TW200527754A - Process for producing anisotropic conductive sheet - Google Patents

Abstract

A process for producing an anisotropic conductive sheet exhibiting a low electric resistance and stable conductivity even if it is pressurized with a small pressurizing force. The process for producing an anisotropic conductive sheet comprises a step for orienting conductive particles in the thickness direction of a conductive material layer by applying a magnetic field in the thickness direction to the conductive material layer where the conductive particles are contained in a liquid polymer substance forming material becoming an insulating elastic polymer substance by being cured, characterized in that the operation for applying a magnetic field to the conductive material layer is performed again at least once during that step after application of a magnetic field to the conductive material layer is stopped.

Description

200527754 (1) IX. Description of the invention [Technical field to which the invention belongs] The present invention relates to a method for manufacturing anisotropic conductive sheets, and more specifically relates to electric power applied to circuit devices such as integrated circuits formed on wafers. Method for manufacturing anisotropic conductive sheet. [Prior art] The anisotropic conductive elastomer sheet is conductive only in the thickness direction, and has a pressurized conductive conductive portion that is conductive only in the thickness direction when pressed in the thickness direction, because it does not require welding or mechanical embedding. It can be used to achieve tight electrical connection, absorb mechanical shock and strain, and can be connected softly. Using this feature, it has been widely used as circuit devices in fields such as computers, electronic digital clocks, electronic cameras, and computer keyboards. For example, a connector for electrical connection between a printed circuit board, a leadless wafer carrier board, a liquid crystal panel, and the like.

Packages of semiconductor integrated circuit devices such as 1C, MCM, etc. After electrical inspection of circuit devices such as wafers that form integrated circuits, printed circuit boards, etc., the electrodes to be inspected formed on one side of the circuit device under inspection and the circuits formed in the inspection In order to achieve electrical connection, the inspection electrodes on the substrate surface are implemented by sandwiching an anisotropic conductive elastomer sheet between the inspection electrode region of the circuit device and the inspection electrode region of the inspection circuit substrate. Conventionally, various structures of such anisotropic conductive elastomer sheets have been known. For example, Patent Document 1 and the like disclose that anisotropic conductive elasticity obtained by dispersing magnetic conductive particles in an elastomer in a state of being aligned in a thickness direction. 200527754 (2) body sheet (hereinafter referred to as "dispersion type anisotropic conductive sheet"), Patent Document 2 and the like disclose that magnetic conductive particles are unevenly distributed in an elastomer to form a large number of conductive layers extending in the thickness direction. The circuit forming portion and an anisotropic conductive elastomer sheet (hereinafter referred to as a "biased anisotropic conductive sheet") formed by insulating these mutually insulating portions are disclosed in Patent Document 3 and the like, and the surface of the conductive circuit forming portion An anisotropically-type anisotropic conductive sheet having a drop from the insulating portion. φ In these anisotropically conductive elastomer sheets, conductive particles are contained in an elastic polymer material in a state of being aligned in the thickness direction to form conductive particle chains, and conductive circuits are formed by the conductive particle chains. Such an anisotropic conductive elastomer sheet has always been obtained by dispersing magnetic conductive particles in a polymer material forming material which can be cured into an elastic polymer material by applying a magnetic field in the thickness direction of the conductive material layer. Function to orient and align the conductive particles in the conductive material layer in the thickness direction, and secondly, stop the effect of the magnetic field of the conductive material layer * · continue or the side of the magnetic field to harden the conductive material layer Process > However, the conventional method for producing an anisotropic conductive elastomer sheet has the following problems. In order to manufacture anisotropic conductive flakes that are conductive with a small applied pressure, in the step of applying a magnetic field to the conductive material layer, a conductive particle chain is formed in the thickness direction, that is, the direction perpendicular to the surface of the conductive material layer. important. However, in the conductive material layer before the magnetic field, the conductive 200527754 (3) particles exist in a state of being uniformly dispersed in the conductive material layer, and a magnetic field acts in the thickness direction of the conductive material layer, as described in In Fig. 26, the conductive particle P chain is formed not only in the thickness direction of the conductive material layer 80, but also in a direction inclined to the thickness direction. In this state, magnetically stable, each of the conductive particles is subject to magnetic force. Therefore, although the effect of the magnetic field continues, the conductive particles do not move and form chains in the thickness direction. Therefore, in this state, the conductive material layer 80 is hardened, and the resulting anisotropic conductive sheet also has conductive particle chains formed in a direction inclined with the thickness direction, so it is difficult to obtain high conductivity by a small applied pressure. . In the dispersive anisotropic conductive sheet, when the conductive particle chains are formed in a direction inclined to the thickness direction, the high decomposition energy, that is, the necessary electrical insulation between adjacent electrodes is necessary for the electrical connection of the electrodes. High reliability is difficult to achieve. In the manufacturing method of the biased type anisotropic conductive sheet, there are the following problems. In the manufacturing process of the biased type anisotropic conductive sheet, as shown in FIG. 27, on the substrate & 91, a conductive circuit forming portion is formed correspondingly. In the same pattern, a ferromagnetic layer 92 is formed, and a non-magnetic layer 93 is formed in the other regions to form an upper mold 90. On the substrate 96, a ferromagnetic layer 97 is formed in an anti-pattern pattern according to the ferromagnetic layer 92 of the upper mold 90. In other regions, a non-magnetic layer 98 is formed between the lower molds 95 to form a conductive material layer 80 formed by dispersing magnetic conductive particles P in a polymer material-shaped material that can be cured into an elastic polymer material. Next, a pair of electromagnets (® not shown) are arranged above the upper mold 90 and below the lower mold 95 to actuate them, so that the upper mold 90 located on the conductive material layer 80 is -6-

200527754 (4) The portion between the ferromagnetic layer 92 and the ferromagnetic layer 97 of the lower mold 95 acts with a magnetic field having a strength greater than that of the other portions. As a result, a portion where the conductive particles P dispersed in the conductive material layer 80 are located between the ferromagnetic body 9 2 of the upper mold 90 and the ferromagnetic layer 97 of the lower mold 95 is the conductive formation portion. Part of the collection, aligned in the thickness direction. Then, the conductive material layer 80 is hardened in the state. However, in the conductive material layer 80, the conductive particles P existing in the central position between the portions that become adjacent conductive circuit shaped portions may not be aligned due to the magnetic field balance of the conductive particles P. The conductive particles P move and stay, because such conductive particles P are connected to their conductive particles P. As shown in FIG. 28, the ferromagnetic layer 92 of the upper mold 90 corresponds to the phase of the ferromagnetic layer 97 of the lower mold 95. Between adjacent ferromagnetic layers, conductive particles P chains are formed. As a result, it is difficult to obtain an anisotropic conductive sheet in which the insulation required between adjacent conductive portions is ensured. In this way, the smaller the distance between the conductive circuit forming portions becomes, the more significant it becomes. Patent Literature 1 Japanese Patent Laid-Open Sho 5 1 -93 3 93 Patent Literature 2 Japanese Patent Laid-Open Sho 5 3-1 47772 Patent Literature 3 Japanese Laid-Open Sho 6 1 -250906 [Summary of the Invention] The present invention is based on the above The first objective is to provide a method for manufacturing a heteroconductive sheet that can be pressed under a small pressure, has a low resistance, and has stable conductivity. A second object of the present invention is to provide a conductive circuit forming portion having a plurality of conductive circuit forming portions having conductive particles oriented in a layered manner, formed with a shape of 97, and contained in a state in a thickness direction of 200527754 (5), and A method for manufacturing anisotropic conductive sheets that insulate these conductive circuit forming sections from each other, which can be manufactured, is pressurized with a small pressure, has a low resistance 并, and has stable conductivity, even if the distance between conductive circuit forming sections is small. It is a method of anisotropically conductive thin sheets that can obtain the required insulation between adjacent conductive circuit forming portions.

