CN1918756A - Process for producing anisotropic conductive sheet - Google Patents

Process for producing anisotropic conductive sheet Download PDF

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Publication number
CN1918756A
CN1918756A CN 200580004183 CN200580004183A CN1918756A CN 1918756 A CN1918756 A CN 1918756A CN 200580004183 CN200580004183 CN 200580004183 CN 200580004183 A CN200580004183 A CN 200580004183A CN 1918756 A CN1918756 A CN 1918756A
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material layer
conductive material
magnetic field
thin plate
electroconductive particle
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Chinese (zh)
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五十岚久夫
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JSR Corp
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JSR Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/44—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of magnetic liquids, e.g. ferrofluids
    • H01F1/447—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of magnetic liquids, e.g. ferrofluids characterised by magnetoviscosity, e.g. magnetorheological, magnetothixotropic, magnetodilatant liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

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  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

A process for producing an anisotropic conductive sheet exhibiting a low electric resistance and stable conductivity even if it is pressurized with a small pressurizing force. The process for producing an anisotropic conductive sheet comprises a step for orienting conductive particles in the thickness direction of a conductive material layer by applying a magnetic field in the thickness direction to the conductive material layer where the conductive particles are contained in a liquid polymer substance forming material becoming an insulating elastic polymer substance by being cured, characterized in that the operation for applying a magnetic field to the conductive material layer is performed again at least once during that step after application of a magnetic field to the conductive material layer is stopped.

Description

The manufacturing method of anisotropic conductive thin plate
Technical field
The present invention relates to the manufacturing methods of anisotropic conductive thin plate, in more detail, are related to perform well in being formed the manufacturing method of the galvanoscopic anisotropic conductive thin plate of the circuit devices such as integrated circuit on the wafer.
Background technique
Anisotropic conductive elastic sheet, it is the thin plate that electric conductivity is shown only along thickness direction, either there is the thin plate for the pressured conductive conductive part for showing electric conductivity only along thickness direction when being pressurized along thickness direction, close electrical connection can be reached with the devices such as soldering or mechanical interlock are not had to, mechanical impact or deformation are absorbed so as to carry out the specialities such as soft connection, therefore this speciality is utilized, such as in electronic computer, electronic type digital clock, Electrofax, in the fields such as computer keyboard, it can be used as reaching and circuit device, such as tellite and without lead wire circuit chip carrier, the connector of the mutual electrical connection such as liquid crystal display panel and be widely used.
In addition, in the electrical inspection of the circuit devices such as conductor integrated circuit devices, the chip for foring integrated circuit, the tellites such as encapsulation IC, MCM, in order to reach the examined electrode being formed in the one side as the circuit device of check object, with be formed in inspection circuit substrate surface on inspection electrode electricity connection, between the examined electrode zone of circuit device and the inspection electrode zone of inspection circuit substrate, it is filled the operation of anisotropic conductive elastic sheet.
In the past, as this anisotropic conductive elastic sheet, structure there are many kinds of known, such as in patent document 1 etc., anisotropic conductive elastic sheet obtained from dispersing in the state that the electroconductive particle for keeping display magnetic is orientated in a manner of arranging in the elastomer along thickness direction is disclosed (hereinafter, being referred to as " distributed anisotropic conductive thin plate ".), in addition, in patent document 2 is equal, disclose that unevenly substep is in the elastomer by the electroconductive particle that keeps display magnetic, form the multiple conductive path forming portions extended along thickness direction, with by anisotropic conductive elastic sheet made of the insulation division of their mutually insulateds (hereinafter, being referred to as " tending to type anisotropic conductive thin plate ".), in turn, in patent document 3 is equal, disclose form step between the surface and insulation division of conductive path forming portion tend to type anisotropic conductive thin plate.
In these anisotropic conductive elastic sheets, in elastomer, by the state being orientated in a manner of arranging along thickness direction, containing electroconductive particle, to form the chain of electroconductive particle, and conductive path is formed by the chain of the electroconductive particle.
This anisotropic conductive elastic sheet, in the past, the conductive material layer constituted in the polymer substance forming material for becoming elastomer and the electroconductive particle for keeping display magnetic is dispersed in and is cured, magnetic field is set to work along its thickness direction, it is orientated the electroconductive particle in high conductivity material layer in a manner of arranging along thickness direction, then, after stopping for the effect in the magnetic field of conductive material layer, or one side continues the effect in magnetic field, manufactures on one side via by the process of the conductive material layer curing process.
But in the manufacturing method of previous anisotropic conductive elastic sheet, distinguished there is a problem of it is following.
In order to manufacture the anisotropic conductive thin plate for showing higher electric conductivity with lesser plus-pressure, in the process for making magnetic field work relative to conductive material layer, along thickness direction, i.e., the chain that direction vertical relative to the surface of conductive material layer forms electroconductive particle is critically important.
But, in the conductive material layer before making magnetic field work, electroconductive particle exists with the state being evenly dispersed in the conductive material layer, so even magnetic field is made to work along the thickness direction of conductive material layer, as shown in figure 26, the chain of electroconductive particle P, the more than thickness direction of conductive material layer 80 also form on relative to the inclined direction of thickness direction.Also, in this state, due to being stable in terms of magnetomechanics, and each electroconductive particle is constrained by magnetic force, so even continuing the effect in magnetic field, electroconductive particle will not be moved in a manner of forming chain along thickness direction.Also, in this state, as also forming the chain of electroconductive particle on relative to the inclined direction of thickness direction for anisotropic conductive thin plate obtained from 80 curing process of conductive material, therefore, it is difficult to obtain higher electric conductivity with lesser plus-pressure.
In addition, in distributed anisotropic conductive thin plate, in the case where foring the chain of electroconductive particle on relative to the inclined direction of thickness direction, hardly result in higher resolution capability, i.e. in the state of ensuring necessary insulating properties between adjacent electrode, the performance of the electrical connection for each electrode is reached with higher reliability.
In turn, in the manufacturing method for tending to type anisotropic conductive thin plate, there is a problem of following.
In the fabrication schedule for tending to type anisotropic conductive thin plate, as shown in figure 27, on substrate 91, ferromagnetic layer 92 is formed according to figure identical with conductive path forming portion to be formed, and upper mold 90 made of nonmagnetic material layer 93 is formed on region in addition to this, with on substrate 96, ferromagnetic layer 97 is formed according to the symmetrical figure of ferromagnetic layer 92 of upper mold 90, and it is formed between lower die 95 made of nonmagnetic material layer 98 on region in addition to this, the electroconductive particle P that being formed keeps display magnetic, which is dispersed in, to be cured and becomes conductive material layer 80 made of in the polymer substance forming material of elastomer.Then, by configuring a pair of of electromagnet (not shown) below the upper surface of upper mold 90 and lower die 95 and making its work, on the part between the ferromagnetic layer 92 of upper mold 90 and the ferromagnetic layer 97 of lower die 95 of conductive material layer 80, the magnetic field for making intensity be greater than part in addition to this is worked.Its result, the electroconductive particle P being dispersed in conductive material layer 80, the part between the ferromagnetic layer 92 of upper mold 90 and the ferromagnetic layer 97 of lower die 95 is concentrated on, becomes the part of conductive path forming portion, while being orientated in a manner of arranging along thickness direction.Then, in this state, the curing process of conductive material layer 80 is carried out.
But, it is present in conductive material layer 80, the electroconductive particle P of central location between part as conductive path forming portion adjacent to each other, because acting on the balance in the magnetic field of electroconductive particle P, in the presence of not to the partial movement for becoming conductive path forming portion and the case where be detained, it is connected by other electroconductive particle P in this electroconductive particle P, as shown in figure 28, between the adjacent ferromagnetic layer 97 of the ferromagnetic layer 92 of upper mold 90 and the ferromagnetic layer 97 of lower die 95 corresponding thereto, form the chain of electroconductive particle P, its result, just the anisotropic conductive thin plate that required insulating properties is ensured between adjacent conductive path forming portion is hardly resulted in.This phenomenon is that the spacing of conductive path forming portion is smaller more significant.
Patent document 1: tekiaki 51-93393 bulletin
Patent document 2: tekiaki 53-147772 bulletin
Patent document 3: tekiaki 61-250906 bulletin
Summary of the invention
The present invention is developed into according to the above situation, and the 1st purpose is, the method pressurizeed even if providing with lesser plus-pressure, and can manufacture that electric resistance value is lower, and show the anisotropic conductive thin plate of stable electric conductivity.
2nd purpose of the invention is, it provides to have and multiple conductive path forming portions made of electroconductive particle is contained with the state being orientated along thickness direction, with by the manufacturing method of the anisotropic conductive thin plate of the insulation division of these conductive path forming portion mutually insulateds, even if it is pressurizeed with lesser plus-pressure, it is lower that electric resistance value can also be manufactured, and the electric conductivity that display is stable, and, even if the spacing of conductive path forming portion is smaller, the method for the anisotropic conductive thin plate of required insulating properties can be also reliably obtained between adjacent conductive path forming portion.
3rd purpose of the invention is, the manufacturing method for containing anisotropic conductive thin plate made of electroconductive particle with the state being orientated along thickness direction is provided, even if it is to make to be pressurizeed with lesser plus-pressure, it is lower that electric resistance value can also be made, and the electric conductivity that display is stable, also, the method for the anisotropic conductive thin plate of resolution capability with higher.
The manufacturing method of anisotropic conductive thin plate of the invention, it is characterised in that:
With by relative to be cured and become insulating properties elastomer liquid polymer substance forming material in contain conductive material layer made of the magnetic electroconductive particle of display, magnetic field is set to work along its thickness direction, the process for being orientated electroconductive particle along the thickness direction of the conductive material layer；
In this process, after it stopped for the effect in the magnetic field of the conductive material layer, 1 operation for making magnetic field work relative to the conductive material layer is at least carried out again.
