WO2013125388A1 - Matériau de connexion conducteur anisotrope, structure de connexion, procédé de fabrication et procédé de connexion pour la structure de connexion - Google Patents

Matériau de connexion conducteur anisotrope, structure de connexion, procédé de fabrication et procédé de connexion pour la structure de connexion Download PDF

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Publication number
WO2013125388A1
WO2013125388A1 PCT/JP2013/053210 JP2013053210W WO2013125388A1 WO 2013125388 A1 WO2013125388 A1 WO 2013125388A1 JP 2013053210 W JP2013053210 W JP 2013053210W WO 2013125388 A1 WO2013125388 A1 WO 2013125388A1
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Prior art keywords
anisotropic conductive
flexible display
connection
electronic component
terminal
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PCT/JP2013/053210
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English (en)
Japanese (ja)
Inventor
川津　雅巳
Original Assignee
デクセリアルズ株式会社
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Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to CN201380010151.9A priority Critical patent/CN104106182B/zh
Priority to KR1020147016359A priority patent/KR101886909B1/ko
Publication of WO2013125388A1 publication Critical patent/WO2013125388A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Definitions

  • the present invention relates to a flexible display and an electronic component using an anisotropic conductive connection layer and an anisotropic conductive connection layer used when mounting an electronic component such as a flexible printed wiring board and a semiconductor element on a flexible display.
  • the present invention relates to a connected connection structure, a connection method for connecting a flexible display and an electronic component using an anisotropic conductive connection layer, and a method for manufacturing a connection structure by this connection method.
  • a flip chip mounting method in which the electronic component is mounted on the substrate in a so-called face-down state is widely used.
  • an anisotropic conductive film is interposed between a terminal of an electronic component and a terminal provided on a substrate for the purpose of improving connection reliability and the like. And mechanical connections are made.
  • the anisotropic conductive film is obtained by dispersing conductive particles in an adhesive containing a resin or the like.
  • the conductive particles are, for example, particles obtained by applying nickel or gold plating to resin particles.
  • This mounting method is also used for liquid crystal displays and flexible displays.
  • the liquid crystal display has a Young's modulus as high as 72 GPa and is not easily deformed.
  • the liquid crystal display is easily damaged by external pressure or the like.
  • a flexible display using a flexible plastic as a base material is very thin and has flexibility, so that it can be bent and is not easily damaged, and can be used for electronic paper or a roll-up screen.
  • the transparent electrode (ITO etc.) in the display area extends and is connected to electronic parts such as IC chip and flexible printed wiring board at the end of the base material made of plastic etc. Terminals are provided.
  • the connection terminals are provided directly below or in the vicinity of the display area, and the terminals are miniaturized and the pitch is reduced in order to cope with high-density mounting.
  • the anisotropic conductive film is used for electrical connection between the terminals thus miniaturized and narrowed in pitch and terminals such as electronic parts and plexi- ble printed wiring boards (for example, Patent Document 2).
  • a flexible base material such as polyimide or polyethylene terephthalate
  • a general anisotropic conductive film used for connection with electronic components, and connected by pressure
  • Problems such as cracks in the terminals starting from the conductive particles, cracks in the base material, or destruction may occur.
  • the IC chip etc. are dotted with bumps serving as terminals, Since the pressure applied at the time of connection is also concentrated on the point, cracks are likely to occur.
  • the present invention has been proposed in view of such a conventional situation, and mechanically and electrically connects a terminal provided on a flexible display and a terminal of an electronic component with an anisotropic conductive connection material.
  • anisotropic conductive connection layer and anisotropic conductive connection layer that can suppress cracks in the terminals provided on the flexible display and cracks in the flexible display itself. It is an object of the present invention to provide a connection structure in which components are connected, a connection method in which a flexible display and an electronic component are connected using an anisotropic conductive connection layer, and a method of manufacturing a connection structure by this connection method.
  • the manufacturing method of the connection structure according to the present invention includes a flexible display and an electronic component in which an anisotropic conductive connection layer is interposed between a terminal provided on the flexible display and a terminal of the electronic component.