A third object of the present invention is to provide a method for manufacturing anisotropic conductive flakes in which conductive particles are contained in a state of being oriented in the thickness direction, which can be manufactured, pressurized with a small pressure, and has low resistance and low stability. A method of anisotropically conductive sheets having conductivity and high decomposition energy. The method for producing an anisotropic conductive sheet according to the present invention is characterized by including a conductive material layer made of magnetic conductive particles in a liquid polymer material forming material which can be cured to form an insulating elastic polymer material, The step of orienting conductive particles in the thickness direction of the conductive material layer by applying a magnetic field to the thickness direction. In this step, after the magnetic field effect of the conductive material layer is stopped, the conductive material layer is again subjected to The magnetic field operation is performed at least once. The method for producing an anisotropic conductive sheet according to the present invention includes a plurality of conductive circuit forming portions in which magnetic conductive particles in an insulating elastic polymer material are oriented in a thickness direction, and the conductive circuits are formed. The method for producing anisotropic conductive films of insulating portions made of insulating elastic high molecular substances in which the forming portions are insulated from each other, is characterized by including, for a liquid state of the insulating elastic high molecular substances which can be hardened to form an insulating elastic high molecular substance 200527754 (6) High The conductive material layer made of magnetic conductive particles contained in the molecular material forming material acts on the conductive material layer in the thickness direction of the conductive circuit forming part with a magnetic field having a strength greater than that of other parts, so that the conductive particles are aggregated. The step of orienting in the thickness direction of the conductive material layer as a part of the conductive circuit forming portion. In this step, after the magnetic field action of the conductive material layer is stopped, the magnetic field action of the conductive material layer is performed again. The operation is performed at least once. The method for producing an anisotropic conductive sheet according to the present invention is a method for producing an anisotropic conductive sheet in which magnetic conductive particles in an insulating elastic polymer material are contained in a state oriented in a thickness direction, and the method includes For a conductive material layer made of magnetic conductive particles in a liquid polymer material forming material which can be hardened to form an insulating elastic polymer material, a magnetic field acts in the thickness direction to orient the conductive particles to the conductive material. Step in the thickness direction of the conductive material layer, # In this step, after stopping the magnetic field action of the conductive material layer, the magnetic field action is performed on the conductive material layer again at least once. The method for producing an anisotropically conductive sheet according to the present invention includes a plurality of conductive circuit forming portions in which magnetic conductive particles in an insulating elastic polymer material are contained in a state oriented in a thickness direction, and the conductive circuits are formed. A method for manufacturing anisotropic conductive sheets of insulating portions made of insulating elastic high-molecular substances that are insulated from each other, is characterized by preparing to form patterns according to a pattern corresponding to a pattern where a conductive circuit forming portion is to be formed. 9- 200527754 ( 7) Sheets for insulating parts made of insulating elastic polymer material with a plurality of through-holes, including those filled in the through-holes of sheet material for insulating parts, hardened to form insulating elastic polymer materials The conductive material layer composed of magnetic conductive particles in the liquid polymer substance forming material has a magnetic field acting in the thickness direction to orient the conductive particles in the thickness direction of the conductive material layer. Step # In this step, After the magnetic field action of the conductive material layer is stopped, the magnetic field action is performed on the conductive material layer again at least once. In the method for manufacturing an anisotropic conductive sheet of the present invention, after the magnetic field action of the conductive material layer is stopped, the magnetic field magnetic flux acting on the conductive material layer is again applied to the conductive material layer during the magnetic field operation. The line direction is preferably reversed from the direction of the magnetic field flux line before the stop. In the method for manufacturing an anisotropically conductive sheet of the present invention, after the effect of the magnetic field on the conductive material layer is stopped, it is preferable to repeat the operation of applying a magnetic field to the conductive material and the material layer again. In such a manufacturing method, after the effect of the magnetic field on the conductive material layer is stopped, it is preferable to perform the operation with the magnetic field on the conductive material layer 5 times or more. According to the method for manufacturing an anisotropic conductive sheet according to the present invention, once the effect of a magnetic field on the conductive material layer is stopped, in this stopped state, the conductive particles in the conductive material layer are released from the limit of magnetic force. Then, once again, a magnetic field acts on the conductive material layer in the thickness direction. Because of this action, the movement of conductive particles begins again. -10- 200527754 (8) The movement of the conductive particles starts again, and the thickness direction of the conductive material layer is more faithful. Formation of conductive particle chains. In this way, the formation of the conductive particle chain in a direction oblique to the thickness direction can be suppressed, so that an anisotropic conductive sheet having stable conductivity and low electrical resistance even when pressed with a small applied pressure can be manufactured. In addition, in the case of manufacturing a biased anisotropic conductive sheet in which a plurality of conductive circuit forming portions are insulated from each other by insulation, formation of conductive particle chains connecting adjacent conductive circuit forming portions φ can be prevented, and thus conductive can be manufactured. Even if the distance between the circuit-forming portions is small, the anisotropically conductive sheet having practically the required insulation between adjacent conductive-circuit forming portions can be obtained. When manufacturing a dispersive anisotropic conductive sheet, the formation of conductive particle chains in a direction inclined to the thickness direction is suppressed, so that an anisotropic conductive sheet having a high resolution can be produced. [Embodiment]

Hereinafter, embodiments of the present invention will be described in detail. [First method] The first method is a method for manufacturing an anisotropic conductive sheet 10 having a structure as shown in Fig. 1. Anisotropic conductive sheet 0 is a bias-type anisotropic conductive sheet, which is arranged in a pattern corresponding to the pattern of the electrode to be connected, for example, the pattern of the electrode under inspection of the circuit device to be inspected, each extending in the thickness direction. The conductive circuit forming portion 1 1 ′ and an insulating portion 12 that insulates these conductive circuit forming portions 11 from each other are configured. Each conductive circuit forming portion ii is insulated as shown in FIG. 2-200527754 〇) The conductive elastic polymer material E is formed by containing conductive particles P in a state of being aligned in the thickness direction, and is pressed in the thickness direction. That is, the conductive circuit is formed by the conductive particle P chain in the thickness direction. As shown in the figure, each of the conductive circuit forming portions 11 is formed so as to protrude from both surfaces of the insulating portion 12. On the other hand, the insulating portion 12 is made of an insulating elastic polymer material, which contains no or almost no conductive particles P, and has no conductivity in either the thickness direction or the surface direction. Also, this example is different. In the conductive sheet, a frame-shaped frame plate 15 is integrally provided on a peripheral portion of the insulating portion 12. Here, the content ratio of the conductive particles P in the conductive circuit forming portion Π is a volume fraction of 10 to 60%, preferably 15 to 50%. If the ratio is less than 10%, the conductive circuit forming portion 11 may not have a sufficiently small resistance. When the ratio exceeds 60%, the resulting conductive circuit forming portion 11 is too fragile and cannot be used as the elasticity required for the conductive circuit forming portion 11. The distance between the conductive circuit forming portions 11 is, for example, 60 to 5,000 μm. When the anisotropic conductive sheet 10 having the distance # 200 μm or less is manufactured, the manufacturing method of the present invention is extremely effective. In the first method for manufacturing such an anisotropic conductive sheet 10, a mold as shown in FIG. 3 is used. For example, the mold in FIG. 3 is specifically composed of the upper mold 50 and the lower mold 55, and the forming surfaces are opposite to each other. The forming surface of the upper mold 50 (the lower surface of FIG. 3) and the forming surface of the lower mold 55 ( Holes are formed between the tops of Figure 3. The upper mold 50 is located under the ferromagnetic substrate 51, and is formed according to the anisotropic conductive sheet 10, the conductive circuit forming section 11, and the configuration pattern of the pattern is formed. 12- 200527754 (10) Ferromagnetic layer 52 A non-magnetic layer 53 having a thickness greater than that of the ferromagnetic layer 52 is formed in a place other than the ferromagnetic layer 52. As a result, the ferromagnetic layer 52 on the molding surface of the upper mold 50 is formed with a recess. In the lower mold 55, on the ferromagnetic substrate 56, a ferromagnetic layer 5 7 is formed on the ferromagnetic substrate 56 according to the same pattern as the layout pattern of the conductive circuit forming portion 11 of the anisotropic conductive sheet 10 manufactured. The ferromagnetic layer A non-magnetic layer 5 8 having a thickness greater than the ferromagnetic layer 5 7 is formed at a place other than 5 7, so that a # recess is formed in the ferromagnetic layer 5 7 where the ferromagnetic layer 5 7 is formed on the forming surface of the lower mold 5 5. Ferromagnetic metals such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, and cobalt can be used as a constituent material of each of the ferromagnetic substrates 5 1 and 5 6 of 50 and the lower mold 5 5. The thickness of the ferromagnetic substrates 51 and 56 is preferably 0.1 to 50 mm, and the surface is preferably smooth, chemically degreased, and mechanically honed. As the constituent material of each of the ferromagnetic layers 52 and 57 of the upper mold 50 and the lower mold 55, ferromagnetic metals such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, and cobalt can be used. The thickness of the ferromagnetic layers 52 and 57 is preferably 10 μm or more. When the thickness is less than 10 μm, it is difficult for the conductive material layer formed in the mold to have a magnetic field with a sufficient intensity distribution. As a result, it is difficult to make conductive particles in the conductive material layer as a portion where the conductive circuit is formed. High-density aggregates sometimes do not have thin films with good anisotropic conductivity. The non-magnetic layers 5 3, 5 and 8 of the upper mold 50 and the lower mold can be made of non-magnetic metals such as copper, heat-resistant polymer materials, and the like, because the non-magnetic layers can be easily formed by photolithography 5 3 5-8, it is better to use radiation-cured polymer materials. The material can be, for example, acrylic-based dry film light-13- 200527754 (11), epoxy-based liquid photoresist, and polyimide-based liquid. Like photoresist. The thickness of the nonmagnetic layer 5 3, 5 8 is set in accordance with the thickness of the ferromagnetic layer 5 2, 5 7 and the protruding height of the conductive circuit forming portion 11 of the target anisotropic conductive sheet 10. Therefore, the first method is a step of forming a conductive and electrically conductive material layer in a mold by forming magnetic polymer particles in a liquid polymer material forming material which can be cured to form an insulating elastic polymer material (a- 1) For the above-mentioned conductive material layer, a magnetic field having a strength greater than that of other portions acts on the thickness direction of the conductive material layer at the portion that becomes the conductive circuit forming portion, and the conductive particles are collected at the portion that becomes the conductive circuit forming portion. Step (b-1) oriented in the thickness direction of the conductive material layer, and the above-mentioned step of hardening the conductive material layer after stopping the magnetic field effect of the conductive material layer or continuing the magnetic field effect on one side (