In addition, the manufacturing method of anisotropic conductive thin plate of the invention, it is manufacture with multiple conductive path forming portions made of the electroconductive particle for containing display magnetism in the elastomer of insulating properties with the state being orientated along thickness direction, with by these conductive path forming portion mutually insulateds, the method for the anisotropic conductive thin plate of insulation division that is made of the elastomer of insulating properties, it is characterised in that:
With by relative to be cured and become insulating properties elastomer liquid polymer substance forming material in contain conductive material layer made of the magnetic electroconductive particle of display, on the part for becoming conductive path forming portion, it works along the thickness direction of the conductive material layer in the magnetic field for making intensity be greater than part in addition to this, concentrate on electroconductive particle on the part as the conductive path forming portion, and the process for being orientated it along the thickness direction of the conductive material layer；
In this process, after it stopped for the effect in the magnetic field of the conductive material layer, 1 operation for making magnetic field work relative to the conductive material layer is at least carried out again.
In addition, the manufacturing method of anisotropic conductive thin plate of the invention, it is to manufacture the method for containing anisotropic conductive thin plate made of the magnetic electroconductive particle of display in the elastomer of insulating properties with the state being orientated along thickness direction, it is characterised in that:
With by relative to be cured and become insulating properties elastomer liquid polymer substance forming material in contain conductive material layer made of the magnetic electroconductive particle of display, magnetic field is set to work along its thickness direction, the process for being orientated electroconductive particle along the thickness direction of the conductive material layer；
In this process, after it stopped for the effect in the magnetic field of the conductive material layer, 1 operation for making magnetic field work relative to the conductive material layer is at least carried out again.
In addition, the manufacturing method of anisotropic conductive thin plate of the invention, it is manufacture with multiple conductive path forming portions made of the electroconductive particle for containing display magnetism in the elastomer of insulating properties with the state being orientated along thickness direction, with by these conductive path forming portion mutually insulateds, the method for the anisotropic conductive thin plate of insulation division that is made of the elastomer of insulating properties, it is characterised in that:
Prepare insulation division thin plate foring multiple through holes according to figure corresponding with the figure of conductive path forming portion to be formed, being made of the elastomer of insulating properties；
With relative to it is in each through hole for being filled in the insulation division thin plate, contain conductive material layer made of the magnetic electroconductive particle of display in the polymer substance forming material of the liquid of the elastomer that becomes insulating properties being cured, magnetic field is set to work along its thickness direction, the process for being orientated electroconductive particle along the thickness direction of the conductive material layer；
In this process, after it stopped for the effect in the magnetic field of the conductive material layer, 1 operation for making magnetic field work relative to the conductive material layer is at least carried out again.
In the manufacturing method of anisotropic conductive thin plate of the invention, preferably after it stopped for the effect in the magnetic field of conductive material layer, in the operation for making magnetic field work relative to the conductive material layer again, so that it is acted on the direction of the magnetic flux line in the magnetic field of conductive material layer again, is the contrary direction with the magnetic flux line in the magnetic field before stopping.
In addition, preferably after it stopped for the effect in the magnetic field of conductive material layer, repeating the operation for making magnetic field work relative to the conductive material layer again in the manufacturing method of anisotropic conductive thin plate of the invention.
In such manufacturing method, preferably after it stopped for the effect in the magnetic field of conductive material layer, by the operation for making magnetic field work relative to the conductive material layer again carry out 5 times or its more than.
The manufacturing method of anisotropic conductive thin plate according to the present invention, due to temporarily ceasing the effect in the magnetic field for conductive material layer, in the halted state, each electroconductive particle in conductive material layer is released under the constraint of magnetic force.Then, by making magnetic field work along thickness direction again relative to conductive material layer, which plays trigger action, the movement of electroconductive particle starts again at, therefore is upwardly formed the chain of electroconductive particle in the more loyal side of the thickness direction relative to conductive material layer.
In this way, can inhibit the phenomenon that in the chain for being upwardly formed electroconductive particle relative to the inclined side of thickness direction, so even pressurizeed with lesser plus-pressure, it can also manufacture that electric resistance value is lower, and indicate the anisotropic conductive thin plate of stable electric conductivity.
In addition, manufacturing multiple conductive path forming portions by insulation division mutually insulated in the case where tending to type anisotropic conductive thin plate, since the case where forming the chain for linking the electroconductive particle between adjacent conductive path forming portion can be prevented, even if the spacing that conductive path forming portion therefore can be manufactured is smaller, the anisotropic conductive thin plate of required insulating properties can be also reliably obtained between adjacent conductive path forming portion.
In addition, in the case where manufacturing distributed anisotropic conductive thin plate, due to that can inhibit that the anisotropic conductive thin plate of resolution capability with higher can be manufactured in the chain for being upwardly formed electroconductive particle relative to the inclined side of thickness direction.
Detailed description of the invention
Fig. 1 is the explanation sectional view constituted for indicating an example of the anisotropic conductive thin plate obtained by the manufacturing method of the present invention.
Fig. 2 is the explanation sectional view for the mian part that amplification indicates anisotropic conductive thin plate shown in FIG. 1.
Fig. 3 has been expressed as manufacture anisotropic conductive thin plate shown in FIG. 1 and the explanation sectional view of the composition of metal mold that uses.
Fig. 4 is the explanation sectional view for indicating to be coated with the state of conductive material in the upper mold of metal mold shown in Fig. 1 and the forming face of lower die.
Fig. 5 is the explanation sectional view for indicating the intracavitary state for foring conductive material layer in metal mold.
Fig. 6 is the explanation sectional view for indicating state metal mold being arranged on electromagnet apparatus.
Fig. 7 is the explanation sectional view for indicating the direction of magnetic flux line in the magnetic field before stopping.
Fig. 8 is the explanation sectional view for indicating the direction of magnetic flux line in the magnetic field for making it work again.
Fig. 9 is that the electroconductive particle for indicating in conductive material layer concentrates on the part as conductive path forming portion, and the explanation sectional view for the state being orientated in a manner of arranging along thickness direction.
Figure 10 is the explanation sectional view constituted for indicating other examples of the anisotropic conductive thin plate obtained by the manufacturing method of the present invention.
Figure 11 is the explanation sectional view for the mian part that amplification indicates anisotropic conductive thin plate shown in Fig. 10.
Figure 12 has been expressed as manufacture anisotropic conductive thin plate shown in Fig. 10 and the explanation sectional view of the composition of molded component that uses.
Figure 13 is the explanation sectional view for indicating to form the state of conductive material layer between the supporter of a side and the supporter of another party of molded component.
Figure 14 is the explanation sectional view that amplification indicates conductive material layer.
Figure 15 is the explanation sectional view for indicating state molded component being arranged on electromagnet apparatus.
Figure 16 is the explanation sectional view for the state for indicating that the electroconductive particle in conductive material layer is orientated in a manner of arranging along thickness direction.
Figure 17 is the explanation sectional view constituted for indicating the still other examples of the anisotropic conductive thin plate obtained by the manufacturing method of the present invention.
Figure 18 is the explanation sectional view for the mian part that amplification indicates anisotropic conductive thin plate shown in Figure 17.
Figure 19 is the explanation sectional view for indicating the composition of the insulation division thin plate for manufacturing anisotropic conductive thin plate shown in Figure 17.
Figure 20 is the explanation sectional view for indicating to be configured with the state of laser mask on the thin plate for obtaining insulation division thin plate.
Figure 21 is the explanation sectional view for indicating to form the state of insulation division thin plate.
Figure 22 indicates the explanation sectional view for the intermediate complexes being made of laser mask, insulation division thin plate and conductive material layer.
Figure 23 is the explanation sectional view for the conductive material layer that amplification indicates intermediate complexes.
Figure 24 is the explanation sectional view for indicating state intermediate complexes being arranged on electromagnet apparatus.
Figure 25 is the explanation sectional view for the state for indicating that the electroconductive particle in conductive material layer is orientated in a manner of arranging along thickness direction.
Figure 26 is indicated in the manufacturing method of previous anisotropic conductive thin plate, and the explanation sectional view of the state of the chain of the electroconductive particle in conductive material layer is formd on relative to the inclined direction of thickness direction.
Figure 27 is the explanation sectional view for indicating to form the state of conductive material layer between upper die and lower die in the manufacturing method of previous anisotropic conductive thin plate.
Figure 28 is indicated in the manufacturing method of previous anisotropic conductive thin plate, between the adjacent ferromagnetic layer of the ferromagnetic layer of upper mold and the ferromagnetic layer of corresponding lower die, forms the explanation sectional view of the state of the chain of electroconductive particle.
Label declaration
10 anisotropic conductive thin plate 10A conductive material layers
11 conductive path forming portion, 12 insulation division
15 frame plate, 20 anisotropic conductive thin plate
25 molded component of 20A conductive material layer
The supporter of 27 another party of supporter of 26 1 sides
28 30 anisotropic conductive thin plates of liner
31 conductive path forming portion 31A conductive material layers
32 insulation division of 31H through hole
32A insulation division thin plate 32B thin plate
34 intermediate complexes, 35 laser mask
36 50 upper molds of opening
51 ferromagnetic substrate, 52 ferromagnetic layer
Side liner on 53 nonmagnetic material layers 54
55 lower die, 56 ferromagnetic substrate
57 ferromagnetic layer, 58 nonmagnetic material layer
59 lower 60 electromagnet apparatus of side liner
61 upside electromagnet, 62 magnetic pole
65 downside electromagnet, 66 magnetic pole
90 upper mold, 91 substrate
92 ferromagnetic layer, 93 nonmagnetic material layer
95 lower die, 96 substrate
97 ferromagnetic layer, 98 nonmagnetic material layer
80 conductive material layer P electroconductive particles
E elastomer
Specific embodiment
Hereinafter, explaining implementation form of the invention in detail.
