plate and the terminals 12 a of the IC chip 12 and the terminals 13 a of the flexible printed wiring board 13 are electrically connected by conductive particles 5 that are compressed and deformed. Has been.
　この接続構造体１０は、次のような接続方法を利用して製造することができる。先ず、フレキシブルフィルム１４の端子１４ａとＩＣチップ１２の端子１２ａ及びフレキシブルプリント配線板１３の端子１３ａとの間に、異方性導電フィルム３を介在させ、フレキシブルフィルム１４の端子１４ａとＩＣチップ１２の端子１２ａ及びフレキシブルプリント配線板１３の端子１３ａとが対向するように、フレキシブルフィルム１４上にＩＣチップ１２及びフレキシブルプリント配線板１３に搭載する搭載工程を行う。次に、ＩＣチップ１２及びフレキシブルプリント配線板１３をフレキシブルフィルム１４に対して加圧し、フレキシブルフィルム１４に設けられた端子１４ａとＩＣチップ１２の端子１２ａ及びフレキシブルプリント配線板１３の端子１３ａとを異方性導電フィルム３で接続及び異方性導電フィルム３中の導電性粒子５を介して導通する接続工程とを行う。 The connection structure 10 can be manufactured by using the following connection method. First, the anisotropic conductive film 3 is interposed between the terminal 14a of the flexible film 14, the terminal 12a of the IC chip 12 and the terminal 13a of the flexible printed wiring board 13, and the terminals 14a of the flexible film 14 and the IC chip 12 are connected. A mounting step of mounting the IC chip 12 and the flexible printed wiring board 13 on the flexible film 14 is performed so that the terminals 12a and the terminals 13a of the flexible printed wiring board 13 face each other. Next, the IC chip 12 and the flexible printed wiring board 13 are pressed against the flexible film 14, and the terminals 14a provided on the flexible film 14 are different from the terminals 12a of the IC chip 12 and the terminals 13a of the flexible printed wiring board 13. The connection process of conducting through the conductive particles 5 in the anisotropic conductive film 3 and the connection with the anisotropic conductive film 3 is performed.
　接続構造体１０の製造方法について、例えば硬化成分として熱可塑性樹脂を用いた絶縁性接着剤４に導電性粒子５を含有した異方性導電フィルム３を備えるフィルム積層体１を用いた場合について説明する。先ず、搭載工程では、フレキシブルフィルム１４の端子１４ａと、ＩＣチップ１２の端子１２ａ及びフレキシブルプリント配線板１３の端子１３ａとを接続する位置にフィルム積層体１の異方性導電フィルム３がフレキシブルフィルム１４の端子１４ａ側となるように置き、剥離フィルム２を剥がし取り、異方性導電フィルム３のみとした後、端子１４ａに異方性導電フィルム３を貼付ける。この貼付けは、例えば僅かに加圧しながら、異方性導電フィルム３に含まれる熱硬化性樹脂成分が硬化しない温度で加熱して行う。これにより、異方性導電フィルム３がフレキシブルフィルム１４の端子１４ａ上に位置決め固定される。 About the manufacturing method of the connection structure 10, the case where the film laminated body 1 provided with the anisotropic conductive film 3 which contained the electroconductive particle 5 in the insulating adhesive 4 which used the thermoplastic resin as a hardening component is used is demonstrated, for example. To do. First, in the mounting process, the anisotropic conductive film 3 of the film laminate 1 is connected to the flexible film 14 at a position where the terminal 14 a of the flexible film 14 is connected to the terminal 12 a of the IC chip 12 and the terminal 13 a of the flexible printed wiring board 13. Then, the release film 2 is peeled off to make only the anisotropic conductive film 3, and then the anisotropic conductive film 3 is attached to the terminal 14a. This pasting is performed by heating at a temperature at which the thermosetting resin component contained in the anisotropic conductive film 3 is not cured, for example, while slightly pressing. Thereby, the anisotropic conductive film 3 is positioned and fixed on the terminal 14 a of the flexible film 14.
　次に、異方性導電フィルム３上にＩＣチップ１２及びフレキシブルプリント配線板１３を搭載する。電子部品の搭載は、異方性導電フィルム３の位置合わせ状態を確認し、位置ずれ等が生じていない場合には、フレキシブルフィルム１４の端子１４ａとＩＣチップ１２の端子１２ａ及びフレキシブルプリント配線板１３の端子１３ａが対向するように、ＩＣチップ１２及びフレキシブルプリント配線板１３を異方性導電フィルム３を介してフレキシブルフィルム１４上に搭載する。 Next, the IC chip 12 and the flexible printed wiring board 13 are mounted on the anisotropic conductive film 3. When the electronic component is mounted, the alignment state of the anisotropic conductive film 3 is confirmed, and if there is no misalignment or the like, the terminal 14a of the flexible film 14, the terminal 12a of the IC chip 12, and the flexible printed wiring board 13 are mounted. The IC chip 12 and the flexible printed wiring board 13 are mounted on the flexible film 14 via the anisotropic conductive film 3 so that the terminals 13a face each other.
