CN105860498B - A kind of low temperature curing type electric slurry halogen-free high-flexibility organic carrier and preparation method thereof - Google Patents
A kind of low temperature curing type electric slurry halogen-free high-flexibility organic carrier and preparation method thereof Download PDFInfo
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- CN105860498B CN105860498B CN201610326699.XA CN201610326699A CN105860498B CN 105860498 B CN105860498 B CN 105860498B CN 201610326699 A CN201610326699 A CN 201610326699A CN 105860498 B CN105860498 B CN 105860498B
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- 239000002002 slurry Substances 0.000 title claims abstract description 48
- 238000013035 low temperature curing Methods 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 238000001723 curing Methods 0.000 claims abstract description 27
- 238000003756 stirring Methods 0.000 claims abstract description 27
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920002521 macromolecule Polymers 0.000 claims abstract description 16
- 239000002562 thickening agent Substances 0.000 claims abstract description 16
- 239000012046 mixed solvent Substances 0.000 claims abstract description 15
- 238000001914 filtration Methods 0.000 claims abstract description 9
- 238000002156 mixing Methods 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 229920000728 polyester Polymers 0.000 claims description 11
- 229920005749 polyurethane resin Polymers 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 150000002148 esters Chemical class 0.000 claims description 5
- ONCZQWJXONKSMM-UHFFFAOYSA-N dialuminum;disodium;oxygen(2-);silicon(4+);hydrate Chemical compound O.[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[Na+].[Na+].[Al+3].[Al+3].[Si+4].[Si+4].[Si+4].[Si+4] ONCZQWJXONKSMM-UHFFFAOYSA-N 0.000 claims description 4
- 229940080314 sodium bentonite Drugs 0.000 claims description 4
- 229910000280 sodium bentonite Inorganic materials 0.000 claims description 4
- 108010010803 Gelatin Proteins 0.000 claims description 3
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 3
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 3
- 229920002472 Starch Polymers 0.000 claims description 3
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 claims description 3
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 3
- 239000008119 colloidal silica Substances 0.000 claims description 3
- 239000003517 fume Substances 0.000 claims description 3
- 239000008273 gelatin Substances 0.000 claims description 3
- 229920000159 gelatin Polymers 0.000 claims description 3
- 235000019322 gelatine Nutrition 0.000 claims description 3
- 235000011852 gelatine desserts Nutrition 0.000 claims description 3
- 239000000017 hydrogel Substances 0.000 claims description 3
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 3
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 claims description 3
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 claims description 3
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 claims description 3
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 claims description 3
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 claims description 3
- 239000008107 starch Substances 0.000 claims description 3
- 235000019698 starch Nutrition 0.000 claims description 3
- 229940092782 bentonite Drugs 0.000 claims 2
- 229910000278 bentonite Inorganic materials 0.000 claims 2
- 239000000440 bentonite Substances 0.000 claims 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims 2
- 238000009835 boiling Methods 0.000 claims 2
- 150000002576 ketones Chemical class 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 238000007639 printing Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 239000000969 carrier Substances 0.000 abstract description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 229910052736 halogen Inorganic materials 0.000 description 9
- 150000002367 halogens Chemical class 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000005452 bending Methods 0.000 description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 7
- 239000004615 ingredient Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- -1 furfuran compound Chemical class 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical group CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- HGUFODBRKLSHSI-UHFFFAOYSA-N 2,3,7,8-tetrachloro-dibenzo-p-dioxin Chemical compound O1C2=CC(Cl)=C(Cl)C=C2OC2=C1C=C(Cl)C(Cl)=C2 HGUFODBRKLSHSI-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- SIZYAYFVBQLSJP-UHFFFAOYSA-N 2-ethylhexyl formate Chemical class CCCCC(CC)COC=O SIZYAYFVBQLSJP-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- 239000004635 Polyester fiberglass Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000011101 paper laminate Substances 0.000 description 1
- 229940023462 paste product Drugs 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229940094537 polyester-10 Drugs 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of low temperature curing type electric slurry halogen-free high-flexibility organic carriers and preparation method thereof.Its mass percent is：Mixed solvent 70-85%, macromolecule resin 5-30%, thickener, 0.5-5%, curing agent 0.5-5%.It weighs, it is added to the container and heats while stirring uniformly, above-mentioned macromolecule resin is weighed by above-mentioned formula to be gradually added in container, it is kept stirring until completely dissolved 1-2 hours, above-mentioned thickener and curing agent is added by being cooled to room temperature, it is kept stirring setting time after mixing, a kind of halogen-free high-flexibility organic carrier of low temperature curing type electric slurry of the invention is obtained after filtering.The organic carrier prepared using this method is halogen-free for modulating low temperature curing type electric slurry and flexibility is strong, hardness is high with extraordinary printing, levelability, after preparing slurry curing with it, can be used for the flexible circuit board manufacturing.
