CN102867566A - Anisotropic conductive film - Google Patents
Anisotropic conductive film Download PDFInfo
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- CN102867566A CN102867566A CN2012103077311A CN201210307731A CN102867566A CN 102867566 A CN102867566 A CN 102867566A CN 2012103077311 A CN2012103077311 A CN 2012103077311A CN 201210307731 A CN201210307731 A CN 201210307731A CN 102867566 A CN102867566 A CN 102867566A
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- conductive film
- anisotropic conductive
- microns
- partition wall
- insulating resin
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Abstract
The invention relates to an anisotropic conductive film, which comprises a base material, a plurality of insulating resin extension partition walls and conductive materials, wherein the insulating resin extension partition walls are arranged on the base material and distributed in parallel; and the conductive materials are arranged among a plurality of insulating resin extension partition walls, so the parallel direction of a plurality of insulating resin extension partition walls is conductive. By adoption of the structure of the anisotropic conductive film, requirements on the bonding area of bonders and the space between two bonders can be completely met, the quantity of required conductive particles is decreased to reduce the material cost of the anisotropic conductive film, and most importantly, the problem of short circuit caused by transverse electrical conduction can be solved.
Description
Technical field
The present invention is about a kind of structure of conducting film, and a kind of Novel structure about anisotropic conductive film particularly.
Background technology
Electrically conduct, bind fixing and the advantage such as operating temperature is lower because anisotropic conductive film has one direction, so be mainly used in the processing procedure that is not suitable for the welding of high temperature slicker solder, coil type crystal grain joining technique (Tape Automated Bonding for example, TAB), ambetti joining technique (Chip on Glass, COG) and crystal grain mantle joining technique (Chip on Film, COF).Between the then thing of unlike material by the bonding of anisotropic conductive film, but current limit flows and the characteristic of left and right directions insulation from direction (vertical direction) conducting of binding, and can reach the general electric connector fine wire that is beyond one's reach and connect effect and do not cause the circuit short-term.
The employed anisotropic conductive film of industry is comprised of resin and conducting particles mostly now, and in order to promote conducting particles in the conductivity of vertical direction, required conducting particles quantity also must improve or use the conducting particles of large-size.Yet too much or excessive conducting particles might make to form between the transverse electrode to electrically conduct in the process that pressing is sticked together, and causes the situation of short circuit.And along with the pin between drive IC is also more and more narrow apart from the conductive projection spacing (space) of (pitch) miniaturization and horizontal pin potential electrode, so that anisotropic conductive film also improves gradually in the difficulty of lateral isolation.
Summary of the invention
Because the problem of above-mentioned known techniques, the invention provides a kind of structure of new-type anisotropic conductive film, reduce required conducting particles quantity to reduce the material cost of anisotropic conductive film, the most important thing is to avoid the electrical short circuit problem that causes in horizontal conducting.
For reaching above-mentioned purpose, the invention provides a kind of anisotropic conductive film, the structure of anisotropic conductive film comprises base material, a plurality of insulating resin extends partition wall and electric conducting material, and wherein, each insulating resin extension partition wall is arranged parallel to each other and is arranged on the base material.Electric conducting material, it is arranged between the above-mentioned insulating resin extension partition wall, makes anisotropic conductive film have conductivity along the parallel direction that a plurality of insulating resins extend partition walls.
As optional technical scheme, insulating resin extends partition wall and can be light-cured resin or heat-curing resin, for example can be selected from the group that acrylic resin (acrylic resin), silicones (silicone) and polyamine formic acid esters (polyurethane) form, and the above-mentioned insulating resin top surface that extends partition wall can be flat surfaces, curved surfaces or is comprised of at least one inclined-plane.
As optional technical scheme, insulating resin extends the width of partition wall for example between 5 microns (μ m) to 300 microns (μ m), they are highly for example between 3 microns (μ m) to 30 microns (μ m), and each insulating resin extends partition wall and contiguous insulating resin and extends the spacing of partition wall that is adjacent two insulating resins extension partition walls for example between 5 microns (μ m) to 100 microns (μ m).