　次に、フレキシブルディスプレイ１１のフレキシブルフィルム１４と、ＩＣチップ１２及びフレキシブルプリント配線板１３とを機械的及び電気的に接続する接続工程は、加熱及び加圧可能な押圧ヘッドでＩＣチップ１２及びフレキシブルプリント配線板１３の上面からＩＣチップ１２及びフレキシブルプリント配線板１３をフレキシブルフィルム１４に対して加熱しながら加圧し、異方性導電フィルム３を硬化させ、フレキシブルフィルム１４の端子１４ａとＩＣチップ１２の端子１２ａ及びフレキシブルプリント配線板１３の端子１３ａとを導電性粒子５を介して電気に接続し、フレキシブルフィルム１４とＩＣチップ１２及びフレキシブルプリント配線板１３とを絶縁性接着剤４で機械的に接続することによって、フレキシブルディスプレイ１１にＩＣチップ１２及びフレキシブルプリント配線板１３が接続された接続構造体１０を得ることができる。 Next, the connection process of mechanically and electrically connecting the flexible film 14 of the flexible display 11 to the IC chip 12 and the flexible printed wiring board 13 is performed using a pressing head that can be heated and pressurized with the IC chip 12 and the flexible print. The IC chip 12 and the flexible printed wiring board 13 are heated and pressed against the flexible film 14 from the upper surface of the wiring board 13 to cure the anisotropic conductive film 3, and the terminals 14a of the flexible film 14 and the terminals of the IC chip 12 are cured. 12a and the terminal 13a of the flexible printed wiring board 13 are electrically connected through the conductive particles 5, and the flexible film 14, the IC chip 12 and the flexible printed wiring board 13 are mechanically connected by the insulating adhesive 4. Depending on the It is possible to obtain the connection structure 10 IC chip 12 and the flexible printed circuit board 13 is connected to the play 11.
　この接続工程の条件は、加熱温度が異方性導電フィルム３に含まれる熱硬化性樹脂の硬化温度以上の温度であり、端子１４ａと端子１２ａ、１３ａと間から熱溶融した異方性導電フィルム３が排除され、導電性粒子５を挟持し得る圧力で加圧する。これにより、フレキシブルフィルム１４とＩＣチップ１２及びフレキシブルプリント配線板１３とが導電性粒子５により電気的に接続され、絶縁性接着剤（バインダー）４により機械的に接続される。温度及び加圧の具体的な条件としては、温度１２０℃～１５０℃程度、圧力１ＭＰａ～５ＭＰａ程度である。 The condition of this connection process is that the heating temperature is a temperature equal to or higher than the curing temperature of the thermosetting resin contained in the anisotropic conductive film 3, and the anisotropic conductive film thermally melted from between the terminal 14a and the terminals 12a and 13a. 3 is excluded, and pressurization is performed at a pressure that can sandwich the conductive particles 5. Thereby, the flexible film 14, the IC chip 12, and the flexible printed wiring board 13 are electrically connected by the conductive particles 5 and mechanically connected by the insulating adhesive (binder) 4. Specific conditions for temperature and pressurization are a temperature of about 120 ° C. to 150 ° C. and a pressure of about 1 MPa to 5 MPa.
　接続工程では、ＩＣチップ１２及びフレキシブルプリント配線板１３がフレキシブルフィルム１４側に向って押圧ヘッドで加圧されることによって、これらの間に介在している導電性粒子５が圧縮変形し、フレキシブルフィルム１４の端子１４ａに対して点で接触せず、面で接触するようになり、端子１４ａとの接触面積が増える。これにより、接続工程では、導電性粒子５から端子１４ａに伝わる単位面積あたりの圧力が軽減し、端子１４ａにかかる局所的な圧力を分散でき、端子１４ａにクラックが発生することを防止でき、またフレキシブルフィルム１４までクラックが入ったり、破壊されることを防止できる。 In the connecting step, the IC chip 12 and the flexible printed wiring board 13 are pressed by the pressing head toward the flexible film 14, whereby the conductive particles 5 interposed therebetween are compressed and deformed, and the flexible film The 14 terminals 14a do not come into contact with each other but come into contact with each other, and the contact area with the terminal 14a increases. Thereby, in the connection process, the pressure per unit area transmitted from the conductive particles 5 to the terminal 14a can be reduced, the local pressure applied to the terminal 14a can be dispersed, and cracks can be prevented from occurring in the terminal 14a. The flexible film 14 can be prevented from cracking or being destroyed.
　以上のような接続構造体１０の製造方法は、フレキシブルフィルム１４の端子１４ａと、ＩＣチップ１２の端子１２ａ及びフレキシブルプリント配線板１３の端子１３ａとの間に介在させた異方性導電フィルム３に含有されている導電性粒子５の３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２であることによって、フレキシブルフィルム１４と電子部品とを接続する際、特に端子が点在しているＩＣチップ１２と接続する際に、フレキシブルフィルム１４の端子１４ａにクラックが生じること及びフレキシブルフィルム１４自体にクラックが入ったり、破壊されることを防止できる。したがって、この接続構造体１０の製造方法では、フレキシブルフィルム１４の端子１４ａにクラックを発生させず、またフレキシブルフィルム１４自体にもクラックが生じず、また破壊することなく、フレキシブルフィルム１４上に電子部品を実装することが可能である。 The manufacturing method of the connection structure 10 as described above is applied to the anisotropic conductive film 3 interposed between the terminal 14a of the flexible film 14, the terminal 12a of the IC chip 12, and the terminal 13a of the flexible printed wiring board 13. When the conductive particles 5 contained have a compression hardness of 30 to 400 kgf / mm 2 at 30% compression deformation, terminals are particularly scattered when connecting the flexible film 14 and the electronic component. When connecting to the IC chip 12, it is possible to prevent cracks from occurring in the terminals 14 a of the flexible film 14 and cracks or breakage of the flexible film 14 itself. Therefore, in the manufacturing method of the connection structure 10, no crack is generated in the terminal 14 a of the flexible film 14, the crack is not generated in the flexible film 14 itself, and the electronic component is formed on the flexible film 14 without being broken. Can be implemented.