(the 1st kind of method)
1st kind of method is the method for manufacturing the anisotropic conductive thin plate 10 of composition shown in FIG. 1.If illustrating anisotropic conductive thin plate 10, it be exactly the anisotropic conductive thin plate 10 is to tend to type anisotropic conductive thin plate, by being constituted according to the electrode to be connected, for example as the corresponding figure configuration of the figure of examined electrode of the circuit device of check object, multiple conductive path forming portions 11 for extending respectively along thickness direction, and by the insulation division 12 of these 11 mutually insulateds of conductive path forming portion.Each conductive path forming portion 11, as indicating Fig. 2 amplification, it is in the elastomer E of insulating properties, contain the part of electroconductive particle P by the state that electroconductive particle P is orientated in a manner of arranging along thickness direction, by being pressurized along thickness direction, the conductive path being made of the chain of electroconductive particle P is formed in a thickness direction.In the example in the figures, each conductive path forming portion 11, by respectively from the two sides of insulation division 12 it is outstanding in a manner of formed.In contrast, insulation division 12, is made of the elastomer of insulating properties, it is the part for not containing electroconductive particle P wholly or substantially, does not show electric conductivity on thickness direction and face direction.
In addition, in the anisotropic conductive thin plate of this, integrally provided with the frame plate of frame-shaped 15 on the peripheral part of insulation division 12.
Here, the content ratio of the electroconductive particle P of conductive path forming portion 11, is 10~60% with volume fraction, preferably 15~50%.When the ratio is less than 10%, the sufficiently small conductive path forming portion 11 of electric resistance value cannot be obtained.On the other hand, when the ratio is more than 60%, obtained conductive path forming portion 11 is easy to become fragile, cannot obtain as elasticity necessary to conductive path forming portion 11.
In addition, the spacing of conductive path forming portion 11, e.g. 60~500 μm, when manufacturing anisotropic conductive thin plate 10 of the spacing less than or equal to 200 μm, the manufacturing method of the present invention is extremely effective.
In the 1st kind of method for manufacturing this anisotropic conductive thin plate 10, metal mold shown in Fig. 3 is used.If specifically describing metal mold shown in Fig. 3, it is exactly the metal mold, by upper mold 50 and lower die 55 pairs of therewith, in case from forming face mode relative to each other configure and constitute, in the forming face (in Fig. 3 of upper mold 50, inner cavity is formed between the forming face of lower die 55 (in Fig. 3, above) below).
In upper mold 50, on below the ferromagnetic substrate 51, according to the symmetrical figure of configuration figure of the conductive path forming portion 11 with the anisotropic conductive thin plate 10 to be manufactured, form ferromagnetic layer 52, on the position other than the ferromagnetic layer 52, the nonmagnetic material layer 53 with the thickness bigger than the thickness of the ferromagnetic layer 52 is formed, thus, on the position where the ferromagnetic layer 52 of the forming face of upper mold 50, it is formed with recess.
On the other hand, in lower die 55, on the upper surface of ferromagnetic substrate 56, according to figure identical with the configuration figure of conductive path forming portion 11 of anisotropic conductive thin plate 10 to be manufactured, ferromagnetic layer 57 is formed, on the position other than the ferromagnetic layer 57, form the nonmagnetic material layer 58 with the thickness bigger than the thickness of the ferromagnetic layer 57, as a result, on the position where the ferromagnetic layer of the forming face of lower die 55 57, it is formed with recess.
As the material for the respective ferromagnetic substrate 51,56 for constituting upper mold 50 and lower die 55, the ferromagnetisms metals such as iron, Fe-Ni alloy, iron-cobalt alloy, nickel, cobalt can be used.The ferromagnetic substrate 51,56, preferably with a thickness of 0.1~50mm, and preferably smooth surface, the ungrease treatment of chemistry is implemented, in addition, having carried out mechanical milled processed.
In addition, the material as the respective ferromagnetic layer 52,57 for constituting upper mold 50 and lower die 55, can be used the ferromagnetisms metals such as iron, Fe-Ni alloy, iron-cobalt alloy, nickel, cobalt.The ferromagnetic layer 52,57, its best thickness are more than or equal to 10 μm.When the thickness is less than 10 μm, relative to the conductive material layer being formed in metal mold, it is difficult to make to have the magnetic field of enough intensity distributions to be worked, its result, just it is difficult to concentrate on electroconductive particle to high-density on the part as conductive path forming portion of the conductive material layer, thus the thin plate with good anisotropic conductive cannot be obtained.
In addition, material as the respective nonmagnetic material layer 53,58 for constituting upper mold 50 and lower die 55, the nonmagnetic metal such as copper, polymer substance with heat resistance etc. can be used, on this point the method by photoetching can be readily formed nonmagnetic material layer 53,58, it is preferred by the polymer substance of radiation-curing, the photoresists such as the liquid resist of the dry film photoresist of propylene class, the liquid resist of epoxies, polyimide can be used for example in its material the most.
In addition, the thickness of nonmagnetic material layer 53,58, the projecting height setting of the conductive path forming portion 11 of anisotropic conductive thin plate 10 according to the thickness of ferromagnetic layer 52,57, as a purpose.
Then, in the 1st kind of method, via:
In metal mold, it is formed in and is cured and becomes in the polymer substance forming material of the liquid of the elastomer of insulating properties, the process (a-1) of the conductive material layer constituted containing the magnetic electroconductive particle of display；
By relative to the conductive material layer, on the part for becoming conductive path forming portion, it works along the thickness direction of the conductive material layer in the magnetic field for making intensity be greater than part in addition to this, concentrate on electroconductive particle on the part as the conductive path forming portion, and the process (b-1) for being orientated it along the thickness direction of the conductive material layer；
After stopping for the effect in the magnetic field of the conductive material layer, or one side continues the effect in magnetic field, on one side the process (c-1) of the brilliant conductive material layer curing process；
Manufacture anisotropic conductive thin plate 10.
Hereinafter, specifically describing each process.
Process (a-1):
In process (a-1), firstly, by the electroconductive particle for keeping display magnetic is dispersed in and is cured become insulating properties elastomer liquid polymer substance forming material in, modulate conductive material.
As the polymer substance forming material for modulating conductive material, a variety of materials can be used, as its concrete example, silicon rubber can be enumerated, polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber equiconjugate polydiene and their hydrogen additive, styrene-butadiene-diene block copolymer rubber, the block copolymer rubbers such as styrene-isoprene block copolymer and their hydrogen additive, chlorobutadiene, polyurethane rubber, polyesters rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, soft liquid epoxy rubber etc..
Wherein, from the point of view of the viewpoints such as durability, shaping processability, electrical characteristics, preferably silicon rubber.
As silicon rubber, preferably by liquid silicone rubber crosslinking or condensation.Liquid silicon rubber, can be the silicon rubber of condensed type, the silicon rubber of additive type, containing vinyl, hydroxyl silicon rubber etc. any one.Specifically, dimethyl siloxane raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl siloxanes raw rubber etc. can be enumerated.
In addition, liquid silicon rubber as additive type, it can be used cured by the reaction of vinyl and Si-H combination, material by the liquid type (one one-tenth parting) for combining the polysiloxanes of this two side to constitute containing vinyl and Si-H, and any one of the material for the two-liquid type (binary type) being made of the polysiloxanes containing vinyl and the polysiloxanes containing Si-H combination, but the additive type liquid silicon rubber of two-liquid type is preferred.
Wherein, liquid silicon rubber (dimethyl silicone polymer containing vinyl) containing vinyl, usually, by in the presence of dimethyl vinyl chlorosilane or dimethyl ethenyl alkoxy silane, make dimethyldichlorosilane or dimethyldialkylammonium oxysilane hydrolyzable and condensation reaction, such as carry out by continuing the difference of dissolution-precipitating repeatedly, it is available.
In addition, contain the liquid silicon rubber of vinyl in two ends, by in the presence of a catalyst by annular siloxane anionic polymerisation as octamethylcy-clotetrasiloxane, as short-stopper, such as use dimethyl divinylsiloxanes, and suitably select other reaction conditions (for example, amount of the amount of annular siloxane and short-stopper) available.Here, the catalyst as anionic polymerisation, can be used the alkali such as tetramethyl ammonium hydroxide and hydroxide Zheng Ding Ji Phosphonium or their silanol metal salt (シ ラ ノ レ-ト) solution etc., reaction temperature, e.g. 80~130 DEG C.
(what is said is standard polystyren converted weight average molecular weight for such dimethyl silicone polymer containing vinyl, preferably its molecular weight Mw.It is same as below) it is 10000~40000.In addition, from the viewpoint of the heat resistance of obtained anisotropic conductive thin plate 10, preferably molecular weight distributing index (say be standard polystyren converted weight average molecular weight Mw standardization polystyrene conversion number average molecular mass Mn ratio Mw/Mn value.It is same as below) it is less than equal to 2.
On the other hand, liquid silicon rubber (dimethyl silicone polymer containing hydroxyl) containing hydroxyl, usually, by in the presence of dimethyl hydrogenated chlorosilane or dimethyl hydrogenated alkoxy silane, make dimethyldichlorosilane or dimethyldialkylammonium oxysilane hydrolyzable and condensation reaction, such as carry out by continuing the difference of dissolution-precipitating repeatedly, it is available.
In addition, by in the presence of a catalyst by annular siloxane anionic polymerisation, as short-stopper, dimethyl hydrogenated chlorosilane, methyl dihydrogenated chlorosilane or dimethyl hydrogenated alkoxy silane etc. can be used for example, and suitably select other reaction conditions (for example, amount of the amount of annular siloxane and short-stopper) also available.Here, the catalyst as anionic polymerisation, can be used the alkali or their silanol metal salt solution etc. such as tetramethyl ammonium hydroxide and hydroxide Zheng Ding Ji Phosphonium, reaction temperature, e.g. 80~130 DEG C.