Description
Technical field
The present invention relates to a kind of halogen-free high-flexibility organic carriers of low temperature curing type electric slurry to prepare, and especially uses
In low temperature curing type electrocondution slurry field, belong to electronic information function new material and technical field of electronic encapsulation.
Background technology
Halogen-free high-flexibility organic carrier is prepared applied to low temperature curing type electric slurry.
In information industry, printed wiring board can be divided into rigid circuit board and flexible circuit board according to making material.Rigidity
Wiring board has phenolic paper laminate, epoxy paper-based laminate, polyester fiberglass carpet veneer pressing plate, epoxy glass cloth laminated board.It is flexible
Wiring board is also known as flex circuit application (i.e. FPC), be using polyimides or polyester film be made of base material it is a kind of have it is highly reliable
The printed circuit board of property and higher circumnutating property.This wiring board thermal diffusivity is good, you can bending folds, rolls up and scratch, and can be in three-dimensional space
Between arbitrarily move and flexible.Component volume can be reduced using FPC, lightweight, miniaturization, slimming are realized, to realize member
Part device and conducting wire connecting integration.FPC is widely used in the industries such as electronic computer, communication, space flight and household electrical appliances, and in FPC
In, mainly realize that signal is transmitted using conductive silver paste as key function material.
And with the development of electronics industry, to flexible circuit boards such as computer keyboard, mobile phone, camera and electronic game machines
Demand increase severely, greatly accelerate the development speed of high-end conductive silver paste product.Flexible circuit board is required to meet with conductive silver paste
Special printing technology, printed wire be thin, can multilayer wiring, have stronger buckle resistance, low resistance, high abrasion, it is highly reliable, make
With performances such as long lifespans, therefore the baked temperature to conductive silver paste, viscosity, fineness, uniformity etc. propose higher technology
It is required that while also requiring to have to comply with European Union environmental protection requirement.Especially halogen-free requirement is wanted that is, in slurry containing Cl and Br respectively
Less than 900ppm, Cl and Br summations are less than 1500ppm.Circuit board and electronic product containing halogen are in unburnt feelings
It will produce many byproducts, including dioxin (dioxin) and furfuran compound (furan-likecompound) under condition, with
And acid or corrosive gas, these have potential hazard to the health of environment and people.Once fire, the acid for generation of burning occurs
Property gas will damage the nose, mouth and throat of people, and smog is also easy to make one to get lost, it is difficult to escape from the fire scene.Due to
Resin containing Cl elements can enhance electric conductivity and adhesive force, and original the type low-temperature conductive silver paste is all made of tree containing halogen
Fat, and with the increasingly fierceness of product market competition, exploitation low temperature curing type electric slurry is organic with halogen-free high-flexibility
Carrier meets the ecological requirements that market is constantly promoted.
China is filled up in the blank of high-end flexible circuitry conductive silver paste, improves the low temperature curing type electronics slurry with its system
The feature of environmental protection of material meets the environmental requirement that a place is formulated, and is the inexorable trend of the following flexible PCB development.