  • the electronic component is mounted on the flexible display so that the terminal of the electronic component faces the terminal provided on the flexible display through the anisotropic conductive connection layer.
  • Mounting step pressurizing the electronic component against the flexible display, connecting the terminal provided on the flexible display and the terminal of the electronic component with an anisotropic conductive connection layer, and conductive particles in the anisotropic conductive connection layer
  • the conductive particles have a compression hardness of 30 to 400 kgf / mm 2 at 30% compression deformation. It is characterized by that.
  • a connection method that achieves the above-described object is a connection method in which a terminal provided on a flexible display and a terminal of an electronic component are connected by an anisotropic conductive connection layer, through the anisotropic conductive connection layer.
  • Mounting the electronic component on the flexible display so that the terminal of the electronic component faces the terminal provided on the flexible display, and the terminal provided on the flexible display by pressing the electronic component against the flexible display And connecting the terminals of the electronic component with an anisotropic conductive connection layer and conducting the conductive particles through the conductive particles in the anisotropic conductive connection layer.
  • the conductive particles are 30% compressed and deformed.
  • the compression hardness is 150 to 400 kgf / mm 2 .
  • An anisotropic conductive connection material according to the present invention that achieves the above-described object is an anisotropic conductive connection material for connecting a terminal provided on a flexible display and a terminal of an electronic component, and 30% in an adhesive. It is characterized by containing conductive particles having a compression hardness at the time of compressive deformation of 150 to 400 kgf / mm 2 .
  • connection structure according to the present invention that achieves the above-described object connects the flexible display and the electronic component by interposing an anisotropic conductive connection layer between the terminal provided on the flexible display and the terminal of the electronic component.
  • the conductive particles in the anisotropic conductive layer are characterized in that the compression hardness at 30% compression deformation is 150 to 400 Kgf / mm 2 .
  • the conductive particles contained in the insulating adhesive of the anisotropic conductive connecting material have a compressive hardness at the time of 30% compression deformation of 150 to 400 Kgf / mm 2. Even when pressure is applied when connecting electronic components, the conductive particles are deformed, the contact area between the conductive particles and the terminals of the flexible display is increased, and cracks can be prevented from entering the terminals of the flexible display. The display itself can be prevented from cracking or being destroyed.
  • the anisotropic conductive connecting material is interposed between the terminal provided on the flexible display and the terminal of the electronic component, and connects the flexible display and the electronic component to make them conductive.
  • Examples of such an anisotropic conductive connection material include a film-like anisotropic conductive film or a paste-like anisotropic conductive connection paste.
  • the anisotropic conductive film or the anisotropic conductive connection paste is defined as “anisotropic conductive connection material”.
  • an anisotropic conductive film will be described as an example.
  • the film laminate 1 is generally a laminate of an anisotropic conductive film 3 serving as an anisotropic conductive connection layer on a release film 2 serving as a release substrate.
  • the release film 2 is formed by, for example, applying a release agent such as silicone to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene) or the like. .
  • a release agent such as silicone to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene) or the like.
  • the anisotropic conductive film 3 is obtained by dispersing conductive particles 5 in an insulating adhesive (binder) 4 containing a film-forming resin, a thermosetting resin, a curing agent, and the like.
  • the anisotropic conductive film 3 is formed on the release film 2 in a film shape.
  • the film forming resin is preferably a resin having an average molecular weight of about 10,000 to 80,000.
  • the film-forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is preferable from the viewpoint of film formation state, connection reliability, and the like. If the content of the film-forming resin is too small, a film will not be formed, and if it is too high, it will be difficult to eliminate the resin for electrical connection.
  • Part by mass preferably 40 to 70 parts by mass.
  • the curing component is not particularly limited as long as it has fluidity at room temperature, and examples thereof include commercially available epoxy resins and acrylic resins.
  • the epoxy resin is not particularly limited and may be appropriately selected depending on the purpose.
  • naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, Phenolmethane type epoxy resin, phenol aralkyl type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like can be mentioned. These may be used alone or in combination of two or more.