c-1) Production of an anisotropically conductive sheet 10. Each step is described in detail below. Step (a -1) · In step (a -1), first, magnetic conductive particles are dispersed in a liquid polymer material forming material which can be hardened to form an insulating elastic high molecular material to prepare a conductive material. Various materials for forming local molecular substances for modulating conductive materials are available. Specific examples include silicone rubber, polybutadiene rubber, natural rubber, polyisoflat rubber, styrene-butadiene copolymer rubber, and acrylonitrile- Conjugated diene rubbers such as butadiene copolymer rubber and hydrogenated products thereof, styrene-butadiene_-14-200527754 (12) Diene block copolymer rubber, styrene-isoflat block copolymer, etc. Block copolymer rubber and hydrogenated products thereof, chlorinated rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, soft liquid epoxy rubber Wait. Among these, a silicone rubber is preferred from the viewpoints of durability, formability, and electrical characteristics. The silicone is preferably a crosslinked or condensed liquid silicone rubber. # Liquid silicone rubber can be any of condensation type, addition molding, vinyl group or hydroxyl group. Specifically, there are dimethyl polyoxo rubber, methyl ethoxylate rubber, methyl phenyl diethylene polysiloxane, and the like. Addition liquid silicone rubber is hardened by the reaction of the combination of vinyl and Si-H. It can be a liquid type (one-component type) formed by the polysiloxane containing both vinyl and Si-H. And a two-component type (two-component type) formed by a polysiloxane containing a vinyl group and a polysiloxane containing a Si-H bond, and the addition of a two-component type liquid silicone rubber is good. • Among these, vinyl-containing liquid silicone rubber (polyvinyl-containing polydimethylsiloxane) is usually made of dimethyldichlorosilane or dimethyldialkoxysilane. Hydrolysis and condensation reactions in the presence of vinyl chlorosilane or dimethylvinyl alkoxysilane are obtained by, for example, repeating continuous dissolution-precipitation. Liquid polysilicone rubber with vinyl at both ends is anionic polymerization of cyclic siloxanes such as octamethylcyclotetrasiloxane in the presence of a catalyst, using a polymerization stopper such as dimethyldiethylene silicon The oxane is obtained by appropriately selecting other reaction conditions (for example, the amount of ring sand oxygen house and the amount of polymerization stopper). -15- 200527754 (13) Here, as the catalyst for the anionic polymerization, alkalis such as tetramethylammonium hydroxide and n-butylhydroxide or silanolate solutions thereof can be used. The reaction temperature is, for example, 80 to 13 ° C. Such a polydimethylsiloxane containing a vinyl group is preferably based on its molecular weight Mw (referring to the weight average molecular weight in terms of standard polystyrene. The same applies hereinafter). From the viewpoint of the heat resistance of the obtained anisotropic conductive sheet 10, it is based on the molecular weight distribution index (referring to the ratio Mw / Mn of the standard polystyrene equivalent weight φ average molecular weight Mw and the standard polystyrene conversion number average molecular weight Mη). The same applies hereinafter). Hydroxyl-containing liquid silicone rubber (hydroxyl-containing polydimethylsiloxane) is usually made of dimethyldichlorosilane or dimethyldialkoxysilane, and dimethylhydroxychlorosilane or dimethyl The hydrolysis and condensation reactions in the presence of hydroalkoxysilane are obtained by, for example, repeating continuous dissolution-precipitation. It is also possible to make anionic polymerization of cyclic siloxane in the presence of a catalyst, using dimethylhydrochlorosilane or dimethylhydroalkoxysilane as the polymerization stopper. • Other reaction conditions (for example, cyclic silicon are appropriately selected) The amount of oxane and the amount of polymerization stopper). Here, as the catalyst for the anionic polymerization, alkalis such as tetramethylammonium hydroxide and n-butylammonium hydroxide, or silanol solutions of these can be used. The reaction temperature is, for example, 80 to 130 ° C. Such a polydimethylsiloxane containing a hydroxyl group is preferably one having a molecular weight Mw of 10,000 to 40,000. From the viewpoint of the heat resistance of the obtained anisotropic conductive sheet 10, the molecular weight distribution index of 2 or less is preferred. In the present invention, either one of the above-mentioned vinyl-containing polydimethylsiloxane and a hydroxyl-containing polydimethylsiloxane can be used, or both can be used. -16- 200527754 (14) When manufacturing anisotropic conductive sheet for probe test or aging test of circuit device 10, the liquid silicone rubber is permanently strained at a compression of 150 ° C with its hardened material at Those below 10% are better, those below 8% are better, those below 6% are even better. When the compressive permanent strain exceeds 10%, when the obtained anisotropic conductive sheet 10 is repeatedly used many times or when it is repeatedly used in a high-temperature environment, the conductive circuit forming portion 11 is liable to generate permanent strain, so the conductive circuit forming portion The chain of 11 conductive particles is disrupted, and as a result, it is difficult to maintain the required conductivity. The compressive permanent strain of the liquid silicone hardened material can be measured according to the method of JIS K 6249. Liquid silicone is based on the hardness of its hardened material at 2 3 ° C. A hardness is preferably 10 ~ 60, more preferably 15 ~ 60, especially 20 ~ 60. If the hardness of the durometer A is less than 10, the insulating portion 12 that insulates the conductive circuit forming portions 11 from each other is excessively strained when pressurized, and the insulation required between the conductive circuit forming portions 11 may be difficult to maintain. When the hardness of the durometer A exceeds 60, it is necessary to apply a considerable load to the appropriate strain in order to impart an appropriate strain to the conductive circuit forming section 11, so it is easy to cause deformation and damage of the inspection object. Here, the hardness A of the liquid silicone hardened material can be measured according to the method of JIS K 6249. It's better to use liquid silicone rubber with its hardened material at 2 3 t: the tear strength is 8kN / m or more, i0kN / m or more is better, i5kN / m is better, 20kN / m The above is particularly preferred. If the tear strength is less than 8 kN / in, when the anisotropic conductive sheet 10 is excessively strained, the durability tends to decrease.

Here, the tear strength of the liquid silicone rubber hardened product can be measured according to the method of J 丨 S K -17- 200527754 (15) 6249. The liquid silicone rubber preferably has a viscosity of 23t at 100 ~ 1,250Pa · s. 150 ~ 800Pa · s is more preferable, and 250 ~ 500Pa · s is more preferable. When the viscosity is less than 100 Pa · s, the obtained conductive material and conductive particles are easy to settle in the liquid silicone rubber, and must not have good storage stability, and in the step (b-1) described later, When the conductive material layer acts on the thickness direction with a magnetic field, the conductive particles are not aligned in the thickness direction, and it is difficult to form a conductive particle chain in a uniform state. When the viscosity exceeds 1,250 Pa · s, it is difficult to form a conductive material layer in the mold because the viscosity of the obtained conductive material is too high. In addition, for the conductive material layer, a magnetic field acts on the thickness direction, and the conductive particles are not formed. Since it moves sufficiently, it is difficult for the conductive particles to be aligned in the thickness direction. Here, the viscosity of the liquid silicone rubber can be measured with a B-type viscometer. The polymer material forming material may contain a hardening catalyst for hardening the polymer material forming material. Such hardening catalysts can be used organic peroxides, fatty acid azo compounds, hydrosilylation catalysts and so on. Specific examples of the organic peroxide used as the hardening catalyst include benzamidine peroxide, bisbicyclic benzamidine peroxide, diammonium peroxide, and di (tertiary butyl) peroxide. Specific examples of the fatty acid azo compound used as the curing catalyst include azobisisobutyronitrile and the like. Specific examples of the catalyst that can be used as a hydrosilylation reaction include platinum chloride and its salts, platinum-unsaturated siloxane complex, ethylene siloxane, and -18-200527754 (16) Platinum complexes, platinum and 1,3_divinyltetramethyldisilazane complexes, diorganophosphine or phosphite complexes with platinum complexes, acetoacetate platinum chelates , Complexes such as cyclic diene and platinum. The amount of the hardening catalyst used is appropriately selected in consideration of the type of the polymer material forming material, the type of the hardening catalyst, and other hardening treatment conditions, and is usually 3 to 5 parts by weight relative to the molecular material forming material. The polymer material-forming material may also be one containing ordinary silica powder, colloidal silica, aerogel silica, and alumina. The shake resistance of the conductive material obtained by containing such an inorganic filler is ensured, the viscosity is high, and the dispersion stability of the conductive particles P is improved, and at the same time, the strength of the anisotropic conductive sheet 10 obtained by the hardening process is increased. There is no particular limitation on the amount of such inorganic aggregates to be used, but in the case of large-scale use, in the step (b -1) described later, the movement of the conductive particles P in the magnetic field is greatly hindered, which is not preferable. The conductive particles used to modulate conductive materials are magnetic. Specific examples # ® There are particles of magnetic metals such as iron, nickel, and cobalt, or alloy particles of these. Particles of these metals, or these particles are used as core particles, The surface of the core particle is plated with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles, glass particles, or other inorganic material particles or polymer particles as the core particle, and the surface of the core particle is plated with A conductive magnetic body such as nickel or cobalt, or a core particle coated with both a conductive magnetic body and a conductive metal. Among these, it is preferable that nickel particles are used as the core particles, and the surface thereof is plated with a metal having good conductivity such as gold or silver. The method of coating the surface of the core particles with a conductive metal is not particularly limited, and may be, for example, electroless plating. For conductive particles, use the surface of the core particle with conductive metal coating on the surface. From the viewpoint of good conductivity, the conductive metal coating rate on the particle surface (the ratio of the conductive metal coating area to the surface area of the core particle) is 40%. The above is better, more than 45% is more preferable, and more preferably 47 to 95%. The coating amount of the conductive metal is preferably 2.5 to 50% by weight of the core particles, more preferably 3 to 30% by weight, even more preferably 3.5 to 25% by weight, and even more preferably 4 to 20% by weight. When the conductive metal is coated with gold, the coating amount is preferably 3 to 30% by weight of the core particles, more preferably 3.5 to 25% by weight, and even more preferably 4 to 20% by weight. When the conductive metal is coated with silver, the coating amount is preferably 3 to 30% by weight of the core particles, more preferably 4 to 25% by weight, even more preferably 5 to 23% by weight, and even more preferably 6 to 20% by weight. The particle size of the conductive particles is preferably from 1 to 500 μm, more preferably from 2 to 3 00 μm, even more preferably from 3 to 200 μm, and even more preferably from 5 to 150 μm. The particle size distribution (Dw / Dn) of the conductive particles is preferably from 1 to 10, and more preferably from 1 to 7, 1 to 5, and even more preferably from 1 to 4. Using conductive particles satisfying such conditions, the obtained anisotropic conductive sheet 10 is easily deformed under pressure, and sufficient electricity can be obtained between the conductive particles P of the conductive circuit forming portion 11 of the anisotropic conductive sheet 10. contact. The shape of the conductive particles is not particularly limited, but it is preferable that the particles are easily dispersed in a high molecular material forming material, such as those having a spherical shape, a star shape, or agglomerates of these secondary particles. The moisture content of the conductive particles is preferably 5% or less, more preferably 3% or less, and 2% or less, and more preferably 1% or less. Using conductive particles that satisfy such conditions -20- 200527754 (18), in the step (c-1) described later, when the conductive material layer is hardened, the generation of bubbles in the conductive material layer is prevented or suppressed. Such a conductive material is applied, for example, by a screen printing method to one or both of the molding surface of the upper mold 50 and the molding surface of the lower mold 55 in the mold of FIG. 3, and then, as shown in FIG. 4, On the lower die 5 5 coated with conductive material, the lower spacer 59, the frame plate 15, the upper spacer 54 and the upper die 5 5 coated with the conductive material are sequentially stacked from the bottom to the die. In the cavity between the upper mold 50 and the lower mold 55, a conductive material layer 10A is formed in which the polymer material forming material contains conductive particles P. In the conductive material layer 10A, as shown in FIG. 5, the conductive particles p are dispersed in the conductive material layer 10a.