Invention content
A kind of halogen-free high-flexibility organic carrier of low temperature curing type electric slurry of the present invention has preferable environmental protection
Performance, the low-temperature setting slurry flexibility with its preparation is strong, and hardness is high, the strong adhesive force on the flexible parent metals such as PET；
What the gained halogen-free high-flexibility organic carrier of a kind of low temperature curing type electric slurry of the invention can be used for preparing
Low temperature curing type slurry, the slurry are flexible for the flexible circuit boards such as computer keyboard, mobile phone, camera and electronic game machine etc.
Wiring board is manufactured, and the performances such as printing, electric conductivity, flexibility, hardness, adhesive force are satisfied by requirement；
The technical problem to be solved in the invention is achieved through the following technical solutions：A kind of low temperature curing type electronics slurry
Expect that halogen-free high-flexibility organic carrier, composition and its weight percent are：Mixed solvent 70-85%, macromolecule resin
5-30%, thickener, 0.5-5%, curing agent 0.5-5%；Wherein, the sum of each component weight percent is 100%.
Above-mentioned mixed solvent is butyl acetate, ethyl cellosolve acetate, formic acid -2- ethylhexyl esters, butyl glycol ether
Acetic acid esters, diethylene glycol ether acetic acid esters, butyl acetic acid esters, cyclohexanone, isophorone, mixed dibasic acid ester
(DBE), at least two in ethylene carbonate.
Above-mentioned macromolecule resin is polyurethane resin, polyester, and ratio is 1:1-10:1, polyurethane molecular amount is more than
30000, molecular weight of polyesters 5000-30000.
Above-mentioned thickener be starch, gelatin, hydroxyethyl cellulose, hydroxypropyl methyl cellulose, sodium carboxymethylcellulose,
One kind in organobentonite, diatomite, fume colloidal silica, sodium bentonite, Silica hydrogel.
Above-mentioned curing agent is blocked curing agent, and deblocking temperature is at 100-150 DEG C.For Asahi Chemical Industry TPA-B80X, 17B-
One kind in 60PX, Degussa B1358A, Bayer BL3175, outstanding grace chemical industry UN-7038, Germany INVBL-223W；
A kind of halogen-free high-flexibility organic carrier of low temperature curing type electric slurry, comprises the following steps that：(1) first
Above-mentioned mixed solvent is weighed by above-mentioned formula, is added to the container and heats while stirring uniformly, heating temperature is maintained at 60-80
℃；
(2) it weighs above-mentioned macromolecule resin by above-mentioned formula to be gradually added in container, be kept stirring until completely dissolved
1-2 hours；
(3) above-mentioned thickener and curing agent is added by being cooled to room temperature, is kept stirring after mixing 30 minutes,
(4) obtained after filtering the halogen-free high-flexibility of a kind of low temperature curing type electric slurry of the invention have it is airborne
Body.
Compared with prior art, the advantages of the present invention are：Organic carrier is without containing halogen and other
Related harmful substance as defined in European Union；The low-temperature setting slurry prepared using the organic carrier and silver powder has extraordinary print
Brush, levelability, good to PET base material adhesive force after slurry curing, flexibility is strong, hardness is high, can be used for flexible circuit board production
Manufacture.In addition, the method and process that the present invention prepares halogen-free high-flexibility organic carrier is simple, using the low-temperature setting of its preparation
Size performance is uniform, and production cost is low.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below to the specific reality of the present invention
It applies mode and details is further described, but the present invention is not limited to ranges as described below, therefore the present invention is not by tool described below
The limitation of body details.
Embodiment 1：A kind of low temperature curing type electric slurry prepared by the present invention has with halogen-free high-flexibility organic carrier
Body ingredient is：Butyl acetic acid esters 54%, isophorone 20%, polyurethane resin 20%, polyester 5%, vapor phase method are white
Carbon black 0.5%, B1358A account for 0.5%.