　したがって、接続構造体１０の製造方法は、フレキシブルディスプレイ１１の表示媒体層１５を有する表示部１０ａに近接又は表示部１０ａの直下に電子部品の実装領域が存在する場合において、実装部１０ｂが狭額な実装領域であってもフレキシブルフィルム１４の端子１４ａにクラックを発生させることなく、またフレキシブルフィルム１４自体にもクラックを発生させることなく、または破壊しないため、表示部１０ａまでクラックや破壊が伝わらず、表示媒体層１５による画像等の表示に影響が及ぶことを防止できる。 Therefore, the manufacturing method of the connection structure 10 is such that the mounting portion 10b is narrow when the mounting area for the electronic component exists near the display portion 10a having the display medium layer 15 of the flexible display 11 or immediately below the display portion 10a. Even if it is a simple mounting region, no cracks are generated in the terminals 14a of the flexible film 14, and no cracks are generated or broken in the flexible film 14 itself. Thus, it is possible to prevent the display medium layer 15 from affecting the display of an image or the like.
　上述した接続構造体１０は、フレキシブルディスプレイ１１に１つのＩＣチップ１２及びフレキシブルプリント配線板１３を機械的及び電気的に接続した構成であるが、このことに限定されず、図５に示すような接続構造体２０であってもよい。接続構造体２０は、フレキシブルディスプレイ１１のフレキシブルフィルム１４に２つのＩＣチップ１２及びフレキシブルプリント配線板１３を異方性導電フィルム３で機械的及び電気的に接続した構成である。この接続構造体２０は、図示しない表示媒体層による画像等を表示する表示部２０ａと、ＩＣチップ１２やフレキシブルプリント配線板１３が機械的及び電気的に接続され、実装された実装部２０ｂとを有する。このような接続構造体２０においても、上述した接続構造体１０と同様に、フレキシブルフィルム１４の端子１４ａにクラックが発生せず、またフレキシブルフィルム１４自体を破壊されることがない。 The connection structure 10 described above has a configuration in which one IC chip 12 and a flexible printed wiring board 13 are mechanically and electrically connected to the flexible display 11, but the present invention is not limited to this, and as shown in FIG. The connection structure 20 may be sufficient. The connection structure 20 has a configuration in which two IC chips 12 and a flexible printed wiring board 13 are mechanically and electrically connected to the flexible film 14 of the flexible display 11 by the anisotropic conductive film 3. The connection structure 20 includes a display unit 20a that displays an image or the like using a display medium layer (not shown), and a mounting unit 20b that is mounted by mechanically and electrically connecting the IC chip 12 and the flexible printed wiring board 13 to each other. Have. In such a connection structure 20 as well, as in the connection structure 10 described above, the terminal 14a of the flexible film 14 is not cracked, and the flexible film 14 itself is not broken.
　また、上述した接続構造体１０、２０は、フレキシブルディスプレイ１１の端子１４ａにクラック防止のための補強処理をする必要がなく、従来のフレキシブルディスプレイ１１の製造工程と変わらず、製造コストが高くなることを防止できる。 In addition, the connection structures 10 and 20 described above do not require reinforcing treatment for preventing cracks on the terminals 14a of the flexible display 11, and the manufacturing cost is the same as the manufacturing process of the conventional flexible display 11. Can be prevented.
　接続構造体１０、２０としては、上述したフレキシブルディスプレイに限定されず、フレキシブルフィルム等のフレキシブル基材に対して、ＩＣチップ１２やフレキシブルプリント配線板１３等の電子部品を接続したものであってもよい。 The connection structures 10 and 20 are not limited to the flexible display described above, and may be ones in which an electronic component such as an IC chip 12 or a flexible printed wiring board 13 is connected to a flexible base material such as a flexible film. Good.
　また、電子部品としては、ＩＣチップ１２やフレキシブルプリント配線板１３に限らず、他の電子部品であってもよい。例えば、ＬＳＩ（Large Scale Integration）チップ等のＩＣチップ以外の半導体チップやチップコンデンサ等の半導体素子、液晶駆動用半導体実装材料（ＣＯＦ：Chip On Film）等を挙げることができる。また、電子部品は、フレキシブルディスプレイ１１に２以上実装してもよく、電子部品の実装位置も図４及び図５に限られず、表示部１０ａ、２０ａの直下に実装してもよい。 Further, the electronic component is not limited to the IC chip 12 and the flexible printed wiring board 13, but may be other electronic components. Examples include semiconductor chips other than IC chips such as LSI (Large Scale Integration) chips, semiconductor elements such as chip capacitors, and semiconductor mounting materials (COF: Chip On Film) for driving liquid crystals. Two or more electronic components may be mounted on the flexible display 11, and the mounting positions of the electronic components are not limited to those shown in FIGS. 4 and 5, and may be mounted directly below the display units 10a and 20a.