In the above, the materials constituting the frame plate 15 can be made of various materials such as metal materials, ceramic materials, and resin materials. Specific examples include iron, copper, nickel, chromium, cobalt, magnesium, manganese, molybdenum, indium, lead, palladium, titanium, Tungsten, aluminum, gold, uranium, silver and other metals or combinations of two or more alloys or alloy steels and other metal materials, silicon nitride, silicon carbide, alumina and other ceramic materials, aromatic polyamide non-woven reinforced ring Resin materials such as oxyresin, aromatic polyimide non-woven reinforced polyimide resin, aromatic non-woven reinforced dicisbutene diimide acryl resin, and other resin materials. When manufacturing the anisotropic conductive sheet 10 for aging test, it is preferable that the material constituting the frame plate 15 is equal to or similar to the coefficient of linear thermal expansion of the material constituting the wafer to be inspected. Specifically, when the material constituting the wafer is silicon, a linear thermal expansion coefficient of 1.5 × 1 (Γ4 / K or less, especially 3 xl (Γ6 to 8x1 (Γ6 / K) is preferred, and specific examples include Invar and the like. -21-200527754 (19) Metal materials such as tile-type alloys, ailing tile alloys such as Ailing tile, super-invar, Kovar, 42 alloys, aromatic polyamide non-woven reinforced organic resin materials. Frame frame 15 The thickness is, for example, 0.03 to 1 mm, and 0.05 to 0.25 mm is preferred. Step (b -1) · In step (b-1), the conductive material Φ material layer 1 formed in step (a-1) is 〇A A magnetic field having a strength greater than that of the other portion acts on the conductive material layer 10A in the thickness of the portion that becomes the conductive circuit forming portion, and the conductive particles are assembled on the portion that becomes the conductive circuit forming portion, aligned and oriented on the conductive layer. The thickness direction of the material layer 10A. Specifically, as shown in FIG. 6, an electromagnet device 60 including an upper electromagnet 61 and a lower electromagnet 65, and magnetic poles 62 and 66 arranged opposite to each other is prepared. 60 between the magnetic pole 62 of the upper electromagnet 6 1 and the magnetic pole 6 6 of the lower electromagnet 6 5 A mold in which a conductive material layer 10A is formed is arranged in the cavity. Next, the electromagnet device is actuated, and the strength between the ferromagnetic layer 52 and the ferromagnetic layer 57 corresponding to the lower mold 55 is higher than that of the upper mold 50. The magnetic field between the non-magnetic layer 53 of the mold 50 and the non-magnetic layer 58 of the lower mold 55. That is, the conductive material layer 10A has a strength greater than that of the conductive circuit forming portion. The magnetic field acts to cause the conductive particles P dispersed in the conductive material layer 10 A to gather at the portion that becomes the conductive circuit forming portion, and align in the thickness direction of the conductive material layer 10 A. Here, the effect The magnetic field strength of 10A on the conductive material layer is preferably as large as -22-22 200527754 (20). Both 0.02 to 2.5 Tesla are preferred. This step (b-1) is to prevent the conductive material layer 10A from being promoted. It is better to perform the curing under room temperature, for example, at room temperature. Then, in step (b-1) of the first method, the magnetic field acting on the conductive material layer 10A is stopped once, and then sealed again. Operation of a magnetic field on a conductive material layer 10 A (hereinafter referred to as this As a "re-operation operation".) At least once. This re-operation operation is specifically to stop the operation of the electromagnetic 0 iron device 60, and then the electro-magnet device 60 is operated again. The time from when the magnetic field effect of the conductive material layer 10 A is stopped until the magnetic field is applied to the conductive material layer 10 A again (hereinafter referred to as the "acting stop time") is considered the conductive material layer 1 The viscosity of 〇A, the ratio of conductive particles in the conductive material layer 10A, the average particle diameter of the conductive particles, and the like are appropriately set to be preferably 200 seconds or less, and more preferably 60 seconds or less. φ When the operation stop time is too long, the time required for step (b-1) is too long, and the production efficiency of the entire process is extremely low. At the same time, the hardening of the liquid polymer-forming material starts, and the conductive material layer 10 A The viscosity changes, and the result may not be perfect. During the re-operation operation, the magnetic field of the conductive material layer 10A is applied again, and the direction of the magnetic flux line may be the same direction as the magnetic flux line of the magnetic field before stopping, and may be opposite to the magnetic flux line of the magnetic field before stopping. The influence of the residual magnetic field is small, and the magnetic flux line of the magnetic field before the stop is preferably reversed. When the magnetic field in the direction opposite to the direction of the magnetic flux line of the magnetic field line before stopping is used as -23- 200527754 (21), the intensity of the magnetic field is the same as the strength of the magnetic field before stopping. It is sufficient to change the polarity of the magnetic pole of the upper electromagnet 61 of the electromagnet device 60 and the polarity of the magnetic pole 66 of the lower electromagnet 65 to the field effect in the direction opposite to the magnetic flux line of the magnetic field before the stop. Specifically, the conductive material layer 10 A initially acts as a magnetic field. For example, the condition that the magnetic pole 62 of the upper electromagnet 6 1 is N pole and the magnetic pole 66 of the lower electromagnetic # 65 is S pole is an electromagnet. The device 60 operates.

