TW201345091A - 異向性導電連接材料、連接結構體、連接結構體之製造方法及連接方法 - Google Patents

異向性導電連接材料、連接結構體、連接結構體之製造方法及連接方法 Download PDF

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Publication number
TW201345091A
TW201345091A TW102105710A TW102105710A TW201345091A TW 201345091 A TW201345091 A TW 201345091A TW 102105710 A TW102105710 A TW 102105710A TW 102105710 A TW102105710 A TW 102105710A TW 201345091 A TW201345091 A TW 201345091A
Authority
TW
Taiwan
Prior art keywords
terminal
flexible display
electronic component
anisotropic conductive
flexible
Prior art date
Application number
TW102105710A
Other languages
English (en)
Chinese (zh)
Inventor
Masami Kawazu
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of TW201345091A publication Critical patent/TW201345091A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
TW102105710A 2012-02-20 2013-02-19 異向性導電連接材料、連接結構體、連接結構體之製造方法及連接方法 TW201345091A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012033850A JP6209313B2 (ja) 2012-02-20 2012-02-20 異方性導電フィルム、接続構造体、接続構造体の製造方法及び接続方法

Publications (1)

Publication Number Publication Date
TW201345091A true TW201345091A (zh) 2013-11-01

Family

ID=49005576

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107115274A TWI647886B (zh) 2012-02-20 2013-02-19 Anisotropic conductive film, connection structure, connection structure manufacturing method and connection method
TW102105710A TW201345091A (zh) 2012-02-20 2013-02-19 異向性導電連接材料、連接結構體、連接結構體之製造方法及連接方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW107115274A TWI647886B (zh) 2012-02-20 2013-02-19 Anisotropic conductive film, connection structure, connection structure manufacturing method and connection method

Country Status (5)

Country Link
JP (1) JP6209313B2 (fr)
KR (1) KR101886909B1 (fr)
CN (1) CN104106182B (fr)
TW (2) TWI647886B (fr)
WO (1) WO2013125388A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016068127A1 (fr) * 2014-10-28 2016-05-06 デクセリアルズ株式会社 Film conducteur anisotrope et structure de connexion
KR101702718B1 (ko) * 2014-11-20 2017-02-06 삼성에스디아이 주식회사 이방성 도전 필름, 이의 조성물 및 이를 이용한 반도체 장치
TWI691977B (zh) * 2015-05-27 2020-04-21 日商迪睿合股份有限公司 異向導電性膜及連接構造體
CN105070351A (zh) * 2015-06-30 2015-11-18 苏州纳微科技有限公司 一种柔韧导电微球及其应用
JP6734159B2 (ja) * 2015-09-30 2020-08-05 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR102190177B1 (ko) * 2016-05-09 2020-12-11 쇼와덴코머티리얼즈가부시끼가이샤 반도체 장치의 제조 방법
JP7039883B2 (ja) 2016-12-01 2022-03-23 デクセリアルズ株式会社 異方性導電フィルム
KR20190015652A (ko) * 2017-08-03 2019-02-14 (주)트러스 압축변형이 가능한 도전성 파우더를 이용한 도전성 점착테이프 및 이의 제조방법
KR101969879B1 (ko) 2018-11-15 2019-04-17 전인하 연속식 정량 공급장치
KR20230012496A (ko) * 2020-05-20 2023-01-26 니폰 가가쿠 고교 가부시키가이샤 도전성 입자, 그것을 사용한 도전성 재료 및 접속 구조체

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1173817A (ja) * 1997-08-28 1999-03-16 Ricoh Co Ltd 導電性粒子および異方導電性接着材および液晶表示装置
KR20040052126A (ko) * 2002-12-13 2004-06-19 엘지전선 주식회사 이방 도전성 접착제, 이를 이용한 회로 접속 방법 및 회로접속 구조체
KR100667374B1 (ko) * 2004-12-16 2007-01-10 제일모직주식회사 이방전도성 접속부재용 고분자 수지 미립자, 전도성 미립자 및 이를 포함한 이방 전도성 접속재료
JP5622137B2 (ja) 2007-10-29 2014-11-12 デクセリアルズ株式会社 電気的接続体及びその製造方法
JP2009242508A (ja) 2008-03-31 2009-10-22 Asahi Kasei E-Materials Corp 接着剤及び接合体
JPWO2009154138A1 (ja) * 2008-06-18 2011-12-01 株式会社ブリヂストン 接着剤組成物、それを用いたディスプレイパネルの製造方法

Also Published As

Publication number Publication date
CN104106182B (zh) 2019-06-14
WO2013125388A1 (fr) 2013-08-29
JP2013171656A (ja) 2013-09-02
KR101886909B1 (ko) 2018-08-08
JP6209313B2 (ja) 2017-10-04
CN104106182A (zh) 2014-10-15
TWI647886B (zh) 2019-01-11
TW201832415A (zh) 2018-09-01
KR20140128294A (ko) 2014-11-05

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