It comprises the following steps that：
(1) first above-mentioned mixed solvent is weighed by above-mentioned formula, is added to the container and heats while stirring uniformly, heating temperature
It is maintained at 70 DEG C；
(2) it weighs above-mentioned macromolecule resin by above-mentioned formula to be gradually added in container, is kept stirring 1 until completely dissolved
Hour；
(3) above-mentioned thickener and curing agent is added by being cooled to room temperature, is kept stirring after mixing 30 minutes,
(4) obtained after filtering the halogen-free high-flexibility of a kind of low temperature curing type electric slurry of the invention have it is airborne
Body.
The halogen-free high-flexibility organic carrier of gained is without containing related harmful substance as defined in halogen and other European Union；It adopts
There are extraordinary printing, a levelability with the low-temperature setting slurry that the organic carrier and silver powder prepare, it is right after slurry curing
PET base material adhesive force：100/100, flexibility：It is high that 5 resistance variations of bending are less than 100%, hardness：>=3H, can be used for flexibility
Wiring board is manufactured.
Embodiment 2：A kind of low temperature curing type electric slurry prepared by the present invention has with halogen-free high-flexibility organic carrier
Body ingredient is：Diethylene glycol ether acetic acid esters 30%, mixed dibasic acid ester (DBE) 31%, isophorone 10%, polyurethane resin
15%, polyester 10%, organobentonite 3%, B1358A account for 1%.
(1) first above-mentioned mixed solvent is weighed by above-mentioned formula, is added to the container and heats while stirring uniformly, heating temperature
It is maintained at 70 DEG C；
(2) it weighs above-mentioned macromolecule resin by above-mentioned formula to be gradually added in container, is kept stirring 1 until completely dissolved
Hour；
(3) above-mentioned thickener and curing agent is added by being cooled to room temperature, is kept stirring after mixing 30 minutes,
(4) obtained after filtering the halogen-free high-flexibility of a kind of low temperature curing type electric slurry of the invention have it is airborne
Body.
The halogen-free high-flexibility organic carrier of gained is without containing related harmful substance as defined in halogen and other European Union；It adopts
There are extraordinary printing, a levelability with the low-temperature setting slurry that the organic carrier and silver powder prepare, it is right after slurry curing
PET base material adhesive force：100/100, flexibility：It is high that 5 resistance variations of bending are less than 50%, hardness：>=2H, can be used for flexible wires
Road plate is manufactured.
Embodiment 3：A kind of low temperature curing type electric slurry prepared by the present invention has with halogen-free high-flexibility organic carrier
Body ingredient is：Diethylene glycol ether acetic acid esters 42%, mixed dibasic acid ester (DBE) 10%, isophorone 25%, polyurethane resin
20%, polyester 1%, sodium bentonite 1.5%, B1358A account for 0.5%.
(1) first above-mentioned mixed solvent is weighed by above-mentioned formula, is added to the container and heats while stirring uniformly, heating temperature
It is maintained at 70 DEG C；
(2) it weighs above-mentioned macromolecule resin by above-mentioned formula to be gradually added in container, is kept stirring 1 until completely dissolved
Hour；
(3) above-mentioned thickener and curing agent is added by being cooled to room temperature, is kept stirring after mixing 30 minutes,
(4) obtained after filtering the halogen-free high-flexibility of a kind of low temperature curing type electric slurry of the invention have it is airborne
Body.
The halogen-free high-flexibility organic carrier of gained is without containing related harmful substance as defined in halogen and other European Union；It adopts
There are extraordinary printing, a levelability with the low-temperature setting slurry that the organic carrier and silver powder prepare, it is right after slurry curing
PET base material adhesive force：100/100, flexibility：It is high that 5 resistance variations of bending are less than 100%, hardness：>=3H, can be used for flexibility
Wiring board is manufactured.
Embodiment 4：A kind of low temperature curing type electric slurry prepared by the present invention has with halogen-free high-flexibility organic carrier
Body ingredient is：DBE50%, isophorone 25%, polyurethane resin 15%, polyester 5%, organobentonite 1.5%, UN-7038
Account for 1%.