In the state, the ferromagnetic layer 52 of the upper die 50 has N poles, and the lower die 55 ferromagnetic layer 57 has the S pole function. As shown in FIG. 7, the direction of the magnetic flux line acting on the magnetic field of the conductive material layer 10 A The direction from the ferromagnetic layer 5 2 of the upper mold 50 to the corresponding ferromagnetic layer 57 of the lower mold 5 5 is from the top to the bottom. In this way, the operation of the electromagnet device 60 is stopped after a specific time has elapsed while the magnetic field is applied to the conductive material 10A. Then, under the condition that the magnetic pole 62 of the upper electromagnet 61 is the S pole, and the magnetic pole 66 of the lower electromagnet 6 5 is the N pole, the electromagnet is installed again, and 60 is operated. In this state, the ferromagnetic layer 5 2 of the upper mold 50 has S, and the ferromagnetic layer 57 of the lower mold 5 5 has an N-pole function. As shown in FIG. 8, the magnetic field is applied to the magnetic field of the conductive material layer 1 0A. The line direction is the direction from the ferromagnetic layer 57 of the lower mold toward the ferromagnetic layer 5 2 corresponding to the upper mold 50, that is, the direction from the bottom to the top. In this way, when the operation of the electromagnet device 60 is stopped, a residual fe field is generated, and the electro-fe iron device 60 is deactivated when it is operated again, so the influence of the residual magnetic field is reduced. At 62 o’clock in Jiaci, the material of the iron is also placed on the side with 55 to make it -24- 200527754 (22) Operate the operation at least once in step (b-1), but repeat it as Specifically, the number of re-operation operations is preferably 5 or more times, and more preferably 10 to 5,000 times. If the number of re-operation operations is too small, there is less chance that each conductive particle P in the conductive material layer 10A is released from the restriction of magnetic force. Therefore, there is less chance for the movement of the conductive particle P to start again. In the thickness direction of the material layer 10A, conductive particle P chains are formed in a more faithful direction. As a result, in the obtained anisotropic conductive sheet, it is difficult to reliably prevent the formation of conductive particle p chains connecting adjacent conductive circuit forming portions. . In this way, when the reactivation operation is repeated, the time from when the magnetic field is applied to the conductive material layer to when the magnetic field is stopped from acting on the conductive material layer (hereinafter referred to as the "reactivation time") is considered the conductive material layer. The viscosity of 10 A, the ratio of conductive particles in the conductive material layer 10A, and the average particle diameter of the conductive particles are appropriately set, and it is preferably 10 to 300 seconds, and more preferably 10 to 200 seconds. # If the re-acting time is too short, a high-intensity magnetic field is not formed. Therefore, the conductive particles P in the conductive material layer 1 A are insufficiently moved. As a result, it is difficult to be more faithful to the thickness direction of the conductive material layer 10 A. Orientation forms a conductive particle P chain. When the re-acting time is too long, the time required for step (b-1) is too long, and the overall production efficiency of the process is extremely low. At the same time, the liquid polymer material forming material starts to harden, and the viscosity of the conductive material layer 10A starts. Changes, as a result, may not be fully effective. As above, formed in step (b-1), as shown in FIG. 9, between the ferromagnetic layer 5 2 of the upper mold 5 0 and the ferromagnetic layer 5 7 corresponding to the lower mold 5 5 -25- 200527754 (23 ), That is, the portion that becomes the conductive circuit forming portion is a dense conductive material layer 10 A containing conductive particles P oriented in a thickness direction. Step (c-1): In step (c-1), the conductive material layer 10A containing the conductive particles P oriented in the thickness direction is partially densified as the conductive circuit forming portion, and is hardened. The hardening treatment of the conductive material layer 10 A can be performed after the magnetic field is applied to the φ conductive material layer 10A, or it can be performed on the side when the magnetic field is applied to the conductive material layer 10A, and thereafter Those are better. The hardening treatment of the conductive material layer 10 A varies depending on the material used, but it is usually a heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type of the polymer material forming material constituting the conductive material layer 10 A and the like. Then, after the hardening treatment of the conductive material layer 10A is completed, for example, it is cooled down to room temperature and taken out from the mold to obtain the anisotropic conductive sheet 10 of Figs. 1 and 2. According to the first method described above, the magnetic field effect on the conductive material layer 10 A is once stopped, and in this stopped state, all the conductive particles P in the conductive material layer 10 A are released from the magnetic force. Then, for the conductive material layer 10 A, a magnetic field is applied to the thickness direction again. Due to the triggering of this action, the movement of the conductive particle p starts again. Therefore, the thickness direction of the conductive material layer 10 A is formed in a more faithful direction. Conductive particle P chain. In this way, the formation of the conductive particle P chain can be suppressed in a direction inclined to the thickness direction, so it is pressurized with a small applied pressure, and the resistance 値 is also low and stable -26- 200527754 (24) Conductivity The formation of conductive particle P chains between adjacent conductive circuit forming portions can be prevented, so it can be manufactured even if the distance between the conductive circuit forming portions is small, and the required insulation between the adjacent conductive circuit forming portions 11 is indeed possible. The obtained anisotropic conductive sheet 10 was obtained. [Second method] The second method is a manufacturing method of the anisotropic conductive sheet 20 having a structure as shown in Fig. 10. The anisotropic conductive sheet 20 is a dispersion type anisotropic conductive sheet, which is also enlarged as shown in FIG. Π. In the insulating elastic polymer material E, the conductive particles P are aligned in the thickness direction to form the conductive particle p chain. State, and the state in which the conductive particle P chains are uniformly distributed in the plane direction includes that any place on the surface is pressurized in the thickness direction, so that the conductive particle P chains in the thickness direction of the space form a conductive circuit. Here, the content ratio of the conductive particles p in the anisotropically conductive sheet 20 is preferably a volume fraction of 10 to 60%, and more preferably 15 to 50%. When the ratio is less than 10%, the conductive circuit forming portion 11 must not have a sufficiently small resistance. When the ratio exceeds 60%, the obtained anisotropic conductive sheet 20 is easily fragile, or it must not be used as the necessary elasticity of the anisotropic conductive sheet 20. The second method is a step (a-2) of forming a conductive material layer containing magnetic conductive particles in a liquid polymer material forming material which can be cured to become an insulating elastic polymer material on an appropriate support. For the above-mentioned conductive material layer, a magnetic field acts on its thickness direction,-27- 200527754 (25) the step (b-2) of orienting conductive particles in the thickness direction of the conductive material layer, and for the above-mentioned conductivity After the magnetic field action of the material layer is stopped or the magnetic field action is continued on one side, the hardening treatment step (c-2) of the conductive material layer is performed to manufacture the anisotropically conductive sheet 20. Each step is described in detail below. Step (a-2): # In step (a-2), first, as in step (a-1) of the first method, the magnetic conductive particles are dispersed in a liquid state which can be hardened to become an insulating elastic polymer material. Among the polymer material forming materials, a conductive material is prepared. Then, as shown in FIG. 12, a forming member 25 formed of one of the support members 26, the other support member 27, and the spacer 28 is prepared, and the other support member 27 of the forming member 25 is coated by, for example, screen printing. A conductive material is applied, and then one of the supports 26 is laminated with the spacer 28 interposed therebetween. As shown in FIG. 13, a conductive material layer 20A is formed between one of the supports 26 and the other support 27. • ® In the conductive material layer 20A, as shown in FIG. 14, the conductive particles P are dispersed in the conductive material layer 20 A. Step (b-2): In step (b-2), the conductive material layer 20A 'formed in step (a_2) is applied with a magnetic field to its thickness direction to orient the conductive particles to the conductive material layer 2 0 A thickness direction. Specifically, as shown in FIG. 5, an electromagnet device 60 ′ including an upper electromagnet 61 and a lower electromagnet 65 is prepared, and the magnetic poles 62 and 66 of the electromagnet device 60 ′ are arranged facing each other on the upper side of the electromagnet device 60. Between the magnetic poles 62 -28-200527754 (26) of the iron 61 and the magnetic poles 66 of the lower electromagnet 65, a forming member 25 having a conductive material layer 20 A formed is arranged. Next, the electromagnet device 60 is actuated to apply a magnetic field to the thickness direction of the conductive material layer 20A, so that the conductive particles P dispersed in the conductive material layer 20A are aligned to the conductive material layer 20A. Thickness direction. The magnetic field strength of 20 A acting on the conductive material layer is preferably as large as 0.02 to 2.5 Tesla. # This step (b-2) is preferably performed under conditions that do not promote hardening of the conductive material layer 20A, for example, at room temperature. Further, in step (b-2) of the second method, after the operation of the electromagnet device 60 is stopped, the electromagnet device 60 is operated again to perform the re-operation operation. In this re-activation operation, the magnetic field of the conductive material layer 20 A again acts in a direction that is the same as that of the magnetic flux line of the magnetic field before the stop, or in the opposite direction to the magnetic flux line of the magnetic field before the stop. Based on the shadow of the residual magnetic field ^ # Responsiveness is better in the opposite direction. When the magnetic field is in the direction of the magnetic flux line and the magnetic field before the stop, the strength of the magnetic field is preferably the same as that of the magnetic field before the stop. The re-operation operation may be performed at least once in step (b_2), and it is better to repeat the operation. Specifically, the number of re-operation operations is preferably more than 5 times, and more preferably 10 to 500 times. The specific conditions of the reactivation operation and the specific conditions when the reactivation operation is repeated are the same as those in the first method step (b-1). As described above, in step (b-2), as shown in FIG. 16, conductive particles are formed. -29- 200527754 (27) P is a conductive material layer 20A contained in a state of being oriented in the thickness direction. Step (c-2): In step (c-2), the conductive material layer 20A contained in the state where the conductive particles p are oriented in the thickness direction is subjected to a hardening treatment. The hardening treatment of the conductive material layer 20 A may be performed after the magnetic field action of the conductive material layer 20 A is stopped, or the conductive material layer 20A may be subjected to a magnetic field effect, the latter being preferred. The hardening treatment of the φ conductive material layer 20 A differs depending on the material used, and is usually a heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type of the polymer material forming material constituting the conductive material layer 20 A. After the hardening treatment of the conductive material layer 20A is completed, for example, it is cooled to room temperature and taken out from the molded member, the anisotropic conductive sheet 20 shown in Figs. 10 and 11 can be obtained according to the second method as described above. The magnetic field • Lu action of the material layer 2 oa once stopped, and in this stopped state, all of the conductive material layer 20 A • The conductive particles p were released from the restriction of the magnetic force. Then, for the conductive material layer 20 A, a magnetic field is applied again in the thickness direction. After the action is triggered, the movement of the conductive particles P starts again, and the thickness direction of the conductive material layer 20 A is formed in a more faithful direction. Conductive particle P chain. In this way, the formation of p-chains of conductive particles in a direction inclined to the thickness direction can be suppressed, so that it can be reliably manufactured with a small pressure, a low resistance 値, and stable conductivity, and 'anisotropic conductivity with high decomposition energy. Sexual sheet 2 0-30-200527754 (28) [Third method] The third method is a method for manufacturing anisotropic 30 having a structure as shown in FIG. 17. The anisotropic conductive sheet 3 0 is a bias type anisotropic conductive sheet that is arranged in a pattern corresponding to a pattern of an electrode to be connected, for example, an electrode of a circuit device to be inspected, each extending in the thickness direction. 31, and These conductive circuit forming portions 31 are constituted by mutual portions 32. Each of the conductive circuit forming portions 31 is enlarged as follows: The conductive elastic particles P in the insulating elastic polymer material E are contained in a state of an arrangement direction, and are pressed in the thickness direction to form electrical conduction with the conductive particles P chains. road. On the other hand, it is made of an insulating elastic polymer material, and it does not contain any conductivity. It has no conductivity in the thickness direction and the surface direction. In the anisotropy 30 of this example, each of the conductive circuit forming portions 31 is formed protruding from the upper surface of the insulating portion 3 2. ^ The content of the conductive particles P in the conductive circuit forming portion 31 is preferably 10 to 60%, and 15 to 50% is more preferable. The ratio must not be sufficiently small, and the conductive circuit forming portion 31 can be formed. And this ratio makes the resulting conductive circuit forming portion 31 easily brittle, or the elasticity required for forming the portion 11 cannot be made. The third method is to prepare a plurality of through holes corresponding to the pattern of the conductive circuit forming portion to be formed. The conductive thin sheet made of an insulating elastic polymer material is insulated by a plurality of conductive insulation materials to be inspected. Figure 18 is a row of 32 series particles P oriented thicker than the thickness in the thickness direction. One side of the conductive sheet (the ratio in the figure is based on a body plug of 10% or more than 60%. It is a conductive pattern. The formed insulation-31-200527754 (29) sheet is formed into a liquid polymer material which is filled in each through hole of the sheet for the insulation part and is cured to become an insulating elastic polymer material. In the step (a-3) of the conductive material layer made of conductive particles in the material, a magnetic field is applied to the thickness direction of the conductive material layer, and the conductive particles are oriented in the thickness direction of the conductive material layer. Step (b-3), and after the magnetic field action of the conductive material layer is stopped or the magnetic field action is continued, the step (c-3) of the hardening treatment of the conductive material layer is used to produce a different material. The conductive sheet 30. Each step will be described in detail below. Step (a-3): In step (a-3), first, as shown in FIG. 19, a diagram corresponding to a pattern where a conductive circuit forming portion 31 should be formed is manufactured. Forming a plurality of through holes 3 1 Η, a sheet for an insulating portion made of an insulating elastic polymer material-· 32A. ^ Specifically, as shown in FIG. 20, a sheet made of an insulating elastic polymer material is prepared. A body 32B is provided on the sheet 32B with a laser mask 35 formed with a plurality of openings 36 corresponding to a pattern of a conductive pattern forming portion. The sheet 32B passes through the laser. The opening 3 6 of the radiation mask 35 is subjected to laser processing. As shown in FIG. 21, an insulating portion having a plurality of through holes 3 1 依 may be formed according to a pattern corresponding to the pattern of the conductive circuit forming portion to be formed. Use a sheet 32A. Similarly to step (a-1) of the first method, disperse particles in a liquid polymer material forming material which can be made into an insulating -32- 200527754 (30) elastic elastic polymer material, and be prepared. Conductive material For lasers placed on the sheet 3 2 A for insulating parts ], A conductive material is applied by, for example, a screen printing method, and the 22nd conductive material layer is formed in each of the through holes of the sheet 3 2 for the insulating portion and each of the openings 3 6 of the laser shield 3 5. In this way, a body 32A for the insulating portion, a laser shield 35 disposed on one side thereof, and each of the through holes 31H and 36 of the laser shield 35 formed in the # body sheet 32 are obtained. Intermediate composite body 3 4 formed by conductive material layer 3 1 A. Conductive material layer 3 1A of intermediate composite body 3 4, as shown in FIG. 2 3, conductive elements P are dispersed in the conductive material layer 3 1 The state in A. Step (b-3): In step (b-3), for the conductive material layer 3 1 A formed in step (a-3), a magnetic field is applied to the thickness direction of the conductive material layer 3 A to make conductive particles in the conductive material layer. 3 1 A thickness direction. Φ Specifically, as shown in FIG. 24, an electromagnet device having an upper electromagnet 6 1 side electromagnet 65 and magnetic poles 62 and 66 arranged opposite to each other is prepared on the electromagnet device 60 and a magnetic pole 6 1 of the side electromagnet 6 1 is provided. Between the lower pole 65 and the magnetic pole 66 of the lower magnet 65, an intermediate complex 34 is disposed. Next, the magnet device 60 operates to apply a magnetic field to each of the conductive materials 3 1 A of the intermediate composite 34 in the thickness direction, thereby aligning the conductive particles P dispersed in the conductive material layer 3 1 A at this direction. The thickness direction of the conductive material 3 1 A. Here, the magnetic field strength acting on the conductive material layer 3 1 A is shown by the conductive I 35 figure, 3 1 Η sheet insulation openings, the neutral granular material orientation and lower 60, the side electricity makes the electrical material layer material layer average- 33- 200527754 (31) As big as 0.02 ~ 2.5 Tesla is better. This step (b-3) is preferably performed under conditions that do not promote hardening of the conductive material layer 31A, for example, at room temperature. In the step (b-3) of the third method, after the operation of the electromagnet device 60 is stopped, the electromagnet device 60 is operated again to perform the reoperation operation. In this re-activation operation, the magnetic field acting on the conductive material layer 3 1 A again may be the direction in which the magnetic flux line is in the same direction as the magnetic field flux line before stopping, or the magnetic field flux line before stopping In the opposite direction, the effect of the residual magnetic field is small, and the opposite direction is preferred. When a magnetic field in the direction opposite to that of the magnetic flux line before stopping is applied, the strength of the magnetic field is preferably the same as that of the magnetic field before stopping. The re-operation operation may be performed at least once in step (b-3), but it is preferable to repeat the operation. Specifically, the number of re-operation operations is preferably 5 or more times, and more preferably 10 to 5,000 times. The specific conditions of the reactivation operation and the specific conditions when the reactivation operation is repeated are the same as those in step (b-1) of the first method.