  • an acrylic resin there is no restriction
  • thermosetting resin it is preferable to use an epoxy resin or an acrylic resin as the thermosetting resin.
  • Examples of the latent curing agent include various curing agents such as a heat curing type and a UV curing type.
  • the latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction.
  • the activation method of the thermally activated latent curing agent includes a method of generating active species (cations and anions) by a dissociation reaction by heating, and the like. There are a method of dissolving and dissolving and starting a curing reaction, a method of starting a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, an elution and curing method using microcapsules, and the like.
  • Thermally active latent curing agents include imidazole series, hydrazide series, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide, and modified products thereof.
  • the above mixture may be sufficient.
  • a microcapsule type imidazole-based latent curing agent is preferable.
  • the anisotropic conductive film 3 may contain a silane coupling agent. Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. By adding the silane coupling agent, connectivity at the interface between the organic material and the inorganic material can be improved.
  • the conductive particles 5 have a compression hardness (K value) at 30% compression deformation of 150 to 400 kgf / mm 2 (1.50 to 4.00 GPa), preferably 150 to 350 kgf / mm 2 (1. 50 to 3.50 GPa).
  • the index of hardness of the conductive particles 5 is calculated from the weight necessary for compressing and deforming 30% of the particle diameter in an unloaded state when one particle is weighted and deformed. Value.
  • the 30% compressive deformation is a state in which when the conductive particles 5 are compressed in one direction, the particle size 2R (mm) of the conductive particles is deformed so as to be 30% shorter than the original particle size. This is a deformation state in which the particle size 2R of the conductive particles is 70% of the original particle size. The smaller the K value, the softer the particles.
  • the compression hardness (K value) at the time of 30% compression deformation of the conductive particles 5 is calculated by the following equation (1).
  • K value is measured by the following measurement method, for example. Specifically, first, conductive particles are dispersed on a steel plate having a smooth surface at room temperature. Next, one conductive particle is selected from the dispersed conductive particles. Then, the conductive end face is pressed by pressing the smooth end face of a diamond cylinder of 50 ⁇ m diameter provided in a micro-compression tester (for example, PCT-200 type: manufactured by Shimadzu Corporation) against one selected conductive particle. Compress the sex particles. At this time, the compression load is electrically detected as an electromagnetic force, and the compression displacement is electrically detected as a displacement by the operating transformer.
  • a micro-compression tester for example, PCT-200 type: manufactured by Shimadzu Corporation
  • the “compression displacement” refers to a value (mm) obtained by subtracting the length of the short diameter of the conductive particles after deformation from the particle diameter of the conductive particles before deformation. Then, another electroconductive particle on a steel plate is selected, and a compressive load and a compressive displacement are measured also about the selected electroconductive particle. For example, compressive deformation is measured for 10 conductive particles with different compressive loads.
  • Compressive displacement-load relationship is expressed as shown in FIG. From the relationship shown in FIG. 2, the load value F (kgf) is calculated from the compression displacement S (mm) when the conductive particles are compressed by 30%. And the compression hardness K value at the time of 30% compression is calculated using Formula (1) from the load value F (kgf) and the compression displacement S (mm).
  • the compression hardness at the time of 30% compression deformation of the conductive particles 5 is 150 to 400 kgf / mm 2 , when the substantially spherical particles are pressed, they are deformed by a load, so that a flexible display as described later can be obtained.
  • the anisotropic conductive film 3 is interposed between the provided terminal and the terminal of the electronic component to connect and conduct the terminals, the terminal is deformed so that it is slightly crushed even if it is compressed. For this reason, the conductive particles 5 come into contact with the terminals of the flexible display without touching at points, reducing the pressure per unit area transmitted to the terminals and dispersing the local pressure applied to the terminals. It is possible to prevent the terminal from being cracked and the flexible display itself from being destroyed.
  • the conduction resistance value of the connecting portion becomes unstable, so that it is 150 Kgf / mm 2 or more.
  • it is possible to prevent the occurrence of cracks in the terminals and the cracks and breakage of the flexible display itself, and the conduction resistance value can be lowered.