Such dimethyl silicone polymer containing hydroxyl, preferably its molecular weight Mw are 10000~40000.In addition, preferably molecular weight distributing index is less than equal to 2 from the viewpoint of the heat resistance of obtained anisotropic conductive thin plate 10.
In the present invention, the either side that the above-mentioned dimethyl silicone polymer containing vinyl and the dimethyl silicone polymer containing hydroxyl can be used, the two can also be used in combination.
In addition, in the case where manufacturing the anisotropic conductive thin plate 10 of the detector for being used for integrated circuit test or degradation, as liquid silicon rubber, 150 DEG C of the compression set that its solidfied material is preferred is less than equal to 10%, more preferably less than it is equal to 8%, then better is less than equal to 6%.When the compression set is more than 10%, when the anisotropic conductive thin plate 10 repeatedly used or when reusing under high temperature environment, it is easy to generate permanent deformation in conductive path forming portion 11, thus, it causes confusion on the chain of the electroconductive particle of conductive path forming portion 11, result is just difficult to maintain required electric conductivity.
Here, the compression set of the solidfied material of liquid silicon rubber, can be measured by the method on the basis of JIS K6249.
In addition, as liquid silicon rubber, it is preferred to use 23 DEG C of its solidfied material, duroscope A hardness be 10~60, and then preferably 15~60, especially preferably 20~60.When duroscope A hardness is less than 10, when pressurized, the insulation division 12 of 11 mutually insulated of conductive path forming portion is easy excessive deformation, is just difficult to maintain the required insulating properties between conductive path forming portion 11.On the other hand, when duroscope A hardness is more than 60, in order to cause suitably to deform to conductive path forming portion 11, the plus-pressure applied by sizable load is needed, therefore is for example easy to appear the deformation or breakage of inspection object.
Here, the duroscope A hardness of the solidfied material of liquid silicon rubber, can be measured by the method on the basis of JIS K 6249.
In addition, as liquid silicon rubber, it is preferred to use 23 DEG C of tearing strength of its solidfied material be more than or equal to 8kN/m, then it is better be greater than equal to 10kN/m, better more than equal to 15kN/m, be particularly preferred that more than or equal to 20kN/m's.When the tearing strength is less than 8kN/m, when causing excessive deformation to anisotropic conductive thin plate 10, the reduction of durability is easily caused.
Here, the tearing strength of the solidfied material of liquid silicon rubber, can be measured by the method on the basis of JIS K6249.
In addition, as liquid silicon rubber, it is preferred to use its 23 DEG C viscosity is 100~1,250Pas, then better is 150~800Pas, is particularly preferred that 250~500Pas's.When the viscosity is less than 100Pas, in obtained conductive material, it is easy to produce the precipitating of the electroconductive particle in the liquid silicon rubber, it cannot obtain good storage stability, in addition, in aftermentioned process (b-1), when making magnetic field work along thickness direction relative to conductive material layer, electroconductive particle cannot be orientated in a manner of arranging along thickness direction, and be difficult to form the chain of electroconductive particle with uniform state.On the other hand, when the viscosity is more than 1, when 250Pas, since obtained conductive material is the higher material of viscosity, just it is difficult to form conductive material layer in metal mold, in addition, even if making magnetic field work along thickness direction relative to conductive material layer, electroconductive particle can not be made fully to move, therefore, it is difficult to be orientated electroconductive particle in a manner of arranging along thickness direction.
Here, the viscosity of liquid silicon rubber, can be measured with Brookfield viscometer.
In polymer substance forming material, it can be made to contain for making the cured curing catalysts of polymer substance forming material.As such curing catalysts, organic peroxide, fatty acid azo-compound, hydrosilylation catalysts etc. can be used.
As curing catalysts come using organic peroxide concrete example, benzoyl peroxide, peroxidating double two ring benzoyls, cumyl peroxide, di-t-butyl peroxides etc. can be enumerated.
As curing catalysts come using fatty acid azo-compound concrete example, azodiisobutyronitrile etc. can be enumerated.
As can come as the catalyst of hydrosilylation reactions using material concrete example; can enumerate complex, the platinum and 1 of siloxane complex containing unsaturated group of chloroplatinic acid and its salt, platinum-, vinylsiloxane and platinum, the compound of the complex of 3- divinyl tetramethyl disiloxane, three organic (base) phosphines or phosphate ester and platinum, acetyl acetate platinum chelating object, cyclic diene hydrocarbon and platinum complex etc. well known to material.
The usage amount of curing catalysts, it may be considered that type, the type of curing catalysts, the other curing process conditions of polymer substance forming material suitably select, but in general, be 3~15 parts by weight relative to 100 parts by weight of polymer substance forming material.
Polymer substance forming material usually can be containing material made of the inorganic filling materials such as Cab-O-sil, colloidal silica, silica aerogel (aerogel slica), aluminium oxide.By containing such inorganic filling material, the thixotropy (thixotropy) for the conductive material that may insure, viscosity increase, and, the dispersion stabilization of electroconductive particle P improves, while the intensity for the anisotropic conductive thin plate 10 obtained from processing that is cured improves.
The usage amount of this inorganic filling material, is not particularly limited, but if a large amount of use, in aftermentioned process (b-1), significantly hinders the movement of the electroconductive particle P realized by magnetic field, therefore undesirable.
As the electroconductive particle for modulating conductive material, display magnetism can be used, as its concrete example, iron can be enumerated, nickel, the particle of the magnetic metal of the display such as cobalt, or the particle of their alloy, or the particle containing these metals, or using these particles as core particle, implement gold on the surface of the core particle, silver, palladium, the material of the plating of the metal with good conductivity such as rhodium, or using the inorganic substances such as non-magnetic metal particles or bead particle or polymer particle as core particle, the above-mentioned nickel on the surface of the core particle, the material of the plating of the electric conductivity magnetic substance such as cobalt, or the material etc. of this two side of electric conductivity magnetic substance and metal with good conductivity is coated on core particle.
Wherein, it is preferred to use using nickel particles as core particle, and implement the material of the plating of the metals with good conductivity such as gold or silver on its surface.
It as the method for the coating conducting metal on the surface of core particle, is not particularly limited, such as can be carried out by electroless plating.
As electroconductive particle, using in the case where the material that coating conducting metal on the surface of core particle is constituted, from the viewpoint of available good electric conductivity, the clad ratio (ratio of the cladding area of the conductive metal of the surface area relative to core particle) of the conductive metal of best particle surface is more than or equal to 40%, it is better again to be greater than equal to 45%, it is particularly preferred that 47~95%.
In addition, the covering amount of conductive metal, preferably 2.5~50 weight % of core particle, then better is 3~30 weight %, preferably 3.5~25 weight % are particularly preferred that 4~20 weight %.In the case where the conductive metal being wrapped by is gold, covering amount, preferably 3~30 weight % of core particle, then better is 3.5~25 weight %, preferably 4~20 weight %.In addition, in the case where the conductive metal being wrapped by is silver, covering amount, preferably 3~30 weight % of core particle, then better is 4~25 weight %, preferably 5~23 weight % are particularly preferred that 6~20 weight %.
In addition, the particle diameter of electroconductive particle, preferably 1~500 μm, then better is 2~300 μm, preferably 3~200 μm, is particularly preferred that 5~150 μm.
In addition, the particle diameter of electroconductive particle is distributed (Dw/Dn), preferably 1~10, then better is 1~7, preferably 1~5, it is particularly preferred that 1~4.
By using the electroconductive particle for meeting such condition, obtained anisotropic conductive thin plate 10, it is easy to pressurizing and deformation, in addition, in the conductive path forming portion 11 of the anisotropic conductive thin plate 10, available enough electrical contacts between electroconductive particle P.
In addition, the shape of electroconductive particle, is not particularly limited, but on this point of can easily make it be dispersed in polymer substance forming material, preferably spherical, starriness or the bulk being made of 2 particles of their cohesions.
In addition, the moisture content of electroconductive particle, be preferably less than equal to 5%, then it is better be less than equal to 3%, be more preferably less than equal to 2%, be particularly preferred that less than or equal to 1%.By using the electroconductive particle for meeting such condition, in aftermentioned process (c-1), in curing process conductive material layer, the case where bubble is generated in the conductive material layer can be prevented or inhibited.
By with such as stencil printing by this conductive material, it is coated on either side or two sides of the forming face of the upper mold 50 of metal mold shown in Fig. 3 and the forming face of lower die 55, then, as shown in Figure 4, in the lower die 55 for being coated with conductive material, since following, make lower side liner 59, frame plate 15, upper side liner 54 and the upper mold 50 for being coated with conductive material are overlapped according to the sequence, it is intracavitary between the upper mold 50 and lower die 55 of metal mold, it is formed in polymer substance forming material containing conductive material layer 10A made of electroconductive particle P.In conductive material layer 10A, as shown in figure 5, electroconductive particle P is dispersed in the state in conductive material layer 10A.
More than, as the material for constituting frame plate 15, metal material can be used, ceramic material, the a variety of materials such as resin material, as its concrete example, iron can be enumerated, copper, nickel, chromium, cobalt, magnesium, manganese, molybdenum, indium, lead, palladium, titanium, tungsten, aluminium, gold, platinum, the metals such as silver or 2 kinds of the metallic combination alloy together or the metal materials such as steel alloy of will be greater than or equal to, silicon nitride, silicon carbide, the ceramic materials such as aluminium oxide, the reinforced epoxy resin of aromatic series non-woven fabrics, aromatic series non-woven fabrics reinforces polyimide type resin, the resin materials such as the reinforced viscose maleimide triazine resin of aromatic series non-woven fabrics.