As described above, in step (b-3), as shown in FIG. 25, a conductive material layer 3 1 A that is densely contained in the state where the conductive particles P are oriented in the thickness direction is formed. Step 1 (c-3): Step (c-3) Here, each conductive material layer 3 1 A contained in the conductive particles p oriented in the thickness direction is hardened. The hardening treatment of the conductive material layer 3 1 A can be performed after the magnetic field effect on each conductive material layer 3 1 A is stopped, or a magnetic field effect can be applied on one side -34- 200527754 (32) on each conductive material layer 3 1 A — surface, preferably the latter. The hardening treatment of the conductive material layer 3 1 A differs depending on the material used, and is usually a heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type and the like of the polymer material forming material constituting the conductive material layer 3 1 A. As described above, the hardening treatment of each of the conductive material layers 3 1 A is performed by forming a plurality of conductive circuit forming portions in a state of being insulated from each other by the insulating portions; on the black edge portion. After the hardening treatment of the conductive material layer 3 A is completed, for example, it is cooled to room temperature, and the laser mask 35 is removed to obtain the anisotropic conductive sheet 30 shown in Figs. 17 and 18. According to the third method, the magnetic field effect on the conductive material layer 3 1 A stops once, and in this stopped state, the conductive particles P in the conductive material layer 3 1 A are released from the limit of the magnetic force. Then, for the conductive material layer 31A, a magnetic field acts again in the thickness direction, and the movement is triggered, and the movement of the conductive particles P starts again, so it is more faithful to the thickness direction of the conductive material layer 3 1 A A p-chain of conductive particles is formed in the direction. In this way, the formation of the conductive particle P chain in an oblique direction with respect to the thickness direction can be suppressed, and an anisotropic conductive sheet 30 having a small electrical resistance and a small resistance and a stable conductivity can be manufactured. In order to form the conductive circuit forming portions 31 in each of the through holes 31H of the sheet 32A for the insulating portion, and the insulating portions 32 in which no conductive particles P exist are formed, the conductive circuit forming portions 31 can be manufactured even if the distance between them is small, Anisotropically conductive sheet with the insulation required for the adjacent conductive circuit forming sections 31 still being available-35- 200527754 (33) The method for producing anisotropically conductive sheet of the present invention is not limited to the first method described above ~ In the third method, a conductive material layer containing conductive particles in all liquid polymer material forming materials which can be cured to form an elastic elastic material can be used to apply a magnetic field to the thickness direction of the conductive particles. A manufacturing method of steps oriented in the thickness direction of the conductive material layer. EXAMPLES Specific examples of the method for producing an anisotropic conductive sheet according to the present invention will be described below, but the present invention is not limited to these. <Example 1> (1) Production of frame plate: A frame plate of the following specifications was produced. The frame plate is made of 42 alloy with a size of 25mmx25mmx0.03nm rectangle '. A rectangular opening of 10.0mmxl0.0mm is formed at its center. (2) Production of spacers: Production of upper and lower spacers with the following specifications. The upper and lower spacers are made of stainless steel (SUS-3 04), a rectangle with a size of 25mm X 25 mm X 0.03mm, and a rectangle of 1 · 0 mm X 1 1.0 mm is formed at the center position. Opening. -36- 200527754 (34) (3) Mold making: According to the structure of table 3, make the following specifications. The upper mold (50) and the lower mold (55) each have a ferromagnetic substrate (51, 5 6) made of 42 alloy with a thickness of 6 mm, and the surface of each ferromagnetic substrate (51, 5 6) is formed on each surface. There are 2000 rectangular ferromagnetic layers (52, 57) made of nickel-cobalt. The size of each ferromagnetic layer (52, 57) is 80 μm (φ vertical) x 80 μm (horizontal) x 50 μm (thick), and the arrangement pitch is 130 μm. The non-magnetic layer (5 3, 80 μm thick) formed by hardening the dry film photoresist is formed on the surface of the ferromagnetic substrate (5 1, 5 6) except the ferromagnetic layer (5 2, 5 7). 5 8). (4) Step (a -1): After adding 100 parts by weight of the liquid silicone rubber to the addition molding, adding 140 parts by weight of conductive particles having an average particle diameter of 8.7 μm, and decompressing and defoaming to adjust the conductivity material. The conductive material is coated on the forming surface of the upper mold and the forming surface of the lower mold by a screen printing method, and then the lower spacer, the frame plate, the upper spacer and the upper mold are sequentially laminated on the lower mold from the bottom. A conductive material layer is formed in the space between the upper mold and the lower mold. The above conductive particles are those in which nickel particles are used as core particles and electroless gold plating is applied to the core particles (average coating amount: 25% by weight of the core particles). For liquid silicone rubber for addition molding, A liquid viscosity of 2 50 0 ρ a · s, B-37- 200527754 (35) Liquid viscosity of 2 50 Pa · s, two liquid types, hardened at 150 ° C, permanent The compressive strain is 5%, the hardness of the hardened material is A, the hardness is 35, and the tear strength of the hardened material is 25 kN / m. The properties of the above addition liquid silicone rubber and its hardened material are measured as follows. (i) Viscosity of the addition liquid silicone rubber: Measure the viscosity of 23 ± 2 ° C with a B-type viscosity meter.