As optional technical scheme, electric conducting material comprises resin and is distributed in electric conductor in this resin that this electric conductor is selected from the group that is comprised of conducting particles, conductive metal wire and conducting polymer.
As optional technical scheme, the particle diameter of this conducting particles is between 3 microns to 30 microns.
As optional technical scheme, the diameter of this conductive metal wire is between 50 nanometer to 500 nanometers, and this conductive metal wire draw ratio is between 3 to 100.
As optional technical scheme, base material can be release film.
Compared with prior art, the structure of anisotropic conductive film of the present invention can meet then fully, and the then area of thing reaches the then size of the spacing between thing, reduce required conducting particles quantity to reduce the material cost of anisotropic conductive film, the most important thing is to avoid the electrical short circuit problem that causes in horizontal conducting.
For foregoing of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphicly, above-described embodiment and diagram are non-to be described in detail below in order to limit to carry before the present invention:
Description of drawings
Fig. 1 illustrates the anisotropic conductive film structural representation of the first embodiment of the present invention.
Fig. 2 A to Fig. 2 D illustrates the manufacture method schematic diagram of the anisotropic conductive film of the first embodiment of the present invention.
Fig. 3 illustrates the anisotropic conductive film structural representation of the second embodiment of the present invention.
Embodiment
The appended diagram of the present invention is in order to describe in detail, is not to limit content of the present invention.
The first embodiment
Please refer to Fig. 1, illustrate the anisotropic conductive film structural representation of the first embodiment of the present invention.Anisotropic conductive film 100 comprises base material 110, a plurality of insulating resin extends partition wall 120 and electric conducting material 130.Base material 110 is transparent base, for example fractal film.Fig. 2 A to Fig. 2 D illustrates the manufacture method schematic diagram of the anisotropic conductive film of the first embodiment of the present invention.The formation method that aforesaid a plurality of insulating resin extends partition wall 120 sees also Fig. 2 A to Fig. 2 C.Fig. 2 A illustrates transparent base 210.Then, insulating resin 220 is coated on the transparent base 210, shown in Fig. 2 B.The coating method of insulating resin 220 knows usually that by having in the affiliated technical field the knowledgeable is known, for example slot coated method (die coating) or intaglio printing rubbing method (gravure coating).The material of insulating resin 220 can be heat-curing resin (thermo-curable resin) or UV-cured resin (UV curable resin), for example can be selected from the group that acrylic resin, silicones and polyamine formic acid esters form, that is insulating resin 220 can be formed or be comprised of multiple combination by wherein a kind of in acrylic resin, silicones and the polyamine formic acid esters.
Then, to have the die marks insulating resin 220 of predetermined pattern, make insulating resin 220 form a plurality of insulating resins and extend partition wall 230, and each insulating resin extension partition wall 230 is arranged parallel to each other.The top surface that above-mentioned insulating resin extends partition wall 230 can be flat surfaces, curved surfaces or is comprised of at least one inclined-plane, and in preferred embodiments of the present invention, its top surface is flat surfaces.
In another preferred embodiments of the present invention, then area for the follow-up adhesion of correspondence, so insulating resin extends the width of partition wall 230 for example between 5 microns (μ m) to 300 microns (μ m), highly for example between 3 microns (μ m) to 30 microns (μ m), and each insulating resin extends the spacing of partition wall 230 and contiguous insulating resin extension partition wall 230 for example between 5 microns (μ m) to 100 microns (μ m).