In addition, in the case where manufacture is used for the anisotropic conductive thin plate 10 of degradation, as the material for constituting frame plate 15, it is preferred to use the coefficient of linear thermal expansion material same or similar as the coefficient of linear thermal expansion of the material of the chip of check object with constituting.Specifically, in the case where constituting the material of chip is silicon, it is preferred to use coefficient of linear thermal expansion is less than or equal to 1.5 × 10-4/ K, in particular, 3 × 10-6~8 × 10-6The material of/K can enumerate the constant modulus alloys steel type alloys such as the invar type such as invar alloy, constant modulus alloy steel, cross the metal materials such as invar alloy, Kovar alloy, 42 alloys, the reinforced organic resin material of aromatic series non-woven fabrics as its concrete example.
In addition, the thickness of frame plate 15, such as 0.03~1mm, preferably 0.05~0.25mm.
Process (b-1):
In process (b-1), by relative to the conductive material layer 10A formed in process (a-1), on the part for becoming electric conductivity forming portion, it works along the thickness direction of conductive material layer 10A in the magnetic field for making intensity be greater than part in addition to this, it concentrates on electroconductive particle on the part as the electric conductivity forming portion, and is orientated it in a manner of along the arrangement of the thickness direction of conductive material layer 10A.
If specifically described, it is exactly as shown in Figure 6, prepare that there is upside electromagnet 61 and downside electromagnet 65, and the electromagnet apparatus 60 configured in respective magnetic pole 62,66 mode relative to each other, between the magnetic pole 62 of the upside electromagnet 61 of the electromagnet apparatus 60 and the magnetic pole 66 of downside electromagnet 65, the intracavitary metal mold for foring conductive material layer 10A including configuration.Then, by making electromagnet apparatus 60 work, between the ferromagnetic layer 52 of upper mold 50 and the ferromagnetic layer 57 of corresponding lower die 55, the magnetic field that intensity is greater than between the nonmagnetic material layer 53 of upper mold 50 and the nonmagnetic material layer 58 of lower die 55 is formed.I.e., on conductive material layer 10A, on the part for becoming conductive path forming portion, it works in the magnetic field for making intensity be greater than part in addition to this, thus, it concentrates on the electroconductive particle P being dispersed in conductive material layer 10A on the part as conductive path forming portion, and is orientated it in a manner of along the arrangement of the thickness direction of conductive material layer 10A.
It is preferably averagely the size of 0.02~2.5 tesla here, acting on the intensity in the magnetic field of conductive material layer 10A.
In addition, the process (b-1), preferably do not promote conductive material layer 10A it is cured under the conditions of, such as carry out at room temperature.
Then, in the 1st kind of method, in the process (b-1), after temporarily ceasing the effect for the magnetic field of conductive material layer 10A, 1 operation (hereinafter, the operation is known as " operation again ") for making magnetic field work relative to conductive material layer 10A is at least carried out again.The operation again, specifically, again, the mode for making electromagnet apparatus 60 work carries out by after the work for stopping electromagnet apparatus 60.
In this again operation, since stopping for the effect in the magnetic field of conductive material layer 10A, time until making magnetic field work relative to conductive material layer 10A again is (following, referred to as " work dwell time "), it is contemplated that the viscosity of conductive material layer 10A, ratio, the average particle diameter of electroconductive particle of electroconductive particle in conductive material layer 10A etc. and suitably set, it is preferred that being less than or equal to 200 seconds, then better it is less than equal to 60 seconds.
When the work dwell time is too long, overlong time required for process (b-1), to become extremely low by the production efficiency of manufacturing process's entirety, simultaneously because the solidification of the polymer substance forming material of liquid starts, therefore the viscosity change of conductive material layer 10A, as a result, sufficient effect just cannot be obtained.
In addition, in operation again, it is set to act on the magnetic field of conductive material layer 10A again, it the direction of its magnetic flux line both can be identical as the direction of the magnetic flux line in the magnetic field before stopping, it can also be contrary with the magnetic flux line in the magnetic field before stopping, but it is preferably contrary with the magnetic flux line in the magnetic field before stopping in terms of the influence of residual magnetic field is less.
In addition, the intensity in the magnetic field is preferably roughly the same with the intensity in the magnetic field before stopping when the magnetic field opposite with the magnetic flux line in the magnetic field before stopping in the direction for making magnetic flux line is worked.
In order to make magnetic flux line direction and stopping before the contrary magnetic field of magnetic flux line in magnetic field work, as long as changing the polarity of the polarity of the magnetic pole 62 of the upside electromagnet 61 of electromagnet apparatus 60 and the magnetic pole 66 of downside electromagnet 65.
If specifically described, exactly when initially magnetic field being made to work relative to conductive material layer 10A, such as upside electromagnet 61 magnetic pole 62 be the pole N and downside electromagnet 65 magnetic pole 66 be the pole S under conditions of, so that electromagnet apparatus 60 is worked.In this state, since the ferromagnetic layer 52 of upper mold 50 is used as the pole N, the ferromagnetic layer 57 of lower die 55 works as the pole S, therefore as shown in Figure 7, act on the direction of the magnetic flux line in the magnetic field of conductive material layer 10A, it is from the ferromagnetic layer 52 of upper mold 50 to the direction of the ferromagnetic layer 57 of corresponding lower die 55, that is, be direction from the top down.In this way, after it have passed through the defined time, temporarily ceasing the work of electromagnet apparatus 60 making magnetic fields in the state of conductive material layer 10A.Later, under conditions of the magnetic pole 66 that the magnetic pole 62 of upside electromagnet 61 is the pole S and downside electromagnet 65 is the pole N, electromagnet apparatus 60 is made to work again.In this state, since the ferromagnetic layer 52 of upper mold 50 is used as the pole S, the ferromagnetic layer 57 of lower die 55 works as the pole N, therefore as shown in Figure 8, act on the direction of the magnetic flux line in the magnetic field of conductive material layer 10A, it is from the ferromagnetic layer 57 of lower die 55 to the direction of the ferromagnetic layer 52 of corresponding upper mold 50, that is, be direction from bottom to top.
By this method, when stopping the work of electromagnet apparatus 60, even if producing residual magnetic field, by making the work of electromagnet apparatus 60 also by its demagnetization again, therefore the influence of residual magnetic field is reduced.
In addition, operation again, in process (b-1) if at least carry out 1 time, but preferably repeat, specifically, the number of operation is preferably equal to or greater than 5 times again, then better is 10~500 times.
When the number of operation again is very few, the chance that each electroconductive particle P in conductive material layer 10A is released under the constraint of magnetic force is less, thus, the chance that the movement of electroconductive particle P starts again at is less, therefore it is difficult to be upwardly formed the chain of electroconductive particle P in the more loyal side of the thickness direction relative to conductive material layer 10A, its result, in obtained anisotropic conductive thin plate, just it is difficult to be reliably prevented the case where forming the chain for linking the electroconductive particle P between adjacent conductive path forming portion.
In this way, in the case where repeating operation again, since making magnetic field work relative to conductive material layer again, it is (following for the time until the effect in the magnetic field of the conductive material layer to stopping, referred to as " working time again "), it is contemplated that the viscosity of conductive material layer 10A, ratio, the average particle diameter of electroconductive particle of electroconductive particle in conductive material layer 10A etc. and suitably set, it is preferred that 10~300 seconds, then better is 10~200 seconds.
When the working time is too short again for this, the magnetic field of higher-strength cannot be formed, it is thus impossible to move the electroconductive particle P in conductive material layer 10A fully, as a result, being just difficult to be upwardly formed the chain of electroconductive particle P in the more loyal side of the thickness direction relative to conductive material layer 10A.On the other hand, when the working time is too long again, overlong time required for process (b-1), to become extremely low by the production efficiency of manufacturing process's entirety, simultaneously because the solidification of the polymer substance forming material of liquid starts, therefore the viscosity change of conductive material layer 10A, as a result, sufficient effect cannot be obtained.
As previously discussed, in process (b-1), as shown in Figure 9, part between the ferromagnetic layer 52 of upper mold 50 and the ferromagnetic layer 57 of corresponding lower die 55, i.e., on part as conductive path forming portion, formed with the state that is orientated along the thickness direction closely conductive material layer 10A containing electroconductive particle P.
Process (c-1):
In process (c-1), for, with the state that is orientated along the thickness direction closely conductive material layer 10A containing electroconductive particle P, carrying out curing process on the part for becoming conductive path forming portion.
The curing process of conductive material layer 10A, both it can be carried out after stopping for the effect in the magnetic field of conductive material layer 10A, magnetic field can also be made to work relative to conductive material layer 10A on one side, carried out on one side, but preferably carried out when making magnetic field work.
In addition, the curing process of conductive material layer 10A, different due to the material used, but are usually carried out by heat treatment.Specific heating temperature and heating time consider to constitute type of polymer substance forming material of conductive material layer 10A etc. and suitably set.
Then, it after the curing process of conductive material layer 10A, by being cooled to such as room temperature, is then taken out from metal mold, obtains Fig. 1 and anisotropic conductive thin plate 10 shown in Fig. 2.
According to the 1st kind of above method, due to temporarily ceasing the effect in the magnetic field for conductive material layer 10A, in the halted state, each electroconductive particle P in conductive material layer 10A is released under the constraint of magnetic force.Then, by making magnetic field work along thickness direction again relative to conductive material layer 10A, which plays trigger action, the movement of electroconductive particle P starts again at, therefore is upwardly formed the chain of electroconductive particle P in the more loyal side of the thickness direction relative to conductive material layer 10A.