　以上、本実施の形態について説明したが、本発明が前述の実施の形態に限定されるものでないことはいうまでもなく、本発明の要旨を逸脱しない範囲で種々の変更が可能である。 As mentioned above, although this Embodiment was demonstrated, it cannot be overemphasized that this invention is not what is limited to the above-mentioned embodiment, A various change is possible in the range which does not deviate from the summary of this invention.
　次に、本発明の具体的な実施例について、実際に行った実験結果に基づいて説明するが、本発明はこれらの実施例に限定されるものではない。 Next, specific examples of the present invention will be described based on experimental results actually performed, but the present invention is not limited to these examples.
　＜異方性導電フィルムの作製＞
　（実施例１～実施例５）
　実施例１～実施例５では、膜形成樹脂としてフェノキシ樹脂（ＹＰ５０、新日鐵化学社製）を３０質量部と、液状エポキシ樹脂（ＥＰ－８２８、三菱化学社製）２０質量部と、イミダゾール系潜在性硬化剤（ノバキュア３９４１ＨＰ、旭化成イーマテリアルズ社製）、シランカップリング剤（Ａ－１８７、モメンティブ・パフォーマンスマテリアルズ社製）２質量部、所定の硬度を有する導電性粒子１０質量部、トルエンを固形分５０％となるように加え、異方性導電組成物を調整した。続いて、前記異方性導電組成物を剥離基材上にバーコーターを用いて塗布し、オーブンを用いてトルエンを乾燥させ、膜厚２０μｍの異方性導電フィルムを作製した。 <Production of anisotropic conductive film>
(Example 1 to Example 5)
In Examples 1 to 5, 30 parts by mass of a phenoxy resin (YP50, manufactured by Nippon Steel Chemical Co., Ltd.), 20 parts by mass of a liquid epoxy resin (EP-828, manufactured by Mitsubishi Chemical Corporation) as a film-forming resin, and imidazole System latent curing agent (Novacure 3941HP, manufactured by Asahi Kasei E-Materials), 2 parts by mass of silane coupling agent (A-187, manufactured by Momentive Performance Materials), 10 parts by mass of conductive particles having a predetermined hardness, Toluene was added to a solid content of 50% to prepare an anisotropic conductive composition. Subsequently, the anisotropic conductive composition was applied onto a release substrate using a bar coater, and toluene was dried using an oven to prepare an anisotropic conductive film having a thickness of 20 μm.
　導電性粒子は、コア部を樹脂で形成し、そのコア部にニッケル（Ｎｉ）メッキ又はニッケル金（ＮｉＡｕ）メッキを施して作製した。具体的には、コア部の樹脂粒子は、ジビニルベンゼン、スチレン、ブチルメタクリレートの混合比を調整した溶液に、重合開始剤としてベンゾイソパーオキサイドを投入して高速で均一撹拌しながら加熱を行い、重合反応を行うことにより微粒子分散液を得た。そして、この微粒子分散液をろ過し減圧乾燥することにより微粒子の凝集体であるブロック体を得た。更に、このブロック体を粉砕することにより、種々の硬度を有する平均粒子径３．０μｍのジビニルベンゼン系樹脂粒子を得た。 The conductive particles were produced by forming the core part with resin and applying nickel (Ni) plating or nickel gold (NiAu) plating to the core part. Specifically, the resin particles in the core part are heated with uniform stirring at high speed by adding benzoisoperoxide as a polymerization initiator to a solution in which the mixing ratio of divinylbenzene, styrene, and butyl methacrylate is adjusted, A fine particle dispersion was obtained by carrying out a polymerization reaction. The fine particle dispersion was filtered and dried under reduced pressure to obtain a block body that was an aggregate of fine particles. Furthermore, this block was pulverized to obtain divinylbenzene resin particles having various hardnesses and an average particle diameter of 3.0 μm.
　そして、以上のようにして得たジビニルベンゼン系樹脂粒子に対して、Ｎｉメッキ又はＮｉＡｕメッキを施して、ジビニルベンゼン系樹脂粒子にＮｉメッキ又はＮｉＡｕメッキを施した導電性粒子を作製した。 Then, the divinylbenzene resin particles obtained as described above were subjected to Ni plating or NiAu plating to produce conductive particles obtained by applying Ni plating or NiAu plating to the divinylbenzene resin particles.