(1) first above-mentioned mixed solvent is weighed by above-mentioned formula, is added to the container and heats while stirring uniformly, heating temperature
It is maintained at 70 DEG C；
(2) it weighs above-mentioned macromolecule resin by above-mentioned formula to be gradually added in container, is kept stirring 1 until completely dissolved
Hour；
(3) above-mentioned thickener and curing agent is added by being cooled to room temperature, is kept stirring after mixing 30 minutes,
(4) obtained after filtering the halogen-free high-flexibility of a kind of low temperature curing type electric slurry of the invention have it is airborne
Body.
The halogen-free high-flexibility organic carrier of gained is without containing related harmful substance as defined in halogen and other European Union；It adopts
There are extraordinary printing, a levelability with the low-temperature setting slurry that the organic carrier and silver powder prepare, it is right after slurry curing
PET base material adhesive force：100/100, flexibility：It is high that 5 resistance variations of bending are less than 100%, hardness：>=3H, can be used for flexibility
Wiring board is manufactured.
Embodiment 5：A kind of low temperature curing type electric slurry prepared by the present invention has with halogen-free high-flexibility organic carrier
Body ingredient is：DBE50%, isophorone 25%, polyurethane resin 15%, polyester 5%, organobentonite 1.5%, UN-7038
Account for 1%.
(1) first above-mentioned mixed solvent is weighed by above-mentioned formula, is added to the container and heats while stirring uniformly, heating temperature
It is maintained at 80 DEG C；
(2) it weighs above-mentioned macromolecule resin by above-mentioned formula to be gradually added in container, is kept stirring 1 until completely dissolved
Hour；
(3) above-mentioned thickener and curing agent is added by being cooled to room temperature, is kept stirring after mixing 30 minutes,
(4) obtained after filtering the halogen-free high-flexibility of a kind of low temperature curing type electric slurry of the invention have it is airborne
Body.
The halogen-free high-flexibility organic carrier of gained is without containing related harmful substance as defined in halogen and other European Union；It adopts
There are extraordinary printing, a levelability with the low-temperature setting slurry that the organic carrier and silver powder prepare, it is right after slurry curing
PET base material adhesive force：100/100, flexibility：It is high that 5 resistance variations of bending are less than 150%, hardness：>=3H, can be used for flexibility
Wiring board is manufactured.
Embodiment 6：A kind of low temperature curing type electric slurry prepared by the present invention has with halogen-free high-flexibility organic carrier
Body ingredient is：DBE50%, isophorone 25%, polyurethane resin 15%, polyester 5%, organobentonite 1.5%, UN-7038
Account for 1%.
(1) first above-mentioned mixed solvent is weighed by above-mentioned formula, is added to the container and heats while stirring uniformly, heating temperature
It is maintained at 60 DEG C；
(2) it weighs above-mentioned macromolecule resin by above-mentioned formula to be gradually added in container, is kept stirring 2 until completely dissolved
Hour；
(3) above-mentioned thickener and curing agent is added by being cooled to room temperature, is kept stirring after mixing 30 minutes,
(4) obtained after filtering the halogen-free high-flexibility of a kind of low temperature curing type electric slurry of the invention have it is airborne
Body.
The halogen-free high-flexibility organic carrier of gained is without containing related harmful substance as defined in halogen and other European Union；It adopts
There are extraordinary printing, a levelability with the low-temperature setting slurry that the organic carrier and silver powder prepare, it is right after slurry curing
PET base material adhesive force：100/100, flexibility：It is high that 5 resistance variations of bending are less than 50%, hardness：>=3H, can be used for flexible wires
Road plate is manufactured.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (2)
1. a kind of halogen-free high-flexibility organic carrier of low temperature curing type electric slurry, it is characterised in that：The organic carrier
Composition and mass percent are：Mixed solvent 70-85%, macromolecule resin 5-30%, thickener, 0.5-5%, curing agent 0.5-
5%；Wherein, the sum of each component weight percent is 100%,
The mixed solvent is at least two in various higher boiling esters, ketones solvent,
The macromolecule resin is polyurethane resin, polyester, and ratio is 1:1~10:1, polyurethane molecular amount is more than 30000,
Molecular weight of polyesters 5000~30000,
The thickener is starch, gelatin, hydroxyethyl cellulose, hydroxypropyl methyl cellulose, sodium carboxymethylcellulose, organic
One kind in bentonite, diatomite, fume colloidal silica, sodium bentonite, Silica hydrogel,
The curing agent is blocked curing agent, and deblocking temperature is at 100~150 DEG C.