In this way, it can inhibit the phenomenon that in the chain for being upwardly formed electroconductive particle P relative to the inclined side of thickness direction, so even being pressurizeed with lesser plus-pressure, it is lower that electric resistance value can also be manufactured, and indicate stable electric conductivity, and, since the case where forming the chain for linking the electroconductive particle P between adjacent conductive path forming portion can be prevented, so even the spacing of conductive path forming portion 11 is smaller, the anisotropic conductive thin plate 10 of required insulating properties can be also reliably obtained between adjacent conductive path forming portion 11.
(the 2nd kind of method)
2nd kind of method is the method for manufacturing the anisotropic conductive thin plate 20 of composition shown in Fig. 10.
If illustrating anisotropic conductive thin plate 20, it be exactly the anisotropic conductive thin plate 20 is distributed anisotropic conductive thin plate, as indicating Figure 11 amplification, in the elastomer E of insulating properties, it is orientated to form the state of the chain of electroconductive particle P in such a way that electroconductive particle P is along thickness direction arrangement, and, contain electroconductive particle P along the state that face direction is evenly distributed with the chain of electroconductive particle P, by along thickness direction by the arbitrary position pressurization on surface, the conductive path formed by the chain of electroconductive particle P is formed along thickness direction on the position.
Here, the content ratio of the electroconductive particle P of anisotropic conductive thin plate 20, is 10~60% with volume fraction, preferably 15~50%.When the ratio is less than 10%, the sufficiently small conductive path forming portion 11 of electric resistance value cannot be obtained.On the other hand, when the ratio is more than 60%, obtained anisotropic conductive thin plate 20 is easy to become fragile, cannot obtain as elasticity necessary to anisotropic conductive thin plate 20.
Also, in the 2nd kind of method, via:
On supporter appropriate, it is formed in and is cured and becomes in the polymer substance forming material of the liquid of the elastomer of insulating properties, the process (a-2) containing conductive material layer made of the magnetic electroconductive particle of display；
By making magnetic field work along its thickness direction relative to the conductive material layer, the process (b-2) for being orientated electroconductive particle along the thickness direction of the conductive material layer；
After stopping for the effect in the magnetic field of the conductive material layer, or one side continues the effect in magnetic field, on one side by the process (c-2) of the conductive material layer curing process；
Manufacture anisotropic conductive thin plate 20.
Hereinafter, specifically describing each process.
Process (a-2):
In process (a-2), first, in the same manner as the process (a-1) of the 1st kind of method, in the polymer substance forming material and electroconductive particle for keeping display magnetic is dispersed in and is cured as the liquid of the elastomer of insulating properties, conductive material is modulated.
Then, as shown in figure 12, prepare the molded component 25 being made of the supporter 26 of a side, the supporter 27 of another party and liner 28, on the supporter 27 of another party of the molded component 25, such as with stencil printing applying conductive material, later, by being overlapped the supporter 26 of a side via liner 28, as shown in figure 13, conductive material layer 20A is formed between the supporter 26 of a side and the supporter 27 of another party.In conductive material layer 20A, as shown in figure 14, electroconductive particle P is dispersed in the state in conductive material layer 20A.
Process (b-2):
In process (b-2), by making magnetic field work along its thickness direction, being orientated electroconductive particle along the thickness direction of conductive material layer 20A relative to the conductive material layer 20A formed in process (a-2).
If specifically described, it is exactly as shown in figure 15, prepare that there is upside electromagnet 61 and downside electromagnet 65, and the electromagnet apparatus 60 configured in respective magnetic pole 62,66 mode relative to each other, between the magnetic pole 62 of the upside electromagnet 61 of the electromagnet apparatus 60 and the magnetic pole 66 of downside electromagnet 65, configuration forms the molded component 25 of conductive material layer 20A.Then, by making electromagnet apparatus 60 work, so that magnetic field is worked along its thickness direction relative to conductive material layer 20A, is orientated the electroconductive particle P being dispersed in conductive material layer 20A in a manner of along the arrangement of the thickness direction of conductive material layer 20A.
It is preferably averagely the size of 0.02~2.5 tesla here, acting on the intensity in the magnetic field of conductive material layer 20A.
In addition, the process (b-2), preferably do not promote conductive material layer 20A it is cured under the conditions of, such as carry out at room temperature.
Then, in the 2nd kind of method, in the process (b-2), by making electromagnet apparatus 60 work again after the work for stopping electromagnet apparatus 60, operation again is carried out.
In addition, in operation again, it is set to act on the magnetic field of conductive material layer 20A again, it the direction of its magnetic flux line both can be identical as the direction of the magnetic flux line in the magnetic field before stopping, it can also be contrary with the magnetic flux line in the magnetic field before stopping, but it is preferably contrary with the magnetic flux line in the magnetic field before stopping in terms of the influence of residual magnetic field is less.In addition, the intensity in the magnetic field is preferably identical as the intensity in the magnetic field before stopping when the magnetic field opposite with the magnetic flux line in the magnetic field before stopping in the direction for making magnetic flux line is worked.In addition, operation again, in process (b-2) if at least carry out 1 time, but preferably repeat, specifically, the number of operation is preferably equal to or greater than 5 times again, then better is 10~500 times.
Again the specific condition of operation and repeat again operation when specific condition, it is identical as condition shown in the process (b-1) of the 1st kind of method.
As previously discussed, in process (b-2), as shown in figure 16, the conductive material layer 20A for containing electroconductive particle P with the state being orientated along thickness direction is formed.
Process (c-2):
In process (c-2), for containing the conductive material layer 20A of electroconductive particle P with the state being orientated along thickness direction, curing process is carried out.
The curing process of conductive material layer 20A, both it can be carried out after stopping for the effect in the magnetic field of conductive material layer 20A, magnetic field can also be made to work relative to conductive material layer 20A on one side, carried out on one side, but preferably carried out when making magnetic field work.
In addition, the curing process of conductive material layer 20A, different due to the material used, but are usually carried out by heat treatment.Specific heating temperature and heating time consider to constitute type of polymer substance forming material of conductive material layer 20A etc. and suitably set.
Then, it after the curing process of conductive material layer 20A, by being cooled to such as room temperature, is then taken out from molded component, obtains anisotropic conductive thin plate 20 shown in Figure 10 and Figure 11.
According to the 2nd kind of above method, due to temporarily ceasing the effect in the magnetic field for conductive material layer 20A, in the halted state, each electroconductive particle P in conductive material layer 20A is released under the constraint of magnetic force.Then, by making magnetic field work along thickness direction again relative to conductive material layer 20A, which plays trigger action, the movement of electroconductive particle P starts again at, therefore is upwardly formed the chain of electroconductive particle P in the more loyal side of the thickness direction relative to conductive material layer 20A.
In this way, it can inhibit the phenomenon that in the chain for being upwardly formed electroconductive particle P relative to the inclined side of thickness direction, so even being pressurizeed with lesser plus-pressure, also it is lower electric resistance value can reliably to be manufactured, and the electric conductivity that display is stable, also, the anisotropic conductive thin plate 20 of resolution capability with higher.
(the 3rd kind of method)
3rd kind of method is the method for manufacturing the anisotropic conductive thin plate 30 of composition shown in Figure 17.
If illustrating anisotropic conductive thin plate 30, it be exactly the anisotropic conductive thin plate 30 is to tend to type anisotropic conductive thin plate, by being constituted according to the electrode to be connected, for example as the corresponding figure configuration of the figure of examined electrode of the circuit device of check object, multiple conductive path forming portions 31 for extending respectively along thickness direction, and by the insulation division 32 of these 31 mutually insulateds of conductive path forming portion.Each conductive path forming portion 31, as indicating Figure 18 amplification, electroconductive particle P is contained with the state being orientated along thickness direction in the elastomer E of insulating properties, by being pressurized along thickness direction, forms the conductive path being made of the chain of electroconductive particle P in a thickness direction.In contrast, insulation division 32, is made of the elastomer of insulating properties, it is entirely free of conductive particle P, and do not show electric conductivity on thickness direction and face direction.In addition, in the anisotropic conductive thin plate 30 of the example, each conductive path forming portion 31 is formed in such a way that the one side (being above in figure) from insulation division 32 is outstanding.
Here, the content ratio of the electroconductive particle P of conductive path forming portion 31, is 10~60% with volume fraction, preferably 15~50%.When the ratio is less than 10%, the sufficiently small conductive path forming portion 31 of electric resistance value cannot be obtained.On the other hand, when the ratio is more than 60%, obtained conductive path forming portion 31 is easy to become fragile, cannot obtain as elasticity necessary to conductive path forming portion 31.
Also, in the 3rd kind of method, via:
Prepare form multiple through holes according to figure corresponding with the figure of conductive path forming portion to be formed, the insulation division thin plate that is made of the elastomer of insulating properties, and formed be filled in it is in each through hole of the insulation division thin plate, be cured and the process (a-3) containing conductive material layer made of electroconductive particle in the polymer substance forming material of the liquid of the elastomer that becomes insulating properties；
By making magnetic field work along its thickness direction relative to the conductive material layer, the process (b-3) for being orientated electroconductive particle along the thickness direction of the conductive material layer；
After stopping for the effect in the magnetic field of the conductive material layer, or one side continues the effect in magnetic field, on one side by the process (c-3) of the conductive material layer curing process；
Manufacture anisotropic conductive thin plate 30.
Hereinafter, specifically describing each process.
Process (a-3):
In process (a-3), firstly, as shown in figure 19, insulation division thin plate 32A that manufacture forms multiple through hole 31H according to figure corresponding with the figure of conductive path forming portion 31 to be formed, being made of the elastomer of insulating properties.
If specifically described, it is exactly as shown in figure 20, prepare the thin plate 32B being made of the elastomer of insulating properties, on thin plate 32B, configuration forms the laser mask 35 of multiple openings 36 according to figure corresponding with the figure of conductive path forming portion to be formed, implement laser processing on thin plate 32B by the opening 36 via laser mask 35, as shown in figure 21, the insulation division thin plate 32A that multiple through hole 31H are formd according to figure corresponding with the figure of conductive path forming portion to be formed is obtained.