　ジビニルベンゼン系樹脂粒子にＮｉメッキを施した導電性粒子は、３μｍのジビニルベンゼン系樹脂粒子５ｇに、パラジウム触媒を浸漬法により担持させた。次に、この樹脂粒子に対し、硫酸ニッケル六水和物、次亜リン酸ナトリウム、クエン酸ナトリウム、トリエタノールアミン及び硝酸タリウムから調整された無電解ニッケルメッキ液（ｐＨ１２、メッキ液温５０℃）を用いて無電解ニッケルメッキを行い、種々のリン含有量を有するニッケルメッキ層（金属層）が表面に形成されたニッケル被膜樹脂粒子を導電粒子（樹脂コアＮｉメッキ粒子）として得た。得られた導電性粒子の平均粒子径は、３～４μｍの範囲内であった。 Conductive particles obtained by applying Ni plating to divinylbenzene resin particles were obtained by supporting palladium catalyst on 5 g of 3 μm divinylbenzene resin particles by an immersion method. Next, an electroless nickel plating solution prepared from nickel sulfate hexahydrate, sodium hypophosphite, sodium citrate, triethanolamine and thallium nitrate (pH 12, plating solution temperature 50 ° C.) Electroless nickel plating was performed using nickel, and nickel-coated resin particles having nickel plating layers (metal layers) having various phosphorus contents formed on the surfaces were obtained as conductive particles (resin core Ni plating particles). The average particle diameter of the obtained conductive particles was in the range of 3 to 4 μm.
　ジビニルベンゼン系樹脂粒子にＮｉＡｕメッキを施した導電性粒子は、塩化金酸ナトリウム１０ｇをイオン交換水１０００ｍＬに溶解させた溶液に、ジビニルベンゼン系樹脂粒子１２ｇを混合して水性懸濁液を調整した。得られた水性懸濁液に、チオ硫酸アンモニウム１５ｇ、亜硫酸アンモニウム８０ｇ、及びリン酸水素アンモニウム４０ｇを投入することにより金メッキ浴を調整した。得られた金メッキ浴にヒドロキシルアミン４ｇを投入後、アンモニアを用いて金メッキ浴のｐＨを９に調整し、その浴温を６０℃に１５～２０分程度維持することにより、金ニッケルメッキ層（金属層）が表面に形成されたニッケル被膜樹脂粒子（樹脂コアＮｉＡｕメッキ粒子）として得た。得られた導電性粒子の平均粒子径は、３～４μｍの範囲内であった。 Conductive particles obtained by applying NiAu plating to divinylbenzene resin particles were prepared by mixing 12 g of divinylbenzene resin particles with a solution of 10 g of sodium chloroaurate dissolved in 1000 mL of ion exchange water to prepare an aqueous suspension. . A gold plating bath was prepared by adding 15 g of ammonium thiosulfate, 80 g of ammonium sulfite, and 40 g of ammonium hydrogen phosphate to the obtained aqueous suspension. After 4 g of hydroxylamine was added to the gold plating bath obtained, the pH of the gold plating bath was adjusted to 9 using ammonia, and the bath temperature was maintained at 60 ° C. for about 15 to 20 minutes. Layer) was obtained as nickel-coated resin particles (resin core NiAu plating particles) formed on the surface. The average particle diameter of the obtained conductive particles was in the range of 3 to 4 μm.
　導電性粒子の３０％圧縮変形時の圧縮硬さは、それぞれ表１に示すようになった。導電性粒子の３０％圧縮変形時の圧縮硬さは、上述したように、室温において平滑表面を有する鋼板の上に導電性粒子を散布し、散布した導電性粒子の中から１個の導電性粒子を選択した。そして、微小圧縮試験機（例えば、ＰＣＴ－２００型：株式会社島津製作所製）が備えるダイアモンド製の直径５０μｍの円柱の平滑な端面を、選択した１個の導電性粒子に押し当てることによりこの導電性粒子を圧縮した。そして、図２に示す関係から、導電性粒子の３０％圧縮時における圧縮変位Ｓ（ｍｍ）から荷重値Ｆ（ｋｇｆ）を算出した。
続いて、算出した荷重値Ｆ（ｋｇｆ）及び圧縮変位Ｓ（ｍｍ）により、式（１）を用いて３０％圧縮時の圧縮硬さＫ値を算出した。 Table 1 shows the compression hardness at the time of 30% compression deformation of the conductive particles. As described above, the compressive hardness at 30% compressive deformation of the conductive particles is that the conductive particles are dispersed on a steel plate having a smooth surface at room temperature, and one of the dispersed conductive particles is electrically conductive. Particles were selected. Then, the conductive end face is pressed by pressing the smooth end face of a diamond cylinder of 50 μm diameter provided in a micro-compression tester (for example, PCT-200 type: manufactured by Shimadzu Corporation) against one selected conductive particle. Sex particles were compressed. And the load value F (kgf) was computed from the compression displacement S (mm) at the time of 30% compression of electroconductive particle from the relationship shown in FIG.
Then, the compression hardness K value at the time of 30% compression was calculated using Formula (1) from the calculated load value F (kgf) and compression displacement S (mm).
　（比較例１～比較例３）
　比較例１～比較例３については、樹脂コアＮｉメッキ粒子の３０％圧縮時の圧縮硬さが表１に示すようになるように導電性粒子を作製したこと以外は、実施例と同様にして異方性導電フィルムを作製した。 (Comparative Examples 1 to 3)
Comparative Examples 1 to 3 were the same as the Examples except that conductive particles were prepared so that the compression hardness at 30% compression of the resin core Ni plated particles was as shown in Table 1. An anisotropic conductive film was produced.