2. the preparation method of halogen-free high-flexibility organic carrier described in claim 1, it is characterised in that specific steps include
It is as follows：
The composition and mass percent of the organic carrier be：Mixed solvent 70-85%, macromolecule resin 5-30%, thickener,
0.5-5%, curing agent 0.5-5%；
(1) first mixed solvent is weighed by formula, is added to the container and heats while stirring uniformly, heating temperature is maintained at 60-80
℃；
(2) it weighs above-mentioned macromolecule resin by above-mentioned formula to be gradually added in container, it is small to be kept stirring 1-2 until completely dissolved
When；
(3) above-mentioned thickener and curing agent is added by being cooled to room temperature, is kept stirring after mixing 30 minutes,
(4) the halogen-free high-flexibility organic carrier of low temperature curing type electric slurry is obtained after filtering,
The macromolecule resin is polyurethane resin, polyester, and ratio is 1:1~10:1, polyurethane molecular amount is more than 30000,
Molecular weight of polyesters 5000~30000,
The mixed solvent is at least two in various higher boiling esters, ketones solvent,
The thickener is starch, gelatin, hydroxyethyl cellulose, hydroxypropyl methyl cellulose, sodium carboxymethylcellulose, organic
One kind in bentonite, diatomite, fume colloidal silica, sodium bentonite, Silica hydrogel,
The curing agent is blocked curing agent, and deblocking temperature is at 100~150 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610326699.XA CN105860498B (en) | 2016-05-17 | 2016-05-17 | A kind of low temperature curing type electric slurry halogen-free high-flexibility organic carrier and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101824204A (en) * | 2009-03-06 | 2010-09-08 | 佛山市顺德区锐新科屏蔽材料有限公司 | Novel halogen-free electronic paste, and preparation method and use thereof |
| CN101877251A (en) * | 2010-06-30 | 2010-11-03 | 彩虹集团公司 | Method for preparing nickel-containing silver electrode slurry |
| CN102254584A (en) * | 2011-05-12 | 2011-11-23 | 中国科学院宁波材料技术与工程研究所 | General electronic paste based on graphene filler |
| CN105472791A (en) * | 2015-12-23 | 2016-04-06 | 东莞珂洛赫慕电子材料科技有限公司 | Rare earth-doped semiconductor infrared radiation thick-film electronic paste and preparation method therefor |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101824204A (en) * | 2009-03-06 | 2010-09-08 | 佛山市顺德区锐新科屏蔽材料有限公司 | Novel halogen-free electronic paste, and preparation method and use thereof |
| CN101877251A (en) * | 2010-06-30 | 2010-11-03 | 彩虹集团公司 | Method for preparing nickel-containing silver electrode slurry |
| CN102254584A (en) * | 2011-05-12 | 2011-11-23 | 中国科学院宁波材料技术与工程研究所 | General electronic paste based on graphene filler |
| CN105472791A (en) * | 2015-12-23 | 2016-04-06 | 东莞珂洛赫慕电子材料科技有限公司 | Rare earth-doped semiconductor infrared radiation thick-film electronic paste and preparation method therefor |
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Address after: 650106 No. 988, science and technology road, Kunming hi tech Development Zone, Yunnan, China (Kunming Institute of Precious Metals) Patentee after: Yunnan Precious Metal New Materials Holding Group Co.,Ltd. Country or region after: China Address before: 650106 No. 988, science and technology road, Kunming hi tech Development Zone, Yunnan, China (Kunming Institute of Precious Metals) Patentee before: Sino-Platinum Metals Co.,Ltd. Country or region before: China |