On the other hand, in the same manner as the process (a-1) of the 1st kind of method, in the polymer substance forming material that becomes the liquid of the elastomer of insulating properties and be cured by being dispersed in electroconductive particle, conductive material is modulated.
Then, by on the surface configured in insulation division with the mask of the laser on thin plate 32A 35, with such as stencil printing applying conductive material, as shown in figure 22, conductive material layer 31A is formed in each through hole 31H of insulation division thin plate 32 and each opening 36 of laser mask 35, the intermediate complexes 34 being made of insulation division thin plate 32A, the conductive material layer 31A for configuring laser mask 35 at a surface thereof and being formed in each through hole 31H of insulation division thin plate 32 and each opening 36 of laser mask 35 are obtained as a result,.In the conductive material layer 31A of the intermediate complexes 34, as shown in figure 23, electroconductive particle P is dispersed in the state in conductive material layer 31A.
Process (b-3):
In process (b-3), by making magnetic field work along its thickness direction, being orientated electroconductive particle along the thickness direction of conductive material layer 31A relative to the conductive material layer 31A formed in process (a-3).
If specifically described, it is exactly as shown in figure 24, prepare that there is upside electromagnet 61 and downside electromagnet 65, and the electromagnet apparatus 60 configured in respective magnetic pole 62,66 mode relative to each other, between the magnetic pole 62 of the upside electromagnet 61 of the electromagnet apparatus 60 and the magnetic pole 66 of downside electromagnet 65, intermediate complexes 34 are configured.Then, by making electromagnet apparatus 60 work, each conductive material layer 31A relative to intermediate complexes 34 makes magnetic field work along its thickness direction, it is orientated the electroconductive particle P being dispersed in conductive material layer 31A in a manner of along the arrangement of the thickness direction of conductive material layer 31A.
It is preferably averagely the size of 0.02~2.5 tesla here, acting on the intensity in the magnetic field of conductive material layer 31A.
In addition, the process (b-3), preferably do not promote conductive material layer 31A it is cured under the conditions of, such as carry out at room temperature.
Then, in the 3rd kind of method, in the process (b-3), by making electromagnet apparatus 60 work again after the work for stopping electromagnet apparatus 60, operation again is carried out.
In addition, in operation again, it is set to act on the magnetic field of conductive material layer 31A again, it the direction of its magnetic flux line both can be identical as the direction of the magnetic flux line in the magnetic field before stopping, it can also be contrary with the magnetic flux line in the magnetic field before stopping, but it is preferably contrary with the magnetic flux line in the magnetic field before stopping in terms of the influence of residual magnetic field is less.In addition, the intensity in the magnetic field is preferably identical as the intensity in the magnetic field before stopping when the magnetic field opposite with the magnetic flux line in the magnetic field before stopping in the direction for making magnetic flux line is worked.In addition, operation again, in process (b-3) if at least carry out 1 time, but preferably repeat, specifically, the number of operation is preferably equal to or greater than 5 times again, then better is 10~500 times.
Again the specific condition of operation and repeat again operation when specific condition, it is identical as condition shown in the process (b-1) of the 1st kind of method.
As previously discussed, in process (b-3), as shown in figure 25, the conductive material layer 31A for containing electroconductive particle P with the state being orientated along thickness direction is formed.
Process (c-3):
In process (c-3), for containing the conductive material layer 31A of electroconductive particle P with the state being orientated along thickness direction, curing process is carried out.
The curing process of conductive material layer 31A, both it can be carried out after stopping for the effect in the magnetic field of each conductive material layer 31A, magnetic field can also be made to work relative to each conductive material layer 31A on one side, carried out on one side, but preferably carried out when making magnetic field work.
In addition, the curing process of conductive material layer 31A, different due to the material used, but are usually carried out by heat treatment.Specific heating temperature and heating time consider to constitute type of polymer substance forming material of conductive material layer 31A etc. and suitably set.
As previously discussed, by the way that by each conductive material layer 31A curing process, multiple conductive path forming portions by the state of insulation division mutually insulated to be formed on the insulation division.Then, after the curing process of conductive material layer 31A, by being cooled to such as room temperature, laser mask 35 is then removed, anisotropic conductive thin plate 30 shown in Figure 17 and Figure 18 is obtained.
According to the 3rd kind of above method, due to temporarily ceasing the effect in the magnetic field for conductive material layer 31A, in the halted state, each electroconductive particle P in conductive material layer 31A is released under the constraint of magnetic force.Then, by making magnetic field work along thickness direction again relative to conductive material layer 31A, which plays trigger action, the movement of electroconductive particle P starts again at, therefore is upwardly formed the chain of electroconductive particle P in the more loyal side of the thickness direction relative to conductive material layer 31A.
In this way, can inhibit the phenomenon that in the chain for being upwardly formed electroconductive particle P relative to the inclined side of thickness direction, so even pressurizeed with lesser plus-pressure, it can also manufacture that electric resistance value is lower, and show the anisotropic conductive thin plate 30 of stable electric conductivity.
In addition, in order to form conductive path forming portion 31 in each through hole 31H of the insulation division with thin plate 32A, form the insulation division 32 that electroconductive particle P is completely absent, even if the spacing that conductive path forming portion 31 therefore can be manufactured is smaller, the anisotropic conductive thin plate 30 of required insulating properties can be also reliably obtained between adjacent conductive path forming portion 31.
The manufacturing method of anisotropic conductive thin plate of the invention, it is not limited to the 1st kind of above-mentioned method~3rd kind method, it can be adapted for all manufacturing methods with following process, i.e., by relative to be cured and become insulating properties elastomer liquid polymer substance forming material in contain conductive material layer made of electroconductive particle, magnetic field is set to work along its thickness direction, the process for being orientated electroconductive particle along the thickness direction of the conductive material layer.
Embodiment
Hereinafter, illustrating the specific embodiment of the manufacturing method of anisotropic conductive thin plate of the invention, however, the present invention is not limited thereto.
(embodiment 1)
(1) production of frame plate:
Make the frame plate of style below.
It is that 42 alloys having a size of 25mm × 25mm × 0.03mm rectangle at its center on position, are formed with the opening of the rectangle of 10.0mm × 10.0mm that frame plate, which is material,.
(2) production padded:
Make the upper side liner and lower side liner of style below.
It is that stainless steel (SUS-304) having a size of 25mm × 25mm × 0.03mm rectangle at its center on position, is formed with the opening of the rectangle of 11.0mm × 11.0mm that upper side liner and lower side liner, which are materials,.
(3) production of metal mold:
According to composition shown in Fig. 3, the metal mold for the style being produced as follows.
Upper mold (50) and lower die (55), it is respectively provided with the ferromagnetic substrate (51,56) being made of 42 alloys with a thickness of 6mm, on the surface of each ferromagnetic substrate (51,56), it is respectively formed with the ferromagnetic layer (52,57) for 2000 rectangles being made of nickel-cobalt.Ferromagnetic layer (52,57) respective size is 80 μm of (vertical) × 80 μm (cross) × 50 μm (thickness), and configuration spacing is 130 μm.In addition, being formed on the region formd other than ferromagnetic layer (52,57) on the surface of ferromagnetic substrate (51,56) by the nonmagnetic material layer (53,58) made of dry film photoresist curing process with a thickness of 80 μm.
(4) process (a-1):
In 100 parts by weight of additive type liquid silicon rubber, after adding and being mixed with 140 parts by weight of electroconductive particle that average particle diameter is 8.7 μm, is handled by the deaeration depressurized, modulate conductive material.
Pass through stencil printing, by the conductive material, it is coated in the forming face of the upper mold of above-mentioned metal mold and the forming face of lower die, later, by in lower die, make lower side liner, frame plate, upper side liner and upper mold since following with sequence coincidence, between upper mold and lower die in intracavitary form conductive material layer.
More than, as electroconductive particle, use using nickel particles as core particle, and implement particle made of electroless gold plating on the core particle (average covering amount: being the amount of 25 weight % of the weight of core particle).
In addition, the viscosity using A liquid is 250Pas as additive type liquid silicon rubber, the viscosity of B liquid is the material of the two-liquid type of 250Pas, 150 DEG C of permanent compression set of solidfied material is 5%, and the duroscope A hardness of solidfied material is 35, and the tearing strength of solidfied material is the material of 25kN/m.
In addition, the characteristic of above-mentioned additive type liquid silicon rubber and its solidfied material, measures in such a way.
(i) viscosity of additive type liquid silicon rubber:
By Brookfield viscometer, the viscosity of 23 ± 2 DEG C of measurement.
(ii) compression set of silicon rubber solidfied material:
The A liquid of the additive type liquid silicon rubber of two-liquid type and B liquid are stirred with the ratio of equivalent.Then, the mixture is poured into metal mold, after the deaeration processing depressurized for the mixture, by carrying out curing process with the condition of 120 DEG C, 30 minutes, make the cylindrical body by constituting with a thickness of 12.7mm, the silicon rubber solidfied material that diameter is 29mm, for the cylindrical body, secondary curing is carried out with the condition of 200 DEG C, 4 hours.The cylindrical body obtained in this way is used as test film, on the basis of JIS K 6249, the compression set of 150 ± 2 DEG C of measurement.
(iii) tearing strength of silicon rubber solidfied material:
By carrying out the curing process and secondary curing of additive type liquid silicon rubber with condition same as above-mentioned (ii), the thin plate with a thickness of 2.5mm is made.The test film of crescent is made from the thin plate by punching press, and on the basis of JIS K 6249, the tearing strength of 23 ± 2 DEG C of measurement.