At last, electric conducting material 240 is injected above-mentioned insulating resin extend between the partition wall 230, shown in Fig. 2 D, make along the parallel direction of a plurality of insulating resins extension partition walls 230 to have conductivity.Electric conducting material 240 comprises resin and is distributed in electric conductor in the resin, the group that forms of the optional free conducting particles of electric conductor, conductive metal wire and conducting polymer wherein that is to say that electric conductor can be by wherein a kind of form or multiple combination forms in conducting particles, conductive metal wire and the conducting polymer.In a preferred embodiments of the present invention, electric conducting material 240 is comprised of resin and conducting particles, wherein the group that forms of the optional free gold, silver of conducting particles, copper and nickel.In order to improve the conducting efficient of electric conducting material 240 in insulating resin extension partition wall 230, for example between 3 microns (μ m) to 30 microns (μ m), better particle diameter is for example between 5 microns (μ m) to 10 microns (μ m) for the particle diameter of conducting particles.And the conducting particles in the electric conducting material 240 and the percentage by weight of resin, better for example between 5: 95 to 30: 70.In another preferred embodiments of the present invention, the conducting particles that uses be shaped as the hollow form metallic, when binding when treating then thing to be subject to external pressure, the space in this hollow metal particle can disperse in order to pressure that will be excessive, wait to follow thing and avoid damaging.Have in the technical field under the kind of above-mentioned conducting particles, shape, particle diameter and percentage by weight are all and know that usually the knowledgeable knows.In addition, be arranged at the electric conducting material 240 that insulating resin extends 230 on partition wall, its height can not be higher than insulating resin and extend partition wall 230, can cause horizontal conducting when avoiding electric conducting material 240 with electrode or glass gluing and causes short circuit problem.So in a preferred embodiments of the present invention, the height of electric conducting material 240 is better for example between 5 microns (μ m) to 10 microns (μ m).
The second embodiment
Please refer to Fig. 3, illustrate the anisotropic conductive film structural representation of the second embodiment of the present invention.The anisotropic conductive film 300 of present embodiment comprises base material 310, a plurality of insulating resin extends partition wall 320 and electric conducting material 330, the anisotropic conductive film 100 main difference parts of itself and the first embodiment are that insulating resin extends the top surface configurations of partition wall 320 and the composition of electric conducting material 330, and all the other something in common are repeated description no longer.In present embodiment, the top surface that insulating resin extends partition wall 320 is the structure that two inclined-planes form, the design of this special construction can avoid electric conducting material 330 to remain on the top surface of insulating resin extension partition wall 320 when coating, and improves electric conducting material 330 in the probability of horizontal conducting.Therefore, the angle between this two inclined-plane is better between 60 ° to 120 °.
Above-mentioned top surface is not limited to the structure that two inclined-planes form, also can be by being comprised of curved surfaces or at least one inclined-plane.The employed electric conducting material 330 of present embodiment is comprised of resin and conductive silver wire, in order to improve the conducting efficient of conductive silver wire in insulating resin extension partition wall 320, the diameter of conductive silver wire for example between 50 nanometers (nm) between 500 nanometers (nm), draw ratio is for example between 3 to 100, and the percentage by weight of the conductive silver wire in the electric conducting material 330 and resin is for example between 0.5: 99.5 to 10: 90.Have in the technical field under above-mentioned employed conductive silver wire kind and percentage by weight are all and know that usually the knowledgeable knows.
In sum, although the present invention discloses as above with various preferred embodiments, so it is not to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when right requires the person of defining.
Claims (10)
1. anisotropic conductive film is characterized in that comprising:
Base material;
A plurality of insulating resins extend partition wall, and it is arranged on this base material, and each this insulating resin extension partition wall is arranged parallel to each other; And
Electric conducting material, it is arranged between these a plurality of insulating resins extension partition walls, makes this anisotropic conductive film have conductivity along the parallel direction that these a plurality of insulating resins extend partition walls.
2. anisotropic conductive film as claimed in claim 1 is characterized in that these a plurality of insulating resins extend the width of partition wall between 5 microns to 300 microns.
3. anisotropic conductive film as claimed in claim 1 is characterized in that these a plurality of insulating resins extend the height of partition wall between 3 microns to 30 microns.