　＜クラックの発生試験＞
　クラックの発生試験には、表１に示すヤング率を有するポリイミド又はポリエチレンテレフタラート（ＰＥＴ）のフレキシブルフィルムを用いた。このフレキシブルフィルム上に、サイズが２０ｍｍ×４０ｍｍ×総厚み５０．６μｍであって、ＰＩ／Ａｌ／ＩＴＯ＝５０μｍ／０．５μｍ／０．１μｍ、ピッチ５０μｍで配線を形成した。 <Crack generation test>
For the crack generation test, a flexible film of polyimide or polyethylene terephthalate (PET) having Young's modulus shown in Table 1 was used. On this flexible film, wiring was formed with a size of 20 mm × 40 mm × total thickness of 50.6 μm, PI / Al / ITO = 50 μm / 0.5 μm / 0.1 μm, and a pitch of 50 μm.
　次に、配線を形成したフレキシブルフィルム上に作製した異方性導電フィルムを載せ、異方性導電フィルムを介してＩＣチップの端子と配線とが対向するように、ＩＣチップを異方性導電フィルム上に裁置した。そして、ＩＣチップの上面から押圧ヘッドで温度２００℃、圧力６００ｋｇｆ／ｃｍ２の条件で加熱、加圧して接続し、接続構造体を作製した。 Next, the anisotropic conductive film produced is placed on the flexible film on which the wiring is formed, and the IC chip is placed on the anisotropic conductive film so that the terminals of the IC chip and the wiring face each other through the anisotropic conductive film. Arranged above. And it connected by heating and pressurizing on the conditions of temperature 200 degreeC and pressure 600kgf / cm < 2 > with the press head from the upper surface of the IC chip, and produced the connection structure.
　そして、配線のクラックの発生は、目視により確認した。クラックの発生率は、１００個の配線のうち、クラックが発生した割合を示す。クラック発生率を表１及び表２に示す。 The occurrence of wiring cracks was confirmed visually. The rate of occurrence of cracks indicates the ratio of occurrence of cracks in 100 wirings. Table 1 and Table 2 show the crack occurrence rates.
　＜導通抵抗値の試験＞
　導通抵抗値の試験は、クラックの発生試験と同様にフレキシブルフィルムとフレキシブル配線基板を接続し、接続構造体を作製し、導通抵抗を測定した。フレキシブル配線基板には、サイズが２０ｍｍ×４０ｍｍ×５０．５μｍであり、ＰＩ／Ａｌ／ＩＴＯ＝５０μｍ／０．５μｍ／０．１μｍ、ピッチ５０μｍで導通測定用配線を形成した測定用の特性評価用素子を使用した。８５℃／８５％ＲＨ環境下に１２５時間放置後（エージング後）の導通抵抗値を評価した。導通抵抗値は、デジタルマルチメーター（商品名：デジタルマルチメーター７５６１、横河電機社製）を用いて、４端子法にて電流１ｍＡを流したときの導通抵抗値を測定した。エージング後の導通抵抗値が１０Ω以下である場合には、抵抗が低いものとする。導通抵抗値の測定結果を表１及び表２に示す。 <Test of conduction resistance>
In the test of the conduction resistance value, a flexible film and a flexible wiring board were connected as in the crack generation test, a connection structure was produced, and the conduction resistance was measured. The flexible wiring board has a size of 20 mm × 40 mm × 50.5 μm, PI / Al / ITO = 50 μm / 0.5 μm / 0.1 μm, and a conductive measurement wiring formed with a pitch of 50 μm for characteristic evaluation for measurement The element was used. The conduction resistance value after being allowed to stand for 125 hours in an 85 ° C./85% RH environment (after aging) was evaluated. The conduction resistance value was measured using a digital multimeter (trade name: Digital Multimeter 7561, manufactured by Yokogawa Electric Corporation) when a current of 1 mA was passed by the four-terminal method. When the conduction resistance value after aging is 10Ω or less, the resistance is low. Tables 1 and 2 show the measurement results of the conduction resistance values.
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
　表１及び２に示す結果から、実施例１～５では、配線にクラックが発生しなかったり、クラックが発生しても発生率は比較例２及び３に比べて低くなり、クラックの発生が抑制されていることがわかる。したがって、実施例１～５から、異方性導電フィルム中の導電粒子の３０％圧縮変形時の圧縮硬さを１５０～４００Ｋｇｆ／ｍｍ２の範囲内となるようにすることで、配線のクラック発生を抑制できることがわかる。 From the results shown in Tables 1 and 2, in Examples 1 to 5, cracks did not occur in the wiring, or even if cracks occurred, the rate of occurrence was lower than in Comparative Examples 2 and 3, and cracks were suppressed. You can see that Accordingly, from Examples 1 to 5, by causing the compression hardness at the time of 30% compression deformation of the conductive particles in the anisotropic conductive film to be in the range of 150 to 400 Kgf / mm 2 , the generation of wiring cracks It can be seen that this can be suppressed.