(iv) duroscope A hardness:
The thin plate that 5 are made in a manner of same as above-mentioned (iii) is coincided together, and obtained laminated body is used as test film, on the basis of JIS K 6249, the duroscope A hardness of 23 ± 2 DEG C of measurement.
(5) process (b-1):
Prepare that there is upside electromagnet and downside electromagnet, and the electromagnet apparatus configured in respective magnetic pole mode relative to each other, between the magnetic pole of the upside electromagnet of the electromagnet apparatus and the magnetic pole of downside electromagnet, setting forms the metal mold of above-mentioned conductive material layer.Then, at room temperature, by making electromagnet apparatus work 15 seconds, make the magnetic fields of 1.6T intensity in the part as conductive path forming portion of conductive material layer, in turn, add up on one side and carry out 200 operations again, make magnetic fields in the part for becoming conductive path forming portion on one side.Herein, the condition of operation again, be work dwell time be 5 seconds, the working time is 15 seconds again, the direction of the magnetic flux line in the magnetic field for making it the work again direction contrary with the magnetic flux line in the magnetic field before stopping, the intensity in magnetic field when magnetic field being made to work relative to the part as conductive path forming portion of conductive material layer again, is all 1.6T.
(6) process (c-1):
By between the magnetic pole of the upside electromagnet in electromagnet apparatus and the magnetic pole of downside electromagnet, in the state of metal mold, the electromagnet apparatus is directly set to work, make the magnetic fields of 1.6T intensity in the part as conductive path forming portion of conductive material layer on one side, on one side with 100 DEG C, 2 hours conditions, carry out the curing process of the conductive material, then, after cooling to room temperature, by taking out from metal mold, manufacture has been integrally provided the anisotropic conductive thin plate of frame plate on the peripheral part of insulation division.
In obtained anisotropic conductive thin plate, the conductive path forming portion of 2000 rectangles is configured with 130 μm of spacing, conductive path forming portion, size in length and breadth is 80 μm of 80 μ m, with a thickness of 150 μm, the projecting height from the two sides of insulation division is respectively 30 μm, insulation division with a thickness of 90 μm.
In addition, all conductive path forming portions, are all 30% in terms of volume fraction when checking the content ratio of the electroconductive particle in conductive path forming portion.
(comparative example 1)
In process (b-1), in addition to without operation again, and it is worked 4000 seconds by making electromagnet apparatus, make the magnetic fields of the intensity of 1.6T except on the part as conductive path forming portion of conductive material layer, similarly to Example 1, manufacture has been integrally provided the anisotropic conductive thin plate of frame plate on the peripheral part of insulation division.
In obtained anisotropic conductive thin plate, the conductive path forming portion of 2000 rectangles is configured with 130 μm of spacing, conductive path forming portion, size in length and breadth is 80 μm of 80 μ m, with a thickness of 150 μm, the projecting height from the two sides of insulation division is respectively 30 μm, insulation division with a thickness of 90 μm.
In addition, all conductive path forming portions, are all 30% in terms of volume fraction when checking the content ratio of the electroconductive particle in conductive path forming portion.
(par of anisotropic conductive thin plate)
The electric conductivity of conductive path forming portion:
All conductive path forming portions of anisotropic conductive thin plate are being measured into the electric resistance value of the respective thickness direction of conductive path forming portion in the state of pressurizeing in such a way that the deformation rate of its thickness direction is 10%, 20%, 30% and 40%.Its result is indicated in table 1.
Insulating properties between conductive path forming portion:
By all conductive path forming portions of anisotropic conductive thin plate, in the state of pressurizeing in such a way that the deformation rate of its thickness direction is 20%, the electric resistance value between adjacent conductive path forming portion is measured, and finds out the number of conductive path forming portion of the value less than 1M Ω.Its result is indicated in table 1.
Table 1
Embodiment 1 Comparative example 1
The electric resistance value (Ω) of conductive path forming portion Deformation rate 10% Average value   0.64   4.10
Maximum value   1.05   10.5
Minimum value   0.52   3.40
Deformation rate 20% Average value   0.20   3.30
Maximum value   0.38   5.45
Minimum value   0.13   2.10
Deformation rate 30% Average value   0.15   2.65
Maximum value   0.26   4.80
Minimum value   0.12   1.65
Deformation rate 40% Average value   0.12   10.0
Maximum value   0.24   58.0
Minimum value   0.09   3.25
The number (a) of conductive path forming portion of the electric resistance value less than 1M Ω between adjacent conductive path forming portion   0      35   
As being defined from the result of table 1, it can be confirmed, according to embodiment 1, available following anisotropic conductive thin plate, that is, even if being pressurizeed with lesser plus-pressure, also have electric resistance value lower, and show the conductive path forming portion of stable electric conductivity, also, there is required insulating properties between adjacent conductive path forming portion.

Claims (7)

1. a kind of manufacturing method of anisotropic conductive thin plate, which is characterized in that with the following process:
Relative to be cured and become the liquid of the elastomer of insulating properties polymer substance forming material in contain conductive material layer made of the magnetic electroconductive particle of display, magnetic field is set to work along its thickness direction, so that electroconductive particle is orientated along the thickness direction of the conductive material layer
In this process, after it stopped for the effect in the magnetic field of the conductive material layer, 1 operation for making magnetic field work relative to the conductive material layer is at least carried out again.
2. a kind of manufacturing method of anisotropic conductive thin plate, the anisotropic conductive thin plate, which is included, contains multiple conductive path forming portions made of the magnetic electroconductive particle of display in the elastomer of insulating properties with the state being orientated along thickness direction, with by these conductive path forming portion mutually insulateds, the insulation division that is made of the elastomer of insulating properties, the manufacturing method of the anisotropic conductive thin plate is characterized in that, with the following process:
Relative to be cured and become the liquid of the elastomer of insulating properties polymer substance forming material in contain conductive material layer made of the magnetic electroconductive particle of display, on the part for becoming conductive path forming portion, it works along the thickness direction of the conductive material layer in the magnetic field for making intensity be greater than part in addition to this, so that electroconductive particle concentrates on the part as the conductive path forming portion, and it is orientated it along the thickness direction of the conductive material layer
In this process, after it stopped for the effect in the magnetic field of the conductive material layer, 1 operation for making magnetic field work relative to the conductive material layer is at least carried out again.
3. a kind of manufacturing method of anisotropic conductive thin plate, the anisotropic conductive thin plate is to be contained made of the magnetic electroconductive particle of display in the elastomer of insulating properties with the state being orientated along thickness direction, the manufacturing method of the anisotropic conductive thin plate is characterized in that, with the following process:
Relative to be cured and become the liquid of the elastomer of insulating properties polymer substance forming material in contain conductive material layer made of the magnetic electroconductive particle of display, magnetic field is set to work along its thickness direction, so that electroconductive particle is orientated along the thickness direction of the conductive material layer
In this process, after it stopped for the effect in the magnetic field of the conductive material layer, 1 operation for making magnetic field work relative to the conductive material layer is at least carried out again.
4. a kind of manufacturing method of anisotropic conductive thin plate, the anisotropic conductive thin plate, which is included, contains multiple conductive path forming portions made of the magnetic electroconductive particle of display in the elastomer of insulating properties with the state being orientated along thickness direction, with by these conductive path forming portion mutually insulateds, the insulation division that is made of the elastomer of insulating properties, the manufacturing method of the anisotropic conductive thin plate is characterized in that, with the following process:
Prepare insulation division thin plate foring multiple through holes according to figure corresponding with the figure of conductive path forming portion to be formed, being made of the elastomer of insulating properties；
Relative to it is in each through hole for being filled in the insulation division thin plate, contain conductive material layer made of the magnetic electroconductive particle of display in the polymer substance forming material of the liquid of the elastomer that becomes insulating properties being cured, magnetic field is set to work along its thickness direction, so that electroconductive particle is orientated along the thickness direction of the conductive material layer；
In this process, after it stopped for the effect in the magnetic field of the conductive material layer, 1 operation for making magnetic field work relative to the conductive material layer is at least carried out again.
5. the manufacturing method of the anisotropic conductive thin plate as described in any one of Claims 1-4, it is characterized in that, in the operation for making magnetic field work relative to the conductive material layer again after it stopped for the effect in the magnetic field of conductive material layer, the contrary of the direction of the magnetic flux line in the magnetic field of conductive material layer and the magnetic flux line in the magnetic field before stopping is acted on again.
6. the manufacturing method of the anisotropic conductive thin plate as described in any one of claim 1 to 5, it is characterized in that, after it stopped for the effect in the magnetic field of conductive material layer, repeat the operation for making magnetic field work relative to the conductive material layer again.
7. the manufacturing method of anisotropic conductive thin plate as claimed in claim 6, which is characterized in that after it stopped for the effect in the magnetic field of conductive material layer, the operation for making magnetic field work relative to the conductive material layer again is carried out 5 times or 5 times or more.
CN 200580004183 2004-02-06 2005-02-01 Process for producing anisotropic conductive sheet Pending CN1918756A (en)

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CN110767348A (en) * 2019-11-12 2020-02-07 业成科技（成都）有限公司 Anisotropic conductive film and manufacturing method thereof
TWI700188B (en) * 2018-04-18 2020-08-01 呂奇恩 Methods of preparing anisotropic conductive sheet and resulting product

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JPH11260518A (en) * 1998-03-13 1999-09-24 Jsr Corp Manufacture of anisotropic conductive sheet and its manufacturing device
JPH11283718A (en) * 1998-03-27 1999-10-15 Jsr Corp Manufacture of and manufacturing device for anisotropic conductive sheet
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CN109867961A (en) * 2019-02-14 2019-06-11 青岛科技大学 A kind of pressure drag composite membrane
CN110767348A (en) * 2019-11-12 2020-02-07 业成科技（成都）有限公司 Anisotropic conductive film and manufacturing method thereof

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