4. anisotropic conductive film as claimed in claim 1 is characterized in that two adjacent these insulating resins extend spacing between the partition walls between 5 microns to 100 microns.
5. anisotropic conductive film as claimed in claim 1 is characterized in that top surface that these a plurality of insulating resins extend partition walls is formed by flat surfaces, curved surfaces or by at least one inclined-plane.
6. anisotropic conductive film as claimed in claim 1 is characterized in that this electric conducting material comprises resin and is distributed in electric conductor in this resin, and this electric conductor is selected from the group that is comprised of conducting particles, conductive metal wire and conducting polymer.
7. anisotropic conductive film as claimed in claim 6 is characterized in that, this electric conductor comprises this conducting particles, and the particle diameter of this conducting particles is between 3 microns to 30 microns.
8. anisotropic conductive film as claimed in claim 6 is characterized in that, this electric conductor comprises this conductive metal wire, and the diameter of this conductive metal wire is between 50 nanometer to 500 nanometers, and this conductive metal wire draw ratio is between 3 to 100.
9. anisotropic conductive film as claimed in claim 1 is characterized in that this base material is fractal film.
10. anisotropic conductive film as claimed in claim 1 is characterized in that these a plurality of insulating resins extend partition wall and are selected from the group that acrylic resin, silicones and polyamine formic acid esters form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103077311A CN102867566A (en) | 2012-08-27 | 2012-08-27 | Anisotropic conductive film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103077311A CN102867566A (en) | 2012-08-27 | 2012-08-27 | Anisotropic conductive film |
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| CN102867566A true CN102867566A (en) | 2013-01-09 |
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| CN2012103077311A Pending CN102867566A (en) | 2012-08-27 | 2012-08-27 | Anisotropic conductive film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811102A (en) * | 2014-02-19 | 2014-05-21 | 上海和辉光电有限公司 | Anisotropic conducting film and manufacturing method for same |
| CN108882552A (en) * | 2018-08-10 | 2018-11-23 | 武汉华星光电半导体显示技术有限公司 | The bonding method of conducting resinl and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060208A (en) * | 2006-04-21 | 2007-10-24 | 保力马科技株式会社 | Anisotropic conductive sheet and method of manufacturing the same |
| KR20070104742A (en) * | 2006-04-24 | 2007-10-29 | 엘지전자 주식회사 | Anisotropic conductive film and method of manufacturing the same |
| KR20090045805A (en) * | 2007-11-02 | 2009-05-08 | 이형곤 | Anisotropic conductive film and conductive particle and core and manufacture |
| JP2012004022A (en) * | 2010-06-18 | 2012-01-05 | Jsr Corp | Sheet-like metal mold and circuit connection member, and their manufacturing method |
-
2012
- 2012-08-27 CN CN2012103077311A patent/CN102867566A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060208A (en) * | 2006-04-21 | 2007-10-24 | 保力马科技株式会社 | Anisotropic conductive sheet and method of manufacturing the same |
| KR20070104742A (en) * | 2006-04-24 | 2007-10-29 | 엘지전자 주식회사 | Anisotropic conductive film and method of manufacturing the same |
| KR20090045805A (en) * | 2007-11-02 | 2009-05-08 | 이형곤 | Anisotropic conductive film and conductive particle and core and manufacture |
| JP2012004022A (en) * | 2010-06-18 | 2012-01-05 | Jsr Corp | Sheet-like metal mold and circuit connection member, and their manufacturing method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811102A (en) * | 2014-02-19 | 2014-05-21 | 上海和辉光电有限公司 | Anisotropic conducting film and manufacturing method for same |
| CN108882552A (en) * | 2018-08-10 | 2018-11-23 | 武汉华星光电半导体显示技术有限公司 | The bonding method of conducting resinl and circuit board |
| WO2020029394A1 (en) * | 2018-08-10 | 2020-02-13 | 武汉华星光电半导体显示技术有限公司 | Conductive adhesive and method for bonding circuit board |
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Application publication date: 20130109 |