(ii) Compression permanent strain of hardened silicone rubber: Liquid A and liquid B of the two-component addition-molding liquid silicone rubber are stirred and mixed in equal amounts. Next, the mixture was poured into a mold, and the mixture was subjected to defoaming treatment under reduced pressure, and then hardened at 120 ° C for 30 minutes to produce a silicone rubber hardened cylinder having a thickness of 12.7 mm and a diameter of 29 mm. This cylinder was aged at 200 ° C for 4 hours and then aged. The thus obtained cylindrical body was used as a test piece 'to measure the compressive permanent strain at 150 ± 2 ° C in accordance with JIS K 6249. (iii) Tear strength of hardened silicone rubber: Under the conditions (i i) above, the hardening treatment and post-curing of the liquid silicone rubber are performed to produce a thin sheet with a thickness of 2.5 mm. A new test piece was made from this sheet by punching, and the tear strength was measured at 23 ° C and 2 ° C in accordance with JIS K 6249. (iv) Hardness tester A hardness: 5 sheets of the sheet made on the contract (i i i) were used as test pieces, according to JIS K 6249 at 23 ± 2. (: Measure the hardness of hardness tester A. -38- 200527754 (36) (5) Step (b-1): Prepare an electromagnet device with an upper electromagnet and a lower electromagnet with the same magnetic poles arranged in the electromagnet device. Between the magnetic poles of the upper electromagnet and the magnetic poles of the lower electromagnet, a mold formed with the above-mentioned conductive material layer is provided. Next, the electromagnet device is operated at room temperature for 15 seconds, and the conductive material layer becomes a conductive circuit. The part of the forming part is acted with a magnetic field of 1.6T intensity, and a total of 200 re-operation operations are performed, and the magnetic field is applied to the part that becomes the conductive φ path forming part. Here, the conditions for the re-operation operation are the stop time of the operation. 5 seconds, then 15 seconds, the direction of the magnetic flux lines of the re-applied magnetic field is opposite to the magnetic flux lines of the magnetic field before the stop, and the magnetic field strength is again applied to the part of the conductive material layer that becomes the conductive circuit forming part when the magnetic field acts Both are 1. 6 T. (6) Step (c-1): Between the magnetic pole of the upper electromagnet and the magnetic pole of the lower electromagnet device, the electromagnet device is operated in a state where a mold is installed. Yu Dao. Electrical The part of the material layer that becomes the conductive circuit forming part is subjected to a magnetic field with a strength of 1.6T, and the conductive material is hardened at 1000 ° C for 2 hours. Secondly, after cooling to room temperature, Take out, and obtain an anisotropic conductive sheet in which the frame plate is integrally provided on the periphery of the insulating part. The obtained anisotropic conductive sheet is provided with 2000 rectangular conductive circuit forming portions at a pitch of 130 μm, and the conductive circuit forming portions have a vertical and horizontal size of 80 μη × 80 μηι and a thickness of 1 50 μηι, the height protruding from both sides of the insulating portion is 30 μηι, and the thickness of the insulating portion is 90 μηι. -39- 200527754 (37) The content ratio of the conductive particles in the conductive circuit forming portion is considered to be formed in all conductive circuits. The volume fraction is about 30%. <Comparative Example 1> No re-operation is performed in step (b -1). 'The electromagnet device is actuated for 4 000 seconds, and a magnetic field with an intensity of 1.6 T is applied to the conduction. Except for the portion that becomes the conductive circuit forming portion of the conductive material layer, the same as in Example 1 was used to fabricate an anisotropic conductive sheet with a φ body provided on the peripheral portion of the insulating portion. The obtained anisotropic conductive sheet 2000 rectangular conductive circuit forming portions are arranged at a pitch of 1 30 μηι. The conductive circuit forming portions have a vertical and horizontal dimensions of 80 μιη x 80 μιη and a thickness of 150 μπι. The thickness of the protruding portions from both sides of the insulating portion is 30 μπι. The thickness of the insulating portion is about 90 μιη. The content of conductive particles in the part is about 30% by volume in all conductive circuit forming parts. [Evaluation of anisotropic conductive sheet] ^ Conductivity of conductive part: all anisotropic conductive sheet The conductive circuit forming portions are measured in the thickness direction with a strain rate of 10%, 20%, 30%, and 40%, and the resistance 値 in the thickness direction of each conductive circuit forming portion is measured. The results are shown in Table 1. Insulation between conductive circuit forming sections: All conductive circuit forming sections of the anisotropic conductive sheet have a strain rate of 20% in the thickness direction, and the resistance 値 between adjacent conductive circuit forming sections is measured to determine its resistance.値 The number of those who have not reached 1 Μ Ω. The results are shown in Table 1. -40- 200527754

(38) [Table 1] Example 1 Comparative example 1 Lead average 値 0.64 4.10 Electrical strain rate 10% Max 値 1.05 10.5 Road minimum 値 0.52 3.40 Shape average 値 0.20 3.30 Strain rate 20% Max 値 0.38 5.45 Part minimum 値 0.13 Average of 2.10 0.15 2.65 Electrical strain rate 30% max. 0.26 4.80 Minimum resistance 1. 0.12 1.65 値 Average 値 0.12 10.0 (Ω) Strain rate 40% maximum 値 0.24 58.0 minimum 値 0.09 3.25 Resistance between adjacent conductive circuit formation parts Number of persons reaching 1MΩ (number) 0 35 From the results in Table 1, it can be confirmed that according to Example 1, it is possible to obtain a conductive circuit forming portion that is pressurized with a small applied pressure, has a small resistance 値, and has stable conductivity, and is adjacent to each other. Anisotropically conductive sheet having required insulation between conductive circuit forming portions [Simplified description of the drawing] FIG. 1 is a cross-sectional view illustrating the structure of an example of anisotropically conductive sheet obtained by the manufacturing method of the present invention. -41-200527754 (39) Figure 2 Enlargement of important parts of the anisotropically conductive sheet in Figure 1 is a cross-sectional view. Fig. 3 is a cross-sectional view illustrating a structure of a mold for manufacturing the anisotropic conductive sheet of Fig. 1. Fig. 4 is a cross-sectional view illustrating a state in which the mold of Fig. 1 is coated with a conductive material on the forming surfaces of the upper and lower molds. Fig. 5 is an explanatory cross-sectional view of a state φ where a conductive material layer is formed in a cavity of a mold. Fig. 6 is an explanatory cross-sectional view showing a state where a mold is set in an electromagnet device. Fig. 7 is an explanatory sectional view showing a direction of a magnetic flux line of a magnetic field before stopping. Fig. 8 is an explanatory sectional view showing the direction of magnetic flux lines of a magnetic field that is no longer acting. Fig. 9 is a cross-sectional view illustrating a state in which conductive particles in the conductive material layer become a conductive circuit- · forming portion and are aligned in a thickness direction. Fig. 10 is a sectional view showing the structure of another example of the anisotropically conductive sheet obtained by the manufacturing method of the present invention. The important parts of the anisotropically conductive sheet in Fig. 11 and Fig. 10 are enlarged cross-sectional views. Fig. 12 is a cross-sectional view illustrating the structure of a forming member used to manufacture the anisotropically conductive sheet of Fig. 10. Fig. 13 A cross-sectional view illustrating a state where a conductive material layer is formed between one support and the other support of a molded member. -42- 200527754 (40) Fig. 14 is an enlarged explanatory sectional view of a conductive material layer. Fig. 15 is a sectional view showing a state in which a molded member is installed in an electromagnet device. Fig. 16 is an explanatory sectional view showing a state in which conductive particles are aligned in a thickness direction in the conductive material layer. Fig. 17 is a sectional view showing the structure of another example of the anisotropically conductive sheet φ obtained by the manufacturing method of the present invention. Fig. 18 is an enlarged cross-sectional view of an important part of the anisotropically conductive sheet of Fig. 17. Fig. 19 is a cross-sectional view illustrating the structure of a sheet for an insulating portion of the anisotropically conductive sheet of Fig. 17; Fig. 20 is a cross-sectional view illustrating a state where a sheet for an insulating portion is provided with a laser mask on the sheet. Fig. 21 is a sectional view showing a state where a sheet for an insulating portion has been formed. ^ Figure 22 is an explanatory cross-sectional view of an intermediate composite formed by a laser shield, a sheet for an insulating portion, and a conductive material layer. Fig. 23 is an enlarged cross-sectional view illustrating the conductive material layer of the intermediate composite. Fig. 24 is an explanatory cross-sectional view showing a state where the intermediate composite is installed in the electromagnet device. Fig. 25 is an explanatory sectional view showing a state in which conductive particles are aligned in a thickness direction in the conductive material layer. -43- 200527754 (41) Figure 26 In the conventional method for manufacturing anisotropic conductive sheet, a sectional view illustrating a state in which conductive particle chains are formed in a direction inclined to the thickness direction in the 'conductive material layer'. Fig. 27 is a sectional view illustrating a state in which a conductive material layer is formed between an upper mold and a lower mold in a conventional method for manufacturing anisotropic conductive sheet. Fig. 28 is a conventional method for manufacturing anisotropic conductive sheet. An explanatory cross-sectional view of a state in which a conductive particle chain is formed between the ferromagnetic layer of the upper mold and the adjacent iron @ 1 生 φ bulk layer of the corresponding ferromagnetic layer of the lower mold. 10A: conductive material layer η: conductive circuit forming portion 12: insulating portion 1 5: frame plate