　また、実施例１～５では、導通抵抗値が比較例１と比べて低くなり、導通抵抗が低くなった。したがって、実施例１～５から、異方性導電フィルム中の導電粒子の３０％圧縮変形時の圧縮硬さを１５０～４００Ｋｇｆ／ｍｍ２の範囲内となるようにすることで、配線のクラック発生を抑制できると共に、導通抵抗値を低くできることがわかる。実施例の中でも、実施例２は、配線のクラックが発生せず、かつ導通抵抗値が低くなった。 In Examples 1 to 5, the conduction resistance value was lower than that in Comparative Example 1, and the conduction resistance was lowered. Accordingly, from Examples 1 to 5, by causing the compression hardness at the time of 30% compression deformation of the conductive particles in the anisotropic conductive film to be in the range of 150 to 400 Kgf / mm 2 , the generation of wiring cracks It can be seen that the conduction resistance value can be lowered. Among the examples, in Example 2, no cracks were generated in the wiring, and the conduction resistance value was low.
　これらの実施例に対して、比較例１は、導電性粒子の３０％圧縮変形時の圧縮硬さが１００Ｋｇｆ／ｍｍ２であり、硬度が低いため、配線のクラックが発生しなかったが、配線への導電性粒子の食い込み不足が生じ、低い導通抵抗値を得ることができなかった。 In contrast to these examples, Comparative Example 1 has a compressive hardness at 30% compressive deformation of the conductive particles of 100 kgf / mm 2 , and since the hardness is low, cracks in the wiring did not occur. Insufficient encroachment of the conductive particles into the surface occurred, and a low conduction resistance value could not be obtained.
　比較例２及び３は、導電性粒子の３０％圧縮変形時の圧縮硬さが５００Ｋｇｆ／ｍｍ２、７２０Ｋｇｆ／ｍｍ２であるため、硬度が高く硬いため、導電抵抗は低くなったが、配線クラックが発生した。比較例３は、比較例２よりも硬いため、配線のクラックがより生じやすくなった。 In Comparative Examples 2 and 3, since the compression hardness at the time of 30% compression deformation of the conductive particles is 500 kgf / mm 2 and 720 kgf / mm 2 , the hardness is high and the conduction resistance is low, but the wiring crack There has occurred. Since Comparative Example 3 was harder than Comparative Example 2, wiring cracks were more likely to occur.
　１　フィルム積層体、２　剥離フィルム、３　異方性導電フィルム、４　絶縁性接着剤、５　導電性粒子、１０　接続構造体、１０ａ　表示部、１０ｂ　実装部、１１　フレキシブルディスプレイ、１２　ＩＣチップ、１２ａ　端子、１３　フレキシブルプリント配線板、１３ａ　端子、１４　フレキシブルフィルム、１４ａ　端子、１５　表示媒体層、１６　封止部　２０　接続構造体、２０ａ　表示部、２０ｂ　実装部
  DESCRIPTION OF SYMBOLS 1 Film laminated body, 2 Release film, 3 Anisotropic conductive film, 4 Insulating adhesive, 5 Conductive particle, 10 Connection structure, 10a Display part, 10b Mounting part, 11 Flexible display, 12 IC chip, 12a terminal , 13 Flexible printed wiring board, 13a terminal, 14 Flexible film, 14a terminal, 15 Display medium layer, 16 Sealing part 20 Connection structure, 20a Display part, 20b Mounting part

Claims (13)

  1. 　フレキシブルディスプレイに設けられた端子と電子部品の端子との間に異方性導電接続層を介在させて、上記フレキシブルディスプレイと上記電子部品とを接続及び導通した接続構造体の製造方法において、
    　上記異方性導電接続層を介して、上記電子部品の端子が上記フレキシブルディスプレイに設けられた端子と対向するように上記電子部品を上記フレキシブルディスプレイ上に搭載する搭載工程と、
    　上記電子部品を上記フレキシブルディスプレイに対して加圧し、上記フレキシブルディスプレイに設けられた端子と上記電子部品の端子とを上記異方性導電接続層で接続及び上記異方性導電接続層中の導電性粒子を介して導通する接続工程とを有し、
    　上記導電性粒子は、３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２であることを特徴とする接続構造体の製造方法。     In a method for manufacturing a connection structure in which an anisotropic conductive connection layer is interposed between a terminal provided on a flexible display and a terminal of an electronic component, and the flexible display and the electronic component are connected and conducted.
    A mounting step of mounting the electronic component on the flexible display so that the terminal of the electronic component faces the terminal provided on the flexible display via the anisotropic conductive connection layer;
    The electronic component is pressurized against the flexible display, and the terminal provided on the flexible display and the terminal of the electronic component are connected by the anisotropic conductive connection layer and the conductivity in the anisotropic conductive connection layer. A connection step of conducting through the particles,
    The method for producing a connection structure according to claim 1, wherein the conductive particles have a compression hardness of 150 to 400 kgf / mm 2 at 30% compression deformation.
  2. 　上記フレキシブルディスプレイの基材に使用されるフレキシブルフィルムは、ヤング率が２～１０ＧＰａであることを特徴とする請求項１記載の接続構造体の製造方法。 The method for producing a connection structure according to claim 1, wherein the flexible film used for the substrate of the flexible display has a Young's modulus of 2 to 10 GPa.
  3. 　上記導電性粒子の３０％圧縮変形時の圧縮硬さが１５０～３５０Ｋｇｆ／ｍｍ２であることを特徴とする請求項１又は請求項２記載の接続構造体の製造方法。 The method for producing a connection structure according to claim 1 or 2 , wherein the conductive particles have a compression hardness of 150 to 350 kgf / mm 2 when 30% compression deformation occurs.