  • the conductive particles 5 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, plastic, and the like.
  • the surface of the particles may be coated with a metal, or the surface of these particles may be further coated with an insulating thin film.
  • the resin particles include, for example, epoxy resin, phenol resin, acrylic resin, acrylonitrile / styrene (AS) resin, benzoguanamine resin, divinylbenzene resin, styrene resin, etc. Particles can be mentioned.
  • the electroconductive particle 5 consists of these materials, and satisfy
  • the average particle diameter of the conductive particles 5 is preferably 1 to 20 ⁇ m, more preferably 2 to 10 ⁇ m, from the viewpoint of connection reliability. By setting the average particle diameter of the conductive particles 5 in the range of 1 ⁇ m to 20 ⁇ m, electrical connection is possible even when compression deformation is caused by pressurization.
  • the film laminate 1 having such a structure is made of an anisotropic conductive composition in which the above-described insulating adhesive (binder) 4 is dissolved in a solvent such as toluene or ethyl acetate and the conductive particles 5 are dispersed.
  • a solvent such as toluene or ethyl acetate
  • the anisotropic conductive composition Produced by applying this anisotropic conductive composition on the release film 2 having peelability to a desired thickness, drying to remove the solvent, and forming the anisotropic conductive film 3 can do.
  • the film laminated body 1 is not limited to the structure which formed the anisotropic conductive film 3 on such a peeling film 2,
  • the insulating resin which consists only of the insulating adhesives 4 in the anisotropic conductive film 3, for example A layer (NCF: Non Conductive Film layer) may be laminated.
  • the film laminate 1 may have a configuration in which a release film is also provided on the surface opposite to the surface on which the release film 2 of the anisotropic conductive film 3 is laminated.
  • the anisotropic conductive film 3 of the film laminate 1 having the above-described configuration is pressurized when the compression hardness at the time of 30% compression deformation of the conductive particles 5 is 150 to 400 Kgf / mm 2.
  • the almost spherical particles are deformed by the load.
  • connection method for conducting and connecting terminals of a flexible display and terminals of an electronic component using the anisotropic conductive film 3, a connection structure manufactured thereby, and a method for manufacturing the connection structure will be described. .
  • connection structure 10 the flexible printed wiring board 13 is mechanically and electrically connected to the flexible display 11 so as to be electrically connected to the IC chip 12 and the outside as an electronic component for driving the flexible display 11.
  • the connection structure 10 includes a display unit 10a that displays an image and the like, and a mounting unit 10b on which the IC chip 12 and the flexible printed wiring board 13 are mechanically and electrically connected and mounted.
  • the flexible display 11 has two flexible films 14, a front plate and a back plate, and a display medium layer 15 such as a microcapsule layer or a liquid crystal layer is disposed between the two flexible films 14.
  • the periphery of the layer 15 is sealed with a sealing portion 16 made of a sealing material.
  • the flexible film 14 has a Young's modulus of 10 GPa or less, preferably 2 to 10 GPa, more preferably 3 to 5 GPa.
  • the Young's modulus is a constant specific to a substance calculated from a strain per unit (deformation rate) generated when a substance is deformed by applying stress. If this Young's modulus is large, it is difficult to deform against stress, and if it is small, it is likely to deform.
  • This flexible film 14 has a small Young's modulus and is easily deformed with respect to a load as compared with a glass substrate of about 72 GPa.
  • Examples of the flexible film 14 include polyimide or polyethylene terephthalate.
  • the terminals 14 a provided on the flexible film 14 on the back plate and the terminals 12 a of the IC chip 12 and the terminals 13 a of the flexible printed wiring board 13 are electrically connected by conductive particles 5 that are compressed and deformed. Has been.
  • connection structure 10 can be manufactured by using the following connection method.
  • a mounting step of mounting the IC chip 12 and the flexible printed wiring board 13 on the flexible film 14 is performed so that the terminals 12a and the terminals 13a of the flexible printed wiring board 13 face each other.
  • the IC chip 12 and the flexible printed wiring board 13 are pressed against the flexible film 14, and the terminals 14a provided on the flexible film 14 are different from the terminals 12a of the IC chip 12 and the terminals 13a of the flexible printed wiring board 13.