2 0: anisotropic conductive sheet 20A: conductive material layer 2 5: molded member 26: one support 27: the other support 2 8: spacer 3 0: anisotropic conductive sheet 3 1: conductive circuit formation Section 3 1 A: Conductive material layer-44- 200527754 (42) 3 1 Η: Through hole 3 2: Insulation section 32A: Sheet for insulation section 32B: Sheet 3 4: Intermediate composite 3 5: For laser Mask 3 6: Opening 50: Upper mold 5 1: Ferromagnetic substrate 52: Ferromagnetic layer 5 3: Non-magnetic layer 5 4: Upper spacer 5 5: Lower mold 5 6: Ferromagnetic substrate 5 7 : Ferromagnetic layer # 5 8: Non-magnetic layer 5 9: Lower spacer 60: Electromagnet device 6 1: Upper electromagnet 6 2: Magnetic pole 65: Lower electromagnet 6 6: Magnetic pole 90: Upper mold 9 1: Substrate-45 200527754 (43) 92: Ferromagnetic layer 93: Non-magnetic layer 9 5: Lower mold 96: Substrate 97: Ferromagnetic layer 9 8: Non-magnetic layer 8 〇: Conductive material layer P: Conductive particles E: Elastic polymer

Claims (1)

200527754 (1) X. Application for patent scope 1 · A method for manufacturing anisotropic conductive sheet, which is characterized in that it contains magnetic conductive material for the liquid polymer material forming material which can be cured to form an insulating elastic polymer material. A step of applying a magnetic field to the thickness direction of the conductive material layer made of particles to orient the conductive particles in the thickness direction of the conductive material layer. In this step, the magnetic field effect of the conductive material layer is stopped. After that, the operation of applying a magnetic field to the conductive material layer was performed at least once again. 2. —A method for manufacturing anisotropic conductive sheet, which has a plurality of conductive circuit forming portions in which magnetic conductive particles in an insulating elastic polymer substance are contained in a state oriented in the thickness direction, and these conductive circuits are formed A method for producing anisotropic conductive sheet of an insulating part made of insulating elastic polymer materials which are insulated from each other, which is characterized by including a # -shaped polymer material forming material for a cured liquid which can form an insulating elastic polymer material. The conductive material layer containing magnetic conductive particles contains a portion that becomes the conductive circuit forming portion acts on the thickness direction of the conductive material layer with a magnetic field having a strength greater than that of the other portion, thereby forming a portion of the conductive circuit forming portion. The step of gathering conductive particles and orienting them in the thickness direction of the conductive material layer. In this step, after stopping the magnetic field effect of the conductive material layer, the operation of applying a magnetic field effect to the conductive material layer is performed at least once again. 1 time. 3. A method for manufacturing anisotropic conductive sheet, which is based on the production of anisotropic conductive sheet-47- 200527754 (2) The production of anisotropic conductive sheet containing conductive particles in a high-molecular substance oriented in the thickness direction The method is characterized by including a conductive material layer containing magnetic conductive particles in a liquid polymer material forming material which can be cured to form an insulative elastic polymer material, and applies a magnetic field to the thickness direction of the conductive particles. A step oriented in the thickness direction of the conductive material layer. In this step, after the magnetic field of the conductive material layer is stopped, the operation of applying a magnetic field to the conductive material layer is performed at least once again. 4. A method for manufacturing a conductive sheet, comprising a plurality of conductive circuit forming portions in which magnetic conductive particles in an insulating elastic polymer material are contained in a state oriented in a thickness direction, and the conductive circuit forming portions are insulated from each other. A method for manufacturing anisotropic conductive sheet of an insulating portion made of an insulating elastic polymer material is characterized in that it is prepared to form a plurality of through-holes in accordance with a pattern corresponding to a pattern of a conductive circuit forming portion, and insulate it. The insulating part made of a flexible elastic polymer material. The sheet material includes a liquid polymer material forming material which can be cured to form an insulating elastic polymer for each through hole filled in the sheet material for the insulating part. The step of orienting the conductive material layer in the thickness direction of the conductive material layer made of magnetic conductive particles by using a magnetic field to orient the conductive particles in the thickness direction of the conductive material layer. In this step, After the magnetic field action is stopped, the operation of the conductive material layer with magnetic field action is at least -48-200527754 (3) line 1 again. Times. 5 · A method for producing an anisotropic conductive sheet, comprising a conductive material layer formed by containing magnetic conductive particles in a liquid polymer material forming material which can be cured to form an insulating elastic polymer material. A step of orienting the conductive particles in the thickness direction of the conductive material layer by applying a magnetic field to the thickness direction of the conductive material layer. In this step, after the magnetic field effect of the conductive material layer is stopped φ, the conductivity of the conductive material layer is again controlled. The operation of the material layer with a magnetic field is performed at least once. In this operation, the direction of the magnetic flux line of the magnetic field that is again applied to the conductive material layer is opposite to the direction of the magnetic flux line of the magnetic field before the stop. 6 · A method for manufacturing anisotropic conductive sheet, which has a plurality of conductive circuit forming portions in which magnetically conductive particles in an insulating elastic polymer substance are contained in a state oriented in the thickness direction, and the conductive circuits are formed A method for producing anisotropic conductive sheets of insulating portions made of insulating elastic polymer materials that are insulated from each other, which is characterized in that # is contained in a liquid polymer material that is cured to form an insulating elastic polymer material. The conductive material layer containing magnetic conductive particles acts on the thickness direction of the conductive material layer with a magnetic field having a strength greater than that of the other portion at the portion that becomes the conductive circuit forming portion, and the conductive particle is formed at the portion that becomes the conductive circuit forming portion. Collecting a step oriented in the thickness direction of the conductive material layer. In this step, after stopping the magnetic field effect of the conductive material layer, the operation of applying a magnetic field effect to the conductive material layer is performed at least once again. This operation -49- 200527754 (4) the direction of the passage of the magnetic field again acting on the conductive material layer, and The magnetic field flux lines of the front stop in the opposite direction. 7. A method for producing anisotropic conductive sheet, which is a method for producing anisotropic conductive sheet containing magnetically conductive particles in an insulating elastic polymer material oriented in a thickness direction, which is characterized by including A conductive polymer layer formed of a liquid polymer material forming material that can form an insulative elastic polymer material contains magnetic conductive particles. A magnetic field acts on the thickness direction of the conductive material to orient the conductive particles φ to the conductive material. A step in the thickness direction of the layer. In this step, after the magnetic field action of the conductive material layer is stopped, the operation of applying the magnetic field action to the conductive material layer is performed at least once again, and in this operation, the conductive action is performed again. The direction of the magnetic flux lines of the magnetic field of the material layer is opposite to that of the magnetic field lines before the stop. 8-A method for manufacturing anisotropic conductive sheet, comprising a plurality of conductive circuit forming portions in which magnetic conductive particles in an insulating elastic high-molecular substance are contained in a thickness direction, and these conductive circuit forming portions are mutually Anisotropic conductivity of an insulating portion made of an insulating, elastic, and high-molecular polymer material. A method for manufacturing a sheet, which is characterized in that a plurality of through holes are formed according to a pattern corresponding to a pattern of a conductive circuit forming portion. The thin sheet for an insulating portion made of an insulating elastic polymer material includes a liquid polymer material forming material that can harden the through-holes filled in the sheet for the insulating portion to form an insulating elastic polymer material. A layer of a conductive material containing magnetic conductive particles and a magnetic field acting on the thickness direction of the conductive material layer to orient the conductive particles in the direction of -50- 200527754 (5) in the thickness direction of the conductive material layer. In this step, After the magnetic field action of the conductive material layer is stopped, the magnetic field action of the conductive material layer is performed again at least once. This operation, again acting in the direction of magnetic field lines of the conductive material layer, and the magnetic flux lines of the magnetic field is stopped before the reverse direction. 9 · The manufacturing method of the anisotropic conductive sheet according to any one of claims 1 to 8, wherein the magnetic field effect on the conductive material layer is stopped by φ, and then the magnetic field effect is applied to the conductive material layer again. The operation is repeated. i 〇. The manufacturing method of the anisotropic conductive sheet according to item 9 of the scope of patent application, wherein after the magnetic field effect of the conductive material layer is stopped, the operation of the conductive material layer by the magnetic field is performed again 5 times or more ° -51-