  4. 　上記フレキシブルディスプレイの基材に使用されるフレキシブルフィルムは、ポリイミド又はポリエチレンテレフタラートであることを特徴とする請求項１乃至請求項３のいずれか１項記載の接続構造体の製造方法。 The method for manufacturing a connection structure according to any one of claims 1 to 3, wherein the flexible film used for the substrate of the flexible display is polyimide or polyethylene terephthalate.
  5. 　フレキシブルディスプレイに設けられた端子と電子部品の端子とを異方性導電接続層により接続する接続方法において、
    　上記異方性導電接続層を介して、上記電子部品の端子が上記フレキシブルディスプレイに設けられた端子と対向するように上記電子部品を上記フレキシブルディスプレイ上に搭載する搭載工程と、
    　上記電子部品を上記フレキシブルディスプレイに対して加圧し、上記フレキシブルディスプレイに設けられた端子と上記電子部品の端子とを上記異方性導電接続層で接続及び上記異方性導電接続層中の導電性粒子を介して導通する接続工程とを有し、
    　上記導電性粒子は、３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２であることを特徴とする接続方法。     In the connection method of connecting the terminal provided on the flexible display and the terminal of the electronic component by the anisotropic conductive connection layer,
    A mounting step of mounting the electronic component on the flexible display so that the terminal of the electronic component faces the terminal provided on the flexible display via the anisotropic conductive connection layer;
    The electronic component is pressurized against the flexible display, and the terminal provided on the flexible display and the terminal of the electronic component are connected by the anisotropic conductive connection layer and the conductivity in the anisotropic conductive connection layer. A connection step of conducting through the particles,
    The connection method according to claim 1, wherein the conductive particles have a compression hardness of 150 to 400 kgf / mm 2 at 30% compression deformation.
  6. 　上記フレキシブルディスプレイの基材に使用されるフレキシブルフィルムは、ヤング率が２～１０ＧＰａであることを特徴とする請求項５記載の接続方法。 6. The connection method according to claim 5, wherein the flexible film used for the substrate of the flexible display has a Young's modulus of 2 to 10 GPa.
  7. 　上記導電性粒子の３０％圧縮変形時の圧縮硬さが１５０～３５０Ｋｇｆ／ｍｍ２であることを特徴とする請求項５又は請求項６記載の接続方法。 The connection method according to claim 5 or 6, wherein the conductive particles have a compression hardness of 150 to 350 Kgf / mm 2 when 30% compression deformation occurs.
  8. 　上記フレキシブルディスプレイに使用されるフレキシブルフィルムは、ポリイミド又はポリエチレンテレフタラートであることを特徴とする請求項５乃至請求項７のいずれか１項記載の接続方法。 The connection method according to any one of claims 5 to 7, wherein the flexible film used for the flexible display is polyimide or polyethylene terephthalate.
  9. 　フレキシブルディスプレイに設けられた端子と電子部品の端子とを接続する異方性導電接続材料において、
    　絶縁性接着剤中に、３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２である導電性粒子を含有することを特徴とする異方性導電接続材料。     In the anisotropic conductive connection material that connects the terminal provided on the flexible display and the terminal of the electronic component,
    An anisotropic conductive connecting material comprising conductive particles having a compression hardness of 150 to 400 kgf / mm 2 at 30% compression deformation in an insulating adhesive.
  10. 　上記導電性粒子の３０％圧縮変形時の圧縮硬さが１５０～３５０Ｋｇｆ／ｍｍ２であることを特徴とする請求項９記載の異方性導電接続材料。 The anisotropic conductive connecting material according to claim 9, wherein the conductive particles have a compression hardness of 150 to 350 kgf / mm 2 when 30% compression deformation occurs.
  11. 　上記導電性粒子が樹脂に金属メッキを施した粒子であることを特徴とする請求項９又は請求項１０記載の異方性導電接続材料。 The anisotropic conductive connecting material according to claim 9 or 10, wherein the conductive particles are particles obtained by performing metal plating on a resin.
  12. 　剥離基材上にフィルム状に形成されていることを特徴とする請求項９乃至請求項１１のいずれか１項記載の異方性導電接続材料。 The anisotropic conductive connection material according to any one of claims 9 to 11, wherein the anisotropic conductive connection material is formed in a film shape on a release substrate.
  13. 　フレキシブルディスプレイに設けられた端子と電子部品の端子との間に異方性導電接続層を介在させて、上記フレキシブルディスプレイと上記電子部品とを接続及び導通した接続構造体であって、
    　上記異方性導電性層中の導電性粒子は、３０％圧縮変形時の圧縮硬さが１５０～４００Ｋｇｆ／ｍｍ２であることを特徴とする接続構造体。
          A connection structure in which an anisotropic conductive connection layer is interposed between a terminal provided on a flexible display and a terminal of an electronic component, and the flexible display and the electronic component are connected and conducted,
    The connection structure according to claim 1, wherein the conductive particles in the anisotropic conductive layer have a compression hardness of 150 to 400 kgf / mm 2 at 30% compression deformation.
PCT/JP2013/053210 2012-02-20 2013-02-12 Anisotropic conductive connection material, connection structure, manufacturing method and connection method for connection structure WO2013125388A1 (en)

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