  • the connection process of conducting through the conductive particles 5 in the anisotropic conductive film 3 and the connection with the anisotropic conductive film 3 is performed.
  • connection structure 10 About the manufacturing method of the connection structure 10, the case where the film laminated body 1 provided with the anisotropic conductive film 3 which contained the electroconductive particle 5 in the insulating adhesive 4 which used the thermoplastic resin as a hardening component is used is demonstrated, for example.
  • the anisotropic conductive film 3 of the film laminate 1 is connected to the flexible film 14 at a position where the terminal 14 a of the flexible film 14 is connected to the terminal 12 a of the IC chip 12 and the terminal 13 a of the flexible printed wiring board 13.
  • the release film 2 is peeled off to make only the anisotropic conductive film 3, and then the anisotropic conductive film 3 is attached to the terminal 14a.
  • This pasting is performed by heating at a temperature at which the thermosetting resin component contained in the anisotropic conductive film 3 is not cured, for example, while slightly pressing. Thereby, the anisotropic conductive film 3 is positioned and fixed on the terminal 14 a of the flexible film 14.
  • the IC chip 12 and the flexible printed wiring board 13 are mounted on the anisotropic conductive film 3.
  • the alignment state of the anisotropic conductive film 3 is confirmed, and if there is no misalignment or the like, the terminal 14a of the flexible film 14, the terminal 12a of the IC chip 12, and the flexible printed wiring board 13 are mounted.
  • the IC chip 12 and the flexible printed wiring board 13 are mounted on the flexible film 14 via the anisotropic conductive film 3 so that the terminals 13a face each other.
  • connection process of mechanically and electrically connecting the flexible film 14 of the flexible display 11 to the IC chip 12 and the flexible printed wiring board 13 is performed using a pressing head that can be heated and pressurized with the IC chip 12 and the flexible print.
  • the IC chip 12 and the flexible printed wiring board 13 are heated and pressed against the flexible film 14 from the upper surface of the wiring board 13 to cure the anisotropic conductive film 3, and the terminals 14a of the flexible film 14 and the terminals of the IC chip 12 are cured.
  • 12a and the terminal 13a of the flexible printed wiring board 13 are electrically connected through the conductive particles 5, and the flexible film 14, the IC chip 12 and the flexible printed wiring board 13 are mechanically connected by the insulating adhesive 4.
  • the connection structure 10 IC chip 12 and the flexible printed circuit board 13 is connected to the play 11.
  • the condition of this connection process is that the heating temperature is a temperature equal to or higher than the curing temperature of the thermosetting resin contained in the anisotropic conductive film 3, and the anisotropic conductive film thermally melted from between the terminal 14a and the terminals 12a and 13a. 3 is excluded, and pressurization is performed at a pressure that can sandwich the conductive particles 5.
  • the flexible film 14, the IC chip 12, and the flexible printed wiring board 13 are electrically connected by the conductive particles 5 and mechanically connected by the insulating adhesive (binder) 4.
  • Specific conditions for temperature and pressurization are a temperature of about 120 ° C. to 150 ° C. and a pressure of about 1 MPa to 5 MPa.
  • the IC chip 12 and the flexible printed wiring board 13 are pressed by the pressing head toward the flexible film 14, whereby the conductive particles 5 interposed therebetween are compressed and deformed, and the flexible film
  • the 14 terminals 14a do not come into contact with each other but come into contact with each other, and the contact area with the terminal 14a increases.
  • the pressure per unit area transmitted from the conductive particles 5 to the terminal 14a can be reduced, the local pressure applied to the terminal 14a can be dispersed, and cracks can be prevented from occurring in the terminal 14a.
  • the flexible film 14 can be prevented from cracking or being destroyed.
  • connection structure 10 As described above is applied to the anisotropic conductive film 3 interposed between the terminal 14a of the flexible film 14, the terminal 12a of the IC chip 12, and the terminal 13a of the flexible printed wiring board 13.
  • the conductive particles 5 contained have a compression hardness of 30 to 400 kgf / mm 2 at 30% compression deformation, terminals are particularly scattered when connecting the flexible film 14 and the electronic component.
  • the manufacturing method of the connection structure 10 is such that the mounting portion 10b is narrow when the mounting area for the electronic component exists near the display portion 10a having the display medium layer 15 of the flexible display 11 or immediately below the display portion 10a. Even if it is a simple mounting region, no cracks are generated in the terminals 14a of the flexible film 14, and no cracks are generated or broken in the flexible film 14 itself. Thus, it is possible to prevent the display medium layer 15 from affecting the display of an image or the like.
  • connection structure 10 described above has a configuration in which one IC chip 12 and a flexible printed wiring board 13 are mechanically and electrically connected to the flexible display 11, but the present invention is not limited to this, and as shown in FIG.
  • the connection structure 20 may be sufficient.
  • the connection structure 20 has a configuration in which two IC chips 12 and a flexible printed wiring board 13 are mechanically and electrically connected to the flexible film 14 of the flexible display 11 by the anisotropic conductive film 3.
  • the connection structure 20 includes a display unit 20a that displays an image or the like using a display medium layer (not shown), and a mounting unit 20b that is mounted by mechanically and electrically connecting the IC chip 12 and the flexible printed wiring board 13 to each other. Have. In such a connection structure 20 as well, as in the connection structure 10 described above, the terminal 14a of the flexible film 14 is not cracked, and the flexible film 14 itself is not broken.
  • connection structures 10 and 20 described above do not require reinforcing treatment for preventing cracks on the terminals 14a of the flexible display 11, and the manufacturing cost is the same as the manufacturing process of the conventional flexible display 11. Can be prevented.
  • connection structures 10 and 20 are not limited to the flexible display described above, and may be ones in which an electronic component such as an IC chip 12 or a flexible printed wiring board 13 is connected to a flexible base material such as a flexible film. Good.
  • the electronic component is not limited to the IC chip 12 and the flexible printed wiring board 13, but may be other electronic components.
  • Examples include semiconductor chips other than IC chips such as LSI (Large Scale Integration) chips, semiconductor elements such as chip capacitors, and semiconductor mounting materials (COF: Chip On Film) for driving liquid crystals.
  • LSI Large Scale Integration
  • COF Chip On Film
  • Two or more electronic components may be mounted on the flexible display 11, and the mounting positions of the electronic components are not limited to those shown in FIGS. 4 and 5, and may be mounted directly below the display units 10a and 20a.
  • Example 1 to Example 5 ⁇ Production of anisotropic conductive film> (Example 1 to Example 5)
  • a phenoxy resin (YP50, manufactured by Nippon Steel Chemical Co., Ltd.)
  • imidazole System latent curing agent Novacure 3941HP, manufactured by Asahi Kasei E-Materials
  • 2 parts by mass of silane coupling agent A-187, manufactured by Momentive Performance Materials
  • 10 parts by mass of conductive particles having a predetermined hardness Toluene was added to a solid content of 50% to prepare an anisotropic conductive composition.
  • the anisotropic conductive composition was applied onto a release substrate using a bar coater, and toluene was dried using an oven to prepare an anisotropic conductive film having a thickness of 20 ⁇ m.
  • the conductive particles were produced by forming the core part with resin and applying nickel (Ni) plating or nickel gold (NiAu) plating to the core part.
  • the resin particles in the core part are heated with uniform stirring at high speed by adding benzoisoperoxide as a polymerization initiator to a solution in which the mixing ratio of divinylbenzene, styrene, and butyl methacrylate is adjusted,
  • a fine particle dispersion was obtained by carrying out a polymerization reaction.
  • the fine particle dispersion was filtered and dried under reduced pressure to obtain a block body that was an aggregate of fine particles.
  • this block was pulverized to obtain divinylbenzene resin particles having various hardnesses and an average particle diameter of 3.0 ⁇ m.
  • the divinylbenzene resin particles obtained as described above were subjected to Ni plating or NiAu plating to produce conductive particles obtained by applying Ni plating or NiAu plating to the divinylbenzene resin particles.
  • Conductive particles obtained by applying Ni plating to divinylbenzene resin particles were obtained by supporting palladium catalyst on 5 g of 3 ⁇ m divinylbenzene resin particles by an immersion method.
  • an electroless nickel plating solution prepared from nickel sulfate hexahydrate, sodium hypophosphite, sodium citrate, triethanolamine and thallium nitrate pH 12, plating solution temperature 50 ° C.
  • Electroless nickel plating was performed using nickel, and nickel-coated resin particles having nickel plating layers (metal layers) having various phosphorus contents formed on the surfaces were obtained as conductive particles (resin core Ni plating particles).
  • the average particle diameter of the obtained conductive particles was in the range of 3 to 4 ⁇ m.
  • Conductive particles obtained by applying NiAu plating to divinylbenzene resin particles were prepared by mixing 12 g of divinylbenzene resin particles with a solution of 10 g of sodium chloroaurate dissolved in 1000 mL of ion exchange water to prepare an aqueous suspension. .
  • a gold plating bath was prepared by adding 15 g of ammonium thiosulfate, 80 g of ammonium sulfite, and 40 g of ammonium hydrogen phosphate to the obtained aqueous suspension. After 4 g of hydroxylamine was added to the gold plating bath obtained, the pH of the gold plating bath was adjusted to 9 using ammonia, and the bath temperature was maintained at 60 ° C. for about 15 to 20 minutes. Layer) was obtained as nickel-coated resin particles (resin core NiAu plating particles) formed on the surface. The average particle diameter of the obtained conductive particles was in the range of 3 to 4 ⁇ m.
  • Table 1 shows the compression hardness at the time of 30% compression deformation of the conductive particles.
  • the compressive hardness at 30% compressive deformation of the conductive particles is that the conductive particles are dispersed on a steel plate having a smooth surface at room temperature, and one of the dispersed conductive particles is electrically conductive. Particles were selected. Then, the conductive end face is pressed by pressing the smooth end face of a diamond cylinder of 50 ⁇ m diameter provided in a micro-compression tester (for example, PCT-200 type: manufactured by Shimadzu Corporation) against one selected conductive particle. Sex particles were compressed. And the load value F (kgf) was computed from the compression displacement S (mm) at the time of 30% compression of electroconductive particle from the relationship shown in FIG. Then, the compression hardness K value at the time of 30% compression was calculated using Formula (1) from the calculated load value F (kgf) and compression displacement S (mm).
  • Comparative Examples 1 to 3 were the same as the Examples except that conductive particles were prepared so that the compression hardness at 30% compression of the resin core Ni plated particles was as shown in Table 1. An anisotropic conductive film was produced.
  • PET polyethylene terephthalate
  • the anisotropic conductive film produced is placed on the flexible film on which the wiring is formed, and the IC chip is placed on the anisotropic conductive film so that the terminals of the IC chip and the wiring face each other through the anisotropic conductive film. Arranged above. And it connected by heating and pressurizing on the conditions of temperature 200 degreeC and pressure 600kgf / cm ⁇ 2 > with the press head from the upper surface of the IC chip, and produced the connection structure.
  • the occurrence of wiring cracks was confirmed visually.
  • the rate of occurrence of cracks indicates the ratio of occurrence of cracks in 100 wirings.
  • Table 1 and Table 2 show the crack occurrence rates.
  • ⁇ Test of conduction resistance> In the test of the conduction resistance value, a flexible film and a flexible wiring board were connected as in the crack generation test, a connection structure was produced, and the conduction resistance was measured.
  • the conduction resistance value after being allowed to stand for 125 hours in an 85 ° C./85% RH environment (after aging) was evaluated.
  • the conduction resistance value was measured using a digital multimeter (trade name: Digital Multimeter 7561, manufactured by Yokogawa Electric Corporation) when a current of 1 mA was passed by the four-terminal method. When the conduction resistance value after aging is 10 ⁇ or less, the resistance is low. Tables 1 and 2 show the measurement results of the conduction resistance values.
  • Example 1 the conduction resistance value was lower than that in Comparative Example 1, and the conduction resistance was lowered. Accordingly, from Examples 1 to 5, by causing the compression hardness at the time of 30% compression deformation of the conductive particles in the anisotropic conductive film to be in the range of 150 to 400 Kgf / mm 2 , the generation of wiring cracks It can be seen that the conduction resistance value can be lowered. Among the examples, in Example 2, no cracks were generated in the wiring, and the conduction resistance value was low.
  • Comparative Example 1 has a compressive hardness at 30% compressive deformation of the conductive particles of 100 kgf / mm 2 , and since the hardness is low, cracks in the wiring did not occur. Insufficient encroachment of the conductive particles into the surface occurred, and a low conduction resistance value could not be obtained.
  • Comparative Examples 2 and 3 since the compression hardness at the time of 30% compression deformation of the conductive particles is 500 kgf / mm 2 and 720 kgf / mm 2 , the hardness is high and the conduction resistance is low, but the wiring crack There has occurred. Since Comparative Example 3 was harder than Comparative Example 2, wiring cracks were more likely to occur.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

La présente invention concerne un procédé de fabrication pour une structure de connexion dans laquelle une couche de connexion conductrice anisotrope est intercalée entre une borne formée sur un affichage souple et une borne d'un composant électronique, et l'affichage souple et le composant électronique sont connectés l'un à l'autre et conducteurs entre eux. Le procédé comprend les étapes suivantes : une étape de montage permettant de monter le composant électronique sur l'affichage souple, par le biais de la couche de connexion conductrice anisotrope, de sorte que la borne du composant électronique soit face à la borne formée sur l'affichage souple ; et une étape de connexion dans laquelle le composant électronique est appuyé contre l'affichage souple, et la borne formée sur l'affichage souple et la borne du composant électronique sont connectées par la couche de connexion conductrice anisotrope et rendues mutuellement conductrices par le biais de particules conductrices se trouvant dans la couche de connexion conductrice anisotrope. La dureté de compression des particules conductrices est de 150 à 400 kgf/mm² lorsque la déformation due à la compression est de 30 %.
PCT/JP2013/053210 2012-02-20 2013-02-12 Matériau de connexion conducteur anisotrope, structure de connexion, procédé de fabrication et procédé de connexion pour la structure de connexion WO2013125388A1 (fr)

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KR1020147016359A KR101886909B1 (ko) 2012-02-20 2013-02-12 이방성 도전 접속 재료, 접속 구조체, 접속 구조체의 제조 방법 및 접속 방법

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KR20170033378A (ko) * 2014-10-28 2017-03-24 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름 및 접속 구조체
KR101702718B1 (ko) * 2014-11-20 2017-02-06 삼성에스디아이 주식회사 이방성 도전 필름, 이의 조성물 및 이를 이용한 반도체 장치
WO2016190424A1 (fr) * 2015-05-27 2016-12-01 デクセリアルズ株式会社 Film conducteur anisotrope et structure de connexion
CN105070351A (zh) * 2015-06-30 2015-11-18 苏州纳微科技有限公司 一种柔韧导电微球及其应用
JP6734159B2 (ja) * 2015-09-30 2020-08-05 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7039883B2 (ja) 2016-12-01 2022-03-23 デクセリアルズ株式会社 異方性導電フィルム
KR20190015652A (ko) * 2017-08-03 2019-02-14 (주)트러스 압축변형이 가능한 도전성 파우더를 이용한 도전성 점착테이프 및 이의 제조방법
KR101969879B1 (ko) 2018-11-15 2019-04-17 전인하 연속식 정량 공급장치
CN115667578A (zh) * 2020-05-20 2023-01-31 日本化学工业株式会社 导电性颗粒、使用其的导电性材料和连接构造体

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CN104106182A (zh) 2014-10-15
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TW201345091A (zh) 2013-11-01
JP6209313B2 (ja) 2017-10-04
KR101886909B1 (ko) 2018-08-08
TWI647886B (zh) 2019-01-11

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